CN110969150A - Assembling method and assembling structure of ultrasonic fingerprint sensing module - Google Patents
Assembling method and assembling structure of ultrasonic fingerprint sensing module Download PDFInfo
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- CN110969150A CN110969150A CN201911390584.7A CN201911390584A CN110969150A CN 110969150 A CN110969150 A CN 110969150A CN 201911390584 A CN201911390584 A CN 201911390584A CN 110969150 A CN110969150 A CN 110969150A
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Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
Abstract
The invention discloses an assembling method and an assembling structure of an ultrasonic fingerprint sensing module, wherein the assembling method comprises the following steps: joining a base to a surface of an ultrasonic fingerprint sensing module, the base having a compressive elastic restoring force; and fixing the ultrasonic fingerprint sensing module and the base by a display and a rear cover, wherein the display is abutted against the surface of the ultrasonic fingerprint sensing module, so that the elasticity of the base is abutted against the surface of the rear cover, and the base is tightly matched with the surface of the rear cover to complete the position fixing.
Description
Technical Field
The present invention relates to an assembly method and an assembly structure thereof, and more particularly, to an assembly method and an assembly structure of an ultrasonic fingerprint sensing module.
Background
Because of the high uniqueness of fingerprint patterns that varies from person to person, fingerprint identification technology is currently the most widely used biometric identification technology. The fingerprint identification principle is that the unique characteristic information of different fingerprints is extracted through a fingerprint sensing module and a fingerprint identification software, and finally, an identification result is obtained through a comparison algorithm so as to determine the identity of a fingerprint owner. In order to save area, the Fingerprint sensing module is disposed below the Display in the future design trend, namely, so-called Fingerprint On Display (FOD). Currently, there are three general types of fingerprint sensing methods: capacitive, optical, and ultrasonic.
The ultrasonic fingerprint sensing module has the advantages that a light source of a display is not needed, the ultrasonic penetration capacity is high, the influence of light rays is avoided, the anti-stain capacity is high, the finger can be identified when being wet or dirty, the copied fingerprint can be identified, and the safety is high. The technical concept is to add a sensing module behind the display panel, so that the fingerprint image can be captured at any position on the display panel. Therefore, the efficiency and the identification degree are higher than those of other schemes.
Please refer to fig. 1, which is a schematic diagram illustrating a conventional ultrasonic fingerprint sensing module integrated into a smart phone. Wherein the smart phone 1 can be simply divided into two parts: a rear cover 10 and a display 11. In order to ensure the transmission efficiency of the ultrasonic wave, the ultrasonic fingerprint sensing module 12 must be tightly attached to the back of the display 11, and the adhesive 13 is usually used to attach the two, but the attaching method hardly allows rework. Since the rework will destroy the sensing structure on the top of the ultrasonic fingerprint sensing module 12, the display 11 will be scrapped together once the attachment fails.
Disclosure of Invention
The present invention is directed to an assembly method and an assembly structure of an ultrasonic fingerprint sensing module for solving the above-mentioned disadvantages of the prior art.
To overcome this deficiency, the present invention provides an assembly method of an ultrasonic fingerprint sensing module, comprising: joining a base to a surface of an ultrasonic fingerprint sensing module, the base having a compressive elastic restoring force; and fixing the ultrasonic fingerprint sensing module and the base by a display and a rear cover, wherein the display is abutted against the surface of the ultrasonic fingerprint sensing module, so that the elasticity of the base is abutted against the surface of the rear cover, and the base is tightly matched with the surface of the rear cover to complete the position fixing.
Another aspect of the present invention is an assembly structure of an ultrasonic fingerprint sensing module, comprising: an ultrasonic fingerprint sensing module; a base coupled to a surface of the ultrasonic fingerprint sensing module, the base having a compressive elastic restoring force; and a display and a back cover fixed with the ultrasonic fingerprint sensing module and the base, wherein the display is pressed against the surface of the ultrasonic fingerprint sensing module, so that the elasticity of the base is pressed against the surface of the back cover, and the base and the back cover are tightly matched to complete the fixation of the position.
The invention can overcome the yield problem of the joint assembly of the ultrasonic fingerprint sensing module and the display in the conventional method, thereby effectively achieving the main purpose of developing the invention.
Drawings
FIG. 1: it is a schematic diagram of the conventional ultrasonic fingerprint sensing module integrated into a smart phone.
FIG. 2: the present invention is a flow chart of an assembly method of an ultrasonic fingerprint sensing module according to an embodiment of the present invention.
FIG. 3: which is an exploded view of an assembly of an ultrasonic fingerprint sensing module and a display according to an embodiment of the present invention.
FIG. 4: which is a schematic view of an ultrasonic fingerprint sensing module and a display according to an embodiment of the present invention after being assembled.
FIG. 5: which is a schematic view of an ultrasonic fingerprint sensing module and a display according to another embodiment of the present invention after assembly.
FIG. 6: it is a schematic view of an ultrasonic fingerprint sensing module and a display according to another embodiment of the present invention after assembly.
Detailed Description
The following embodiments are provided for illustrative purposes only and do not limit the scope of the present invention. In addition, the drawings in the embodiments omit elements that are not necessary or that can be accomplished by a general technique to clearly show the technical features of the present invention.
Please refer to fig. 2, fig. 3 and fig. 4, which are respectively an exploded schematic view of an assembly method flow and a structure of an ultrasonic fingerprint sensing module according to an embodiment of the present invention. In one embodiment, the following steps may be included: the upper surface 221 of the ultrasonic fingerprint sensing module 22 is covered with a protective structure layer 220 (step 21). In one embodiment, the top surface 221 is a surface adjacent to the display 23, the protective structure layer 220 may be at least one thin POLYMER layer (POLYMER) with a thickness of about 2-20 μm, and the material of the protective structure layer 220 may be a poly (CxFy) POLYMER or one or any combination of POLYMERs such as poly (methyl methacrylate), PMMA, SU-8 photoresist, or PDMS.
The function of the protective structure layer 220 is to prevent the ultrasonic fingerprint sensing module 22 from being damaged by the wear of the foreign objects, and also to consider the function of the transmission of sound waves. By contacting the protective structure layer 220 with the display 23, the ultrasonic fingerprint sensing module 22 can transmit and receive ultrasonic waves to detect a fingerprint (not shown) placed on the display 23. When the ultrasonic fingerprint sensing module 22 contacts the display 23 through the protective structure layer 220, the contact position can be selected from a preferable sound wave transmission path in the structure of the display 23 and a preferable sound wave transmission material in the structure of the display 23.
Next, an upper surface 211 of a base 21 with a compressive elastic restoring force is bonded to a lower surface 222 of the ultrasonic fingerprint sensing module 22 (step S22), the base 21 may be made of a material with a compressive elastic restoring force, such as silicon rubber, etc., or may be made of other materials, such as other compound elastomers containing carbon, hydrogen, oxygen and silicon. Since the lower surface 222 of the ultrasonic fingerprint sensing module 22 does not have important components such as an ultrasonic transmitter and a receiver, the upper surface 211 of the base 21 and the lower surface 222 of the ultrasonic fingerprint sensing module 22 can be adhered by an adhesive. The ultrasonic fingerprint sensing module 22 attached with the base 21 can be fixed on a predetermined position of the back cover 20 by a low strength method (e.g. cooperation of release agents and adhesives) to prepare for the next assembly. Of course, the base 21 and the rear cover 20 may be directly placed on a predetermined position to wait for the next assembly without gluing.
In addition, in order to reduce the interference caused by the reflection of ultrasonic wave, the base 21 may be made of elastic material (such as polymer doped with inorganic fine particles as metal material, tungsten carbide (WC), tungsten boride (WB), tungsten nitride (WN), ferrite, diamond, graphite, silicon carbide (SIC), aluminum nitride (A1N), Boron Nitride (BN) and aluminum oxide (Al) with sound absorption capability in this frequency band2O3) The finished vibration absorbing material, and the metal material including tungsten (W) is finished or additionally coated with a sound absorbing paint. Of course, the structure may be irregular surface that is less likely to reflect sound waves or other three-dimensional structure that is advantageous for sound absorption (e.g., phononic crystal having a thickness direction periodic structure).
The assembly method of the ultrasonic fingerprint sensing module may further include step 23, in which the display 23 and the rear cover 20 are assembled and fixed in a tight fit manner, for example, the display 23 and the rear cover 20 are engaged with each other by using fixing elements such as screws, and the lower surface 212 of the base 21 is abutted against the circuit element 200 of the rear cover 20 by using the elasticity of the base 21, so as to complete the close fit between the base 21 and the circuit element 200 and complete the reinforced fixing of the positions. Because of the soft elasticity of the base 21, the lower surface thereof can conform to the uneven surface of the circuit component 200. And the compression restoring force F (shown in fig. 4) of the base 21 makes the ultrasonic fingerprint sensing module 22 abut against the display 23, so that the upper surface thereof can be smoothly attached to the bottom of the display 23, thereby maintaining good transmission characteristics of the ultrasonic waves. The method of the present invention does not need to fix the ultrasonic fingerprint sensing module 22 to the display 23 by adhesion, and the low strength bonding (such as the matching of a release agent and an adhesive) between the base 21 and the rear cover 20 and the non-bonding between the ultrasonic fingerprint sensing module 22 and the display 23 can allow for multiple position adjustments during assembly, thereby not only increasing the assembly precision, but also avoiding the loss caused by the yield reduction.
Since the upper surface 221 of the ultrasonic fingerprint sensing module 22 has important components such as an ultrasonic transmitter and a receiver, in one embodiment, the material of the protective structure layer 220 may be a material with favorable sound transmission characteristics, such as a material with sound impedance matching the materials of the upper and lower layers. More specifically, in one embodiment, the acoustic impedance of the protective structure layer 220 and the acoustic impedance of the lower surface of the display 23 may have a specific proportional relationship, for example, the acoustic impedance value of the protective structure layer 220 is between the acoustic impedance value of the ultrasonic fingerprint sensing module 22 itself and the acoustic impedance value of the lower surface of the display 23.
The structure diagram after the assembly is shown in fig. 4. The reference numerals are the same as those in fig. 3, and only the position and appearance of the fixing element 40 for assembling the display 23 and the rear cover 20 are illustrated, which can be assembled between the display 23 and the rear cover 20 by using the force generated by the screws and screw holes disposed at the four corners and the sides.
Fig. 5 is a schematic view of an ultrasonic fingerprint sensing module and a display according to another embodiment of the present invention after they are assembled. In this embodiment, a supporting structure 50 is disposed between the ultrasonic fingerprint sensing module 22 and the base 52. Compared with the elastic base 52, the supporting structure 50 fixed below the ultrasonic fingerprint sensing module 22 has a stronger deformation resistance, the supporting structure 50 is fixed to the rear cover 20 by the fixing element (e.g., screw) 51, and the elastic base 52 can generate a pushing force in response to the deformation of the circuit element 200 on the rear cover 20, so as to tightly fit and join the ultrasonic fingerprint sensing module 22 to the display 23 in the vertical direction. Since the distance between the fixing element 51 and the ultrasonic fingerprint sensing module 22 is small, the fixing element 51 also needs to eliminate resonance to improve the overall purity of ultrasonic signal transmission.
Of course, in order to reduce the interference caused by the reflection of the ultrasonic wave, the supporting structure 50 may also be made of a material with sound absorption capability in this frequency band, or may be an irregular surface or other three-dimensional structure (e.g., a phononic crystal with a periodic structure in the thickness direction) that is less likely to reflect the sound wave.
FIG. 6 shows a super-capacitor according to yet another embodiment of the present inventionSchematic diagram of the sound wave fingerprint sensing module and the display after being assembled. In this embodiment, a layer of vibration absorbing material 60 is disposed between the support structure 50 and the ultrasonic fingerprint sensing module 22. As mentioned above, the supporting structure 50 under the ultrasonic fingerprint sensing module 22 has a strong deformation resistance, and the vibration absorbing material layer 60 is used to reduce the interference caused by the reflection of the ultrasonic wave, and the material having the sound absorbing capability in this frequency band (for example, the polymer doped with inorganic fine particles such as metal material, tungsten carbide (WC), tungsten boride (WB), tungsten nitride (WN), ferrite, diamond, graphite, silicon carbide (SIC), aluminum nitride (A1N), Boron Nitride (BN), and aluminum oxide (Al) can be particularly selected2O3) And the like, and the metal material includes tungsten (W), and the structure may be irregular surface or other three-dimensional structure (for example, phononic crystal having a thickness direction periodic structure) which is less likely to reflect sound waves. The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, so that other equivalent changes and modifications without departing from the spirit of the present invention are also included in the inventive concept of the present invention.
In summary, the present invention develops an assembly method and an assembly structure of an ultrasonic fingerprint sensing module, which can effectively improve the defect in the prior art that rework is not allowed or the sensing structure of the ultrasonic fingerprint sensing module is damaged due to rework, and can greatly improve the yield problem when the ultrasonic fingerprint sensing module is assembled with a display, thereby achieving the main purpose of the development of the present invention.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (27)
1. An assembly method of an ultrasonic fingerprint sensing module comprises the following steps:
joining a base to a surface of an ultrasonic fingerprint sensing module, the base having a compressive elastic restoring force; and
the ultrasonic fingerprint sensing module and the base are fixed by a display and a rear cover, wherein the display is propped against the surface of the ultrasonic fingerprint sensing module, so that the elasticity of the base is propped against the surface of the rear cover, and the base is tightly matched with the surface of the rear cover to complete the fixation of the position.
2. The method of assembling an ultrasonic fingerprint sensing module according to claim 1, further comprising: covering a protective structure layer on an upper surface of the ultrasonic fingerprint sensing module, wherein the protective structure layer is composed of at least one polymer layer with a thickness of 2-20 μm, and the upper surface is a surface close to the display.
3. The method of assembling an ultrasonic fingerprint sensing module according to claim 1, further comprising: covering a protective structure layer on an upper surface of the ultrasonic fingerprint sensing module, wherein the protective structure layer is composed of at least one polymer layer, and the upper surface is a surface close to the display.
4. The method of claim 3, wherein the protective structure layer is made of one or any combination of polyfluorocarbon, polymethyl methacrylate, SU-8 photoresist and polydimethylsiloxane.
5. The method of claim 3, wherein the protection layer contacts the display such that the ultrasonic transmitter and receiver can transmit and receive ultrasonic waves for detecting the fingerprint display disposed above the display.
6. The method of claim 3, wherein the acoustic impedance of the protection structure is between the acoustic impedance of the ultrasonic fingerprint sensing module and the acoustic impedance of the bottom surface of the display.
7. The method of assembling an ultrasonic fingerprint sensing module according to claim 1, further comprising: an upper surface of the base is attached to a lower surface of the ultrasonic fingerprint sensing module by using an adhesive.
8. The method of claim 1, wherein the base is made of silicone, rubber, or a compound elastomer containing carbon, hydrogen, oxygen, and silicon.
9. The method of claim 1, wherein the base is additionally coated with an acoustic absorbing coating.
10. The method of claim 1, wherein the base has irregular surfaces that are not reflective to sound waves.
11. The method of claim 1, wherein the base has a thickness-wise periodic structure of phononic crystals.
12. The method of claim 1, wherein the display is disposed on a surface of the ultrasonic fingerprint sensing module, and the bottom surface of the display is disposed on a circuit component of the rear cover by elasticity of the base.
13. An assembly structure of an ultrasonic fingerprint sensing module, comprising:
an ultrasonic fingerprint sensing module;
a base coupled to a surface of the ultrasonic fingerprint sensing module, the base having a compressive elastic restoring force; and
a display and a back cover fixed with the ultrasonic fingerprint sensing module and the base, wherein the display is propped against the surface of the ultrasonic fingerprint sensing module, so that the elasticity of the base is propped against the surface of the back cover, thereby completing the close fit of the base and the back cover on the surface to complete the position fixation.
14. The assembly structure of the ultrasonic fingerprint sensing module of claim 13, wherein a protective structure layer is covered on an upper surface of the ultrasonic fingerprint sensing module, the protective structure layer is composed of at least one polymer layer with a thickness of 2-20 μm, and the upper surface is a surface close to the display.
15. The assembly structure of the ultrasonic fingerprint sensing module of claim 13, wherein a protective structure layer is covered on an upper surface of the ultrasonic fingerprint sensing module, the protective structure layer is formed by at least one polymer layer, wherein the upper surface is a surface close to the display.
16. The assembly structure of the ultrasonic fingerprint sensing module of claim 15, wherein the material of the protective structure layer is one or any combination of polyfluorocarbon, polymethyl methacrylate, SU-8 photoresist and polydimethylsiloxane.
17. The assembly structure of the ultrasonic fingerprint sensing module of claim 15, wherein the protection structure layer contacts the display, so that the ultrasonic transmitter and receiver can transmit and receive ultrasonic waves for detecting a fingerprint placed on the display.
18. The assembly structure of the ultrasonic fingerprint sensing module of claim 15, wherein the acoustic impedance of the protection structure layer is between the acoustic impedance of the ultrasonic fingerprint sensing module and the acoustic impedance of the lower surface of the display.
19. The assembly structure of the ultrasonic fingerprint sensing module of claim 13, wherein an adhesive is used to attach an upper surface of the base to a lower surface of the ultrasonic fingerprint sensing module.
20. The assembly structure of the ultrasonic fingerprint sensing module of claim 13, wherein the base is made of silicone, rubber, or a compound elastomer containing carbon, hydrogen, oxygen, and silicon.
21. The assembly structure of the ultrasonic fingerprint sensing module of claim 13, wherein the base is additionally coated with an acoustic absorption coating.
22. The assembly structure of the ultrasonic fingerprint sensing module of claim 13, wherein the base has irregular surfaces that are not easy to reflect sound waves.
23. The assembly structure of the ultrasonic fingerprint sensing module of claim 13, wherein the base has a thickness direction periodic structure of phononic crystals.
24. The assembly structure of the ultrasonic fingerprint sensing module of claim 13, wherein the display is pressed against the surface of the ultrasonic fingerprint sensing module, and the elastic property of the base is used to press the lower surface of the base against the circuit component on the surface of the rear cover, thereby completing the position fixing.
25. The assembly structure of the ultrasonic fingerprint sensing module of claim 13, further comprising a supporting structure disposed between the ultrasonic fingerprint sensing module and the base, the supporting structure being stronger in deformation resistance than the base, the supporting structure being fixed to the back cover by a fixing element in a horizontal position.
26. The assembly structure of the ultrasonic fingerprint sensing module of claim 25, wherein the supporting structure is a material with ultrasonic band sound absorption capability.
27. The assembly structure of an ultrasonic fingerprint sensing module of claim 25, wherein a vibration absorbing material layer is further disposed between the supporting structure and the ultrasonic fingerprint sensing module, the vibration absorbing material layer is made of a material having ultrasonic sound absorbing capability, the material of the vibration absorbing material layer is polymer-doped inorganic fine particles, and the inorganic fine particles comprise a vibration absorbing material made of a metal material, tungsten carbide, tungsten boride, tungsten nitride, ferrite, diamond, graphite, silicon carbide, aluminum nitride, boron nitride, aluminum oxide, etc.
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| CN111524461A (en) * | 2020-04-27 | 2020-08-11 | 武汉华星光电半导体显示技术有限公司 | Display module and preparation method thereof |
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| CN109492502A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Cover board, ultrasonic wave biological identification device and electronic equipment |
| CN212541357U (en) * | 2019-09-10 | 2021-02-12 | 神盾股份有限公司 | Assembly structure of ultrasonic fingerprint sensing module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111524461A (en) * | 2020-04-27 | 2020-08-11 | 武汉华星光电半导体显示技术有限公司 | Display module and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN212541357U (en) | 2021-02-12 |
| WO2021047117A1 (en) | 2021-03-18 |
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