CN110994105A - Power combining and distributing structure, power amplifier and medical equipment - Google Patents
Power combining and distributing structure, power amplifier and medical equipment Download PDFInfo
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- CN110994105A CN110994105A CN201911363686.XA CN201911363686A CN110994105A CN 110994105 A CN110994105 A CN 110994105A CN 201911363686 A CN201911363686 A CN 201911363686A CN 110994105 A CN110994105 A CN 110994105A
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Abstract
The present application relates to a power combining and distributing structure, a power amplifier, and a medical apparatus. The power combining distribution structure includes: the circuit board, the first balun module and the second balun module; the first balun module and the second balun module are arranged on the circuit board, the first balun module comprises a first differential component, the second balun module comprises a second differential component, and the first balun module and the second balun module comprise a shared common component; the power signal is synthesized or distributed by the first differential component, the second differential component, and the common component. The first balun module and the second balun module share the common component, so that the space occupied by the balun modules can be reduced, the first differential component, the second differential component and the common component are used for synthesizing or distributing power signals, a synthesizer and a distributor are saved, the space occupied by the power synthesis distribution structure is further saved, and the production cost of the power synthesis distribution structure is saved.
Description
Technical Field
The present application relates to the technical field of medical devices, and in particular, to a power combining and distributing structure, a power amplifier, and a medical device.
Background
A magnetic resonance imaging apparatus is a type of tomographic imaging that obtains electromagnetic signals from a human body using a magnetic resonance phenomenon and reconstructs human body information. The magnetic resonance imaging apparatus applies a radio frequency pulse of a certain specific frequency to a human body in a static magnetic field to excite hydrogen protons in the human body to generate a magnetic resonance phenomenon. After the stopping pulse, the protons produce magnetic resonance signals during relaxation. And acquiring a corresponding magnetic resonance signal, and performing image reconstruction on the magnetic resonance signal to obtain a medical image. Magnetic resonance imaging (MR) is a very powerful imaging method. The technology can obtain high-contrast clear images of the interior of a sample/tissue under the conditions of no damage and no ionizing radiation, and is widely applied to various fields, particularly medical diagnosis. Compared with other auxiliary imaging examination means, the nuclear magnetic resonance imaging examination method has the advantages of multiple imaging parameters, high scanning speed, high tissue resolution, clearer image and the like. Can find early lesions, and is a tool for early screening of tumors, heart diseases and cerebrovascular diseases at present.
A power amplifier is an important component of a magnetic resonance imaging apparatus, and a power combining/distributing structure is commonly used in many high-power amplifiers to combine power generated by a plurality of low-power devices into a desired high power. The current power combining/dividing is realized by a balun structure and a combiner or a divider. In order to output higher power, a multi-stage power combining/distributing structure is often required, occupying a larger space.
Disclosure of Invention
In view of the above, it is desirable to provide a power combining and distributing structure, a power amplifier, and a medical apparatus that can save space.
A power combining distribution architecture, the power combining distribution architecture comprising: the circuit board, the first balun module and the second balun module; the first balun module and the second balun module are both arranged on the circuit board, the first balun module comprises a first differential component, the second balun module comprises a second differential component, and the first balun module and the second balun module comprise a common component; and the power signals are synthesized or distributed through the first differential component, the second differential component and the common component.
In one embodiment, the first differential component is used for accessing a first power signal; the second differential component is used for accessing a second power signal; the common component is used for outputting a third power signal synthesized according to the first power signal and the second power signal.
In one embodiment, the common component is used for accessing a fourth power signal; the first differential component is used for outputting a fifth power signal distributed according to the fourth power signal; the second differential component is used for outputting a sixth power signal distributed according to the fourth power signal.
In one embodiment, the circuit board is a double-layer structure and comprises a first circuit layer and a second circuit layer; the first balun module is arranged on the first circuit layer, and the second balun module is arranged on the second circuit layer.
In one embodiment, the common components of the first balun module and the second balun module are arranged between the first circuit layer and the second circuit layer of the circuit board; the first differential assembly of the first balun module is arranged on one surface, far away from the common assembly, of the first circuit layer, and corresponds to the position of the common assembly; the second differential assembly of the second balun module is arranged on one surface, far away from the common assembly, of the second line layer, and corresponds to the position of the common assembly.
In one embodiment, the first differential assembly includes a first differential cell and a second differential cell; the first differential unit and the second differential unit are arranged at intervals and correspond to the position of the common component; the second differential assembly comprises a third differential unit and a fourth differential unit; the third differential unit and the fourth differential unit are arranged at intervals and correspond to the position of the common component.
In one embodiment, the first differential unit includes a first differential terminal; the second differential unit comprises a second differential end; the third differential unit comprises a third differential end; the fourth differential unit comprises a fourth differential terminal; the common assembly comprises a common end; the first differential end and the second differential end are connected with a first power signal, and the phase difference between the first differential end and the second differential end is 180 degrees; the third differential end and the fourth differential end are connected with a second power signal, and the phase difference between the third differential end and the fourth differential end is 180 degrees; the phase difference between the first differential end and the third differential end is 0 degree, and the phase difference between the second differential end and the fourth differential end is 0 degree; the common terminal outputs a third power signal synthesized from the first power signal and the second power signal.
In one embodiment, the first differential unit includes a first differential terminal; the second differential unit comprises a second differential end; the third differential unit comprises a third differential end; the fourth differential unit comprises a fourth differential terminal; the common assembly comprises a common end; the public end is accessed with a fourth power signal; the first differential end and the second differential end output a fifth power signal distributed according to the fourth power signal, and the phase difference between the first differential end and the second differential end is 180 degrees; the third differential end and the fourth differential end output a sixth power signal distributed according to the fourth power signal, and the phase difference between the third differential end and the fourth differential end is 180 degrees; the phase difference between the first differential end and the third differential end is 0 degree, and the phase difference between the second differential end and the fourth differential end is 0 degree.
In one embodiment, the power combining structure further includes: the system comprises a first isolation module and a second isolation module; the first isolation module is arranged between the first differential end and the third differential end and used for increasing isolation between in-phase signals; the second isolation module is arranged between the second differential end and the fourth differential end and used for increasing isolation between in-phase signals.
A power amplifier comprising a power combining and splitting architecture as claimed in any one of the above.
A medical device comprises the power amplifier.
The power synthesis distribution structure comprises a circuit board, a first balun module and a second balun module. The first balun module and the second balun module are arranged on the circuit board, the first balun module comprises a first differential component, the second balun module comprises a second differential component, the first balun module and the second balun module comprise a shared common component, and power signals are synthesized or distributed through the first differential component, the second differential component and the common component. The first balun module and the second balun module share the common component, so that the space occupied by the balun modules can be reduced, the first differential component, the second differential component and the common component are used for synthesizing or distributing power signals, a synthesizer and a distributor are saved, the space occupied by the power synthesis distribution structure is further saved, and the production cost of the power synthesis distribution structure is saved.
Drawings
FIG. 1 is a schematic diagram of a balun module in one embodiment;
FIG. 2 is a schematic diagram of the distribution of balun on the PCB in one embodiment;
fig. 3 is a schematic structural diagram of a balun and a power divider/combiner in an embodiment;
FIG. 4 is a schematic diagram of the structure of a first balun module and a second balun module in one embodiment;
FIG. 5 is a schematic diagram of the distribution of the balun structure of FIG. 4 on a PCB;
fig. 6 is a schematic diagram of a power combining distribution structure in one embodiment.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and in the accompanying drawings, preferred embodiments of the present application are set forth. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. This application is capable of embodiments in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. In the description of the present application, "a number" means at least one, such as one, two, etc., unless specifically limited otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Power combining/dividing structures are commonly used in many high power amplifiers to combine the power generated by multiple low power devices into the desired high power. The power synthesis has two types, one is equal-amplitude reverse-phase synthesis/distribution, the other is equal-amplitude in-phase synthesis/distribution, and the power synthesis and the power amplifier have wide application, wherein the equal-amplitude reverse synthesis can be realized by using a balun and synthesizer structure. The signals at the balun differential ends are equal in amplitude and 180 degrees in phase difference. Balun is commonly used in the design of a power amplifier in a push-pull structure, and the power amplifier in the push-pull structure has higher efficiency in inhibiting even harmonics. In order to obtain higher power, a structure that a plurality of power devices work simultaneously and then multi-stage power synthesis is performed is often adopted, and a common synthesizer is a two-way power synthesizer with equal amplitude and same phase.
The balun structure includes: LC balun, transmission line balun, and microstrip printed balun. Among them, the LC balun is essentially a bridge, called a "lattice-form" balun. The circuit comprises two capacitors and two inductors which respectively generate plus and minus 90-degree phase shift. The transmission line balun may be implemented by a lambda/4 transmission line. As shown in fig. 1-2, the microstrip printed balun may be printed on a PCB board or on a microwave integrated circuit dielectric board. The microstrip line balun includes: the differential layer 10 and the common layer 20 are formed by microstrip lines, the differential layer 10 and the common layer 20 are respectively disposed on two sides of the PCB 30, and a projection position of the microstrip line structure of the differential layer 10 on the PCB 30 and a projection position of the microstrip line structure of the common layer 20 on the PCB 30 may or may not coincide. The differential layer 10 includes two sections of microstrip line structures, one end of the first section of microstrip line structure is a differential end 1, the other end is grounded, one end of the second section of microstrip line structure is a differential end 2, the other end is grounded, the common layer is a common end, the differential end of the first section of microstrip line structure and the differential end of the second section of microstrip line structure have the same signal amplitude and the phase difference of 180 degrees. The balun and the synthesizer have various realization forms, and can be realized by a magnetic core, a discrete capacitance inductor or a PCB circuit. In the prior art, as shown in fig. 3, the differential layer and the common layer of the balun are respectively disposed on two sides of the PCB. The first balun structure balun A comprises a differential end A1, a differential end A2 and a common end A, and is connected to the first end of the synthesizer/power divider by the common end A; the second balun structure balun B includes a differential terminal B1, a differential terminal B2, and a common terminal B, and is connected to the second terminal of the combiner/power divider by the common terminal B, and the combiner/power divider further includes a third terminal. An isolation device is arranged between the public terminal A and the public terminal B. If the combination of the balun structure and the power divider is adopted, the third terminal of the power divider is connected with a power signal transmitted by the high-power device, the power divider divides the power signal into a power signal required by the first balun structure and a power signal required by the second balun structure, the power signal required by the first balun structure is transmitted to the first load, and the power signal required by the second balun structure is transmitted to the second load. If the combination of the balun structure and the synthesizer is adopted, the first balun structure is connected to a power signal transmitted by the first power device, and the power signal transmitted by the first power device is transmitted to the synthesizer; the second balun structure is connected to a power signal transmitted by the second power device and transmits the power signal transmitted by the second power device to the synthesizer; the synthesizer synthesizes the power signal transmitted by the first power device and the power signal transmitted by the second power device and transmits the synthesized power signal to a load. The PCB balun and the synthesizer are suitable for high-power and high-frequency scenes, but because the two balun structures are arranged on the PCB side by side, the two balun structures and the synthesizer both occupy the area of the PCB and occupy larger space.
In one embodiment, as shown in fig. 4-6, a power combining distribution structure includes: a circuit board 100, a first balun module 200 and a second balun module 300; the first balun module 200 and the second balun module 300 are both disposed on the wiring board 100, the first balun module 200 includes a first differential component 210, the second balun module 300 includes a second differential component 310, and the first balun module 200 and the second balun module 300 include a common component 320; the power signal is combined or distributed by the first differential component 210, the second differential component 310 and the common component 320.
By sharing the common component 320 with the first balun module 200 and the second balun module 300, the space occupied by the balun modules can be saved. The power signals are synthesized or distributed through the first differential component 210, the second differential component 310 and the common component 320, so that a synthesizer and a distributor are saved, the space occupied by the power synthesis distribution structure is further saved, and the production cost of the power synthesis distribution structure is saved.
In one embodiment, when the power combining distribution structure is used as a power combining device, the first differential component 210 is used for accessing a first power signal; the second differential component 310 is configured to access a second power signal; the common component 320 is configured to output a third power signal synthesized from the first power signal and the second power signal.
Specifically, the first differential component 210 of the first balun structure 200 is connected to a first power signal transmitted by a first power device, the second differential component 310 of the second balun structure 300 is connected to a second power signal transmitted by a second power device, the first power signal and the second power signal are combined among the first differential component 210, the second differential component 310 and the common component 320 to form a third power signal, the common component 320 is configured to output a third power signal combined according to the first power signal and the second power signal to a load, and the power of the third power signal is greater than the power of the first power signal and the power of the second power signal.
In one embodiment, the common component 320 is used to access a fourth power signal when the power combining and distributing structure is used as a power distributing device; the first differential component 210 is configured to output a fifth power signal distributed according to the fourth power signal; the second differential component 310 is configured to output a sixth power signal distributed according to the fourth power signal.
Specifically, the common component 320 of the first balun module 200 and the second balun module 300 accesses a fourth power signal, and the fourth power signal is divided into a fifth power signal and a sixth power signal among the first differential component 210, the second differential component 310, and the common component 320. The fifth power signal is a power signal required by the load connected to the first balun module 200, and the sixth power signal is a power signal required by the load connected to the second balun module 300. The first differential component outputs a fifth power signal distributed according to the fourth power signal to a load; the second differential assembly 310 outputs the sixth power signal distributed according to the fourth power signal to the load.
In one embodiment, the circuit board 100 has a double-layer structure, including a first circuit layer 110 and a second circuit layer 120; the first balun module 200 is disposed on the first circuit layer 110, and the second balun module 300 is disposed on the second circuit layer 120.
Specifically, the wiring board 100 may be a multilayer board, which refers to a printed board having three or more layers of conductive patterns laminated with insulating materials therebetween at intervals, and the conductive patterns therebetween interconnected as required. The common component 320 of the first balun module 200 and the second balun module 300 is disposed between the first circuit layer 110 and the second circuit layer 120 of the circuit board 100, and the first differential component 210 of the first balun module 200 is disposed on a surface of the first circuit layer 110 away from the common component 320, and corresponds to the position of the common component 320. The position of the first differential component 210 corresponding to the position of the common component 320 includes two cases: the projection position of the first differential component 210 on the circuit board 100 overlaps with the projection position of the common component 320 on the circuit board 100; the projected position of the first differential component 210 on the circuit board 100 and the projected position of the common component 320 on the circuit board 100 do not overlap. The positions of the first differential component 210 and the common component 320 correspond to each other, and only the correspondence relationship between the first differential component 210 and the common component 320 is required. The second differential element 310 of the second balun module 300 is disposed on a side of the second circuit layer 120 away from the common element 320, and corresponds to the position of the common element 320. Wherein, the position of the second differential component 310 corresponding to the common component 320 includes two cases: the projection position of the second differential component 310 on the circuit board 100 overlaps the projection position of the common component 320 on the circuit board 100; the projected position of the second differential component 310 on the wiring board 100 does not overlap the projected position of the common component 320 on the wiring board 100. The positions of the second differential component 310 and the common component 320 correspond to each other, and it is only necessary that the second differential component 310 and the common component 320 have a corresponding relationship.
In one embodiment, the first differential component 210 includes a first differential unit 211 and a second differential unit 212; the first differential unit 211 and the second differential unit 212 are arranged at intervals and correspond to the position of the common component 320; the second differential component 310 includes a third differential unit 311 and a fourth differential unit 312; the third differential unit 311 and the fourth differential unit 312 are disposed at an interval, and correspond to the position of the common component 320.
Specifically, the first differential component 210 may be arranged in a straight line or in a curved line, and it is only necessary that the first differential component 210 corresponds to the position of the common component 320, and preferably, the first differential component 210 is arranged in a curved line. The second differential component 310 may be arranged in a straight line or in a curved line, and it is only necessary that the second differential component 310 corresponds to the common component 320, and the preferred second differential component 310 is arranged in a curved line.
In one embodiment, when the power combining split structure is used as a power combining device, the first differential unit 211 includes a first differential end 2111; the second differential unit 212 includes a second differential terminal 2121; the third differential unit 311 includes a third differential terminal 3111; the fourth differential unit 312 includes a fourth differential terminal 3121; the common component 320 includes a common terminal 3211; the first differential end 2111 and the second differential end 2121 access a first power signal, and the phase difference between the first differential end 2111 and the second differential end 2121 is 180 °, that is, the first power signals accessed by the first differential end 2111 and the second differential end 2121 have the same amplitude and opposite phase; the third differential port 3111 and the fourth differential port 3121 access a second power signal, and a phase difference between the third differential port 3111 and the fourth differential port 3121 is 180 °, that is, the amplitude of the second power signal accessed by the third differential port 3111 and the fourth differential port 3121 is the same, and the phases are opposite; the phase difference between the first differential end 2111 and the third differential end 3111 is 0 °, and the phase difference between the second differential end 2121 and the fourth differential end 3121 is 0 °; the common terminal 3211 outputs a third power signal synthesized from the first and second power signals.
Specifically, the first differential end 2111 and the second differential end 2121 of the first balun module 200 are connected to the first power signal of the first power device; the third differential port 3111 and the fourth differential port 3121 of the second balun module 300 receive the second power signal of the second power device. The first and second power signals are combined into a third power signal among the first and second differential components 210 and 310 and the common component 320, and the common component 320 transmits the third power signal to the load.
In one embodiment, when the power combining and distributing structure is used as a power distributing device, the first differential unit 211 includes a first differential end 2111; the second differential unit 212 includes a second differential terminal 2121; the third differential unit 311 includes a third differential terminal 3111; the fourth differential unit 312 includes a fourth differential terminal 3121; the common component 320 includes a common terminal 3211; the common terminal 3211 accesses a fourth power signal; the first differential end 2111 and the second differential end 2121 output a fifth power signal distributed according to the fourth power signal, and the phase difference between the first differential end 2111 and the second differential end 2121 is 180 °, that is, the amplitude of the fifth power signal distributed by the first differential end 2111 and the second differential end 2121 is the same, and the phase is opposite; the third differential port 3111 and the fourth differential port 3121 output sixth power signals distributed according to the fourth power signals, and the phase difference between the third differential port 3111 and the fourth differential port 3121 is 180 °, that is, the sixth power signals distributed by the third differential port 3111 and the fourth differential port 3121 have the same amplitude and opposite phase; the first differential port 2111 and the third differential port 3111 are out of phase by 0 °, and the second differential port 2121 and the fourth differential port 3121 are out of phase by 0 °.
Specifically, the common terminal 3211 of the common component 320 accesses a fourth power signal, which is divided among the first differential component 210, the second differential component 310, and the common component 320 into a fifth power signal and a sixth power signal. The fifth power signal is a power signal required by the load connected to the first balun module 200, and the sixth power signal is a power signal required by the load connected to the second balun module 300. The first differential port 2111 and the second differential port 2121 output a fifth power signal to the load, and the third differential port 3111 and the fourth differential port 3121 output a sixth power signal to the load.
In one embodiment, the power combining structure further includes: a first isolation module 400 and a second isolation module 500; the first isolation module 400 is disposed between the first differential end 2111 and the third differential end 3111, and is configured to increase isolation between in-phase signals; the second isolation module 500 is disposed between the second differential end 2121 and the fourth differential end 3121, and is configured to increase isolation between in-phase signals. The isolation circuit may be a pure resistive element or an element including a reactance, and the present embodiment does not specifically limit the structure of the isolation circuit, and only needs to increase the isolation between phase signals.
In one embodiment, the original PCB plane layout between the balun structure and the synthesizer is changed into a three-dimensional layout. The first balun module and the second balun module 300 are divided into three layers by arranging a double-layer circuit board structure, common units of the first balun module and the second balun module are combined into a whole, and the power is subjected to in-phase synthesis while performing opposite-phase synthesis between a differential unit and the common units, so that the functions of the two original baluns and a synthesizer/power divider can be realized only by the area of one balun module, the space is greatly saved, higher power density can be realized in the same space, and the application value in an application scene with limited space is high.
The power synthesis distribution structure comprises a circuit board, a first balun module and a second balun module. The first balun module and the second balun module are arranged on the circuit board, the first balun module comprises a first differential component, the second balun module comprises a second differential component, the first balun module and the second balun module comprise a shared common component, and power signals are synthesized or distributed through the first differential component, the second differential component and the common component. The first balun module and the second balun module share the common component, so that the space occupied by the balun modules can be reduced, the first differential component, the second differential component and the common component are used for synthesizing or distributing power signals, a synthesizer and a distributor are saved, the space occupied by the power synthesis distribution structure is further saved, and the production cost of the power synthesis distribution structure is saved.
In one embodiment, there is also provided a power amplifier, wherein the power combining and distributing device in the power amplifier is the power combining and distributing structure in any one of the above embodiments. By providing the power combining/dividing structure in the power amplifier, the power amplifier can be further miniaturized, and the cost of the power amplifier can be saved.
In one embodiment, a medical device is also provided, wherein the medical device uses the power amplifier, and the production cost of the medical device can be saved by using the power amplifier.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. A power combining distribution architecture, the power combining distribution architecture comprising: the circuit board, the first balun module and the second balun module;
the first balun module and the second balun module are both arranged on the circuit board, the first balun module comprises a first differential component, the second balun module comprises a second differential component, and the first balun module and the second balun module comprise a common component; and the power signals are synthesized or distributed through the first differential component, the second differential component and the common component.
2. The power combining distribution architecture of claim 1,
the first differential component is used for accessing a first power signal;
the second differential component is used for accessing a second power signal;
the common component is used for outputting a third power signal synthesized according to the first power signal and the second power signal.
3. The power combining distribution architecture of claim 1,
the common component is used for accessing a fourth power signal;
the first differential component is used for outputting a fifth power signal distributed according to the fourth power signal;
the second differential component is used for outputting a sixth power signal distributed according to the fourth power signal.
4. The power combining distribution structure according to any one of claims 1-3, wherein the wiring board is a two-layer structure including a first wiring layer and a second wiring layer;
the first balun module is arranged on the first circuit layer, and the second balun module is arranged on the second circuit layer.
5. The power combining distribution architecture of claim 4,
the common component of the first balun module and the second balun module is arranged between the first circuit layer and the second circuit layer of the circuit board; the first differential assembly of the first balun module is arranged on one surface, far away from the common assembly, of the first circuit layer, and corresponds to the position of the common assembly; the second differential assembly of the second balun module is arranged on one surface, far away from the common assembly, of the second line layer, and corresponds to the position of the common assembly.
6. The power combining distribution architecture of claim 5,
the first differential component comprises a first differential unit and a second differential unit; the first differential unit and the second differential unit are arranged at intervals and correspond to the position of the common component;
the second differential assembly comprises a third differential unit and a fourth differential unit; the third differential unit and the fourth differential unit are arranged at intervals and correspond to the position of the common component.
7. The power combining distribution architecture of claim 6,
the first differential unit comprises a first differential end; the second differential unit comprises a second differential end; the third differential unit comprises a third differential end; the fourth differential unit comprises a fourth differential terminal; the common assembly comprises a common end;
the first differential end and the second differential end are connected with a first power signal, and the phase difference between the first differential end and the second differential end is 180 degrees;
the third differential end and the fourth differential end are connected with a second power signal, and the phase difference between the third differential end and the fourth differential end is 180 degrees;
the phase difference between the first differential end and the third differential end is 0 degree, and the phase difference between the second differential end and the fourth differential end is 0 degree;
the common terminal outputs a third power signal synthesized from the first power signal and the second power signal.
8. The power combining distribution architecture of claim 6,
the first differential unit comprises a first differential end; the second differential unit comprises a second differential end; the third differential unit comprises a third differential end; the fourth differential unit comprises a fourth differential terminal; the common assembly comprises a common end;
the public end is accessed with a fourth power signal;
the first differential end and the second differential end output a fifth power signal distributed according to the fourth power signal, and the phase difference between the first differential end and the second differential end is 180 degrees;
the third differential end and the fourth differential end output a sixth power signal distributed according to the fourth power signal, and the phase difference between the third differential end and the fourth differential end is 180 degrees;
the phase difference between the first differential end and the third differential end is 0 degree, and the phase difference between the second differential end and the fourth differential end is 0 degree.
9. The power combining distribution structure according to any one of claims 7-8, wherein the power combining structure further comprises: the system comprises a first isolation module and a second isolation module;
the first isolation module is arranged between the first differential end and the third differential end and used for increasing isolation between in-phase signals;
the second isolation module is arranged between the second differential end and the fourth differential end and used for increasing isolation between in-phase signals.
10. A power amplifier comprising the power combining distribution architecture of any one of claims 1-9.
11. A medical device comprising the power amplifier of claim 10.
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