CN110972400A

CN110972400A - PCB baking device

Info

Publication number: CN110972400A
Application number: CN201911322562.7A
Authority: CN
Inventors: 陈在; 汪天骄; 姚佳; 尤志刚; 胡仕伟
Original assignee: Anhui Heavenly Electronic Polytron Technologies Inc
Current assignee: Anhui Heavenly Electronic Polytron Technologies Inc
Priority date: 2019-12-20
Filing date: 2019-12-20
Publication date: 2020-04-07
Anticipated expiration: 2039-12-20
Also published as: CN110972400B

Abstract

The invention discloses a PCB baking device, which comprises a conveying device and a segmented baking mechanism, wherein the segmented baking device comprises a baking box body, a preheating area and a baking area are sequentially arranged in front of and behind the baking box body, a heating assembly is arranged in the baking area, the heating assembly comprises a hot air pipe assembly and a heat supply element, the hot air pipe assembly is uniformly distributed with a plurality of hot air outlets, and the hot air outlets are opposite to a PCB; the lower part of the punching conveyer belt opposite to the heating assembly is provided with a first air suction assembly for absorbing and baking waste gas, the first air suction assembly is connected with an air blowing assembly which is arranged below the punching conveyer belt of the preheating area and used for preheating the PCB through a first exhaust pipe, the baking box body opposite to the air blowing assembly is provided with a second air suction assembly, and the second air suction assembly is connected with a cooling exhaust device for cooling the PCB from the baking area through a second exhaust pipe.

Description

PCB baking device

Technical Field

The invention relates to the technical field of baking devices, in particular to a PCB baking device.

Background

The PCB board is baked to prevent the finished board from bending, deforming and shrinking. Because the soldering flux can be better combined with the device and the bonding pad after the PCB is brushed with the solder paste after the temperature of the PCB is high to a certain degree, the welding effect is improved. Both the BGA and PCB typically require baking if there is a BGA on the PCB board.

The existing baking device for the PCB has the following defects:

(1) in the device for baking the PCB, because the heat source is unevenly distributed, uneven baking is easy to occur, the corner of the PCB is seriously warped, and the quality of the PCB is influenced;

(2) the PCB board baking process can generate waste gas which can not be directly discharged into air, but the waste gas has higher heat, which causes energy waste, and the existing measure is to adopt a filtering device to purify the waste gas and then directly discharge the purified waste gas;

(3) the PCB board after toasting need be placed and resumes to room temperature at ordinary temperature, and in order to improve cooling efficiency, some processing plants can adopt extra cooling device to cool off the PCB board, not only occupy the production area, need extra equipment expenditure moreover.

Disclosure of Invention

Therefore, the invention provides a PCB baking device to solve the above-mentioned defects in the prior art.

A PCB baking device comprises a conveying device for conveying a PCB and a segmented baking mechanism arranged above the conveying device, wherein the conveying device comprises a punching conveyer belt, conveying rollers sleeved at two ends of the punching conveyer belt and a speed reducing motor connected with a rotating shaft of the conveying rollers; the segmented baking device comprises a baking box body, a preheating area is arranged at the front section of the baking box body, a baking area is arranged at the rear section of the baking box body, a heating assembly used for heating a PCB below is arranged in the baking area, the heating assembly comprises a hot air pipe assembly and a heat supply element, the hot air pipe assembly is uniformly distributed, the heat supply element is used for heating air in the hot air pipe assembly, and a plurality of hot air outlets facing the PCB are uniformly distributed on the hot air pipe assembly; the PCB board preheating device comprises a punching conveyer belt, a heating assembly, a first air suction assembly, a second air suction assembly and a cooling and exhausting device, wherein the first air suction assembly is used for absorbing and baking waste gas and is arranged below the punching conveyer belt, the heating assembly is right opposite to the punching conveyer belt, the first air suction assembly is connected with the air blowing assembly which is arranged below the punching conveyer belt in the preheating area and used for preheating the PCB board through a first exhaust pipe, the baking box body right opposite to the air blowing assembly is provided with the second air suction assembly, and the second air suction assembly is connected with the cooling and.

Preferably, the hot-air pipe subassembly includes two parallel arrangement's first intake pipe, two same air-blowing device of tee junction is passed through to first intake pipe, two be connected with mutual parallel distribution's second intake pipe between the first intake pipe, hot air outlet evenly connected distributes just right in the second intake pipe one side of the conveyer belt that punches a hole, the heat supply component is a plurality of second intake pipe heat supplies.

Preferably, the cooling and exhaust device comprises a gas filter cartridge connected to the second exhaust pipe, the gas filter cartridge is connected to a heat exchanger, a pipe heat pipe of the heat exchanger is coiled around the wall of the gas filter cartridge, the gas outlet end of the gas filter cartridge is connected to a rotating bearing, the center of the rotating bearing is connected to a rotating shaft, and the rotating shaft is connected to a propeller blade.

Preferably, the first air suction assembly comprises a plurality of air suction pipes which are uniformly distributed, a plurality of waste gas suction ports are formed in one side, opposite to the punching conveying belt, of each air suction pipe, and the air suction pipes and the second air inlet pipes are distributed in a staggered mode.

Preferably, air extractors are arranged on the first exhaust pipe and the second air inlet pipe.

Preferably, the gas filter cartridge comprises a filter barrel body and a gas purification layer sleeved inside the filter barrel body.

Preferably, the punching conveyer belt is a stainless steel net belt conveyer belt provided with a plurality of uniformly distributed through holes.

The invention has the following advantages:

(1) according to the invention, the first air suction assembly is used for sucking uniform drying airflow released from the hot air pipe assembly above the PCB from the lower part of the PCB, so that the hot airflow above and below the PCB is distributed more uniformly, the heat conduction is accelerated, the warpage is reduced, and the finished product quality of the PCB is improved;

(2) the high-temperature waste gas generated during drying of the PCB is used for drying the PCB in the preheating zone, so that the heat in the waste gas is effectively utilized, and the energy consumption is reduced;

(3) after the waste gas in the preheating zone of the device is consumed at high temperature, the waste gas can be cooled and filtered for cooling the PCB after the baking in the baking zone is finished, so that the cooling speed of the PCB is accelerated, an integrated drying device which takes the heat flow waste gas as a guide and integrates preheating, drying and cooling is formed, and the drying efficiency of the PCB is greatly improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic diagram of the distribution of the hot gas tube assembly, the first suction assembly, the blow down assembly and the second suction assembly of the present invention;

fig. 3 is a schematic structural view of the cooling and exhausting device of the present invention.

In the figure:

1-a transfer device; 2-a segmented baking device; 3-cooling the air exhaust device; 4-an air extractor;

101-punching conveyer belt; 102-a transport roller; 103-a reduction motor; 104-through hole;

201-baking box body; 202-a preheating zone; 203-a baking zone; 204-a heat-supplying element; 205-hot air outlet; 206-a first inspiratory assembly; 207-first exhaust pipe; 208-a blow-down assembly; 209-a second getter assembly; 210-a second exhaust pipe;

301 — a first intake pipe; 302-a second intake pipe; 303-a tee joint;

401-suction pipe; 402-exhaust gas suction;

501-gas filter cartridge; 502-heat exchanger; 503-pipe heat pipe; 504-a rotational bearing; 505-a rotating shaft; 506-a propeller blade; 507-a filter vat body; 508-gas purification layer.

Detailed Description

The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 to 3, the present invention provides a PCB baking apparatus, which can not only effectively treat the waste gas generated during baking the PCB, but also effectively utilize the heat in the high temperature waste gas for preheating the PCB. Specifically, the method comprises the following steps:

the baking apparatus conventionally includes a conveyor 1 for conveying PCB boards and a segmented baking mechanism 2 disposed above the conveyor 1. Specifically, the method comprises the following steps:

the conveying device 1 comprises a punched conveying belt 101, conveying rollers 102 sleeved at two ends of the punched conveying belt 101 and a speed reduction motor 103 connected with a rotating shaft of the conveying rollers 102. The punching conveyer 101 is a stainless steel conveyer belt on which a plurality of evenly distributed through holes 104 are arranged. Heat and flowing air can be transmitted up and down on the punching conveyer belt 101 through the through holes 104, which is beneficial to heat transfer.

The segmented baking device 2 comprises a baking box body 201, a preheating zone 202 is arranged at the front section of the baking box body 201, and a baking zone 203 is arranged at the rear section of the baking box body 201. Therefore, when the PCB is heated, the mode that two successive PCB batches are heated simultaneously is adopted, and the high-temperature gas waste gas generated in the heating process of the first PCB batch is used for heating the second PCB batch, so that the energy is saved, the waste heat is utilized, the baking progress of the PCB can be accelerated, and the baking efficiency is improved.

Wherein the baking area 203 is provided with a heating component for heating the lower PCB board. The heating assembly comprises a hot air pipe assembly and a heat supply element 204, the hot air pipe assembly is evenly distributed on the heating assembly, the heat supply element is used for heating air in the hot air pipe assembly, and a plurality of hot air outlets 205 facing the PCB are evenly distributed on the hot air pipe assembly. Specifically, the method comprises the following steps:

the hot-air pipe subassembly includes two parallel arrangement's first intake pipe 301, two same air-blowing device is connected through tee bend 303 to first intake pipe 301, two be connected with mutual parallel distribution's second intake pipe 302 between the first intake pipe 301, hot air outlet 205 evenly connected distributes just right in second intake pipe 302 one side of conveyer belt 101 punches a hole, heating element 204 is a plurality of second intake pipe 302 heat supplies.

The air blowing device may be an air blower (not shown), and the cold air blown out from the air blowing device firstly enters the two first air inlet pipes 301 arranged in parallel through the tee joint 303, and the air in the first air inlet pipes 301 enters the second air inlet pipes 302 again to be heated by the heat supply element 204. The heated air flow is sprayed out from the hot air outlet 205 to uniformly heat and dry the PCB on the surface of the punched conveyer belt 101, high-temperature toxic waste gas is generated in the process, further treatment is needed, and the heat in the waste gas is recycled. Specifically, the method comprises the following steps:

wherein, a first air suction component 206 for absorbing waste gas generated by baking is arranged below the punching conveyer belt 101 opposite to the heating component. The first air suction assembly 206 is connected with an air blowing assembly 208 which is arranged below the punching conveyer belt 101 of the preheating zone 202 and used for preheating the PCB through a first air exhaust pipe 207, and a second air suction assembly 209 is arranged on the baking box body 201 opposite to the air blowing assembly 208.

The high temperature toxic waste first enters the first air suction assembly 206, then flows out from the air blowing assembly 208 to heat the PCB board in the preheating zone 202, and then the common exhaust gas generated by the baking zone 203 and the preheating zone 202 enters the second air suction assembly 209 for centralized treatment.

The first and second air suction assemblies 206 and 209 and the air blowing assembly 208 are preferably constructed in the same manner as the hot gas pipe assembly. The first air suction assembly 206 includes a plurality of air suction pipes 401 uniformly arranged, a plurality of exhaust air suction ports 402 are disposed on a side of the air suction pipes 401 facing the punched hole conveyor belt 101, and the air suction pipes 401 and the second air inlet pipe 302 are arranged in a staggered manner (not shown in the middle).

This is because the hot-blast export 205 of concentrated follow on the second intake pipe 302 of heated gas is discharged, and is relatively weaker to the PCB board stoving effect that corresponds between two adjacent second intake pipes 302, and it is inhomogeneous to dry, through breathing pipe 401 and the second intake pipe 302 of crisscross arrangement, can make the relative skew of air current appearance of heating, and the PCB board is dried more evenly.

An air extractor 4 is arranged on each of the first exhaust pipe 207 and the second intake pipe 302.

Considering that most of the dried PCB plates are cooled to room temperature in a natural state, the cooling time is long, and if external equipment is used, the production cost is increased, the waste gas discharged after purification is allowed to exert the residual value again by the device, namely the dried PCB plates are cooled. Specifically, the method comprises the following steps:

the second air suction assembly 209 is connected with a cooling and exhausting device 3 for cooling and filtering the PCB plate coming out of the baking area 203 through a second exhaust pipe 210.

Preferably, the cooling and air exhausting device 3 includes a gas filtering cylinder 501 connected to the second exhaust pipe 210, the gas filtering cylinder 501 is connected to a heat exchanger 502, a pipe heat pipe 503 of the heat exchanger 502 surrounds a cylindrical wall of the gas filtering cylinder 501 in a disk shape, an air outlet end of the gas filtering cylinder 501 is connected to a rotating bearing 504, a rotating shaft 505 is connected to a central position of the rotating bearing 504, and a propeller blade 506 is connected to the rotating shaft 505.

The gas filter cartridge 501 includes a filter barrel body 507 and a gas purification layer 508 sleeved inside the filter barrel body 507. The gas purification layer 508 may be determined according to the composition of toxic gas in the exhaust gas mainly discharged from the PCB, for example, containing activated carbon, silica gel, alumina component, etc.

The device of the invention specifically works as follows:

drying: the hot air pipe assembly uniformly sprays hot air heated by the heat supply element 204 to one side above the PCB above the conveying device 1, and the hot air is relatively uniformly distributed above and below the PCB through heat conduction and extraction of the first air suction assembly 206 from the lower part of the PCB;

preheating: the first air suction assembly 206 sucks high-temperature exhaust gas generated by baking the PCB in the baking area 203, and the high-temperature exhaust gas is sprayed to the surface of the PCB in the preheating area 202 through the air blowing assembly 208, and the preheated exhaust gas is sucked from the other surface of the PCB in the preheating area 202 by the second air suction assembly 209;

and (3) cooling: waste gas after preheating the PCB board in the second air suction assembly 209 enters the gas purification layer 508 of the gas filter cartridge 501 through the second exhaust pipe 210 for filtration treatment, and the temperature of the heat in the waste gas is reduced after heat exchange through the heat exchanger 502, so that the propeller blades 506 are driven to rotate along the rotating shaft 505, and cold air is uniformly blown to the surface of the dried PCB board, so that cooling is accelerated.

According to the invention, the first air suction assembly 206 is used for sucking uniform drying airflow released from the hot air pipe assembly above the PCB from the lower part of the PCB, so that the hot airflow above and below the PCB is distributed more uniformly, the heat conduction is accelerated, the warpage is reduced, and the finished product quality of the PCB is improved; the high-temperature waste gas generated during the drying of the PCB is used for drying the PCB in the preheating zone 202, so that the heat in the waste gas is effectively utilized, and the energy consumption is reduced;

after the waste gas in the preheating zone 202 of the device is consumed at high temperature, the waste gas can be cooled and filtered for cooling the PCB after the baking in the baking zone is finished, so that the cooling speed of the PCB is increased, an integrated drying device which takes heat flow waste gas as a guide and integrates preheating, drying and cooling is formed, and the drying efficiency of the PCB is greatly improved.

Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims

1. A PCB board baking device comprises a conveying device (1) for conveying PCB boards and a segmented baking mechanism (2) arranged above the conveying device (1), and is characterized in that: the conveying device (1) comprises a punching conveying belt (101), conveying rollers (102) sleeved at two ends of the punching conveying belt (101) and a speed reducing motor (103) connected with rotating shafts of the conveying rollers (102);

the segmented baking device (2) comprises a baking box body (201), a preheating area (202) is arranged at the front section of the baking box body (201), a baking area (203) is arranged at the rear section of the baking box body (201), a heating assembly used for heating a PCB below is arranged in the baking area (203), the heating assembly comprises a hot air pipe assembly and a heat supply element (204), the hot air pipe assembly is uniformly distributed with a plurality of hot air outlets (205) which are just opposite to the PCB, and the heat supply element is used for heating air in the hot air pipe assembly;

with heating element is just right the below of punching a hole conveyer belt (101) is provided with and is used for absorbing the first subassembly (206) of breathing in that toasts and produce waste gas, first subassembly (206) of breathing in is connected with the setting through first blast pipe (207) and is in preheating zone (202) punching a hole conveyer belt (101) below is used for carrying out the subassembly (208) of blowing that preheats to the PCB board, it breathes in subassembly (209) to be provided with the second on just right toasting box (201) of subassembly (208) to blow, second breathe in subassembly (209) are connected with through second blast pipe (210) and are used for carrying out refrigerated cooling exhaust device (3) to the PCB board that toasts the district (203) and come out.

2. The PCB baking apparatus of claim 1, wherein: the hot-air pipe subassembly includes two parallel arrangement's first intake pipe (301), two same air-blowing device is connected through tee bend (303) in first intake pipe (301), two be connected with mutual parallel distribution's second intake pipe (302) between first intake pipe (301), hot air outlet (205) evenly connected distributes just right in second intake pipe (302) one side of conveyer belt (101) punches a hole, heat supply component (204) are a plurality of second intake pipe (302) heat supply.

3. The PCB baking apparatus of claim 1, wherein: the cooling and air exhausting device (3) comprises a gas filtering cylinder (501) connected with the second exhaust pipe (210), the gas filtering cylinder (501) is connected with a heat exchanger (502), a pipe heat pipe (503) of the heat exchanger (502) is wound on the wall of the gas filtering cylinder (501) in a disc shape, the air outlet end of the gas filtering cylinder (501) is connected with a rotating bearing (504), the center of the rotating bearing (504) is connected with a rotating shaft (505), and the rotating shaft (505) is connected with a propeller blade (506).

4. The PCB baking apparatus of claim 2, wherein: the first air suction assembly (206) comprises a plurality of air suction pipes (401) which are uniformly distributed, a plurality of waste air suction ports (402) are arranged on one side, which is opposite to the punching conveying belt (101), of each air suction pipe (401), and the air suction pipes (401) and the second air inlet pipes (302) are distributed in a staggered mode.

5. The PCB baking apparatus of claim 1, wherein: air extractors (4) are arranged on the first exhaust pipe (207) and the second air inlet pipe (302).

6. The PCB baking apparatus of claim 3, wherein: the gas filter cartridge (501) comprises a filter barrel body (507) and a gas purification layer (508) sleeved inside the filter barrel body (507).

7. The PCB baking apparatus of claim 1, wherein: the punching conveyer belt (101) is a stainless steel conveyer belt provided with a plurality of uniformly distributed through holes (104).