CN110996519A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN110996519A CN110996519A CN201911302928.4A CN201911302928A CN110996519A CN 110996519 A CN110996519 A CN 110996519A CN 201911302928 A CN201911302928 A CN 201911302928A CN 110996519 A CN110996519 A CN 110996519A
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Abstract
The invention relates to a circuit board and a manufacturing method thereof, comprising the following steps: providing a carrier plate provided with a first circuit layer; providing a first die, wherein the first die is provided with a first through hole; enabling the first mold to abut against the carrier plate, and enabling the first through holes to be aligned to at least part of the first circuit layer; electroplating on the surface of the first circuit layer to form a first conductive column in the first through hole; removing the first mold; arranging a first liquid insulating material on the carrier plate, and enabling the first liquid insulating material to cover the surface of the first circuit layer; and curing the first liquid insulating material to convert the first liquid insulating material into a first insulating layer so as to obtain the circuit board. Compared with the prior art, the manufacturing method of the circuit board is different from the prior art.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a circuit board and a manufacturing method thereof.
Background
The wiring board is an important electronic component, and is a carrier and a support for connecting electronic components. At present, the manufacturing process of increasing the number of layers of the circuit board at least comprises the steps of laminating a copper foil and an insulating layer together, then manufacturing a circuit, then drilling, then plating copper in holes, communicating the circuit of each layer through the hole copper, and because the circuit board is manufactured by adopting the mode at present, because the material of the insulating layer in the prior art is the prepreg, but the current prepreg can not be manufactured to be too thin, so that the circuit board is manufactured through the insulating layer, and the circuit board can not further reduce the thickness.
Disclosure of Invention
In view of the above, it is necessary to provide a circuit board and a method for manufacturing the same.
A circuit board manufacturing method comprises the following steps:
providing a carrier plate provided with a first circuit layer;
providing a first die, wherein the first die is provided with a first through hole;
abutting the first mold with the carrier plate, and aligning the first through hole with at least part of the first circuit layer;
electroplating on the surface of the first circuit layer to form a first conductive pillar in the first through hole;
removing the first mold;
arranging a first liquid insulating material on the carrier plate, and enabling the first liquid insulating material to cover the surface of the first circuit layer;
and curing the first liquid insulating material to convert the first liquid insulating material into a first insulating layer so as to obtain the circuit board.
According to the circuit board manufacturing method, the first conductive column is manufactured on the carrier plate provided with the first circuit layer, and then the first insulating layer is manufactured.
In one embodiment, in the step of providing the carrier board provided with the first circuit layer, the carrier board is a metal carrier board.
In one embodiment, the step of providing the carrier board provided with the first circuit layer includes:
providing a carrier plate;
arranging a metal layer on the carrier plate;
the metal layer forms the first line layer by including a film coating process, an exposure process, a developing process, an etching process, and a film removal process.
In one embodiment, the step of disposing a metal layer on the carrier includes:
and electroplating a metal layer on the carrier plate.
In one embodiment, a first liquid insulating material is disposed on the carrier plate, and the first liquid insulating material covers the surface of the first circuit layer; the step of curing the first liquid insulating material so that the first liquid insulating material is converted into a first insulating layer to obtain a wiring board includes:
arranging a first liquid insulating material on the carrier plate, enabling the first liquid insulating material to cover the surface of the first circuit layer, and enabling the first liquid insulating material to cover the first conductive column;
curing the first liquid insulating material such that the first liquid insulating material is transformed into a first insulating layer;
and thinning the first insulating layer from the surface of the first circuit layer to expose one end of the first conductive column away from the first circuit layer.
In one embodiment, the step of curing the first liquid insulating material to convert the first liquid insulating material into a first insulating layer to obtain the wiring board includes:
curing the first liquid insulating material such that the first liquid insulating material is transformed into a first insulating layer;
and removing at least part of the carrier plate to obtain the circuit board.
In one embodiment, the step of abutting the first mold with the carrier plate and aligning the first through hole with at least part of the first circuit layer includes:
and abutting the first mold with the carrier plate, aligning the first through hole with at least part of the first circuit layer, and covering at least part of the first circuit layer by the first mold.
In one embodiment, the carrier board is a circuit board.
In one embodiment, the step of curing the first liquid insulating material to convert the first liquid insulating material into a first insulating layer further comprises the following steps:
arranging a second circuit layer on one surface, away from the first circuit layer, of the first insulating layer, wherein the second circuit layer is connected with the first conductive columns;
providing a second die, wherein the second die is provided with a second through hole;
abutting the second mold with the first insulating layer and aligning the second via with at least a portion of the second circuit layer;
electroplating the surface of the second circuit layer to form a second conductive column in the second through hole;
removing the second mold;
disposing a second liquid insulating material on the first insulating layer such that the second liquid insulating material covers a surface of the second circuit layer;
curing the second liquid insulating material such that the second liquid insulating material is transformed into a second insulating layer.
A circuit board is manufactured by the circuit board manufacturing method according to any one of the above embodiments.
Drawings
Fig. 1 is a schematic process flow diagram of a manufacturing method of a circuit board according to an embodiment.
Fig. 2 is a schematic process flow diagram of a manufacturing method of a circuit board according to an embodiment.
Fig. 3a is a schematic diagram of a manufacturing process of a circuit board according to an embodiment.
Fig. 3b is a schematic diagram of a manufacturing process of the circuit board according to an embodiment.
Fig. 3c is a schematic diagram of a manufacturing process of the circuit board according to an embodiment.
Fig. 3d is a schematic diagram of a manufacturing process of the circuit board according to an embodiment.
Fig. 3e is a schematic diagram of a manufacturing process of the circuit board according to an embodiment.
Fig. 3f is a schematic diagram of a manufacturing process of the circuit board according to an embodiment.
Fig. 3g is a schematic diagram of a manufacturing process of the circuit board according to an embodiment.
Fig. 3h is a schematic diagram of a manufacturing process of the circuit board according to an embodiment.
Fig. 3i is a schematic diagram of a manufacturing process of the circuit board according to an embodiment.
Fig. 3j is a schematic diagram of a manufacturing process of the circuit board according to an embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The circuit board in the prior art has the defects of complex process, inconvenient manufacturing and long manufacturing period.
In one embodiment, a method for manufacturing a circuit board is provided, which includes the following steps:
In one embodiment, in the step of providing the carrier board provided with the first circuit layer, the first circuit layer may be implemented by a method including, in one embodiment, pressing a metal foil on the carrier board, and etching the metal foil to form the first circuit layer. In one embodiment, a metal layer is plated on a carrier plate, and the metal layer is etched to form a first circuit layer. It should be understood that the carrier is used for carrying the first circuit layer, and therefore, the material of the carrier is not limited, and the material of the carrier may be a conductor, or may be other substances. The carrier sheet of conductive material can facilitate the electroplating of the metal layer or can be used for laminating metal foils. The carrier plate made of other materials can be used for manufacturing the first circuit layer by pressing the metal foil. In the above manner, the first circuit layer can be disposed on the carrier. In one embodiment, the carrier is a conductive carrier, and in one embodiment, the carrier is a non-conductive carrier.
In one embodiment, a first mold is provided, wherein in the step of forming the first through hole in the first mold, the first through hole is disposed through the first mold, the first through hole is used for accommodating the first conductive pillar in the subsequent step, and the first mold may be a conductive body or an insulator. In one embodiment, the material of the first mold is an electrical conductor, and in one embodiment, the material of the first mold is an insulator. When the first mold is a conductive body, the first conductive column can be electroplated on the first mold and the first circuit layer more simultaneously, so that the first conductive column can be formed quickly, the shape of the first conductive column is similar to that of the through hole finally, and the function of limiting the structure of the first conductive column is achieved, when the first mold is an insulator, the first conductive column is generated from the first circuit layer, the through hole is beneficial to thickening of the first conductive column along the extending direction of the through hole, the function of guiding the generation of the first conductive column is achieved, and the shape of the first conductive column is similar to that of the through hole finally, so that the shape of the first conductive column is more uniform and stable, and the stability of a subsequent circuit board structure is improved, in addition, because the first conductive column is not electroplated on the wall part of the first mold, the bonding force between the first conductive column and the wall part of the first mold is lower, facilitating the subsequent demoulding of the first mould. In conclusion, the first mold made of the conductor helps to enable the first conductive column to be generated more quickly, the first mold made of the insulator helps to facilitate subsequent demolding, the material of the first mold can be selected according to actual conditions in production, and the first through holes of the first mold help to enable the first conductive column to be regular in shape, so that the structure of the first conductive column is more stable. And it should be understood that, when the first mold is a conductive body, a cylindrical first conductive pillar can be manufactured, that is, the first conductive pillar is cylindrical, and it is not necessary to completely fill the first through hole with the first conductive pillar.
In one embodiment, in the step of abutting the first mold against the carrier plate and aligning the first through hole with at least part of the first circuit layer, the first mold covers at least part of the first circuit layer to prevent the position of the first circuit layer, which does not need to be plated, from being plated. Meanwhile, the first through hole is aligned to the first circuit layer and used for accommodating the first conductive pillar, that is, the first conductive pillar is formed in the first through hole. The first through hole is used for corresponding to the positions of the through hole structure and the buried hole structure on the circuit board.
In one embodiment, in the step of electroplating the surface of the first circuit layer to form the first conductive pillar in the first through hole, in this embodiment, the carrier plate and the first mold are both placed in an electroplating bath, so that the electroplating solution permeates into the first through hole and contacts with the first circuit layer, after the electroplating solution is electrified, the electroplating on the surface of the first circuit layer is realized, metal ions in the electroplating solution obtain electrons on the surface of the first circuit layer and form a metal simple substance, and the metal simple substance is attached to the surface of the first circuit layer, so that the thickness of the metal at the position of the first circuit layer corresponding to the first through hole is increased, and the metal simple substance is continuously generated along the extending direction of the first through hole to form the first conductive pillar.
In the step of removing the first mold, the manner of removing the first mold at least includes the manner of following embodiments, in one of the embodiments, the first mold is removed by a milling machine, in this embodiment, a milling cutter of the milling machine mills the first mold, so as to remove the first mold. In one embodiment, the first mold is removed by using an etching solution, and the etching solution is used for etching the first mold, so that the first mold is removed.
In one embodiment, in the step of disposing the first liquid insulating material on the carrier plate and allowing the first liquid insulating material to cover the surface of the first circuit layer, the first liquid insulating material is disposed on the carrier plate by potting, specifically, the frame body is disposed on the carrier plate, so that an accommodating space is formed between the frame body and the carrier plate, the first circuit layer is located in the accommodating space, and the first liquid insulating material is further potted in the accommodating space to allow the first liquid insulating material to be disposed on the carrier plate. In one embodiment, the first liquid insulating material is disposed on the carrier by brushing, and a thin first liquid insulating material is formed on the carrier by brushing, so that after the first insulating layer is formed by curing, the thickness of the first insulating layer is smaller.
In one embodiment, in the step of curing the first liquid insulating material to convert the first liquid insulating material into a first insulating layer to obtain the circuit board, curing the first liquid insulating material may be static curing or heating curing. In one embodiment, the first liquid insulating material is statically cured so that the first liquid insulating material is converted into the first insulating layer, and in one embodiment, the first liquid insulating material is heated and cured so that the first liquid insulating material is converted into the first insulating layer, and the heating and curing can improve the curing efficiency, so that the production efficiency of the circuit board is improved.
It should be understood that the prepreg is a solid, and when the prepreg is made too thin, the prepreg is easily damaged in the production and transportation processes, generally, the prepreg on the market can only achieve 100 μm to 120 μm, and in the above method for manufacturing a circuit board, the first conductive pillar is firstly manufactured on the carrier board provided with the first circuit layer, and then the first insulating layer is manufactured. The first liquid insulating material can be loaded through a container and is easily handled by machine and by hand, so that there is no problem of difficulty in production and transportation.
It is worth mentioning that, the circuit board manufacturing method of this application need not pass through the pressfitting technology, therefore need not carry out the management and control to the thickness around the pressfitting for the manufacturing procedure is simpler and make more convenient, and simultaneously, the pressfitting technology needs longer time, so that insulating layer and copper foil fully contact, however, this application need not carry out the pressfitting, has shortened the preparation cycle of circuit board, like this, can compare in prior art process simpler, make more convenient, and the cycle is shorter.
It should be understood that the lamination process requires a long time for heating and pressing the insulating layer and the copper foil, melting the insulating layer, bonding the insulating layer and the copper foil, and curing the insulating layer, thereby achieving lamination of the insulating layer and the copper foil. Meanwhile, the thickness change of the insulating layer before and after compression needs to be judged according to experience, and experiments are also needed to verify whether the thickness change of the insulating layer before and after compression meets the requirements, so that a large number of influencing factors which are difficult to control exist in the pressing process. In the application, the thickness of the first liquid insulating material is not changed greatly after being cured, therefore, the thickness of the first liquid insulating layer is not required to be verified according to experience or multiple experiments, complex pressing equipment for pressurizing and heating is not required, the curing of the first liquid insulating material can be adjusted through the curing dosage, the curing time of the first liquid insulating material is easily shortened, the curing time of the first liquid insulating material is shorter than the pressing time, and compared with the prior art, the production process of the application is simpler, the manufacturing process is easier, and the manufacturing period is also shorter.
In one embodiment, the step of providing the carrier board provided with the first circuit layer includes: providing a carrier plate; arranging a metal layer on the carrier plate; the metal layer forms the first circuit layer through a film covering process, an exposure process, a developing process, an etching process and a film removing process, so that the first circuit layer can be arranged on the carrier plate.
In one embodiment, the step of disposing a metal layer on the carrier includes: and electroplating a metal layer on the carrier plate. In one embodiment, the carrier is a metal carrier, such that a metal layer may be plated on the carrier to wrap the surface of the carrier, or the carrier may be made of other conductive materials. At present, the thinnest of the copper foil on the market can be 10 μm, because the thinner copper foil is difficult to produce and transport and is easy to damage, and in the application, the thickness of the metal layer can be 5 μm due to the adoption of the electroplated metal layer, namely the thickness of the first circuit layer can be 5 μm. Even in the electroplating bath with higher electroplating precision, the thickness of the metal layer can be less than 5 μm. In one embodiment, the carrier is a conductor carrier, so that the conductor carrier can be used for electroplating a metal layer, which can make the thickness of the metal layer 5 μm, i.e. the thickness of the first circuit layer that follows can make the thickness 5 μm.
In one embodiment, in the step of providing the carrier board provided with the first circuit layer, the carrier board is a metal carrier board, and the metal carrier board can be used for electroplating the metal layer, so that the first circuit layer can be more easily provided on the metal carrier board, the arrangement of the first circuit layer is simpler, and the metal material or the alloy material can react with the acidic etching solution, so that the removal of the carrier board by the etching solution can be facilitated in some embodiments.
In one embodiment, a first liquid insulating material is disposed on the carrier plate, and the first liquid insulating material covers the surface of the first circuit layer; the step of curing the first liquid insulating material so that the first liquid insulating material is converted into a first insulating layer to obtain a wiring board includes: arranging a first liquid insulating material on the carrier plate, enabling the first liquid insulating material to cover the surface of the first circuit layer, and enabling the first liquid insulating material to cover the first conductive column; curing the first liquid insulating material such that the first liquid insulating material is transformed into a first insulating layer; and thinning the first insulating layer from the surface of the first circuit layer to expose one end of the first conductive column away from the first circuit layer. In this embodiment, the first liquid insulating material covers the first conductive pillar, that is, the distance that the first liquid insulating material protrudes from the surface of the carrier board is greater than the distance that the conductive pillar protrudes from the surface of the carrier board, that is, the first liquid insulating material can completely submerge the first conductive pillar, or the first liquid insulating material can completely wrap the surface of the first conductive pillar, so as to fix the first conductive pillar, which is beneficial to thinning the first conductive pillar to a flat state in the following process, and meanwhile, the thickness of the first insulating layer is thinned from the side of the first insulating layer away from the first circuit layer, so that the thicknesses of the first insulating layer and the first conductive pillar can be adjusted according to the practical situation, and because the thickness is directly processed at a later stage, the precision of thickness can be controlled better, rather than need control heating pressurization parameter like the pressfitting for the control to first insulating layer thickness and first conductive pillar thickness is more accurate in this application. In one embodiment, the thinning of the first insulating layer is performed by a lathe starting from the side of the first insulating layer facing away from the first wiring layer. In one embodiment, the first insulating layer is thinned starting from the side of the first insulating layer facing away from the first circuit layer by a milling machine. In one embodiment, the first insulating layer is thinned by a grinding process from the side of the first insulating layer facing away from the first circuit layer. It should be understood that, in the prior art, the insulating layer is made of a prepreg, a structure of the prepreg includes a reinforcing material, the reinforcing material is generally a glass fiber cloth, and the glass fiber cloth has a woven structure. In one embodiment, after the first conductive column is exposed, the first insulating layer and the first conductive column are also thinned synchronously, so that the first insulating layer and the first conductive column can be thinned simultaneously according to the actual requirement on the thickness of the circuit board, the thickness of the circuit board can be controlled better, and the thinner circuit board is convenient to manufacture. In this embodiment, because the first insulating layer is thinned by the milling machine at a later stage, the thicknesses of the first insulating layer and the first conductive column depend on the precision of the milling machine, and through experiments, the milling machine can make the thickness of the first insulating layer and the thickness of the first conductive column be 50 μm, and even some milling machines with higher precision can make the thickness of the first insulating layer and the thickness of the first conductive column be less than 50 μm.
In one embodiment, the step of curing the first liquid insulating material to convert the first liquid insulating material into a first insulating layer to obtain the wiring board includes: curing the first liquid insulating material such that the first liquid insulating material is transformed into a first insulating layer; and removing the carrier plate to obtain the circuit board. In this embodiment, since the first circuit layer needs to be exposed, the carrier board is removed, so that the first circuit layer can be used for mounting components. In other embodiments, the carrier plate has other functions, such as for insulation and heat dissipation, and accordingly, the carrier plate does not need to be removed, or only a part of the carrier plate is removed. In one embodiment, the step of curing the first liquid insulating material to convert the first liquid insulating material into a first insulating layer to obtain the wiring board includes: curing the first liquid insulating material such that the first liquid insulating material is transformed into a first insulating layer; and removing at least part of the carrier plate to obtain the circuit board.
In one embodiment, the step of abutting the first mold with the carrier plate and aligning the first through hole with at least part of the first circuit layer includes: and abutting the first mold with the carrier plate, aligning the first through hole with at least part of the first circuit layer, and covering at least part of the first circuit layer by the first mold. Thus, the position of the first circuit layer which does not need to be electroplated can be prevented from being electroplated.
In one embodiment, the carrier board is a circuit board, which is substantially a circuit board, and for convenience of describing the relationship among the components in the process, the carrier board is named by a circuit board name. The circuit board may be a circuit board manufactured in the above embodiments, or a circuit board in the prior art, and when the carrier board is a circuit board, the manufacturing method can increase one layer of circuit board, so as to finally obtain a multi-layer circuit board.
In one embodiment, the step of curing the first liquid insulating material to convert the first liquid insulating material into a first insulating layer further comprises the following steps: arranging a second circuit layer on one surface, away from the first circuit layer, of the first insulating layer, wherein the second circuit layer is connected with the first conductive columns; providing a second die, wherein the second die is provided with a second through hole; abutting the second mold with the first insulating layer and aligning the second via with at least a portion of the second circuit layer; electroplating the surface of the second circuit layer to form a second conductive column in the second through hole; removing the second mold; disposing a second liquid insulating material on the first insulating layer such that the second liquid insulating material covers a surface of the second circuit layer; curing the second liquid insulating material such that the second liquid insulating material is transformed into a second insulating layer. In this embodiment, the second circuit layer is connected to the first conductive pillar, and an electronic component can be mounted on one end of the second conductive pillar, which is away from the second circuit layer, so as to obtain a multilayer circuit board. It should be understood that, on the basis of the second conductive pillars, the third circuit layer, the third conductive pillars and the third insulating layer may be repeatedly fabricated; on the basis of the third conductive column, the fourth circuit layer, the fourth conductive column and the fourth insulating layer can be repeatedly manufactured, and the process is repeated until the nth circuit layer, the nth conductive column and the nth insulating layer are manufactured, so that the multilayer circuit board is obtained. In one embodiment, after the step of fabricating the nth insulating layer of the first insulating layer and the second insulating layer … …, the nth insulating layer of the first insulating layer and the second insulating layer … … is thinned, so that the nth insulating layer of the first insulating layer and the second insulating layer … … can be fabricated to a desired thickness, and finally an ultra-thin multilayer circuit board is obtained.
To obtain a multilayer circuit board, in one embodiment, a method for manufacturing a circuit board includes the steps of: providing a carrier plate; arranging a metal layer on the carrier plate; the metal layer is formed into a circuit layer by a process including a film coating process, an exposure process, a developing process, an etching process and a film removing process. Providing a die, wherein the die is provided with a through hole; abutting the mold with the carrier plate, and aligning the through hole with at least part of the circuit layer; electroplating on the surface of the circuit layer to form a conductive column in the through hole; removing the mold; arranging a liquid insulating material on the carrier plate, enabling the liquid insulating material to cover the surface of the circuit layer, and enabling the liquid insulating material to cover the conductive columns; curing the liquid insulating material so that the liquid insulating material is transformed into an insulating layer; starting to thin the insulating layer from one side, deviating from the circuit layer, of the insulating layer to expose one end, far away from the circuit layer, of the conductive column, and repeating the steps from the metal layer to the side, deviating from the circuit layer, of the insulating layer to start to thin the insulating layer, wherein when the metal layer is repeatedly arranged, the metal layer is arranged on the insulating layer; the carrier plate is removed to form a multi-layer circuit board, and in the present application, the step of removing the carrier plate may be optionally placed after the first insulating layer is formed. Thus, a multilayer wiring board can be obtained. The thickness of each insulating layer can be well controlled by the circuit board, so that the whole thickness of the circuit board can be better controlled, and when the thickness of each insulating layer is kept to be thinner, an ultrathin and multilayer circuit board can be obtained
And in the step of arranging a first liquid insulating material on the carrier plate and enabling the first liquid insulating material to cover the surface of the first circuit layer, the first liquid insulating material comprises at least one of epoxy glue, silica gel and UV glue. The first liquid insulating material has two forms of liquid and solid, can be encapsulated on the surface of the first circuit layer in the liquid state, and can realize the insulating effect after being solidified.
In one embodiment, curing the first liquid insulating material such that the first liquid insulating material is transformed into a first insulating layer comprises: and carrying out surface treatment on the exposed first conductive column and/or the first circuit layer. In one embodiment, the exposed first conductive pillar and the first circuit layer are subjected to at least one of a protective film coating process, a gold immersion process, a silver immersion process, and a gold plating process. In one embodiment, the exposed first conductive pillar and the first circuit layer are subjected to a film coating process. In one embodiment, the exposed first conductive pillar and the first circuit layer are subjected to a gold immersion treatment. In one embodiment, the exposed first conductive pillar and the first circuit layer are subjected to a silver immersion treatment. In one embodiment, the exposed first conductive pillar and the first circuit layer are subjected to a gold immersion treatment. In one embodiment, the exposed first conductive pillar and the first circuit layer are subjected to a gold immersion process and a gold plating process. Thus, the exposed first conductive pillar and the first circuit layer are protected.
In one embodiment, the metal layer is a copper layer and the metal foil is a copper foil. The materials of the first circuit layer, the second circuit layer … …, the nth circuit layer, the first conductive pillar, and the second conductive pillar … …, the nth conductive pillar all include copper. Therefore, the conductive function of each structure is realized, and it is worth mentioning that in the field of circuit boards, the material of a common conductive structure comprises copper.
In one embodiment, as shown in fig. 2, a circuit board is manufactured by a method including the steps of manufacturing the circuit board as described in any one of the above embodiments.
In one embodiment, a method for manufacturing a circuit board includes the steps of:
and step 210, forming a copper film on the periphery of the carrier plate by an electro-coppering process.
In step 220, a circuit layer is formed on the surface of the copper film by an etching process.
And 240, forming the conductive columns in the holes of the mold by using a copper electroplating process on the surface of the mold with the through holes.
At step 250, the mold is removed by a removing method, and finally the conductive pillar is formed.
In step 270, the insulation layer with an excessive thickness is removed by removing the insulation layer, so that the conductive pillars are exposed.
And 290, performing surface treatment on the circuit layer and the conductive column to obtain the circuit board. Wherein, the surface treatment comprises tin spraying, gold immersion, OSP and the like.
In one embodiment, steps 210-280 are repeated on the basis of step 280 to obtain a double-layer board or a multi-layer board, wherein the insulating layer of step 280 serves as the carrier board of step 210, and the insulating layer does not need to be removed in the subsequent steps. In one embodiment, before or after step 280, step 281 is further included to form a copper film around the insulating layer by an electroplating copper process, and steps 220-270 are repeated based on the copper film formed in step 281.
In one embodiment, a method for manufacturing a circuit board includes the steps of:
as shown in fig. 3a, a carrier plate 300 is provided.
As shown in fig. 3b, a metal layer 310 is plated on the carrier board 300.
As shown in fig. 3c, the metal layer 310 forms a first circuit layer 311 by including a film coating process, an exposure process, a developing process, an etching process, and a stripping process.
As shown in fig. 3d, a first mold 400 is provided, wherein the first mold 400 is provided with a first through hole 401.
As shown in fig. 3d, the first mold 400 is abutted against the carrier 300, and the first through hole 401 is aligned with at least a portion of the first circuit layer 311.
As shown in fig. 3d, electroplating is performed on the surface of the first circuit layer 311 to form a first conductive pillar 312 in the first via 401.
As shown in fig. 3e, the first mold 400 is removed.
And arranging a first liquid insulating material on the carrier plate, wherein the first liquid insulating material covers the surface of the first circuit layer, and the first liquid insulating material covers the first conductive posts.
As shown in fig. 3f, the first liquid insulating material is cured such that the first liquid insulating material is transformed into a first insulating layer 320.
As shown in fig. 3g, the first insulating layer 311 is thinned from a side of the first insulating layer 320 facing away from the first circuit layer 311 to expose an end of the first conductive pillar 312 away from the first circuit layer 311.
As shown in fig. 3g and 3h, at least a portion of the carrier board 300 is removed to obtain the circuit board 510.
According to the circuit board manufacturing method, the first conductive column is manufactured on the carrier plate provided with the first circuit layer, and then the first insulating layer is manufactured. The circuit board manufacturing method does not need to pass through the pressing process, and therefore the thickness around the pressing is not needed to be controlled, the manufacturing process is simpler and more convenient to manufacture, meanwhile, the pressing process needs a longer time, the insulating layer and the copper foil are made to be in full contact, however, the pressing is not needed to be carried out, the manufacturing period of the circuit board is shortened, and therefore the circuit board manufacturing method can be simpler in process compared with the prior art, more convenient to manufacture and shorter in period. First liquid insulating material covers first leading electrical pillar for first liquid insulating material can cover first leading electrical pillar completely, plays the effect fixed to first leading electrical pillar, is favorable to making first leading electrical pillar attenuate to leveling state in the follow-up, simultaneously, by the first insulating layer deviates from one side of first circuit layer begins the attenuate the thickness of first insulating layer, thereby can adjust the thickness of first insulating layer and first leading electrical pillar according to actual, and because thickness is later stage direct processing, can control the precision of thickness better, and not need control heating pressurization parameter like the pressfitting, make the control to first insulating layer thickness and first leading electrical pillar thickness more accurate in this application. Compared with the prior art, the ultrathin multilayer circuit board has the advantages that the thickness of the first insulating layer and the thickness of the nth insulating layer … … can be well controlled, and therefore the overall thickness of the circuit board can be better controlled.
In one embodiment, a method for manufacturing a circuit board includes the steps of:
as shown in fig. 3a, a carrier plate 300 is provided.
As shown in fig. 3b, a metal layer 310 is plated on the carrier board 300.
As shown in fig. 3c, the metal layer 310 forms a first circuit layer 311 by including a film coating process, an exposure process, a developing process, an etching process, and a stripping process.
As shown in fig. 3d, a first mold 400 is provided, wherein the first mold 400 is provided with a first through hole 401.
As shown in fig. 3d, the first mold 400 is abutted against the carrier 300, and the first through hole 401 is aligned with at least a portion of the first circuit layer 311.
As shown in fig. 3d, electroplating is performed on the surface of the first circuit layer 311 to form a first conductive pillar 312 in the first via 401.
As shown in fig. 3e, the first mold 400 is removed.
And arranging a first liquid insulating material on the carrier plate, wherein the first liquid insulating material covers the surface of the first circuit layer, and the first liquid insulating material covers the first conductive posts.
As shown in fig. 3f, the first liquid insulating material is cured such that the first liquid insulating material is transformed into a first insulating layer 320.
As shown in fig. 3g, the first insulating layer 311 is thinned from a side of the first insulating layer 320 facing away from the first circuit layer 311 to expose an end of the first conductive pillar 312 away from the first circuit layer 311.
As shown in fig. 3i, a second metal layer 330 is electroplated on the first insulating layer 320.
As shown in fig. 3j, the metal layer 330 forms a second circuit layer 331 by including a film coating process, an exposure process, a developing process, an etching process, and a stripping process.
And providing a second die, wherein the second die is provided with a second through hole.
And abutting the second mold with the carrier plate, and aligning the second through hole with at least part of the second circuit layer.
As shown in fig. 3j, electroplating is performed on the surface of the second circuit layer 331 to form a second conductive pillar 332 in the second via hole (not shown).
Removing the second mold.
And arranging a second liquid insulating material on the carrier plate, wherein the second liquid insulating material covers the surface of the second circuit layer, and the second liquid insulating material covers the second conductive columns.
As shown in fig. 3j, the second liquid insulating material is cured such that the second liquid insulating material is transformed into a second insulating layer 340.
As shown in fig. 3j, the second insulating layer 340 is thinned from a side of the second insulating layer 340 facing away from the second circuit layer, so as to expose one end of the second conductive pillar 332 away from the second circuit layer 331.
As shown in fig. 3i and 3j, at least a portion of the carrier board 300 is removed to obtain the circuit board 520.
According to the circuit board manufacturing method, the first conductive column is manufactured on the carrier plate provided with the first circuit layer, and then the first insulating layer is manufactured. The circuit board manufacturing method does not need to pass through the pressing process, and therefore the thickness around the pressing is not needed to be controlled, the manufacturing process is simpler and more convenient to manufacture, meanwhile, the pressing process needs a longer time, the insulating layer and the copper foil are made to be in full contact, however, the pressing is not needed to be carried out, the manufacturing period of the circuit board is shortened, and therefore the circuit board manufacturing method can be simpler in process compared with the prior art, more convenient to manufacture and shorter in period. First liquid insulating material covers first leading electrical pillar for first liquid insulating material can cover first leading electrical pillar completely, plays the effect fixed to first leading electrical pillar, is favorable to making first leading electrical pillar attenuate to leveling state in the follow-up, simultaneously, by the first insulating layer deviates from one side of first circuit layer begins the attenuate the thickness of first insulating layer, thereby can adjust the thickness of first insulating layer and first leading electrical pillar according to actual, and because thickness is later stage direct processing, can control the precision of thickness better, and not need control heating pressurization parameter like the pressfitting, make the control to first insulating layer thickness and first leading electrical pillar thickness more accurate in this application. In addition, when the thicknesses of the first insulating layer and the second insulating layer are reduced, an ultra-thin and multilayered wiring board can be obtained by a convenient method.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A circuit board manufacturing method is characterized by comprising the following steps:
providing a carrier plate provided with a first circuit layer;
providing a first die, wherein the first die is provided with a first through hole;
abutting the first mold with the carrier plate, and aligning the first through hole with at least part of the first circuit layer;
electroplating on the surface of the first circuit layer to form a first conductive pillar in the first through hole;
removing the first mold;
arranging a first liquid insulating material on the carrier plate, and enabling the first liquid insulating material to cover the surface of the first circuit layer;
and curing the first liquid insulating material to convert the first liquid insulating material into a first insulating layer so as to obtain the circuit board.
2. The method for manufacturing a circuit board according to claim 1, wherein in the step of providing the carrier board provided with the first circuit layer, the carrier board is a metal carrier board.
3. The method for manufacturing a circuit board according to claim 1, wherein the step of providing the carrier board provided with the first circuit layer comprises:
providing a carrier plate;
arranging a metal layer on the carrier plate;
the metal layer forms the first line layer by including a film coating process, an exposure process, a developing process, an etching process, and a film removal process.
4. The method for manufacturing a circuit board according to claim 3, wherein the step of disposing the metal layer on the carrier includes:
and electroplating a metal layer on the carrier plate.
5. The method for manufacturing a circuit board according to claim 1, wherein a first liquid insulating material is disposed on the carrier plate, and the first liquid insulating material covers a surface of the first circuit layer; the step of curing the first liquid insulating material so that the first liquid insulating material is converted into a first insulating layer to obtain a wiring board includes:
arranging a first liquid insulating material on the carrier plate, enabling the first liquid insulating material to cover the surface of the first circuit layer, and enabling the first liquid insulating material to cover the first conductive column;
curing the first liquid insulating material such that the first liquid insulating material is transformed into a first insulating layer;
and thinning the first insulating layer from the surface of the first circuit layer to expose one end of the first conductive column away from the first circuit layer.
6. The method of manufacturing a wiring board according to claim 1, wherein the step of curing the first liquid insulating material to convert the first liquid insulating material into a first insulating layer to obtain the wiring board comprises:
curing the first liquid insulating material such that the first liquid insulating material is transformed into a first insulating layer;
and removing at least part of the carrier plate to obtain the circuit board.
7. The method of claim 1, wherein the step of abutting the first mold against the carrier plate and aligning the first through hole with at least a portion of the first circuit layer comprises:
and abutting the first mold with the carrier plate, aligning the first through hole with at least part of the first circuit layer, and covering at least part of the first circuit layer by the first mold.
8. The method for manufacturing a circuit board according to claim 1, wherein the carrier board is a circuit board.
9. The method for manufacturing a circuit board according to claim 1, wherein the step of curing the first liquid insulating material to convert the first liquid insulating material into a first insulating layer further comprises the following steps:
arranging a second circuit layer on one surface, away from the first circuit layer, of the first insulating layer, wherein the second circuit layer is connected with the first conductive columns;
providing a second die, wherein the second die is provided with a second through hole;
abutting the second mold with the first insulating layer and aligning the second via with at least a portion of the second circuit layer;
electroplating the surface of the second circuit layer to form a second conductive column in the second through hole;
removing the second mold;
disposing a second liquid insulating material on the first insulating layer such that the second liquid insulating material covers a surface of the second circuit layer;
curing the second liquid insulating material such that the second liquid insulating material is transformed into a second insulating layer.
10. A wiring board produced by the wiring board production method according to any one of claims 1 to 9.
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| CN201911302928.4A CN110996519A (en) | 2019-12-17 | 2019-12-17 | Circuit board and manufacturing method thereof |
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| CN201911302928.4A CN110996519A (en) | 2019-12-17 | 2019-12-17 | Circuit board and manufacturing method thereof |
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Cited By (1)
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| CN113517224A (en) * | 2021-07-09 | 2021-10-19 | 广东工业大学 | Forming process of through hole and blind hole interconnection structure |
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