CN110987849A - Infrared detector and multi-channel optical filter precision registration method and combined structure - Google Patents
Infrared detector and multi-channel optical filter precision registration method and combined structure Download PDFInfo
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
- G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
- G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G01J5/08—Optical arrangements
- G01J5/0803—Arrangements for time-dependent attenuation of radiation signals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
Abstract
The invention discloses a precise registration method and a combined structure of an infrared detector and a multi-channel optical filter, wherein the method comprises the following steps: arranging a long-line multi-spectral detector chip on a detector splicing substrate; arranging an optical filter support on the detector splicing substrate, wherein the optical filter support is used for erecting a multi-channel optical filter above a long-line multi-spectral-segment detector chip; aligning the multi-channel optical filter to the long-line multi-spectral detector chip by adjusting the position of the optical filter support relative to the long-line multi-spectral detector chip; the combined structure is prepared by adopting the steps of the infrared detector and multi-channel optical filter precision registration method. The invention realizes the high-precision registration of the multi-channel optical filter and the long-line multi-spectral detector chip by a high-precision connection and adjustment mode.
Description
Technical Field
The invention relates to the field of infrared detectors, in particular to a precise registration method and a combined structure of an infrared detector and a multi-channel optical filter.
Background
The infrared detector detects the radiation and reflected infrared electromagnetic waves of the target, takes the spectral characteristics of the target as identification basis, spectral information can effectively improve the anti-interference capability of infrared detection, and adopts a multi-color detector and combines the characteristics of the target under different wave bands, so that the identification distance can be obviously improved. The multispectral infrared detector can be widely applied to the fields of early warning detection, information reconnaissance, accurate striking, night vision, astronomical observation and the like. In recent years, with the rapid development of infrared detector technology, in order to realize the requirements of larger field of view and higher spatial resolution, the requirements for ultra-long line-row and multi-spectral-band imaging are more and more urgent.
In a conventional monochromatic infrared detector, an optical filter is generally bonded to the top of a cold screen structure of the detector or the near end of a photosensitive element of the detector, precise registration of the optical filter and the photosensitive element of a detector chip is not needed, and limitation on a response spectrum of the detector can be realized only by covering the area of an effective pixel. The multi-spectral-band integrated infrared detector subdivides the spectral response of the same detector through a multi-channel optical filter, and optical registration is required to be carried out on the multi-channel combined optical filter and each pixel output channel of a detector chip so as to realize multi-spectral-band target detection. Particularly for an ultra-long linear array and multi-spectral-band imaging infrared focal plane detector assembly for aerospace, the size of a detector chip array reaches more than 8000 yuan, and relates to a four-spectral-band chip with the wavelength range of 1.5-12.5 mu m, the minimum distance between different spectral bands is 100 mu m, and the problems of signal response crosstalk between spectral bands, poor stray radiation inhibition, ghost image formation and the like can be caused by using a conventional optical filter bonding mode.
Disclosure of Invention
The embodiment of the invention provides a precise registration method and a combined structure of an infrared detector and a multi-channel optical filter, which are used for solving the problem of low bonding precision of the infrared detector and the multi-channel combined optical filter bonded by using a conventional optical filter bonding mode in the prior art.
The embodiment of the invention provides a precise registration method of an infrared detector and a multi-channel optical filter, which comprises the following steps:
arranging a long-line multi-spectral detector chip on a detector splicing substrate;
arranging an optical filter support on the detector splicing substrate, wherein the optical filter support is used for erecting a multi-channel optical filter above the long-line multi-spectral-segment detector chip;
and adjusting the position of the filter support relative to the long-line-array multi-spectral-segment detector chip so that the multi-channel filter is aligned with the long-line-array multi-spectral-segment detector chip.
Optionally, a detector alignment mark is arranged on the long-line multispectral detector chip, and a substrate alignment mark is arranged on the detector splicing substrate;
and when the detector alignment mark is aligned with the substrate alignment mark, the long-line multi-spectral-band detector chip is correctly installed relative to the detector splicing base plate.
Optionally, the detector splicing substrate is provided with an alignment bonding mark;
the alignment bonding mark is used for indicating the installation position of the optical filter support on the detector splicing substrate.
Optionally, a spectrum registration identifier is arranged on the long-line multi-spectrum detector chip;
the spectral registration identifier is used for indicating the placement position of the multichannel filter relative to the long-line multi-spectral detector chip so as to further adjust the position of the filter support.
Optionally, the multi-channel optical filter is disposed in the optical filter support, and the multi-channel optical filter includes: a plurality of single spectral band filters spliced according to preset process parameters;
the aligning the multi-channel filter to the long line array multi-spectral detector chip by adjusting the position of the filter holder relative to the long line array multi-spectral detector chip comprises:
after the long-line multi-spectral-segment detector chip is arranged on the detector splicing substrate, recording the position coordinates of the spectral-segment registration mark through a microscope;
and adjusting the position of the optical filter bracket relative to the long-line-array multi-spectral-segment detector chip under a microscope so as to align splicing gaps among the single spectral-segment optical filters to the position coordinates of the spectral-segment registration marks.
Optionally, the preset process parameter at least includes one of the following:
the splicing gaps among the single spectral band filters are less than or equal to 30 mu m, the edge breakage of the single spectral band filters is less than or equal to 30 mu m, and the parallelism of the splicing gaps among the single spectral band filters is less than or equal to 30'.
Optionally, the method further includes:
and masking two ends of the single spectral band optical filter, and blackening the surface of the optical filter support.
Optionally, the method further includes:
after the position of the optical filter support relative to the long-line-array multi-spectral-segment detector chip is adjusted, recording coordinates corresponding to the identifier in the detector pair through a microscope, selecting a multi-channel optical filter reference point, and recording coordinates corresponding to the multi-channel optical filter reference point;
and respectively comparing the coordinates corresponding to the identifiers in the detector pairs and the coordinates corresponding to the reference points of the multi-channel optical filter with standard coordinates, and judging whether the alignment precision of the multi-channel optical filter and the long-line multi-spectral detector chip reaches the standard or not according to the comparison result.
Optionally, the determining, according to the comparison result, whether the alignment accuracy of the multichannel optical filter and the long-line multispectral detector chip reaches the standard includes:
setting a difference value obtained by comparing the coordinate corresponding to the identifier in the pair of detectors with the standard coordinate as a first position error, and judging whether the first position error exceeds a first preset threshold value or not;
setting a difference value obtained by comparing the corresponding coordinates of the multi-channel optical filter reference point with the standard coordinates as a second position error, and judging whether the second position error exceeds a second preset threshold value;
calculating a third position error of the multichannel optical filter relative to the long-line-array multi-spectral-band detector chip by comparing the first position error with the second position error, and judging whether the third position error exceeds a third preset threshold value;
and if the first position error does not exceed the first preset threshold, the second position error does not exceed the second preset threshold and the third position error does not exceed the third preset threshold, judging that the alignment precision of the multichannel optical filter and the long-line multi-spectral detector chip reaches the standard, otherwise, judging that the alignment precision does not reach the standard.
In a second aspect, an embodiment of the present invention provides an infrared detector and multi-channel optical filter combination structure, where the combination structure is prepared by adopting the steps of the above-mentioned infrared detector and multi-channel optical filter precision registration method.
By adopting the embodiment of the invention, the high-precision registration of the multi-channel optical filter and the long-line-array multi-spectral-band detector chip is realized by a high-precision connection and adjustment mode, and the problems of signal response crosstalk between spectral bands, poor stray radiation inhibition and ghost image formation of an image are avoided; the embodiment of the invention performs mask processing on two ends of the single-spectrum-segment optical filter contained in the multi-channel optical filter, thereby ensuring the reliability of the bonding process; the surface of the optical filter bracket is blackened, so that stray light is effectively inhibited; the precise registration method of the embodiment of the invention also comprises a step of judging whether the alignment precision reaches the standard, and can verify whether the alignment precision of the multi-channel optical filter and the long-line multi-spectral detector chip reaches the standard.
The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a schematic diagram illustrating an implementation flow of a method for precision registration of an infrared detector and a multi-channel optical filter according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a filter holder according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a single spectral band filter structure according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of the relative positions of the multi-channel filter and the spectral registration markers provided by the embodiment of the present invention;
FIG. 5 is a schematic diagram of a combined structure of an infrared detector and a multi-channel filter according to an embodiment of the present invention;
fig. 6 is a schematic cross-sectional view of a combined structure of an infrared detector and a multi-channel filter according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
In order to solve the problems of inter-spectral-band signal response crosstalk, poor stray radiation inhibition and ghost image formation caused by low bonding precision of an infrared detector and a multi-channel combined optical filter bonded by using a conventional optical filter bonding mode in the prior art, the embodiment of the invention provides a precise registration method of the infrared detector and the multi-channel optical filter. The multi-channel filter is formed by bonding a plurality of single spectral filters by an adhesive. The multi-channel optical filter is bonded with the optical filter support through the adhesive, and the optical filter support is bonded with the splicing substrate through the adhesive. The method comprises the steps of precisely registering 3 multi-channel filters consisting of 4 single-spectral-band filters on 3 detector chips, wherein each detector chip is formed by interconnecting 1 readout circuit and 2 HgCdTe chips by adopting indium columns, photosensitive pixels of the detector chips correspond to input stages of the readout circuits one by one, response spectral bands of the HgCdTe chips can be short, medium or long waves, and incident radiation is received by the back of the HgCdTe chips. In the specific implementation, because the back of a photosensitive pixel of a detector chip is invisible, an indirect registration design method is adopted, the pixel of the mercury cadmium telluride chip is interconnected with a contact hole of an input stage of a reading circuit, the alignment precision error is less than 1 mu m, a detector alignment mark and a spectrum registration mark are arranged on the reading circuit, and a splicing gap between single spectrum filters is ensured to be less than 30 mu m; in order to ensure the consistency of the installation distance between the multi-channel optical filter and the detector chip, each multi-channel optical filter is installed on 1 optical filter bracket, and the spectral registration of the detector chip and the multi-channel optical filter is realized through the optical filter brackets; the alignment accuracy of the multichannel optical filter and the long-line-array multi-spectral-band detector chip is tested through the alignment mark of the detector splicing substrate and the detector alignment mark, and the spectral response accuracy and consistency of the long-line-array multi-spectral-band detector chip are guaranteed.
Based on this, as shown in fig. 1, it is a schematic implementation flow diagram of a precision registration method for an infrared detector and a multi-channel optical filter provided in an embodiment of the present invention, and the method includes:
s10: arranging a long-line multispectral detector chip 3 on a detector splicing substrate 4, wherein a detector alignment mark is arranged on the long-line multispectral detector chip 3, a substrate alignment mark is arranged on the detector splicing substrate 4, and the detector splicing substrate 4 is made of sapphire;
when the detector alignment mark is aligned with the substrate alignment mark, the long-line multi-spectral detector chip 3 is correctly installed relative to the detector splicing base plate 4.
The long-line multispectral detector chip 3 and the detector splicing base plate 4 are subjected to position registration between the long-line multispectral detector chip 3 and the detector splicing base plate 4 under a microscope by comparing a detector alignment mark and a substrate alignment mark, and are bonded by an adhesive.
S12: arranging an optical filter support 2 on the detector splicing substrate 4, wherein the optical filter support 2 is used for erecting a multi-channel optical filter 1 above the long-line-array multi-spectral-segment detector chip 3, so that the distance between the lower surface of the multi-channel optical filter 1 and the upper surface of the long-line-array multi-spectral-segment detector chip 3 is less than 1.2mm, the stray radiation inhibition is effectively improved, and the ghost image interference in the image is eliminated; the multichannel optical filter 1 and the optical filter support 2 are bonded through an adhesive, in the embodiment, the multichannel optical filter 1 is made of silicon or germanium, the optical filter support 2 is made of kovar alloy, and the optical filter support 2 is structurally shown in fig. 2.
And an alignment bonding mark is arranged on the detector splicing substrate 4 and used for prompting the installation position of the optical filter support 2 on the detector splicing substrate 4.
The long-line-array multi-spectral-band detector chip 3 is provided with a spectral-band registration mark 5, and the spectral-band registration mark 5 is used for prompting the placement position of the multi-channel optical filter 1 relative to the long-line-array multi-spectral-band detector chip 3 so as to further adjust the position of the optical filter support 2.
The multi-channel optical filter 1 is arranged in the optical filter bracket 2, and the multi-channel optical filter 1 comprises: in specific implementation, a single-spectrum-segment optical filter 101, a single-spectrum-segment optical filter 102, a single-spectrum-segment optical filter 103 and a single-spectrum-segment optical filter 104 are mechanically spliced in sequence by using an opaque-band low-temperature adhesive to form a multi-channel optical filter 1, wherein the structure of the single-spectrum-segment optical filter is shown in fig. 3; the preset process parameters at least comprise one of the following parameters: splicing gaps among the single spectral band filters are less than or equal to 30 micrometers, edge breakage of the single spectral band filters is less than or equal to 30 micrometers, and parallelism of the splicing gaps among the single spectral band filters is less than or equal to 30';
it should be understood that the preset process parameter is only one possible implementation manner of the embodiment of the present invention, and in the specific implementation, the preset process parameter may be adjusted according to actual needs, which is not limited in the embodiment of the present invention.
S14: the position of the filter support 2 relative to the long-line multi-spectral detector chip 3 is adjusted, so that the multi-channel filter 1 is aligned with the long-line multi-spectral detector chip 3.
Since the filter holder 2 is disposed on the detector-spliced substrate 4 in the coarse alignment manner in S12, the alignment accuracy of the multichannel filter 1 disposed in the filter holder 2 and the long-line-array multispectral detector chip 3 cannot reach the standard, based on which:
s14 specifically includes:
after the long-line multi-spectral-band detector chip 3 is arranged on the detector splicing substrate 4, recording the position coordinates of the spectral-band registration mark 5 through a microscope;
the position of the optical filter support 2 relative to the long-line multi-spectral detector chip 3 is adjusted under a microscope, so that the splicing gap between the single spectral filters is aligned with the position coordinate of the spectral registration mark 5, the relative positions of the multi-channel optical filter 1 and the spectral registration mark 5 after alignment are shown in fig. 4, the error of the alignment precision of the position coordinate of the spectral registration mark 5 and the splicing gap between the single spectral filters is smaller than 20 μm, and the signal response crosstalk between the spectral filters can be effectively reduced.
Optionally, the method further includes:
in order to ensure the reliability of the bonding process, masking the two ends of the single-spectrum-segment optical filter, wherein the thickness of the masking is 2.5 mm; in order to suppress the stray light, the surface of the filter holder 2 is blackened.
Optionally, after adjusting the position of the filter holder 2 relative to the long-line multi-spectral detector chip 3, the method further includes:
s16: and performing registration precision test on the multi-channel optical filter 1 and the long-line multi-spectral detector chip 3, and checking whether the alignment precision of the multi-channel optical filter 1 and the long-line multi-spectral detector chip 3 reaches the standard or not through the registration precision test.
Specifically, S16 includes:
recording coordinates corresponding to the alignment marks of the detectors through a microscope, selecting a reference point of the multi-channel optical filter 1, and recording corresponding coordinates of the reference point of the multi-channel optical filter 1, wherein in specific implementation, the detector splicing substrate 4 bonded with the multi-channel optical filter 1 and the long-line multi-spectral detector chip 3 is placed on an objective table of the microscope; determining the central point of the detector spliced substrate 4 through the alignment mark of the spliced substrate, and adjusting the position of the detector spliced substrate 4 to enable the axial direction of the detector spliced substrate 4 to be parallel to the X axis of the microscope; aligning a lens of the microscope to the central point, setting the XY axis intersection point coordinate of the microscope as (0,0), and establishing a coordinate system;
comparing the coordinates corresponding to the identifier in the detector pair and the corresponding coordinates of the reference point of the multi-channel optical filter 1 with standard coordinates respectively, and judging whether the alignment precision of the multi-channel optical filter 1 and the long-line multi-spectral detector chip 3 reaches the standard according to the comparison result, wherein in the specific implementation, the difference value obtained by comparing the coordinates corresponding to the identifier in the detector pair with the standard coordinates is set as a first position error, and whether the first position error exceeds a first preset threshold value is judged;
setting the difference value obtained by comparing the corresponding coordinates of the reference point of the multi-channel optical filter 1 with the standard coordinates as a second position error, and judging whether the second position error exceeds a second preset threshold value or not;
calculating a third position error of the multi-channel optical filter 1 relative to the long-line multi-spectral detector chip 3 by comparing the first position error with the second position error, and judging whether the third position error exceeds a third preset threshold value;
if the first position error does not exceed the first preset threshold, the second position error does not exceed the second preset threshold and the third position error does not exceed the third preset threshold, the alignment precision of the multichannel optical filter 1 and the long-line-array multi-spectral-band detector chip 3 is judged to be up to standard, otherwise, the alignment precision is judged to be not up to standard.
The embodiment of the invention also provides a combined structure of the infrared detector and the multi-channel optical filter, which is prepared by adopting the precise registration method steps of the infrared detector and the multi-channel optical filter in a registration manner, and the combined structure of the infrared detector and the multi-channel optical filter is shown in figure 5, and the section of the combined structure of the infrared detector and the multi-channel optical filter is shown in figure 6.
In the embodiment of the invention, the registration of the multi-channel combined optical filter and the infrared detector is carried out by designing the special identifier on the read-out circuit layout and the multi-channel combined optical filter, so that the preparation of the short-medium wave integrated 4-spectral-band infrared detector is realized, and the infrared detector is successfully applied to the infrared detector component of the GF-5 satellite full-spectral-band spectral imager. The multi-channel optical filter can be precisely registered and split with a long-line multi-spectral detector chip, the registration position error is better than 20 mu m, and the signal response crosstalk between spectral segments is effectively reduced; the surface of the multi-channel optical filter support is subjected to blackening treatment, and the distance between the lower surface of the multi-channel optical filter and the upper surface of the long-line multi-spectral-band detector chip is less than 1.2mm, so that the stray radiation inhibition is effectively improved, and the ghost image interference in the image is eliminated. The multi-channel optical filter provided by the invention is designed for the optical filter base material and the film system respectively aiming at different response spectral bands, the average transmittance in the pass band of the optical filter is high, the depth of the out-of-band cut-off is suppressed, the ripple coefficient is small, the transition characteristic is good, the film layer has high stability and high reliability, and the effective signal-to-noise ratio of the output signal of the detector is effectively improved. According to the invention, the low-temperature adhesive is used for bonding the plurality of single-spectrum-segment optical filters, the multi-channel optical filter and the optical filter support, and the optical filter support and the detector splicing substrate, so that the mechanical reliability and the environmental adaptability of the optical filter structure at low temperature are ensured.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A precise registration method for an infrared detector and a multi-channel optical filter is characterized by comprising the following steps:
arranging a long-line multi-spectral detector chip on a detector splicing substrate;
arranging an optical filter support on the detector splicing substrate, wherein the optical filter support is used for erecting a multi-channel optical filter above the long-line multi-spectral-segment detector chip;
and adjusting the position of the filter support relative to the long-line-array multi-spectral-segment detector chip so that the multi-channel filter is aligned with the long-line-array multi-spectral-segment detector chip.
2. The method for precise registration of an infrared detector and a multi-channel optical filter according to claim 1, wherein a detector alignment mark is disposed on the long-line multi-spectral detector chip, and a substrate alignment mark is disposed on the detector splicing substrate;
and when the detector alignment mark is aligned with the substrate alignment mark, the long-line multi-spectral-band detector chip is correctly installed relative to the detector splicing base plate.
3. The method for precisely registering an infrared detector and a multi-channel optical filter as claimed in claim 1, wherein the detector splicing substrate is provided with an alignment bonding mark;
the alignment bonding mark is used for indicating the installation position of the optical filter support on the detector splicing substrate.
4. The method for fine registration of an infrared detector and a multi-channel optical filter according to claim 1, wherein a spectral registration mark is disposed on the long-line multi-spectral detector chip;
the spectral registration identifier is used for indicating the placement position of the multichannel filter relative to the long-line multi-spectral detector chip so as to further adjust the position of the filter support.
5. The method of claim 4, wherein the multi-channel filter is disposed within the filter holder, and the multi-channel filter comprises: a plurality of single spectral band filters spliced according to preset process parameters;
the aligning the multi-channel filter to the long line array multi-spectral detector chip by adjusting the position of the filter holder relative to the long line array multi-spectral detector chip comprises:
after the long-line multi-spectral-segment detector chip is arranged on the detector splicing substrate, recording the position coordinates of the spectral-segment registration mark through a microscope;
and adjusting the position of the optical filter bracket relative to the long-line-array multi-spectral-segment detector chip under a microscope so as to align splicing gaps among the single spectral-segment optical filters to the position coordinates of the spectral-segment registration marks.
6. The method as claimed in claim 5, wherein the predetermined process parameters include at least one of:
the splicing gaps among the single spectral band filters are less than or equal to 30 mu m, the edge breakage of the single spectral band filters is less than or equal to 30 mu m, and the parallelism of the splicing gaps among the single spectral band filters is less than or equal to 30'.
7. The method of fine registration of an infrared detector with a multi-channel filter of claim 5, wherein the method further comprises:
and masking two ends of the single spectral band optical filter, and blackening the surface of the optical filter support.
8. The method of fine registration of an infrared detector with a multi-channel filter as set forth in claim 2, further comprising:
after the position of the optical filter support relative to the long-line-array multi-spectral-segment detector chip is adjusted, recording coordinates corresponding to the identifier in the detector pair through a microscope, selecting a multi-channel optical filter reference point, and recording coordinates corresponding to the multi-channel optical filter reference point;
and respectively comparing the coordinates corresponding to the identifiers in the detector pairs and the coordinates corresponding to the reference points of the multi-channel optical filter with standard coordinates, and judging whether the alignment precision of the multi-channel optical filter and the long-line multi-spectral detector chip reaches the standard or not according to the comparison result.
9. The method of claim 8, wherein said determining whether the alignment accuracy of the multichannel filter and the long-line multi-spectral detector chip meets the standard according to the comparison result comprises:
setting a difference value obtained by comparing the coordinate corresponding to the identifier in the pair of detectors with the standard coordinate as a first position error, and judging whether the first position error exceeds a first preset threshold value or not;
setting a difference value obtained by comparing the corresponding coordinates of the multi-channel optical filter reference point with the standard coordinates as a second position error, and judging whether the second position error exceeds a second preset threshold value;
calculating a third position error of the multichannel optical filter relative to the long-line-array multi-spectral-band detector chip by comparing the first position error with the second position error, and judging whether the third position error exceeds a third preset threshold value;
and if the first position error does not exceed the first preset threshold, the second position error does not exceed the second preset threshold and the third position error does not exceed the third preset threshold, judging that the alignment precision of the multichannel optical filter and the long-line multi-spectral detector chip reaches the standard, otherwise, judging that the alignment precision does not reach the standard.
10. An infrared detector and multi-channel optical filter combined structure, which is characterized in that the combined structure is prepared by adopting the steps of the precision registration method of the infrared detector and the multi-channel optical filter as claimed in any one of claims 1 to 9.
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