CN110987282A - Anti-deposition air homogenizing ring - Google Patents
Anti-deposition air homogenizing ring Download PDFInfo
- Publication number
- CN110987282A CN110987282A CN201911212669.6A CN201911212669A CN110987282A CN 110987282 A CN110987282 A CN 110987282A CN 201911212669 A CN201911212669 A CN 201911212669A CN 110987282 A CN110987282 A CN 110987282A
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- CN
- China
- Prior art keywords
- ring
- deposition
- shim
- blade
- blades
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008021 deposition Effects 0.000 claims abstract description 6
- 239000000356 contaminant Substances 0.000 claims abstract description 5
- 230000002401 inhibitory effect Effects 0.000 claims abstract description 3
- 239000000956 alloy Substances 0.000 claims description 5
- 239000003344 environmental pollutant Substances 0.000 abstract description 6
- 231100000719 pollutant Toxicity 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 5
- 239000012528 membrane Substances 0.000 abstract description 2
- 230000000903 blocking effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
An anti-deposition shim ring formed from a circumferential array of obliquely twisted shim ring vanes stacked on a capacitive sensor support ring for inhibiting the deposition of contaminants onto the sensor film. The anti-deposition air homogenizing ring provided by the invention comprises an upper layer and a lower layer, and the air homogenizing ring blades of the upper layer and the lower layer are alternately arranged, so that pollutants can be effectively prevented from being deposited on the membrane from the axial direction. Meanwhile, the uniform gas ring blades have a certain inclination angle, so that the air flow can smoothly flow through the uniform gas ring blades without blocking, and the accuracy of the vacuum value of the process environment is ensured.
Description
Technical Field
The invention relates to the field of sensors, in particular to an anti-deposition air homogenizing ring.
Background
Thin film capacitive pressure sensors are commonly used in integrated circuit manufacturing to measure pressure values in process chambers. Some processes used in integrated circuit fabrication, such as etching or plating, tend to produce large amounts of particles or contaminants that can deposit on the thin film over time, causing zero drift in the sensor. Therefore, most existing sensors have a filtering mechanism at the air inlet to prevent the deposition of contaminants. However, the existing baffle for preventing pollutant deposition is too few, so that pollutant deposition cannot be effectively avoided, and the measurement of the pressure value of the process cavity by the sensor is influenced by too many baffles.
Disclosure of Invention
Technical problem to be solved
The invention aims to provide an anti-deposition gas homogenizing ring to solve the problem that pollutants in a process cavity are deposited on a sensor film in the manufacturing process of a film type capacitance sensor integrated circuit, so that a sensor generates zero drift.
(II) technical scheme
An anti-deposition shim ring formed from a circumferential array of obliquely twisted shim ring vanes stacked on a capacitive sensor support ring for inhibiting the deposition of contaminants onto the sensor film.
In the above scheme, the anti-deposition air homogenizing ring comprises an upper layer and a lower layer, and the upper layer and the lower layer of air homogenizing ring blades are arranged alternately.
In the above scheme, the outer edge of the deposition-preventing gas homogenizing ring is fixed on the capacitance sensor support ring through a screw or a snap spring, and the capacitance sensor support ring is fixed on the bottom shell of the capacitance sensor through a screw.
In the scheme, the anti-deposition gas homogenizing ring is made of a low-expansion alloy material, wherein the low-expansion alloy material is GH 3600.
In the scheme, the size of the uniform air ring blade is determined by the following formula:
h＝(2πR/z)·sinα
where h is the blade height, R is the blade radius, α is the blade pitch angle, and z is the number of blades.
In the scheme, the blade angle of the anti-deposition air homogenizing ring blade is 20 degrees, the thickness of the blade is 0.3mm, and the number of the blades is 36.
(III) advantageous effects
The anti-deposition gas homogenizing ring provided by the invention is positioned on the capacitance sensor support ring and comprises the upper layer and the lower layer of gas homogenizing ring blades which are alternately arranged, and the gas homogenizing ring blades are at a certain inclination angle.
Drawings
FIG. 1 is a schematic view of an anti-deposition uniform gas ring structure according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a capacitive pressure sensor in accordance with an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
As shown in fig. 1, fig. 1 is a schematic view of an anti-deposition gas distribution ring according to an embodiment of the present invention, the anti-deposition gas distribution ring is formed by stacking a circumferential array of obliquely twisted gas distribution ring blades, the gas distribution ring is divided into an upper layer and a lower layer, and the two layers of gas distribution ring blades are alternately arranged, namely, the gas distribution ring just completely blocks a membrane when viewed from the top. The anti-deposition gas homogenizing ring is positioned on the capacitance sensor supporting ring and used for preventing pollutants from being deposited on the sensor film. The outer edge of the double-layer air homogenizing ring is fixed on a support ring through a screw or a snap spring, the support ring is fixed on the bottom shell through a screw, and the position of the support ring is shown in figure 2.
The anti-deposition gas homogenizing ring is made of metal which is the same as the material of the sensor shell, and the metal is low-expansion alloy, such as GH 3600.
The anti-deposition air homogenizing ring blades have certain inclined torsion angles, the inclined torsion angles are beneficial to the unimpeded circulation of air, and pollutants are deposited on the blades. The blade chord length of the inclined twisted blade is approximately equal to the arc length of the blade top, namely the quotient of the circumference length of the blade top and the number z of the blades, namely the blade size formula is as follows:
h＝(2πR/z)·sinα
where h is the blade height, R is the blade radius, and α is the blade angle.
In the embodiment of the invention, the angle of the blade is 20 degrees, the thickness of the blade is 0.3mm, and the number of the blades is 36.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. An anti-deposition shim ring formed from a circumferential array of obliquely twisted shim ring vanes stacked on a capacitive sensor support ring for inhibiting contaminant deposition onto a sensor film.
2. The anti-deposition shim ring of claim 1, wherein the anti-deposition shim ring comprises an upper layer and a lower layer, the upper and lower layers having alternating shim ring vanes.
3. The deposition-proof gas homogenizing ring according to claim 1, wherein the outer edge of the gas homogenizing ring is fixed on the capacitive sensor supporting ring by a screw or a snap spring, and the capacitive sensor supporting ring is fixed on the capacitive sensor bottom shell by a screw.
4. The anti-deposition turbulator ring according to claim 1, wherein said anti-deposition turbulator ring is made of a low expansion alloy material.
5. The anti-deposition gassing ring according to claim 4 wherein said low expansion alloy material is GH 3600.
6. The anti-deposition shim ring of claim 1, wherein the shim ring vanes are sized using the formula:
h＝(2πR/z)·sinα
where h is the blade height, R is the blade radius, α is the blade pitch angle, and z is the number of blades.
7. The anti-deposition shim ring of claim 1, wherein the anti-deposition shim ring blades have a blade angle of 20 °, a blade thickness of 0.3mm, and a blade count of 36.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911212669.6A CN110987282A (en) | 2019-11-29 | 2019-11-29 | Anti-deposition air homogenizing ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911212669.6A CN110987282A (en) | 2019-11-29 | 2019-11-29 | Anti-deposition air homogenizing ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110987282A true CN110987282A (en) | 2020-04-10 |
Family
ID=70089060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911212669.6A Pending CN110987282A (en) | 2019-11-29 | 2019-11-29 | Anti-deposition air homogenizing ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110987282A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040226382A1 (en) * | 2003-05-16 | 2004-11-18 | Lischer D. Jeffrey | Contaminant deposition control baffle for a capacitive pressure transducer |
| TW200504869A (en) * | 2003-07-18 | 2005-02-01 | Au Optronics Corp | Buffer of pressure gauge sensor used in dry etching reaction chamber |
| CN102787302A (en) * | 2011-05-18 | 2012-11-21 | 中国科学院微电子研究所 | Gas homogenizing device for improving film preparation process |
| CN103594316A (en) * | 2012-08-14 | 2014-02-19 | 朗姆研究公司 | Plasma baffle ring for a plasma processing apparatus and method of use |
| US20140196545A1 (en) * | 2013-01-16 | 2014-07-17 | Tokyo Electron Limited | Pressure measuring instrument and substrate processing apparatus provided with the pressure measuring instrument |
| CN105637336A (en) * | 2013-04-30 | 2016-06-01 | Mks仪器公司 | MEMS pressure sensors with integrated baffles |
| CN107202666A (en) * | 2017-07-05 | 2017-09-26 | 成都众山科技有限公司 | A kind of pressure transmitter device that can prevent from blocking |
| CN206974603U (en) * | 2017-07-05 | 2018-02-06 | 成都众山科技有限公司 | A kind of pressure transmitter device with filtering function |
| CN109200654A (en) * | 2018-10-23 | 2019-01-15 | 昌邑市滨海盐化供销服务有限公司 | A kind of novel evacuated leaf filter for salinization technique |
-
2019
- 2019-11-29 CN CN201911212669.6A patent/CN110987282A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040226382A1 (en) * | 2003-05-16 | 2004-11-18 | Lischer D. Jeffrey | Contaminant deposition control baffle for a capacitive pressure transducer |
| TW200504869A (en) * | 2003-07-18 | 2005-02-01 | Au Optronics Corp | Buffer of pressure gauge sensor used in dry etching reaction chamber |
| CN102787302A (en) * | 2011-05-18 | 2012-11-21 | 中国科学院微电子研究所 | Gas homogenizing device for improving film preparation process |
| CN103594316A (en) * | 2012-08-14 | 2014-02-19 | 朗姆研究公司 | Plasma baffle ring for a plasma processing apparatus and method of use |
| US20140196545A1 (en) * | 2013-01-16 | 2014-07-17 | Tokyo Electron Limited | Pressure measuring instrument and substrate processing apparatus provided with the pressure measuring instrument |
| CN105637336A (en) * | 2013-04-30 | 2016-06-01 | Mks仪器公司 | MEMS pressure sensors with integrated baffles |
| CN107202666A (en) * | 2017-07-05 | 2017-09-26 | 成都众山科技有限公司 | A kind of pressure transmitter device that can prevent from blocking |
| CN206974603U (en) * | 2017-07-05 | 2018-02-06 | 成都众山科技有限公司 | A kind of pressure transmitter device with filtering function |
| CN109200654A (en) * | 2018-10-23 | 2019-01-15 | 昌邑市滨海盐化供销服务有限公司 | A kind of novel evacuated leaf filter for salinization technique |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200410 |
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| RJ01 | Rejection of invention patent application after publication |