CN110987071A - Circuit board welding performance test method - Google Patents
Circuit board welding performance test method Download PDFInfo
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- CN110987071A CN110987071A CN201911264713.8A CN201911264713A CN110987071A CN 110987071 A CN110987071 A CN 110987071A CN 201911264713 A CN201911264713 A CN 201911264713A CN 110987071 A CN110987071 A CN 110987071A
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- welding
- circuit boards
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- board
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- 238000003466 welding Methods 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000011056 performance test Methods 0.000 title claims abstract description 8
- 238000012360 testing method Methods 0.000 claims abstract description 41
- 238000005476 soldering Methods 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000007689 inspection Methods 0.000 claims abstract description 7
- 230000032683 aging Effects 0.000 claims abstract description 6
- 238000001514 detection method Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 230000004907 flux Effects 0.000 claims abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 6
- 238000009864 tensile test Methods 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000011179 visual inspection Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a circuit board welding performance test method, which comprises the following steps: taking 9 circuit boards to be welded, preparing corresponding welding materials, numbering the circuit boards in groups, and respectively welding the 9 groups of circuit boards under different welding time and temperature parameters, wherein 9 groups of circuit boards are 9 groups; carrying out appearance inspection on each group of circuit boards; carrying out welding spot electrical detection tests on each group of circuit boards; performing a welding spot mechanical strength test on each group of circuit boards; performing a welding spot thermal cycle test on each group of circuit boards; carrying out solder joint aging tests on each group of circuit boards; carrying out welding rework test on each group of circuit boards; the circuit board comprises a main control board, a power supply board, a video board, a display board and an oscillating board, and the welding material comprises an electronic element, soldering tin and soldering flux. The circuit board welding performance test method is simple in steps, simple and convenient to operate and easy to master, can effectively detect the quality of the circuit board welding performance, and guarantees normal processing and production of the circuit board.
Description
Technical Field
The invention relates to the technical field of circuit board production and processing, in particular to a circuit board welding performance test method.
Background
The main parameters affecting the soldering effect of the circuit board are soldering temperature, soldering time and selected soldering power. The three have great influence on the welding effect and quality, such as: when the welding power is higher, the welding time is shorter; also the temperature of the weld is affected.
In order to test the welding performance of the circuit board on line, so that the welding operation of the circuit board is standard, reliable and qualified, and the production efficiency of the circuit board is improved, it is urgently needed to provide a circuit board welding performance test method to solve the technical problems.
Disclosure of Invention
The invention aims to provide a circuit board welding performance test method which is simple in steps, simple and convenient to operate, easy to master, capable of effectively detecting the welding performance of a circuit board and guaranteeing normal processing and production of the circuit board.
In order to achieve the above object, the present invention provides a circuit board soldering performance testing method, comprising:
7, performing a welding rework test on each group of circuit boards; wherein the content of the first and second substances,
the circuit board comprises a main control board, a power supply board, a video board, a display board and an oscillating board, and the welding material comprises electronic elements, soldering tin and soldering flux.
Preferably, step 2 comprises: visual inspection is carried out by using a magnifying glass, wherein whether the brazing filler metal completely covers the soldering position of the bonding pad and the lead is firstly checked, and the contact angle is 45 degrees; secondly, checking whether the surface of the welding spot is complete, smooth and bright; and finally, checking whether the circuit board has no color change, no welding point is tilted or falls off, and whether the electronic element has no color change, deformation or fracture.
Preferably, step 3 comprises: and (3) taking 9 groups of welded circuit boards, loading the circuit boards into a host machine by using a replacement method, and connecting a power supply to detect whether the circuit boards are in poor conduction and whether the heat damage of the electronic elements is caused in the brazing process.
Preferably, step 4 comprises: and sawing the welding points and the electronic element from the circuit board by using a saw blade, fixing the circuit board and the electronic element on a tensile testing machine for a tensile test, and observing whether bubbles, cracks or burrs exist in each welding point of the circuit board and the electronic element.
Preferably, step 5 comprises: and (3) taking the welded circuit board, controlling the temperature range to be minus 40-150 ℃, and observing whether bubbles, cracks or burrs exist in welding points of the circuit board and the electronic element, wherein the thermal cycle period is 3600 s.
Preferably, step 6 comprises: 9 groups of welded circuit boards are taken, loaded into a host machine by an alternative method and continuously operated 105And s, controlling the temperature to be 80-100 ℃, and observing whether bubbles, cracks or burrs exist in welding points of the circuit board and the electronic element.
Preferably, step 7 comprises: taking 9 groups of welded circuit boards, adopting a resistor, an IC chip and a lead wire, respectively heating welding spots of selected electronic elements by using an electric iron, controlling the running time to be 3-8s, controlling the using temperature to be 300-350 ℃, and observing whether the electronic elements are damaged or not and whether welding pads of the circuit boards are discolored, tilted or fall off or not.
According to the technical scheme, after a plurality of groups of various circuit boards which are mutually compared are welded, the circuit board welding mode which meets the installation and use requirements is obtained through appearance inspection, welding spot electrical detection tests, welding spot mechanical strength tests, welding spot thermal cycle tests, welding spot aging tests and welding rework tests of each group of circuit boards. Therefore, the welding performance of the circuit board can be effectively detected and judged, and the normal processing and production of the circuit board are ensured.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 shows parameters of soldering 9 groups of circuit boards in step 1 in the method for testing soldering performance of circuit boards according to the present invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In the present invention, unless otherwise specified, the directional words "upper, lower" and the like included in the terms merely represent the orientation of the terms in the conventional use state or are colloquially known by those skilled in the art, and should not be construed as limiting the terms.
Referring to fig. 1, the present invention provides a circuit board soldering performance testing method, including:
7, performing a welding rework test on each group of circuit boards; wherein the content of the first and second substances,
the circuit board comprises a main control board, a power supply board, a video board, a display board and an oscillating board, and the welding material comprises electronic elements, soldering tin and soldering flux.
Through the technical scheme, after a plurality of groups of various circuit boards which are mutually compared are welded, the circuit board welding mode which meets the installation and use requirements is obtained through appearance inspection, welding spot electrical detection tests, welding spot mechanical strength tests, welding spot thermal cycle tests, welding spot aging tests and welding rework tests of each group of circuit boards. Therefore, the welding performance of the circuit board can be effectively detected and judged, and the normal processing and production of the circuit board are ensured.
In the present embodiment, step 2 includes: performing visual inspection by using a magnifying glass, wherein whether the brazing filler metal completely covers the soldering part of the bonding pad and the lead is firstly checked, the contact angle is not less than 20 degrees at the minimum, the standard of 45 degrees is usually adopted, and the maximum is not more than 60 degrees; secondly, checking whether the surface of the welding spot is complete, smooth and bright (for example, no pinhole, sand grains, cracks, bridging, pointing and other tiny defects); and finally, checking whether the circuit board has no color change, no welding point is tilted or falls off, and whether the electronic element has no color change, deformation or fracture.
The step 3 comprises the following steps: and (3) taking 9 groups of welded circuit boards, loading the circuit boards into a host machine by using a replacement method, and connecting a power supply to detect whether the circuit boards are in poor conduction and whether the heat damage of the electronic elements is caused in the brazing process.
Referring to IPC-9701, step 5 comprises: and (3) taking the welded circuit board, controlling the temperature range to be minus 40-150 ℃, and observing whether bubbles, cracks or burrs exist in welding points of the circuit board and the electronic element, wherein the thermal cycle period is 3600 s.
The step 6 comprises the following steps: 9 groups of welded circuit boards are taken, loaded into a host machine by an alternative method and continuously operated 105s, using the temperature to control between 80 ℃ and 100 ℃, and observing each of the circuit board and the electronic elementWhether the solder joint has bubbles, cracks or burrs.
In addition, considering that the circuit board welding cannot be completely qualified, the defects of insufficient soldering, missing soldering or desoldering can exist, and a welding spot reworking test is required for a semi-finished product which is unqualified in inspection and needs to be reworked. Specifically, step 7 includes: taking 9 groups of welded circuit boards, adopting a resistor, an IC chip and a lead wire, respectively heating welding spots of selected electronic elements by using an electric iron, controlling the running time to be 3-8s, controlling the using temperature to be 300-350 ℃, and observing whether the electronic elements are damaged or not and whether welding pads of the circuit boards are discolored, tilted or fall off or not.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (7)
1. A circuit board welding performance test method is characterized by comprising the following steps:
step 1, taking 9 circuit boards to be welded, preparing corresponding welding materials, numbering the circuit boards in groups, and respectively welding the 9 groups of circuit boards under different welding time and temperature parameters, wherein 9 groups of circuit boards are provided;
step 2, performing appearance inspection on each group of circuit boards;
step 3, performing welding spot electrical detection tests on each group of circuit boards;
step 4, performing welding spot mechanical strength test on each group of circuit boards;
step 5, performing a welding spot thermal cycle test on each group of circuit boards;
step 6, carrying out solder joint aging tests on each group of circuit boards;
7, performing a welding rework test on each group of circuit boards; wherein the content of the first and second substances,
the circuit board comprises a main control board, a power supply board, a video board, a display board and an oscillating board, and the welding material comprises electronic elements, soldering tin and soldering flux.
2. The method for testing the welding performance of the circuit board according to claim 1, wherein the step 2 comprises the following steps: visual inspection is carried out by using a magnifying glass, wherein whether the brazing filler metal completely covers the soldering position of the bonding pad and the lead is firstly checked, and the contact angle is 45 degrees; secondly, checking whether the surface of the welding spot is complete, smooth and bright; and finally, checking whether the circuit board has no color change, no welding point is tilted or falls off, and whether the electronic element has no color change, deformation or fracture.
3. The method for testing the welding performance of the circuit board according to claim 1, wherein the step 3 comprises the following steps: and (3) taking 9 groups of welded circuit boards, loading the circuit boards into a host machine by using a replacement method, and connecting a power supply to detect whether the circuit boards are in poor conduction and whether the heat damage of the electronic elements is caused in the brazing process.
4. The method for testing the welding performance of the circuit board according to claim 1, wherein the step 4 comprises the following steps: and sawing the welding points and the electronic element from the circuit board by using a saw blade, fixing the circuit board and the electronic element on a tensile testing machine for a tensile test, and observing whether bubbles, cracks or burrs exist in each welding point of the circuit board and the electronic element.
5. The method for testing the welding performance of the circuit board according to claim 1, wherein the step 5 comprises the following steps: and (3) taking the welded circuit board, controlling the temperature range to be minus 40-150 ℃, and observing whether bubbles, cracks or burrs exist in welding points of the circuit board and the electronic element, wherein the thermal cycle period is 3600 s.
6. The method for testing the welding performance of the circuit board according to claim 1, wherein the step 6 comprises the following steps: 9 groups of welded circuit boards are taken, loaded into a host machine by an alternative method and continuously operated 105And s, controlling the temperature to be 80-100 ℃, and observing whether bubbles, cracks or burrs exist in welding points of the circuit board and the electronic element.
7. The method for testing the soldering performance of the circuit board according to claim 1, wherein the step 7 comprises: taking 9 groups of welded circuit boards, adopting a resistor, an IC chip and a lead wire, respectively heating welding spots of selected electronic elements by using an electric iron, controlling the running time to be 3-8s, controlling the using temperature to be 300-350 ℃, and observing whether the electronic elements are damaged or not and whether welding pads of the circuit boards are discolored, tilted or fall off or not.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911264713.8A CN110987071A (en) | 2019-12-11 | 2019-12-11 | Circuit board welding performance test method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911264713.8A CN110987071A (en) | 2019-12-11 | 2019-12-11 | Circuit board welding performance test method |
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| Publication Number | Publication Date |
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| CN110987071A true CN110987071A (en) | 2020-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911264713.8A Pending CN110987071A (en) | 2019-12-11 | 2019-12-11 | Circuit board welding performance test method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111398868A (en) * | 2020-04-17 | 2020-07-10 | Oppo（重庆）智能科技有限公司 | Detection method for detecting connection reliability of welding spots |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1761884A (en) * | 2003-03-13 | 2006-04-19 | 英特尔公司 | Thermal stratification test apparatus and method providing cyclical and steady-state stratified environments |
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2019
- 2019-12-11 CN CN201911264713.8A patent/CN110987071A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1761884A (en) * | 2003-03-13 | 2006-04-19 | 英特尔公司 | Thermal stratification test apparatus and method providing cyclical and steady-state stratified environments |
Non-Patent Citations (2)
| Title |
|---|
| 郭大琪 等: "无铅表面组装工艺试验", 电子与封装, vol. 03, no. 05, pages 24 - 27 * |
| 黄丽娟 等: "无铅手工焊接工艺分析和试验研究", 热加工工艺, vol. 41, no. 15, pages 200 - 202 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111398868A (en) * | 2020-04-17 | 2020-07-10 | Oppo（重庆）智能科技有限公司 | Detection method for detecting connection reliability of welding spots |
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Application publication date: 20200410 |