CN110955002A - 硅光子芯片光功率测量装置、设备、系统及测量方法 - Google Patents
硅光子芯片光功率测量装置、设备、系统及测量方法 Download PDFInfo
- Publication number
- CN110955002A CN110955002A CN202010002907.7A CN202010002907A CN110955002A CN 110955002 A CN110955002 A CN 110955002A CN 202010002907 A CN202010002907 A CN 202010002907A CN 110955002 A CN110955002 A CN 110955002A
- Authority
- CN
- China
- Prior art keywords
- light
- silicon
- optical power
- silicon photonic
- photonic chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 172
- 239000010703 silicon Substances 0.000 title claims abstract description 172
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 169
- 230000003287 optical effect Effects 0.000 title claims abstract description 147
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000007493 shaping process Methods 0.000 claims abstract description 25
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 239000013307 optical fiber Substances 0.000 claims description 45
- 238000005259 measurement Methods 0.000 claims description 27
- 239000011521 glass Substances 0.000 claims description 9
- 239000000523 sample Substances 0.000 claims description 6
- 230000000007 visual effect Effects 0.000 claims description 4
- 230000004075 alteration Effects 0.000 claims 2
- 238000011056 performance test Methods 0.000 abstract description 5
- 238000010168 coupling process Methods 0.000 description 14
- 230000008878 coupling Effects 0.000 description 13
- 238000005859 coupling reaction Methods 0.000 description 13
- 238000012360 testing method Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000012216 screening Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4298—Coupling light guides with opto-electronic elements coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010002907.7A CN110955002A (zh) | 2020-01-02 | 2020-01-02 | 硅光子芯片光功率测量装置、设备、系统及测量方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010002907.7A CN110955002A (zh) | 2020-01-02 | 2020-01-02 | 硅光子芯片光功率测量装置、设备、系统及测量方法 |
Publications (1)
Publication Number | Publication Date |
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CN110955002A true CN110955002A (zh) | 2020-04-03 |
Family
ID=69985523
Family Applications (1)
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CN202010002907.7A Pending CN110955002A (zh) | 2020-01-02 | 2020-01-02 | 硅光子芯片光功率测量装置、设备、系统及测量方法 |
Country Status (1)
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CN (1) | CN110955002A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113884180A (zh) * | 2021-09-29 | 2022-01-04 | 歌尔光学科技有限公司 | 衍射光波导的测试系统、方法及装置 |
CN118131416A (zh) * | 2024-04-30 | 2024-06-04 | 赛丽科技(苏州)有限公司 | 一种光通信器件及光通信系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104765102A (zh) * | 2015-04-21 | 2015-07-08 | 四川飞阳科技有限公司 | 一种硅光子芯片的封装结构 |
CN110554459A (zh) * | 2018-05-31 | 2019-12-10 | 意法半导体股份有限公司 | 制造用于绝热耦合的器件的方法、对应的器件和系统 |
CN211236362U (zh) * | 2020-01-02 | 2020-08-11 | 亨通洛克利科技有限公司 | 硅光子芯片光功率测量装置、设备及系统 |
-
2020
- 2020-01-02 CN CN202010002907.7A patent/CN110955002A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104765102A (zh) * | 2015-04-21 | 2015-07-08 | 四川飞阳科技有限公司 | 一种硅光子芯片的封装结构 |
CN110554459A (zh) * | 2018-05-31 | 2019-12-10 | 意法半导体股份有限公司 | 制造用于绝热耦合的器件的方法、对应的器件和系统 |
CN211236362U (zh) * | 2020-01-02 | 2020-08-11 | 亨通洛克利科技有限公司 | 硅光子芯片光功率测量装置、设备及系统 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113884180A (zh) * | 2021-09-29 | 2022-01-04 | 歌尔光学科技有限公司 | 衍射光波导的测试系统、方法及装置 |
CN113884180B (zh) * | 2021-09-29 | 2024-03-12 | 歌尔光学科技有限公司 | 衍射光波导的测试系统、方法及装置 |
CN118131416A (zh) * | 2024-04-30 | 2024-06-04 | 赛丽科技(苏州)有限公司 | 一种光通信器件及光通信系统 |
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PB01 | Publication | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20200828 Address after: No.88 Hengtong Road, Wujiang Economic and Technological Development Zone, Suzhou, Jiangsu Province, 215299 Applicant after: HENGTONG ROCKLEY TECHNOLOGY Co.,Ltd. Applicant after: JIANGSU HENGTONG OPTICAL NETWORK TECHNOLOGY Co.,Ltd. Address before: 215200 Hengdao 88, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Applicant before: HENGTONG ROCKLEY TECHNOLOGY Co.,Ltd. |
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Application publication date: 20200403 |
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