CN110988146A - Packaged chip detection method - Google Patents
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- CN110988146A CN110988146A CN201911060347.4A CN201911060347A CN110988146A CN 110988146 A CN110988146 A CN 110988146A CN 201911060347 A CN201911060347 A CN 201911060347A CN 110988146 A CN110988146 A CN 110988146A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
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Abstract
The invention provides a packaged chip detection method, which comprises the following steps: preprocessing a packaged chip to be detected; determining corresponding detection scanning parameters according to the packaged chip to be detected; configuring the acoustic scanning microscope according to the detection scanning parameters; and scanning and detecting the preprocessed packaged chip to be detected by using the configured acoustic scanning microscope. The SONIX Q-350 acoustic scanning microscope is used for scanning the internal structure of the packaged chip, so that the connection condition of the solder bumps inside the packaged chip and the substrate can be completely, accurately and clearly displayed, whether bonding holes exist or not can be conveniently observed, and the quality of the device can be detected and controlled.
Description
Technical Field
The invention relates to the field of electronic device detection tests, in particular to a packaged chip detection method.
Background
With the increasing integration level of silicon single chips, the requirements for packaging integrated circuits are more strict, the number of I/O pins is increased rapidly, and the power consumption is increased. In order to meet the development requirement and reduce the parasitic inductance and noise of the device, the traditional wire bonding mode is gradually replaced by a novel packaging mode. On the basis of the original packaging variety, the flip chip ball grid array packaging realizes the electric connection between a chip and a packaging substrate by utilizing solder ball salient points, and the bare chip is installed on the substrate with the front side facing downwards, so that the flip chip ball grid array packaging becomes the best choice for high-density, high-performance, multifunctional and high-I/O pin packaging. The chip devices are highly integrated and are generally used for central processing control and other purposes, so that the quality detection is particularly important, and an important concern of the quality detection is the connection condition between the solder bumps of the chip and the substrate.
An acoustic scanning microscope (SAM) is a multifunctional and high-resolution microscopic imaging instrument, has the characteristics of high resolution of electron microscopy and nondestructive internal imaging of acoustic microscopy, and can detect the lattice structure, impurity particles, internal cracks, layering defects, cavities, bubbles, gaps and the like in materials. However, the existing standard and method for detecting by using the acoustic scanning microscope are not suitable for detecting the packaged chip and can not accurately detect the welding spot connection condition of the packaged chip.
Disclosure of Invention
In view of the above, the present invention is directed to a method for detecting the internal condition of a packaged chip to obtain a complete, accurate and clear connection condition between a solder joint and a substrate.
Based on the above purpose, the present invention provides a packaged chip detection method, which includes:
preprocessing a packaged chip to be detected;
determining corresponding detection scanning parameters according to the packaged chip to be detected;
configuring the acoustic scanning microscope according to the detection scanning parameters;
and scanning and detecting the preprocessed packaged chip to be detected by using the configured acoustic scanning microscope.
Optionally, the acoustic scanning microscope is model SONIX Q-350.
Optionally, the preprocessing the packaged chip to be tested includes:
unsealing the packaged chip to be tested;
and cleaning the back coating of the chip main body exposed after the unsealing.
Optionally, the detection scan parameter includes a preparation parameter and a scan mode parameter;
the preparation parameters are used for determining the specification of the selected acoustic scanning probe;
the scanning mode parameter is used for determining a scanning working mode of the acoustic scanning microscope.
Optionally, the preparation parameters include:
the specification of the selected acoustic scanning probe is 110 MHz.
Optionally, the scan mode parameters include:
the ENERGY scanning mode of the acoustic scanning microscope is a gating state;
setting the scanning high-pass parameter of the acoustic scanning microscope to be 5 and the scanning low-pass parameter to be 300.
Optionally, the performing, by using the configured acoustic scanning microscope, scanning and detecting the preprocessed packaged chip to be detected includes:
and immersing the preprocessed packaged chip to be tested into purified water, installing an acoustic scanning probe and moving the acoustic scanning microscope to align the acoustic scanning probe to the preprocessed packaged chip to be tested, and adjusting dynamic scanning parameters to scan the preprocessed packaged chip to be tested.
Optionally, the dynamic scanning parameters include a gain parameter, a focusing parameter, and a resolution parameter;
the adjusting range of the gain parameter is 30dB-40 dB;
the adjustment range of the focusing parameters is 50% -60%;
and adjusting the resolution parameter according to the size of the packaged chip to be tested.
Optionally, the resolution parameter is set to 50.
From the above, it can be seen that the packaged chip detection method provided by the invention can ensure complete, accurate and clear display of the connection condition between the solder bump of the chip main body in the packaged chip and the PCB substrate by determining the corresponding detection scanning parameters for the packaged chip to be detected and pre-configuring the acoustic scanning microscope according to the detection scanning parameters to scan and detect the packaged chip to be detected, thereby facilitating detection and control of the quality of the packaged chip.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic diagram illustrating a method for detecting a packaged chip according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an internal structure of the chip to be tested obtained after detection and scanning in the method for detecting a packaged chip according to the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
It is to be noted that technical terms or scientific terms used in the embodiments of the present invention should have the ordinary meanings as understood by those having ordinary skill in the art to which the present disclosure belongs, unless otherwise defined. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
As shown in fig. 1, some optional embodiments of the present invention provide a packaged chip detection method, including:
s1: preprocessing a packaged chip to be detected;
s2: determining corresponding detection scanning parameters according to the packaged chip to be detected;
s3: configuring the acoustic scanning microscope according to the detection scanning parameters;
s4: and scanning and detecting the preprocessed packaged chip to be detected by using the configured acoustic scanning microscope.
The model of the acoustic scanning microscope is SONIX Q-350, the packaging chip detection method utilizes the acoustic scanning microscope to scan the packaging chip to be detected, firstly, the packaging chip to be detected is preprocessed, packaging is removed to obtain a chip main body, detection scanning parameters are set in a targeted mode to configure the acoustic scanning microscope, then, the chip main body is scanned, a complete, accurate and clear scanning result of the internal structure of the packaging chip can be obtained, whether a bonding hole exists or not can be conveniently observed, and the quality of a packaging device is detected and controlled.
In some optional embodiments, the packaged chip detecting method, where the preprocessing S1 is performed on the packaged chip to be tested, includes:
the packaged chip to be tested is unpacked, specifically, the packaged chip to be tested is mechanically unpacked by using tools such as a scalpel, bench clamp, flat tongs, a hammer and the like, and a chip main body is exposed;
the back coating of the chip main body exposed after the unsealing is cleaned, and particularly, the back coating of the chip main body can be wiped off by alcohol.
According to the packaged chip detection method, the chip to be detected is preprocessed, a clean chip main body with a smooth surface is obtained, foreign matter influence is discharged, and scanning detection on the chip main body is facilitated.
In some alternative embodiments, the packaged chip detecting method includes detecting scan parameters including a preparation parameter and a scan mode parameter;
the preparation parameters are used for determining the specification of the selected acoustic scanning probe;
the scanning mode parameter is used for determining a scanning working mode of the acoustic scanning microscope.
In the method for inspecting a packaged chip provided in some optional embodiments, the specification of the acoustic scanning probe selected by the acoustic scanning microscope for the packaged chip to be inspected is 110 MHz.
In some optional embodiments, the packaged chip detecting method further includes:
the ENERGY scanning mode of the acoustic scanning microscope is a gating state;
setting the scanning high-pass parameter of the acoustic scanning microscope to be 5 and the scanning low-pass parameter to be 300.
And before the scanning working mode configuration of the acoustic scanning microscope is carried out according to the scanning mode parameters, carrying out system resetting on the acoustic scanning microscope.
In some optional embodiments, the performing, by using the configured acoustic scanning microscope, scanning and detecting S4 on the preprocessed packaged chip to be tested includes:
and immersing the preprocessed packaged chip to be tested into purified water, installing an acoustic scanning probe and moving the acoustic scanning microscope to align the acoustic scanning probe to the preprocessed packaged chip to be tested, and adjusting dynamic scanning parameters to scan the preprocessed packaged chip to be tested.
In some optional embodiments, the method for detecting a packaged chip includes the steps of obtaining a dynamic scan parameter, a gain parameter, a focus parameter, and a resolution parameter;
the adjusting range of the gain parameter is 30dB-40 dB;
the adjustment range of the focusing parameters is 50% -60%;
and adjusting the resolution parameter according to the size of the packaged chip to be tested.
In some alternative embodiments, the packaged chip inspection method is provided, wherein the resolution parameter is set to 50.
Because the packaged chip and the conventional plastic package device are different in parameter adjustment in acoustic scanning microscopy, the resolution is 50 (adjusted according to the size of the chip body), the focusing is adjusted to be between 50% and 60%, and the gain parameter is adjusted to be between 30dB and 40dB, so that the internal structure of the chip body can be clearly scanned, internal defects can be distinguished, and as shown in fig. 2, the internal structure of the chip to be detected obtained after scanning is displayed.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of the invention, also features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity.
In addition, well known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown within the provided figures for simplicity of illustration and discussion, and so as not to obscure the invention. Furthermore, devices may be shown in block diagram form in order to avoid obscuring the invention, and also in view of the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the present invention is to be implemented (i.e., specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the invention, it should be apparent to one skilled in the art that the invention can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative instead of restrictive.
While the present invention has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic ram (dram)) may use the discussed embodiments.
The embodiments of the invention are intended to embrace all such alternatives, modifications and variances that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements and the like that may be made without departing from the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (9)
1. A packaged chip detection method is characterized by comprising the following steps:
preprocessing a packaged chip to be detected;
determining corresponding detection scanning parameters according to the packaged chip to be detected;
configuring the acoustic scanning microscope according to the detection scanning parameters;
and scanning and detecting the preprocessed packaged chip to be detected by using the configured acoustic scanning microscope.
2. The method of claim 1, wherein the acoustic scanning microscope is model SONIX Q-350.
3. The method of claim 1, wherein the pre-processing the packaged chip to be tested comprises:
unsealing the packaged chip to be tested;
and cleaning the back coating of the chip main body exposed after the unsealing.
4. The method of claim 2, wherein the detecting the scan parameter comprises a preparation parameter and a scan mode parameter;
the preparation parameters are used for determining the specification of the selected acoustic scanning probe;
the scanning mode parameter is used for determining a scanning working mode of the acoustic scanning microscope.
5. The method of claim 4, wherein the preparation parameters comprise:
the specification of the selected acoustic scanning probe is 110 MHz.
6. The method of claim 4, wherein the scan mode parameters comprise:
the ENERGY scanning mode of the acoustic scanning microscope is a gating state;
setting the scanning high-pass parameter of the acoustic scanning microscope to be 5 and the scanning low-pass parameter to be 300.
7. The method according to claim 2, wherein the performing the scanning inspection on the preprocessed packaged chip to be tested by using the configured acoustic scanning microscope comprises:
and immersing the preprocessed packaged chip to be tested into purified water, installing an acoustic scanning probe and moving the acoustic scanning microscope to align the acoustic scanning probe to the preprocessed packaged chip to be tested, and adjusting dynamic scanning parameters to scan the preprocessed packaged chip to be tested.
8. The method of claim 7, wherein the dynamic scan parameters comprise a gain parameter, a focus parameter, and a resolution parameter;
the adjusting range of the gain parameter is 30dB-40 dB;
the adjustment range of the focusing parameters is 50% -60%;
and adjusting the resolution parameter according to the size of the packaged chip to be tested.
9. The method of claim 8, wherein the resolution parameter is set to 50.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911060347.4A CN110988146A (en) | 2019-11-01 | 2019-11-01 | Packaged chip detection method |
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| CN201911060347.4A CN110988146A (en) | 2019-11-01 | 2019-11-01 | Packaged chip detection method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111452236A (en) * | 2020-04-16 | 2020-07-28 | 西安奕斯伟硅片技术有限公司 | Crystal bar bonding method and crystal bar bonding device |
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Cited By (2)
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