CN110967121A

CN110967121A - Matrix type three-dimensional temperature test monitoring system

Info

Publication number: CN110967121A
Application number: CN201911273827.9A
Authority: CN
Inventors: 王珍; 何荣国; 陈建国; 张志新; 邱立鹏
Original assignee: Dalian University
Current assignee: Dalian University
Priority date: 2019-12-12
Filing date: 2019-12-12
Publication date: 2020-04-07

Abstract

A matrix type three-dimensional temperature test monitoring system belongs to the technical field of electronics. The technical scheme is as follows: the method comprises the following steps: the system comprises an upper end module, a middle end module and a lower end module, wherein the upper end module is a computer and is provided with independently developed software for sending commands, receiving and displaying data and storing the data; the middle-end module uses the singlechip as an inspection host, is used for relay work, transmits a command of the upper-end host to the extension at the lower end, and reports data of the extension at the lower end to the host; the lower end module uses a single chip microcomputer as an extension set, each extension set is connected with a plurality of temperature sensors, and the distribution of the sensors in space is three-dimensional distribution. The invention has the advantages that the temperature sensor is arranged in a three-dimensional way, so that the temperature of any position in the space can be monitored at any time; according to the requirement, the temperature sensor at any position can be manually appointed to upload the temperature information.

Description

Matrix type three-dimensional temperature test monitoring system

Technical Field

The invention belongs to the technical field of electronics, and particularly relates to a temperature testing and monitoring system for three-dimensional point positions in a whole closed environment.

Background

In some closed indoor environments, such as laboratories, etc., the requirement on the temperature of the whole environment is high, the temperature of the environment needs to be collected in real time or at regular time, and when the temperature is higher or lower than a set temperature, a warning is given or the temperature regulating device starts to be started for temperature regulation, so that a set of system is urgently needed to collect and analyze the temperature of the environment in real time or at fixed points.

Disclosure of Invention

In order to solve the problems in the prior art, the invention provides a matrix type three-dimensional temperature testing and monitoring system, in the system, the arrangement of temperature sensors is three-dimensional, the temperature sensors can be monitored in real time at any position in the space, and the system is efficient and rapid.

The technical scheme is as follows:

a matrix type three-dimensional temperature test monitoring system comprises: the system comprises an upper end module, a middle end module and a lower end module, wherein the upper end module is a computer and is provided with independently developed software for sending commands, receiving and displaying data and storing the data; the middle-end module uses the singlechip as an inspection host, is used for relay work, transmits a command of the upper-end host to the extension at the lower end, and reports data of the extension at the lower end to the host; the lower end module uses a single chip microcomputer as an extension set, each extension set is connected with a plurality of temperature sensors, and the distribution of the sensors in space is three-dimensional distribution.

Furthermore, the temperature sensors are connected in series by twisted pairs, and a plurality of twisted pairs are distributed in a three-dimensional space according to a certain distance.

Furthermore, the computer sends an acquisition instruction to the inspection host, the inspection host forwards the acquisition instruction to the extension sets, the extension sets perform continuous temperature acquisition according to the instruction and upload the temperature acquisition to the inspection host, the inspection host uploads the temperature acquisition to the computer, and finally the computer analyzes, displays and stores the received data and performs corresponding operation according to the analysis result.

Furthermore, in the timing acquisition working mode, an acquisition time point is preset, when the time point is reached, firstly, the computer sends an acquisition primary instruction to the inspection host, then the inspection host forwards the acquisition primary instruction to each extension, each extension carries out primary temperature acquisition according to the instruction and uploads the temperature acquisition to the inspection host, the inspection host uploads the temperature acquisition to the computer, and finally, the computer analyzes, displays and stores the received data and carries out corresponding operation according to the analysis result.

The invention has the beneficial effects that:

the matrix type three-dimensional temperature testing and monitoring system has the following beneficial effects:

(1) because the arrangement of the temperature sensor is the three-dimensional placement, the temperature of any position in the space can be monitored at any time;

(2) the first mode is real-time acquisition, the lower end module continuously acquires temperature information and uploads the temperature information to the upper end module, the second mode is timing acquisition, a plurality of fixed time nodes are set artificially, and the temperature information acquired by each temperature sensor is acquired and uploaded when the set time node is reached;

(3) according to the requirement, the temperature sensor at any position can be manually appointed to upload the temperature information;

(4) the upper module analyzes and stores the received temperature information for later use.

Drawings

FIG. 1 is a spatial overall wiring diagram of a temperature sensor according to the present invention;

FIG. 2 is a block diagram of a communication system according to the present invention;

fig. 3 is a schematic diagram of the binary conversion of the collected data.

Detailed Description

The matrix three-dimensional temperature testing and monitoring system is further described with reference to fig. 1-3.

Example 1

A matrix type three-dimensional temperature test monitoring system comprises an upper module, a middle module and a lower module, wherein the upper module is mainly a computer and is provided with independently developed software, and the main functions of the upper module are to send commands, receive and display data, store data and the like; the middle-end module mainly uses a singlechip with higher performance as an inspection host, and has the main functions of relaying, transmitting the command of the upper-end host to the extension set at the lower end, and reporting the data of the extension set at the lower end to the host; the lower module mainly uses a single chip with relatively common performance as an extension set, each extension set is connected with a plurality of temperature sensors by twisted-pair lines, and the sensors are distributed in a three-dimensional manner in space.

The upper end module plays a role in master control, the middle end module plays a role in relaying, the work of issuing is uploaded, the lower end module plays a role in carrying out data acquisition on the temperature, the temperature sensors are connected in series by twisted pairs, and then a plurality of twisted pairs are distributed in a three-dimensional space according to a certain distance.

In fig. 1: "extension" belongs to the extension of the lower module, A, B, C, D is a temperature sensor, and the solid line and the dotted line connecting the extension and the temperature sensor are a communication line and a power line.

In fig. 2: the computer is an upper end module, the inspection host is a middle end module, and each extension is a lower end module. The upper end module and the middle end module are connected through an RS232 bus, and the middle end module and the lower end module are connected through an RS485 bus.

In fig. 3: the "X binary" and "Y binary" are shown as the collected data, the raw data collected is binary and needs to be converted into decimal data which is commonly known and is carried out at the upper module.

Example 2

The invention provides the following technical scheme: the whole system is divided into three modules of an upper end, a middle end and a lower end. The upper module is mainly a computer and is provided with independently developed software, and has the main functions of sending commands, receiving and displaying data, storing data and the like; the middle-end module mainly uses a singlechip with higher performance as an inspection host, and has the main functions of relaying, transmitting the command of the upper-end host to the extension set at the lower end, and reporting the data of the extension set at the lower end to the host; the lower module mainly uses a single chip with relatively common performance as an extension set, each extension set is connected with a plurality of temperature sensors by twisted-pair lines, and the sensors are distributed in a three-dimensional manner in space.

Fig. 1 of a matrix three-dimensional temperature testing and monitoring system shows a space wiring diagram of temperature sensors, wherein A, B, C, D temperature sensors such as 1-1-1# are connected in series through twisted pairs, and then 1-1-1#, 1-1-2# … … 1-1-7# twisted pairs are incorporated into a bus controlled by a number 1 extension. Role of the twisted pair: namely the data transmission line and the power line. The distance between the temperature sensors can be adjusted according to actual needs.

Fig. 2 shows a communication structure diagram of the temperature test monitoring system, in which a "computer" is an upper module, a "inspection main unit" is a middle module, and each "extension unit" is a lower module. (1) In the real-time acquisition mode, firstly, the computer sends an acquisition instruction to the inspection host, then the inspection host forwards the acquisition instruction to the extension sets, the extension sets continuously acquire temperature according to the instruction and upload the temperature to the inspection host, the inspection host uploads the temperature to the computer, and finally the computer analyzes, displays and stores the received data and performs corresponding operation according to the analysis result. (2) In the timing collection working mode, a collection time point is preset, when the time point is reached, firstly, a computer sends a collection primary instruction to an inspection main machine, the inspection main machine forwards the collection primary instruction to all extension machines, all extension machines carry out primary temperature collection according to the instruction and upload the temperature collection to the inspection main machine, the extension machines upload the temperature collection to the computer, and finally, the computer analyzes, displays and stores the received data and carries out corresponding operation according to the analysis result.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.

Claims

1. The utility model provides a three-dimensional temperature test monitored control system of matrix which characterized in that includes: the system comprises an upper end module, a middle end module and a lower end module, wherein the upper end module is a computer and is provided with independently developed software for sending commands, receiving and displaying data and storing the data; the middle-end module uses the singlechip as an inspection host, is used for relay work, transmits a command of the upper-end host to the extension at the lower end, and reports data of the extension at the lower end to the host; the lower end module uses a single chip microcomputer as an extension set, each extension set is connected with a plurality of temperature sensors, and the distribution of the sensors in space is three-dimensional distribution.

2. The matrix three-dimensional temperature testing and monitoring system according to claim 1, wherein the temperature sensors are connected in series by twisted pairs, and a plurality of twisted pairs are distributed in the three-dimensional space at a certain distance.

3. The matrix type three-dimensional temperature testing and monitoring system according to claim 1, wherein the computer sends a collection command to the inspection host, the inspection host forwards the collection command to the extension sets, the extension sets continuously collect and upload temperature according to the command to the inspection host, the inspection host uploads the collected temperature to the computer, and finally the computer analyzes, displays and stores the received data and performs corresponding operations according to the analysis result.

4. The matrix type three-dimensional temperature testing and monitoring system according to claim 1, wherein in the timing collection mode, a collection time point is preset, when the time point is reached, a collection command is sent to the inspection host by the computer, the inspection host forwards the collection command to each extension, each extension collects temperature once according to the command and uploads the temperature to the inspection host, the inspection host uploads the temperature to the computer, and finally the computer analyzes, displays and stores the received data and performs corresponding operations according to the analysis result.