CN110968046B - Mold positioning system, method and device - Google Patents

Mold positioning system, method and device Download PDF

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Publication number
CN110968046B
CN110968046B CN201811160286.4A CN201811160286A CN110968046B CN 110968046 B CN110968046 B CN 110968046B CN 201811160286 A CN201811160286 A CN 201811160286A CN 110968046 B CN110968046 B CN 110968046B
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mold
information
uwb base
die
uwb
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CN110968046A (en
Inventor
廖昌海
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Gree Electric Appliances Inc of Zhuhai
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Gree Electric Appliances Inc of Zhuhai
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/4189Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the transport system
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00Administration; Management
    • G06Q10/08Logistics, e.g. warehousing, loading or distribution; Inventory or stock management
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00Systems or methods specially adapted for specific business sectors, e.g. utilities or tourism
    • G06Q50/04Manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30Computing systems specially adapted for manufacturing

Abstract

The invention provides a mold positioning system, a mold positioning method and a mold positioning device, which are used for realizing the technical effect of accurately positioning a mold in real time. The system comprises a positioning device, a plurality of UWB base stations and a server; the positioning equipment is adsorbed on the surface of the mold to be positioned and used for acquiring the mold information of the mold to be positioned and sending UWB signals and mold information to the UWB base stations; each UWB base station of the plurality of UWB base stations is configured to: receiving a UWB signal and mold information sent by positioning equipment, determining the distance between a mold to be positioned and a UWB base station according to the received UWB signal, and sending the mold information and the distance between the mold to be positioned and the UWB base station to a server; the server is used for: and determining the mold to be positioned as the mold to be positioned according to the received mold information, and positioning the mold to be positioned according to the distance between each UWB base station in the plurality of UWB base stations and the mold to be positioned.

Description

Mold positioning system, method and device
Technical Field
The invention relates to the technical field of electronics, in particular to a mold positioning system, method and device.
Background
With the continuous progress of scientific technology, the traditional manual warehouse can not meet the requirements of the warehouse logistics industry which develops increasingly, and more digital warehouse management systems are mentioned.
However, at present, the mode of manual collection and manual input is still adopted for die management, the specific position information of the die cannot be accurately traced and monitored, the die is difficult to find, the die cannot be effectively scheduled, and the die production and management efficiency is low.
Disclosure of Invention
The embodiment of the invention provides a mold positioning system, a mold positioning method and a mold positioning device, which are used for achieving the technical effect of accurately positioning a mold in real time.
In a first aspect, an embodiment of the present invention provides a mold positioning system, including a positioning device, a plurality of UWB base stations, and a server;
the positioning equipment is adsorbed on the surface of a mold to be positioned and used for acquiring mold information of the mold to be positioned and sending UWB signals and the mold information to the UWB base stations; the mould information at least comprises the number of the mould to be positioned;
the plurality of UWB base stations are fixed at predetermined positions, each UWB base station of the plurality of UWB base stations is configured to: receiving a UWB signal sent by the positioning equipment and the mold information; determining the distance between the mold to be positioned and the UWB base station according to the received UWB signals, and sending the mold information and the distance between the mold to be positioned and the UWB base station to the server;
the server is configured to: and determining the mold to be positioned as the mold to be positioned according to the received mold information, and positioning the mold to be positioned according to the distance between each UWB base station in the plurality of UWB base stations and the mold to be positioned.
In the embodiment, the positioning equipment is adsorbed on the surface of the mold to be positioned, acquires the mold information of the mold to be positioned, and sends UWB signals and mold information to a plurality of UWB base stations fixed at preset positions; after receiving a UWB signal and mold information sent by positioning equipment, each UWB base station in the UWB base stations determines the distance between a mold to be positioned and the UWB base station according to the received UWB signal, and then sends the mold information and the determined distance between the mold to be positioned and the UWB base station to a server; and the server determines the mold to be positioned as the mold to be positioned according to the received mold information, and positions the mold to be positioned according to the distance between each UWB base station and the mold to be positioned. The accurate tracing and monitoring of the mold position are realized, the full life cycle tracing of the mold can be carried out, and the production and management efficiency is effectively improved.
Optionally, the positioning device specifically includes a radio frequency identification RFID reader and a UWB positioning tag;
the RFID reader is used for: reading the mold information of the mold to be positioned stored in the RFID nameplate of the mold to be positioned, and sending the mold information to the UWB positioning tag;
the UWB positioning tag is configured to: periodically transmitting UWB signals and the mold information to the plurality of UWB base stations after receiving the mold information.
According to the embodiment, the mold information of the mold to be positioned is acquired through the RFID technology, and UWB positioning technology is combined to periodically send UWB signals and mold information, so that the mold position is accurately positioned and updated, and the production and management efficiency is further improved.
Optionally, the server stores position coordinates of the plurality of UWB base stations in advance;
the server is specifically configured to: and determining the position coordinate of the mold to be positioned according to the position coordinate of each UWB base station in the plurality of UWB base stations and the distance between each UWB base station and the mold to be positioned.
According to the embodiment, the position coordinates of the UWB base stations are stored in advance, the processing efficiency of the server can be further improved, the accuracy of mold positioning is further improved, especially under the scene that the number of molds is large, the running speed of the server can be guaranteed, and the positions of the molds can be tracked accurately.
Optionally, the positioning device is further configured to:
when the mold is transferred to a machine tool, acquiring identification information of the machine tool; transmitting identification information of the machine tool to the plurality of UWB base stations;
the plurality of UWB base stations are further configured to: receiving the identification information of the machine tool and sending the identification information of the machine tool to the server;
the server is further configured to: and after receiving the identification information of the machine tool, determining that the die to be positioned is positioned on the machine tool.
In the embodiment, when the mold is transferred to the machine tool, the information of the transfer path, the last stored position or the installed machine tool and the like is known, and based on the data, data analysis can be performed, such as perfecting the stock space planning and reducing the mold transfer path; carrying out production scheduling according to the states of the die and the machine tool; and judging whether the mold is installed on an improper machine tool or not according to the position where the mold is finally placed.
Optionally, the server is further configured to: and when receiving the mold information of the mold which is not put in a warehouse or is taken out of the warehouse or the unknown mold, executing an abnormal alarm.
Through this embodiment, can further promote the production and the management efficiency of mould.
In a second aspect, an embodiment of the present invention provides a mold positioning method, including:
the method comprises the steps that positioning equipment obtains die information of a die to be positioned; the positioning equipment is adsorbed on the surface of the mould to be positioned, and the mould information at least comprises the number of the mould to be positioned;
the positioning equipment sends UWB signals and the mold information to a plurality of UWB base stations fixed at preset positions, so that each UWB base station in the UWB base stations determines the distance between the mold to be positioned and the UWB base station according to the received UWB signals, and sends the mold information and the distance between the mold to be positioned and the UWB base station to a server.
Optionally, the positioning device specifically includes an RFID reader and an UWB positioning tag;
the positioning equipment acquires the mold information of the mold to be positioned, and specifically comprises the following steps:
the positioning equipment reads the mold information of the mold to be positioned, which is stored in the RFID nameplate of the mold to be positioned, through the RFID reader;
the positioning device sends UWB signals and the mold information to a plurality of UWB base stations fixed at predetermined positions, and specifically includes:
after acquiring the mold information of a mold to be positioned, the positioning equipment periodically sends UWB signals and the mold information to a plurality of UWB base stations fixed at preset positions through the UWB positioning tags.
Optionally, when the mold is transferred to a machine tool, the method further comprises:
the positioning equipment acquires identification information of the machine tool;
and the positioning equipment sends the identification information of the machine tool to the plurality of UWB base stations.
In a third aspect, an embodiment of the present invention provides a mold positioning method, including:
the method comprises the following steps that a UWB base station receives UWB signals sent by positioning equipment and mold information of a mold to be positioned, wherein the mold information is adsorbed by the positioning equipment; the UWB base station is any one of a plurality of UWB base stations fixed at a preset position, and the mould information at least comprises the number of the mould to be positioned;
the UWB base station determines the distance between the mold to be positioned and the UWB base station according to the received UWB signals;
the UWB base station sends the mould information and the distance between the mould to be positioned and the UWB base station to the server, so that the server determines the mould to be positioned as the mould to be positioned according to the received mould information, and positions the mould to be positioned according to the distance between each UWB base station in the UWB base stations and the mould to be positioned.
Optionally, the UWB base station receives a UWB signal sent by a positioning device and mold information of a mold to be positioned, which is adsorbed by the positioning device, and specifically includes:
the UWB base station receives UWB signals sent periodically by positioning equipment and mold information of a mold to be positioned, which is adsorbed by the positioning equipment.
Optionally, when the mold is transferred to a machine tool, the method further comprises:
the UWB base station receives the identification information of the machine tool sent by the positioning equipment;
and the UWB base station sends the identification information of the machine tool to the server, so that the server receives the identification information of the machine tool and determines that the die to be positioned is positioned on the machine tool.
In a fourth aspect, an embodiment of the present invention provides a mold positioning method, including:
the method comprises the steps that a server receives die information of a die to be positioned and the distance between the die to be positioned and a UWB base station, wherein the die information is sent by each UWB base station in the UWB base stations; wherein the mold information at least comprises the number of the mold to be positioned;
and the server determines the die to be positioned as the die to be positioned according to the received die information, and positions the die to be positioned according to the distance between each UWB base station in the plurality of UWB base stations and the die to be positioned.
Optionally, the server stores position coordinates of the plurality of UWB base stations in advance;
the server positions the mold to be positioned according to the distance between each UWB base station in the plurality of UWB base stations and the mold to be positioned, and the positioning method specifically comprises the following steps:
and the server determines the position coordinates of the mold to be positioned according to the position coordinates of each UWB base station in the plurality of UWB base stations and the distance between each UWB base station and the mold to be positioned.
Optionally, when the mold is transferred to a machine tool, the method further comprises:
the server receives the identification information of the machine tool sent by the UWB base stations;
and after receiving the identification information of the machine tool, the server determines that the die to be positioned is positioned on the machine tool.
Optionally, the method further includes:
and the server executes an abnormal alarm when receiving the mold information of the mold which is not put in a warehouse or is taken out of the warehouse or the unknown mold.
In a fifth aspect, an embodiment of the present invention provides a mold positioning device, including:
the acquisition unit is used for acquiring the die information of the die to be positioned; the device is adsorbed on the surface of the die to be positioned, and the die information at least comprises the number of the die to be positioned;
the device comprises a sending unit, a server and a positioning unit, wherein the sending unit is used for sending UWB signals and the mold information to a plurality of UWB base stations fixed at preset positions, so that each UWB base station in the UWB base stations determines the distance between the mold to be positioned and the UWB base station according to the received UWB signals, and sends the mold information and the distance between the mold to be positioned and the UWB base station to the server.
Optionally, the obtaining unit is specifically configured to: reading the mold information of the mold to be positioned, which is stored in the RFID nameplate of the mold to be positioned;
the sending unit is specifically configured to: periodically transmitting UWB signals and the mold information to a plurality of UWB base stations fixed at predetermined positions.
Optionally, the obtaining unit is further configured to:
when the mold is transferred to a machine tool, acquiring identification information of the machine tool;
the sending unit is further configured to: and transmitting the identification information of the machine tool to the plurality of UWB base stations.
In a sixth aspect, an embodiment of the present invention provides a mold positioning device, including:
the receiving unit is used for receiving UWB signals sent by the positioning equipment and the mold information of the mold to be positioned adsorbed by the positioning equipment; the device is any one of a plurality of devices fixed at a preset position, and the mold information at least comprises the number of the mold to be positioned;
the determining unit is used for determining the distance between the die to be positioned and the device according to the received UWB signals;
and the sending unit is used for sending the mold information and the distance between the mold to be positioned and the device to the server so that the server determines the mold to be positioned as the mold to be positioned according to the received mold information, and positions the mold to be positioned according to the distance between each device in the devices and the mold to be positioned.
Optionally, the receiving unit is specifically configured to: and receiving UWB signals periodically sent by positioning equipment and the mold information of the mold to be positioned adsorbed by the positioning equipment.
Optionally, the receiving unit is further configured to:
when the mold is transferred onto a machine tool, receiving identification information of the machine tool sent by the positioning equipment;
the sending unit is further configured to: and sending the identification information of the machine tool to the server so that the server receives the identification information of the machine tool and determines that the die to be positioned is positioned on the machine tool.
In a seventh aspect, an embodiment of the present invention provides a mold positioning apparatus, including:
the device comprises a receiving unit, a positioning unit and a positioning unit, wherein the receiving unit is used for receiving the die information of a die to be positioned and the distance between the die to be positioned and each UWB base station in a plurality of UWB base stations; wherein the mold information at least comprises the number of the mold to be positioned;
and the processing unit is used for determining the die to be positioned as the die to be positioned according to the received die information and positioning the die to be positioned according to the distance between each UWB base station in the plurality of UWB base stations and the die to be positioned.
Optionally, the apparatus further includes a storage unit, configured to store position coordinates of the plurality of UWB base stations;
the processing unit is specifically configured to: and determining the position coordinate of the mold to be positioned according to the position coordinate of each UWB base station in the plurality of UWB base stations and the distance between each UWB base station and the mold to be positioned.
Optionally, the receiving unit is further configured to:
when the mold is transferred onto a machine tool, receiving identification information of the machine tool sent by the plurality of UWB base stations;
the processing unit is further to: and after the receiving unit receives the identification information of the machine tool, determining that the die to be positioned is positioned on the machine tool.
Optionally, the processing unit is further configured to:
and when the receiving unit receives the mold information of the mold which is not put in a warehouse or is taken out of the warehouse or the unknown mold, executing an abnormal alarm.
In an eighth aspect, an embodiment of the present invention provides a mold positioning apparatus, including:
at least one processor, and
a memory communicatively coupled to the at least one processor, a communication interface;
wherein the memory stores instructions executable by the at least one processor, and the at least one processor performs the method of the second or third or fourth aspect of the embodiments of the invention using the communication interface by executing the instructions stored by the memory.
In a ninth aspect, the present invention provides a computer-readable storage medium, which stores computer instructions that, when executed on a computer, cause the computer to perform the method of the second aspect, the third aspect, or the fourth aspect of the present invention.
One or more technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages:
according to the technical scheme of the embodiment of the invention, the positioning equipment is adsorbed on the surface of the die to be positioned, acquires the die information of the die to be positioned, and sends UWB signals and the die information to a plurality of UWB base stations fixed at preset positions; after receiving a UWB signal and mold information sent by positioning equipment, each UWB base station in the UWB base stations determines the distance between a mold to be positioned and the UWB base station according to the received UWB signal, and then sends the mold information and the determined distance between the mold to be positioned and the UWB base station to a server; and the server determines the mold to be positioned as the mold to be positioned according to the received mold information, and positions the mold to be positioned according to the distance between each UWB base station and the mold to be positioned. Therefore, the accurate tracing and monitoring of the mold position are realized, the full life cycle tracing of the mold can be realized, and the production and management efficiency is effectively improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic view of a mold positioning system in an embodiment of the present invention;
FIG. 2 is a schematic diagram of one possible embodiment of an RFID tag of the present disclosure;
FIG. 3 is a schematic diagram of a possible structure of a pointing device 01 according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a mold positioning device according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a mold positioning device according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a mold positioning device according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a mold positioning apparatus in an embodiment of the present invention.
Detailed Description
The technical solutions of the present invention are described in detail below with reference to the drawings and the specific embodiments, and it should be understood that the specific features in the embodiments and the embodiments of the present invention are not intended to limit the technical solutions of the present invention, but may be combined with each other without conflict.
An embodiment of the present invention provides a mold positioning system, and referring to fig. 1, the system includes a positioning device 01, a plurality of Ultra Wide Band (UWB) base stations 02, and a server 03; the positioning device 01 is adsorbed on the surface of a mold to be positioned, and the plurality of UWB base stations 02 are fixed at a preset position.
The specific method for positioning the system mold comprises the following steps:
the method comprises the steps that a positioning device 01 obtains die information of a die to be positioned, wherein the die information at least comprises the number of the die to be positioned, and UWB signals and the die information are sent to a plurality of UWB base stations 02 fixed at preset positions;
each UWB base station 02 of the plurality of UWB base stations 02 receives a UWB signal and the mold information sent by the positioning device 01, and each UWB base station 02 determines a distance between the mold to be positioned and the UWB base station 02 according to the received UWB signal, and sends the mold information and the distance between the mold to be positioned and the UWB base station 02 to the server 03;
the server 03 determines the mold to be positioned as the mold to be positioned according to the received mold information, and positions the mold to be positioned according to the distance between each UWB base station 02 of the plurality of UWB base stations 02 and the mold to be positioned.
In the embodiment of the present invention, the mold information of each mold at least includes a mold identifier, such as a mold number, so that the server can determine the mold to be positioned according to the mold number.
In order to further improve the management efficiency of the mold, the mold information may further include other production information of the mold, such as a model number, a manufacturing date, a using apparatus, a production company, a size, a name, and the like of the mold. For example, fig. 2 is a schematic diagram of a possible Radio Frequency Identification (RFID) tag.
In the embodiment of the invention, each mould is provided with an RFID nameplate for storing the mould information; the positioning device 01 specifically comprises a Radio Frequency Identification (RFID) reader and a UWB positioning tag; the RFID reader is used for reading the mold information stored in the RFID nameplate of the mold to be positioned and sending the mold information to the UWB positioning tag; the UWB positioning tag is configured to transmit UWB signals and the mold information to each UWB base station 02.
Further, in order to facilitate the attachment and detachment of the mold, the positioning device 01 may further include a magnet. In order to ensure the normal operation of the positioning device 01, the positioning device 01 may further include a charging plug, a lithium battery, an antenna, an indicator light, a switch, and the like. For example, fig. 3 is a schematic diagram of a possible structure of the positioning apparatus 01.
In this embodiment, a positioning device 01 is attached to the surface of a mold to be positioned, and the positioning device 01 acquires mold information of the mold to be positioned and transmits UWB signals and mold information to a plurality of UWB base stations 02 fixed at predetermined positions; after receiving the UWB signal and the mold information sent by the positioning device 01, each UWB base station 02 of the plurality of UWB base stations 02 determines the distance between the mold to be positioned and the UWB base station 02 according to the received UWB signal, and then sends the mold information and the determined distance between the mold to be positioned and the UWB base station 02 to the server 03; the server 03 determines the mold to be positioned as the mold to be positioned according to the received mold information, and positions the mold to be positioned according to the distance between each UWB base station 02 and the mold to be positioned. The accurate tracing and monitoring of the mold position are realized, the full life cycle tracing of the mold can be carried out, and the production and management efficiency is effectively improved.
Alternatively, the server 03 may store the position coordinates of each UWB base station 02 in advance; then, the specific implementation manner of the server 03 for positioning the tape positioning mold includes: the server 03 determines the position coordinates of the mold to be positioned according to the position coordinates of each UWB base station 02 in the plurality of UWB base stations 02 and the distance between each UWB base station 02 and the mold to be positioned.
In the embodiment, the position coordinates of the UWB base stations 02 are stored in the server 03 in advance, so that the processing efficiency of the server 03 can be further improved, the positioning accuracy of the mold can be further improved, especially, the running speed of the server 03 can be guaranteed in a scene with a large number of molds, and the position of each mold can be tracked accurately.
Optionally, the positioning apparatus 01 is further configured to: when a die to be positioned is transferred to a machine tool, acquiring identification information of the machine tool, and sending the identification information of the machine tool to a plurality of UWB base stations 02; after receiving the identification information of the machine tool, each UWB base station 02 sends the identification information of the machine tool to the server 03; after receiving the identification information of the machine tool, the server 03 determines that the mold to be positioned has been transferred to the machine tool.
Further, in order to improve the processing efficiency of the server 03, the server 03 may also store relevant information of each machine tool, such as position coordinates, model, size, and the like of each machine tool in advance.
In the embodiment, when the mold is transferred to the machine tool, the information of the transfer path, the last stored position or the installed machine tool and the like is known, and based on the data, data analysis can be performed, such as perfecting the stock space planning and reducing the mold transfer path; carrying out production scheduling according to the states of the die and the machine tool; and judging whether the mold is installed on an improper machine tool or not according to the position where the mold is finally placed.
Optionally, in the scheduling process, if the RFID tag identification of the mold is abnormal, for example, when a mold that is not put in storage, a mold that has been taken out of storage, or an unknown mold is found, the server 03 may further perform an abnormal alarm. For example, the position of the abnormal mold is displayed through a visual interface, or an alarm indication is sent to the positioning device on the abnormal mold, so that an indicator lamp of the positioning device on the abnormal mold flashes.
Further, for newly added moulds in the system or moulds needing to be delivered and stored due to scrapping and the like, when the moulds are outside the warehouse, the mould information can be read by manually holding the RFID scanning gun to scan the mould nameplate, and the corresponding moulds are delivered and stored through a visual interface. Or using a fixed ex-warehouse and in-warehouse scanning area, and when the mold is placed in the ex-warehouse and in-warehouse scanning area, considering that the mold is ex-warehouse and in-warehouse.
According to the embodiment, the production and management efficiency of the die can be further improved.
Based on the same inventive concept, the embodiment of the present invention further provides a mold positioning method, including:
the method comprises the steps that positioning equipment obtains die information of a die to be positioned; the positioning equipment is adsorbed on the surface of the mould to be positioned, and the mould information at least comprises the number of the mould to be positioned;
the positioning equipment sends UWB signals and the mold information to a plurality of UWB base stations fixed at preset positions, so that each UWB base station in the UWB base stations determines the distance between the mold to be positioned and the UWB base station according to the received UWB signals, and sends the mold information and the distance between the mold to be positioned and the UWB base station to a server.
Optionally, the positioning device specifically includes an RFID reader and an UWB positioning tag;
the positioning equipment acquires the mold information of the mold to be positioned, and specifically comprises the following steps:
the positioning equipment reads the mold information of the mold to be positioned, which is stored in the RFID nameplate of the mold to be positioned, through the RFID reader;
the positioning device sends UWB signals and the mold information to a plurality of UWB base stations fixed at predetermined positions, and specifically includes:
after acquiring the mold information of a mold to be positioned, the positioning equipment periodically sends UWB signals and the mold information to a plurality of UWB base stations fixed at preset positions through the UWB positioning tags.
Optionally, when the mold is transferred to a machine tool, the method further comprises:
the positioning equipment acquires identification information of the machine tool;
and the positioning equipment sends the identification information of the machine tool to the plurality of UWB base stations.
Based on the same inventive concept, the embodiment of the present invention further provides a mold positioning method, including:
the method comprises the following steps that a UWB base station receives UWB signals sent by positioning equipment and mold information of a mold to be positioned, wherein the mold information is adsorbed by the positioning equipment; the UWB base station is any one of a plurality of UWB base stations fixed at a preset position, and the mould information at least comprises the number of the mould to be positioned;
the UWB base station determines the distance between the mold to be positioned and the UWB base station according to the received UWB signals;
the UWB base station sends the mould information and the distance between the mould to be positioned and the UWB base station to the server, so that the server determines the mould to be positioned as the mould to be positioned according to the received mould information, and positions the mould to be positioned according to the distance between each UWB base station in the UWB base stations and the mould to be positioned.
Optionally, the UWB base station receives a UWB signal sent by a positioning device and mold information of a mold to be positioned, which is adsorbed by the positioning device, and specifically includes:
the UWB base station receives UWB signals sent periodically by positioning equipment and mold information of a mold to be positioned, which is adsorbed by the positioning equipment.
Optionally, when the mold is transferred to a machine tool, the method further comprises:
the UWB base station receives the identification information of the machine tool sent by the positioning equipment;
and the UWB base station sends the identification information of the machine tool to the server, so that the server receives the identification information of the machine tool and determines that the die to be positioned is positioned on the machine tool.
Based on the same inventive concept, the embodiment of the present invention further provides a mold positioning method, including:
the method comprises the steps that a server receives die information of a die to be positioned and the distance between the die to be positioned and a UWB base station, wherein the die information is sent by each UWB base station in the UWB base stations; wherein the mold information at least comprises the number of the mold to be positioned;
and the server determines the die to be positioned as the die to be positioned according to the received die information, and positions the die to be positioned according to the distance between each UWB base station in the plurality of UWB base stations and the die to be positioned.
Optionally, the server stores position coordinates of the plurality of UWB base stations in advance;
the server positions the mold to be positioned according to the distance between each UWB base station in the plurality of UWB base stations and the mold to be positioned, and the positioning method specifically comprises the following steps:
and the server determines the position coordinates of the mold to be positioned according to the position coordinates of each UWB base station in the plurality of UWB base stations and the distance between each UWB base station and the mold to be positioned.
Optionally, when the mold is transferred to a machine tool, the method further comprises:
the server receives the identification information of the machine tool sent by the UWB base stations;
and after receiving the identification information of the machine tool, the server determines that the die to be positioned is positioned on the machine tool.
Optionally, the method further includes:
and the server executes an abnormal alarm when receiving the mold information of the mold which is not put in a warehouse or is taken out of the warehouse or the unknown mold.
Based on the same inventive concept, an embodiment of the present invention further provides a mold positioning apparatus, referring to fig. 4, including:
an obtaining unit 41, configured to obtain mold information of a mold to be positioned; the device is adsorbed on the surface of the die to be positioned, and the die information at least comprises the number of the die to be positioned;
a sending unit 42, configured to send UWB signals and the mold information to a plurality of UWB base stations fixed at predetermined positions, so that each UWB base station in the plurality of UWB base stations determines a distance between the mold to be positioned and the UWB base station according to the received UWB signal, and sends the mold information and the distance between the mold to be positioned and the UWB base station to a server.
Optionally, the obtaining unit 41 is specifically configured to: reading the mold information of the mold to be positioned, which is stored in the RFID nameplate of the mold to be positioned;
the sending unit 42 is specifically configured to: periodically transmitting UWB signals and the mold information to a plurality of UWB base stations fixed at predetermined positions.
Optionally, the obtaining unit 41 is further configured to:
when the mold is transferred to a machine tool, acquiring identification information of the machine tool;
the sending unit 42 is further configured to: and transmitting the identification information of the machine tool to the plurality of UWB base stations.
The specific implementation manner of the operations performed by the units may refer to the corresponding steps performed by the positioning device in the mold positioning method according to the embodiment of the present invention, and repeated details are not repeated.
Based on the same inventive concept, an embodiment of the present invention further provides a mold positioning apparatus, referring to fig. 5, including:
a receiving unit 51, configured to receive a UWB signal sent by a positioning device and mold information of a mold to be positioned adsorbed by the positioning device; the device is any one of a plurality of devices fixed at a preset position, and the mold information at least comprises the number of the mold to be positioned;
a determining unit 52, configured to determine a distance between the mold to be positioned and the apparatus according to the received UWB signal;
a sending unit 53, configured to send the mold information and the distance between the mold to be positioned and the device to the server, so that the server determines, according to the received mold information, that the mold to be positioned is a mold to be positioned, and positions the mold to be positioned according to the distance between each device of the multiple devices and the mold to be positioned.
Optionally, the receiving unit 51 is specifically configured to: and receiving UWB signals periodically sent by positioning equipment and the mold information of the mold to be positioned adsorbed by the positioning equipment.
Optionally, the receiving unit 51 is further configured to:
when the mold is transferred onto a machine tool, receiving identification information of the machine tool sent by the positioning equipment;
the sending unit 53 is further configured to: and sending the identification information of the machine tool to the server so that the server receives the identification information of the machine tool and determines that the die to be positioned is positioned on the machine tool.
The specific implementation manner of the operations executed by the above units may refer to the corresponding steps executed by the UWB base station in the above mold positioning method according to the embodiment of the present invention, and repeated details are not repeated.
Based on the same inventive concept, an embodiment of the present invention further provides a mold positioning apparatus, referring to fig. 6, including:
the receiving unit 61 is configured to receive mold information of a mold to be positioned and a distance between the mold to be positioned and each UWB base station in the plurality of UWB base stations; wherein the mold information at least comprises the number of the mold to be positioned;
and the processing unit 62 is configured to determine, according to the received mold information, that the mold to be positioned is a mold to be positioned, and position the mold to be positioned according to a distance between each UWB base station in the plurality of UWB base stations and the mold to be positioned.
Optionally, the apparatus further includes a storage unit, configured to store position coordinates of the plurality of UWB base stations;
the processing unit 62 is specifically configured to: and determining the position coordinate of the mold to be positioned according to the position coordinate of each UWB base station in the plurality of UWB base stations and the distance between each UWB base station and the mold to be positioned.
Optionally, the receiving unit 61 is further configured to:
when the mold is transferred onto a machine tool, receiving identification information of the machine tool sent by the plurality of UWB base stations;
the processing unit 62 is further configured to: after the receiving unit 61 receives the identification information of the machine tool, it is determined that the die to be positioned is located on the machine tool.
Optionally, the processing unit 62 is further configured to:
and when the receiving unit 61 receives the mold information of the mold which is not put in a warehouse or is taken out of the warehouse or the unknown mold, executing an abnormal alarm.
The specific implementation manner of the operations executed by the units may refer to the corresponding steps executed by the server in the mold positioning method in the embodiment of the present invention, and repeated details are not repeated.
Based on the same inventive concept, an embodiment of the present invention further provides a mold positioning apparatus, referring to fig. 7, including:
at least one processor 71, and
a memory 72, a communication interface 73 communicatively coupled to the at least one processor 71;
wherein the memory 72 stores instructions executable by the at least one processor 71, and the at least one processor 71 executes the instructions stored in the memory 72 to perform the method performed by the positioning device 01, the UWB base station 02 or the server 03 according to the embodiment of the present invention by using the communication interface 73.
Based on the same inventive concept, an embodiment of the present invention further provides a computer-readable storage medium, where the computer-readable storage medium stores computer instructions, and when the computer instructions are executed on a computer, the computer is caused to execute the method executed by the positioning device 01, the UWB base station 02, or the server 03 according to the embodiment of the present invention.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (11)

1. A mould positioning system is characterized by comprising positioning equipment, a plurality of UWB base stations and a server;
the positioning device is attached to the surface of a mold to be positioned and used for acquiring mold information of the mold to be positioned, sending UWB signals and the mold information to the UWB base stations, acquiring identification information of a machine tool when the mold to be positioned is transferred to the machine tool, and sending the identification information of the machine tool to the UWB base stations; the mould information at least comprises the number of the mould to be positioned;
the plurality of UWB base stations are fixed at predetermined positions, each UWB base station of the plurality of UWB base stations is configured to: receiving UWB signals sent by the positioning equipment, the mold information and the identification information of the machine tool; determining the distance between the die to be positioned and the UWB base station according to the received UWB signals, and sending the die information, the identification information of the machine tool and the distance between the die to be positioned and the UWB base station to the server;
the server is configured to: determining the mold to be positioned as the mold to be positioned according to the received mold information, positioning the mold to be positioned according to the distance between each UWB base station in the plurality of UWB base stations and the mold to be positioned, determining that the mold to be positioned is positioned on the machine tool according to the identification information of the machine tool, and executing abnormal alarm when receiving the mold information of the mold which is not put in storage or is taken out of storage or the unknown mold.
2. The system of claim 1, wherein the locating devices comprise Radio Frequency Identification (RFID) readers and UWB locating tags;
the RFID reader is used for: reading the mold information of the mold to be positioned stored in the RFID nameplate of the mold to be positioned, and sending the mold information to the UWB positioning tag;
the UWB positioning tag is configured to: periodically transmitting UWB signals and the mold information to the plurality of UWB base stations after receiving the mold information.
3. The system of claim 1, wherein said server stores position coordinates of said plurality of UWB base stations in advance;
the server is specifically configured to: and determining the position coordinate of the mold to be positioned according to the position coordinate of each UWB base station in the plurality of UWB base stations and the distance between each UWB base station and the mold to be positioned.
4. A method of positioning a mold, comprising:
the method comprises the steps that a positioning device obtains die information of a die to be positioned, and when the die to be positioned is transferred to a machine tool, identification information of the machine tool is obtained; the positioning equipment is adsorbed on the surface of the mould to be positioned, and the mould information at least comprises the number of the mould to be positioned;
the positioning equipment sends UWB signals, the mold information and the identification information of the machine tool to a plurality of UWB base stations fixed at preset positions, so that each UWB base station in the UWB base stations determines the distance between the mold to be positioned and the UWB base station according to the received UWB signals, and sends the mold information, the identification information of the machine tool and the distance between the mold to be positioned and each UWB base station in the UWB base stations to a server, so that the server determines the mold to be positioned as the mold to be positioned according to the received mold information, positions the mold to be positioned according to the distance between each UWB base station and the mold to be positioned, determines the mold to be positioned on the machine tool according to the identification information of the machine tool, and when the mold information of a mold which is not put in storage or is put out of storage or an unknown mold is received, and executing abnormal alarm.
5. A method of positioning a mold, comprising:
the method comprises the following steps that a UWB base station receives UWB signals sent by positioning equipment, mold information of a mold to be positioned and adsorbed by the positioning equipment and identification information of a machine tool; the UWB base station is any one of a plurality of UWB base stations fixed at a preset position, and the mould information at least comprises the number of the mould to be positioned;
the UWB base station determines the distance between the mold to be positioned and the UWB base station according to the received UWB signals;
the UWB base station sends the mould information, the identification information of the machine tool and the distance between the mould to be positioned and the UWB base station to a server, so that the server determines the mould to be positioned as a mould to be positioned according to the received mould information, positions the mould to be positioned according to the distance between each UWB base station in the UWB base stations and the mould to be positioned, determines that the mould to be positioned is positioned on the machine tool according to the identification information of the machine tool, and executes abnormal alarm when receiving the mould information of a mould which is not stored in a warehouse or a mould which is out of the warehouse or an unknown mould.
6. A method of positioning a mold, comprising:
the method comprises the steps that a server receives die information of a die to be positioned, identification information of a machine tool and the distance between the die to be positioned and a UWB base station, wherein the die information is sent by each UWB base station in the UWB base stations; wherein the mold information at least comprises the number of the mold to be positioned;
the server determines the die to be positioned as the die to be positioned according to the received die information, positions the die to be positioned according to the distance between each UWB base station in the plurality of UWB base stations and the die to be positioned, determines that the die to be positioned is positioned on the machine tool according to the identification information of the machine tool, and executes an abnormal alarm when the die information of the die which is not stored in the machine tool in a warehouse or the die which is out of the warehouse or the die which is unknown is received.
7. A mold positioning device, comprising:
the acquisition unit is used for acquiring the die information of the die to be positioned and the identification information of the machine tool; the device is adsorbed on the surface of the die to be positioned, and the die information at least comprises the number of the die to be positioned;
a sending unit, configured to send UWB signals, the mold information, and the identification information of the machine tool to a plurality of UWB base stations fixed at predetermined positions, so that each of the UWB base stations determines a distance between the mold to be positioned and the UWB base station according to the received UWB signals, and send the mold information, the identification information of the machine tool, and the distance between the mold to be positioned and each of the UWB base stations to a server, so that the server determines, according to the received mold information, that the mold to be positioned is a mold to be positioned, positions the mold to be positioned according to the distance between each of the UWB base stations and the mold to be positioned, determines, according to the identification information of the machine tool, that the mold to be positioned is located on the machine tool, and when mold information of a mold that is not put into a warehouse or a mold that has been put out of a warehouse or an unknown mold is received, and executing abnormal alarm.
8. A mold positioning device, comprising:
the receiving unit is used for receiving UWB signals sent by positioning equipment, the mold information of the mold to be positioned and adsorbed by the positioning equipment and the identification information of the machine tool; the device is any one of a plurality of devices fixed at a preset position, and the mold information at least comprises the number of the mold to be positioned;
the determining unit is used for determining the distance between the die to be positioned and the device according to the received UWB signals;
and the sending unit is used for sending the mold information, the identification information of the machine tool and the distance between the mold to be positioned and the device to a server, so that the server determines the mold to be positioned as the mold to be positioned according to the received mold information, positions the mold to be positioned according to the distance between each device in the devices and the mold to be positioned, determines the mold to be positioned on the machine tool according to the identification information of the machine tool, and executes abnormal alarm when the mold information of the mold which is not stored in the machine tool or is taken out of the machine tool or is received.
9. A mold positioning device, comprising:
the device comprises a receiving unit, a positioning unit and a positioning unit, wherein the receiving unit is used for receiving the die information of a die to be positioned, the identification information of a machine tool and the distance between the die to be positioned and the UWB base station, which are sent by each UWB base station in the plurality of UWB base stations; wherein the mold information at least comprises the number of the mold to be positioned;
the processing unit is used for determining the die to be positioned as the die to be positioned according to the received die information, positioning the die to be positioned according to the distance between each UWB base station in the plurality of UWB base stations and the die to be positioned, determining that the die to be positioned is positioned on the machine tool according to the identification information of the machine tool, and executing abnormal alarm when the die information of the die which is not stored in the machine tool in a warehouse or the die which is out of the warehouse or the unknown die is received.
10. A mold positioning apparatus, comprising:
at least one processor, and
a memory communicatively coupled to the at least one processor, a communication interface;
wherein the memory stores instructions executable by the at least one processor, the at least one processor performing the method of any of claims 4-6 with the communications interface by executing the instructions stored by the memory.
11. A computer-readable storage medium having stored thereon computer instructions which, when executed on a computer, cause the computer to perform the method of any of claims 4-6.
CN201811160286.4A 2018-09-30 2018-09-30 Mold positioning system, method and device Active CN110968046B (en)

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