CN110943116B - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN110943116B CN110943116B CN201911319259.1A CN201911319259A CN110943116B CN 110943116 B CN110943116 B CN 110943116B CN 201911319259 A CN201911319259 A CN 201911319259A CN 110943116 B CN110943116 B CN 110943116B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000010410 layer Substances 0.000 claims abstract description 278
- 239000002346 layers by function Substances 0.000 claims abstract description 66
- 238000002955 isolation Methods 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000004806 packaging method and process Methods 0.000 claims abstract description 34
- 238000005538 encapsulation Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 71
- 230000008569 process Effects 0.000 claims description 51
- 229920002120 photoresistant polymer Polymers 0.000 claims description 41
- 230000004888 barrier function Effects 0.000 claims description 23
- 238000000059 patterning Methods 0.000 claims description 22
- 238000005530 etching Methods 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 230000007423 decrease Effects 0.000 claims 1
- 238000003384 imaging method Methods 0.000 abstract description 12
- 238000002834 transmittance Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000005192 partition Methods 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- 238000000926 separation method Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
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Abstract
The invention provides a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises: a substrate base; a first display region including a light emitting region and a light transmitting region; for the first display area, a transparent isolating layer is arranged in the light-transmitting area only; for the first display region, only a light-emitting functional layer, a cathode layer positioned on the light-emitting functional layer and an encapsulation layer positioned on the cathode layer are arranged in the light-emitting region; in the direction parallel to the plane of the substrate base plate, the transparent isolation layer and the packaging layer are overlapped with each other. The technical scheme provided by the embodiment of the invention can be used for improving the imaging quality.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.
Background
An Organic Light-Emitting Diode (OLED) device has the advantages of simple structure, fast response speed, active Light emission, low power consumption and the like, and has been widely applied to the display fields of mobile phones, flat panels, televisions and the like.
In order to realize a full screen display, as shown in fig. 1, which is a schematic diagram of a structure of a display device in the related art, an area 1 where display will also be performed is generally disposed in a display area of an OLED display device, and an off-screen sensor 100 (e.g., a camera) is disposed in the area 1. In the prior art, the transmittance of light in the area 1 is reduced to a certain extent due to the cathode on the whole surface of the display area including the area 1, so that the off-screen sensor 100 cannot receive a sufficient amount of light, and the imaging quality of the off-screen sensor is reduced.
Disclosure of Invention
The invention provides a display panel, a manufacturing method thereof and a display device, which are used for improving imaging quality.
In a first aspect, an embodiment of the present invention provides a display panel, including:
a substrate base;
A first display region including a light emitting region and a light transmitting region;
for the first display area, a transparent isolating layer is arranged in the light-transmitting area only;
for the first display region, only a light-emitting functional layer, a cathode layer positioned on the light-emitting functional layer and an encapsulation layer positioned on the cathode layer are arranged in the light-emitting region;
in the direction parallel to the plane of the substrate base plate, the transparent isolation layer and the packaging layer are overlapped with each other.
In a second aspect, based on the same inventive concept, an embodiment of the present invention provides a method for manufacturing a display panel as described above, including:
forming a pattern of the transparent barrier layer within the light-transmitting region;
evaporating the light-emitting functional layer and the cathode layer on the transparent isolating layer;
Forming an encapsulation layer on the cathode layer;
and sequentially etching the packaging layer, the cathode layer and the luminous functional layer which are positioned in the light transmission area by using a composition process to respectively form a pattern of the packaging layer, a pattern of the cathode layer and a pattern of the luminous functional layer.
In a third aspect, based on the same inventive concept, an embodiment of the present invention provides a display device including a display panel as described above.
The beneficial effects of the invention are as follows:
In the display panel, the manufacturing method thereof and the display device provided by the embodiment of the invention, for the first display area, the transparent isolation layer is arranged in the light transmission area only, and for the first display area, the light emitting function layer, the cathode layer positioned on the light emitting function layer and the packaging layer positioned on the cathode layer are arranged in the light emitting area only, and meanwhile, the transparent isolation layer and the packaging layer are mutually overlapped in the direction parallel to the plane of the substrate. The light-emitting functional layer and the cathode layer in the first display area can be separated through the transparent separation layer, and the edges of the light-emitting functional layer and the cathode layer can be packaged through the transparent separation layer. Therefore, on one hand, the patterning treatment of the cathode layer is realized through the transparent partition layer, only the cathode layer is arranged in the light-emitting area in the first display area, the cathode layer is not arranged in the light-transmitting area, the light transmittance of the light-transmitting area is improved, on the other hand, the packaging of the edges of the light-emitting functional layer and the cathode layer in the light-emitting area is realized through the transparent partition layer while the cathode layer in the light-emitting area is packaged through the packaging layer, the packaging effect of the display panel is improved, the light transmittance of the first display area is improved through the transparent partition layer, the imaging quality of the sensor arranged under the screen in the first display area is improved, and meanwhile, the packaging effect of the display panel is ensured.
Drawings
FIG. 1 is a schematic diagram of a display device in the related art;
FIG. 2 is a schematic top view of one of the areas 1 of the display device shown in FIG. 1;
FIG. 3 is a schematic cross-sectional view taken along aa' in the area 1 of FIG. 2;
fig. 4 is a schematic top view of a display panel according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of the first display area shown in FIG. 4;
FIG. 6 is a schematic cross-sectional view of the first display area shown in FIG. 5 along the light transmitting area bb';
FIG. 7 is a schematic diagram of another structure of a display panel according to an embodiment of the invention;
FIG. 8 is a schematic diagram of another structure of a display panel according to an embodiment of the invention;
FIG. 9 is a flowchart of a method for fabricating a display panel according to an embodiment of the present invention;
fig. 10 is a flowchart of a method of step S101 in a method of manufacturing a display panel according to an embodiment of the present invention;
Fig. 11 is a process flow chart corresponding to step S101 in the method for manufacturing a display panel according to the embodiment of the invention;
fig. 12 is a corresponding process flow chart of steps S101 to S103 in the method for manufacturing a display panel according to the embodiment of the invention;
fig. 13 is a flowchart of a method of step S104 in the method for manufacturing a display panel according to the embodiment of the present invention;
Fig. 14 is a process flow chart corresponding to steps S301 to S304 in the method for manufacturing a display panel according to the embodiment of the invention;
FIG. 15 is a flowchart of a method provided in an embodiment of the present invention before step S201;
fig. 16 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The terms "first," "second," and the like in the description and in the claims and in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprise," "include," and any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
The term "and/or" is herein merely an association relationship describing an associated object, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. The character "/" herein generally indicates that the associated object is an "or" relationship unless otherwise specified.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
In order to better understand the above technical solutions, the following detailed description of the technical solutions of the present invention is made by using the accompanying drawings and specific embodiments, and it should be understood that the specific features of the embodiments and the embodiments of the present invention are detailed descriptions of the technical solutions of the present invention, and not limiting the technical solutions of the present invention, and the embodiments and the technical features of the embodiments of the present invention may be combined with each other without conflict. Moreover, the shapes and sizes of the various components in the drawings do not reflect actual proportions, and are intended to illustrate the invention only.
In the implementation process, fig. 2 is a schematic top view of one of the areas 1 in the display device shown in fig. 1, and fig. 3 is a schematic cross-sectional view along aa' in the area 1 shown in fig. 2. As shown in fig. 2 and 3, in general, the display device area 1 may include: an organic light emitting diode 11 on the array substrate 10, an encapsulation layer 12 on the organic light emitting diode 11, and an off-screen sensor 100 on a side of the array substrate 10 facing away from the organic light emitting diode 11. The organic light emitting diode 11 has an anode 01, a light emitting layer 02, and a cathode 03 stacked together.
In practical applications, ambient light S enters the under-screen sensor 100 after passing through the area 1 to image the under-screen sensor 100. However, since the cathode 03 in the organic light emitting diode 11 is generally configured as a full-face electrode, the transmittance of light through the cathode 03 is low, resulting in less amount of light received by the under-screen sensor 100 and poor imaging quality.
In view of this, an embodiment of the present invention provides a display panel for improving the imaging quality of the under-screen sensor 100.
In the implementation process, fig. 4 to fig. 6 are combined, wherein fig. 4 is a schematic top view of a display panel according to an embodiment of the present invention, fig. 5 is a schematic structural view of a first display area A1 in the display panel shown in fig. 4, and fig. 6 is a schematic structural view of a portion of the first display area A1 in the direction of a light transmission area bb' shown in fig. 5. Specifically, the display panel includes a substrate 1000, a first display area A1 and a second display area A2, where the first display area A1 is a translucent area for setting an off-screen sensor, the first display area A1 is an area in the display area a corresponding to the off-screen sensor and capable of displaying, and the second display area A2 is other display areas in the display area a except the first display area A1 (i.e., the translucent area). In the embodiment of the present invention, the first display area A1 and the second display area A2 respectively include a pixel unit PX, and the pixel unit PX includes a plurality of sub-pixel units spx.
The first display area A1 includes a light emitting area a11 and a light transmitting area a12 as shown in fig. 5. It should be noted that, the external light can pass through the light-transmitting area a12 in the first display area A1 and propagate to the position of the sensor under the screen, so as to provide the light required by the normal operation of the sensor under the screen. In order to ensure that the light transmission area a12 in the first display area A1 is large enough to increase the light quantity received by the under-screen sensor and ensure that the under-screen sensor can receive enough light, the density of pixel units PX in the first display area A1 can be set to be smaller than that of pixel units PX in the second display area A2, or the pixel circuits of the pixel units in the first display area A1 are arranged outside the first display area A1, so that the area of the light transmission area a12 is increased, the transmittance of light passing through the light transmission area a12 is increased, and the imaging quality of the under-screen sensor is improved.
In the embodiment of the present invention, as shown in fig. 6, for the first display area A1, the transparent barrier layer 20 is disposed only in the light-transmitting area a12, and for the first display area A1, the light-emitting function layer 30, the cathode layer 40 on the light-emitting function layer 30, and the encapsulation layer 50 on the cathode layer 40 are disposed only in the light-emitting area a11, while the transparent barrier layer 20 and the encapsulation layer 50 overlap each other in a direction parallel to the plane of the substrate 1000. Optionally, the transparent barrier layer 20 and the encapsulation layer 50 are in contact with each other. Wherein the light emitting functional layer 30 and the cathode layer 40 in the first display area A1 may be blocked by the transparent blocking layer 20, and edges of the light emitting functional layer 30 and the cathode layer 40 may be encapsulated by the transparent blocking layer 20. In this way, on the one hand, the patterning process of the cathode layer 40 is realized through the transparent isolation layer 20, only the cathode layer 40 is arranged in the light emitting area A11 in the first display area A1, the cathode layer 40 is not arranged in the light transmitting area A12, the light transmittance of the light emitting area A11 is improved, on the other hand, the packaging of the edges of the light emitting functional layer 30 and the cathode layer 40 in the light emitting area A11 is realized through the transparent isolation layer 20 while the cathode layer 40 in the light emitting area A11 is packaged through the packaging layer 50, the packaging effect of the display panel is improved, and on the other hand, the light transmittance of the light in the first display area A1 is improved through the transparent isolation layer 20, the imaging quality of the sensor arranged under the screen in the first display area A1 is improved, and meanwhile, the packaging effect of the display panel is ensured.
In a specific implementation, the encapsulation layer 50 may include a first inorganic layer and a second inorganic layer, and an organic layer between the first inorganic layer and the second inorganic layer, the second inorganic layer being located on a side of the first inorganic layer away from the light emitting functional layer 30. The material of the organic layer may be parylene, and the material of the first and second inorganic layers may be silicon nitride, silicon dioxide, or the like. In a specific implementation process, the package layer 50 can prevent the damage of water and oxygen to the display panel, so that the service life of the display panel is prolonged.
In the embodiment of the present invention, the first display area A1 and the second display area A2 may form a continuous display area a, so that the first display area A1 and the second display area A2 may both display images. Illustratively, the shape of the display area a is substantially rectangular, for example, the top corners of the display area a are all right angles, and the display area a is rectangular. For another example, if the apex angle of the display area a is an arc angle, the display area a is substantially rectangular in shape.
In a specific implementation process, the first display area A1 may be one or more. The second display area A2 may be a continuous area, or the second display area A2 may be a discontinuous area, which may be designed and determined according to the actual application environment, and is not limited herein.
In a specific implementation process, the relative positional relationship between the first display area A1 and the second display area A2 may be that at least part of the edges of the first display area A1 coincides with at least part of the edges of the display area a, and the rest of the first display area A1 is surrounded by the second display area A2, so that the first display area A1 may be disposed at the edge of the display area a.
In the implementation process, the relative positional relationship between the first display area A1 and the second display area A2 may be that the second display area A2 surrounds the first display area A1, so that the first display area A1 may be disposed inside the display area a. For example, the first display area A1 may be disposed at the upper left corner of the second display area A2. For another example, the first display area A1 may be disposed at the upper right corner of the second display area A2. For another example, the first display area A1 may be disposed at the left side of the second display area A2. For another example, the first display area A1 may be disposed at an upper side of the second display area A2. Of course, in practical applications, the specific position of the first display area A1 may be designed and determined according to the practical application environment, which is not limited herein.
In a specific implementation process, the shape of the first display area A1 may be set to a regular shape, such as a circle, an ellipse, or a rectangle, and the top corner of the rectangle may be a right angle, or the top corner of the rectangle may also be an arc-shaped corner. For another example, the first display area A1 may be configured to have a trapezoid shape, which may be a regular trapezoid or an inverted trapezoid. In addition, the vertex angle of the trapezoid can be a normal included angle or can also be an arc-shaped angle. For another example, the shape of the first display area A1 may also be set to an irregular shape. For example, the shape of the first display area A1 may be set to a drop shape. Of course, in practical applications, the shape of the first display area A1 may be designed according to the shape of the element disposed in the first display area A1, which is not limited herein.
In a specific implementation process, the area of the first display area A1 may be smaller than the area of the second display area A2. Of course, in practical application, the design may be performed according to the elements disposed in the first display area A1, which is not limited herein.
In the embodiment of the present invention, the relative positional relationship and shape of the first display area A1 and the second display area A2 are not limited, and may be specifically set according to the screen design of the display device. Taking a mobile phone as an example, the first display area A1 may be disposed at the upper left corner of the display area a, or the first display area A1 may be disposed at the upper right corner of the display area a. The camera is arranged at the corner, and the first display area A1 can be utilized for displaying simple and quick function services such as time, weather and information reminding.
In this embodiment of the present invention, as shown in fig. 7, which is a schematic structural diagram of a display panel provided in this embodiment of the present invention, specifically, an edge of the light emitting functional layer 30 has a step descending along a direction close to the substrate 1000, so that an edge of the cathode layer 40 located on the light emitting functional layer 30 will also have a step descending along a direction close to the substrate 1000, so that, when the light emitting functional layer 30 and the cathode layer 40 in the light emitting area a11 are encapsulated by the transparent isolation layer 20 and the encapsulation layer 50, the first display area A1 can be ensured to be separated from the relevant film layers located in the light emitting area a11 and the light transmitting area a12, which is convenient for process manufacturing, and improves the manufacturing efficiency of the display panel. In addition, in order to ensure that the edge of the light emitting function layer 30 has a step descending in a direction approaching the substrate 1000 in the specific implementation process, for the first display area A1, a raised layer 130 is further disposed between the light emitting function layer 30 and the substrate 1000 in the light emitting area a11, and the thickness of the raised layer 130 is smaller than that of the transparent barrier layer 20, so that the edge of the light emitting function layer 30 disposed on the raised layer 130 near the transparent barrier layer 20 is ensured to have a step descending in a direction approaching the substrate 1000. The pad layer 70 may be a pixel circuit provided only in the light emitting region a11, or may be another film layer, and is not limited thereto.
As shown in fig. 8, in another structural schematic diagram of the display panel according to the embodiment of the invention, specifically, a pixel circuit 110 is disposed between the light emitting functional layer 30 and the substrate 1000, a first insulating layer 60 is disposed between the pixel circuit 110 and the light emitting functional layer 30, and the thickness of the transparent insulating layer 20 is greater than the sum of the thickness of the light emitting functional layer 30 and the thickness of the first insulating layer 60. Alternatively, in the embodiment, the pixel circuit 110 is provided only in the light emitting area a11 for the first display area A1. By the pixel circuit 110, not only the pixel units in the corresponding light emitting area a11 can be controlled to emit light to realize the control of the display effect of the display panel, but also the edges of the light emitting functional layer 30 and the first insulating layer 60 arranged on the pixel circuit 110 can be provided with steps descending along the direction approaching the substrate 100. For example, the thickness of the transparent isolation layer 20 is d1, and the sum of the thickness of the light-emitting functional layer 30 and the thickness of the first insulating layer 60 is d2, d1> d2, so that, on one hand, through the thickness of the transparent isolation layer 20 and the thickness difference between the thickness of the light-emitting functional layer 30 and the thickness of the first insulating layer 60, the edge of the light-emitting functional layer 30 is ensured to have a step descending along the direction close to the substrate 1000, and meanwhile, the transparent isolation layer 20 is ensured to be capable of isolating the light-emitting functional layer 30, and on the other hand, the transparent isolation layer 20 is ensured to fully encapsulate the edge of the light-emitting functional layer 30, so that the water-oxygen isolation of the light-emitting functional layer 30 is realized, and the service life of the display panel is prolonged. In addition, in the implementation process, the first insulating layer 60 may be at least one of a buffer layer, a gate insulating layer, an interlayer insulating layer, and a pixel definition layer, so that interference of external signals to the pixel circuit 110 is effectively prevented by the first insulating layer 60, and display quality of the display panel is ensured. Of course, in practical application, different insulating layers can be selected according to application requirements, which is not limited herein.
In the embodiment of the invention, the thickness of the transparent insulating layer 20 is smaller than that of the packaging layer 50, so that the packaging layer 50 fully packages the cathode layer 40 positioned in the light-emitting area A11, and the service life of the display panel is prolonged.
In the embodiment of the present invention, the thickness of the transparent insulating layer 20 along the direction perpendicular to the substrate 1000 is greater than or equal to 3 micrometers, for example, 5 micrometers, so that the transparent insulating layer 20 is ensured to fully partition the light-emitting functional layer 30 and the cathode layer 40 and fully encapsulate the edges of the light-emitting functional layer 30 and the cathode layer 40, thereby improving the service life of the display panel. Of course, in practical application, the specific thickness value of the transparent insulating layer 20 in the direction perpendicular to the substrate 1000 may be set according to the application requirement, which is not limited herein.
In the embodiment of the present invention, the material of the transparent insulating layer 20 includes at least one of silicon nitride and silicon oxide, and the transparent insulating layer 20 can effectively prevent the damage of external water and oxygen to the light-emitting functional layer 30 and the cathode layer 40, so as to improve the service life of the display panel, and of course, in actual use, the transparent insulating layer 20 of other materials can be selected according to the application requirements, which is not limited herein.
Based on the same inventive concept, as shown in fig. 9, an embodiment of the present invention provides a method for manufacturing a display panel, including:
s101: forming a pattern of the transparent barrier layer within the light-transmitting region;
in a specific implementation process, a whole transparent isolation layer 20 is formed on the substrate 1000, and then a pattern of the transparent isolation layer is formed in the transparent area a12 by using a conventional mask technology and an exposure etching method.
S102: evaporating the light-emitting functional layer and the cathode layer on the transparent isolating layer;
In a specific implementation process, after the patterns of the transparent isolation layer 20 are formed, the light-emitting functional layer 30 and the cathode layer 40 are sequentially evaporated on the transparent isolation layer 20, and as the transparent isolation layer 20 is only arranged in the light-transmitting area A12, but the transparent isolation layer 20 is not arranged in the light-emitting area A11, the light-emitting functional layer 30 in the light-emitting area A11 is disconnected at the edge, so that the light-transmitting area A12 and the relevant film layer in the light-emitting area A11 are separated from each other, and corresponding patterning treatment can be performed on the light-emitting functional layer 30 in the light-transmitting area A12 according to practical application requirements. In the implementation process, the cathode layer 40 formed on the light-emitting functional layer 30 in the light-emitting area a11 is also cut off at the edge, so that the cathode layer 40 in the light-transmitting area a12 can be subjected to corresponding patterning according to practical application requirements, thereby improving the manufacturing efficiency of the patterning of the corresponding film layer.
S103: forming an encapsulation layer on the cathode layer;
S104: and sequentially etching the packaging layer, the cathode layer and the luminous functional layer which are positioned in the light transmission area by using a patterning process (optionally, a one-time patterning process), so as to respectively form a pattern of the packaging layer, a pattern of the cathode layer and a pattern of the luminous functional layer.
In a specific implementation process, the pattern of the encapsulation layer 50, the pattern of the cathode layer 40 and the pattern of the light-emitting functional layer 30 may be formed by a one-time patterning process, and the exposure process may be a process including two steps of exposure and development, where the exposure process may be a process of using a controllable modulation mask to realize exposure control. In this way, the encapsulation layer 50, the cathode layer 40 and the light-emitting functional layer 30 in the light-transmitting region a12 can be sequentially etched by using a patterning process to form a pattern of the encapsulation layer 50, a pattern of the cathode layer 40 and a pattern of the light-emitting functional layer 30. The composition process belongs to a conventional process, and has low process cost, so that the manufacturing cost of the display panel is reduced while the manufacturing efficiency of the display panel is improved.
In addition, for the first display area A1, since only the light-emitting area a11 is provided with the cathode layer 40 and no cathode layer 40 is arranged in the transparent area, the light transmittance of the light-transmitting area a12 is improved, the imaging quality of the under-screen sensor arranged in the translucent area is improved, and in addition, the transparent isolation layer 20 is arranged in the light-transmitting area a12 of the translucent area, the edges of the light-emitting functional layer 30 and the cathode layer 40 positioned in the light-emitting area a11 can be effectively packaged through the transparent isolation layer 20, so that the service performance of the display panel is improved.
In the embodiment of the present invention, as shown in fig. 10, step S101: forming a pattern of the transparent barrier layer within the light-transmitting region, comprising:
s201: forming the transparent barrier layer on the substrate base plate;
s202: coating a first photoresist on the transparent isolation layer, and patterning the first photoresist to form a patterned first photoresist;
S203: etching the transparent isolation layer in the light-emitting area, stripping the first photoresist, and forming a pattern of the transparent isolation layer in the light-transmitting area.
In the implementation process, the implementation process of step S201 to step S203 is as follows:
First, a transparent barrier layer 20 is formed on a substrate 1000, and then a first photoresist 70 is coated on the transparent barrier layer 20, and the first photoresist 70 is patterned to form a patterned first photoresist 70. For example, the first photoresist 70 may be patterned using a halftone mask to form a pattern of the first photoresist 70. Then, the transparent barrier layer 20 in the light emitting region a11 is etched away according to the pattern of the first photoresist 70, and then the first photoresist 70 is stripped off, forming a pattern of the transparent barrier layer 20 in the light transmitting region a 12. In the implementation process, since the transparent isolation layer 20 is only disposed in the light-transmitting region a12 of the substrate 1000, the patterning process can be performed specifically on the relevant film layers of the light-transmitting region a12 and the light-emitting region a11, so that the manufacturing efficiency of the display panel is improved while the light transmittance of the light-transmitting region is improved.
In the embodiment of the present invention, fig. 11 is a process flow chart corresponding to step S101, specifically, in step S201: before the transparent barrier layer 20 is formed on the base substrate 1000, the spacer layer 130 is formed on the base substrate 1000, then the transparent barrier layer 20 is formed on the spacer layer 130, and the transparent barrier layer 20 is subjected to patterning processing as in step S201 to step S203, so that a pattern of the transparent barrier layer 20 is formed in the light-transmitting region a 12.
In the embodiment of the present invention, after the transparent insulating layer 20 is patterned in the transparent region a12 in combination with the process flow shown in fig. 11, one process flow diagram corresponding to steps S101 to S103 is shown in fig. 12.
In the embodiment of the present invention, as shown in fig. 13, step S104: etching the encapsulation layer, the cathode layer and the light emitting function layer in the light transmitting region in sequence by using a patterning process (optionally, a one-time patterning process), respectively forming a pattern of the encapsulation layer, a pattern of the cathode layer and a pattern of the light emitting function layer, including:
S301: coating a second photoresist on the packaging layer, and patterning the second photoresist to form a patterned second photoresist;
s302: etching the packaging layer in the light-transmitting area, stripping the second photoresist, and forming a pattern of the packaging layer in the light-emitting area;
S303: coating a third photoresist on the packaging layer, and patterning the third photoresist to form a patterned third photoresist;
S304: etching the cathode layer and the light-emitting functional layer in the light-transmitting area, stripping the third photoresist, and forming patterns of the cathode layer and the light-emitting functional layer in the light-emitting area.
In the implementation process, the specific implementation process of step S301 to step S304 is as follows:
First, a second photoresist 80 is coated on the encapsulation layer 50, and the second photoresist 80 is patterned to form a patterned second photoresist 80. For example, the second photoresist 80 may be patterned using a halftone reticle to form a pattern of the second photoresist 80. Then, the encapsulation layer 50 in the light-transmitting region a12 is etched away, and the second photoresist 80 is stripped to form a pattern of the encapsulation layer 50 in the light-emitting region a 11. In this way, only the light-emitting region a11 has the encapsulation layer 50, and the encapsulation layer 50 effectively encapsulates the cathode layer 40 and the light-emitting functional layer 30, thereby improving the light transmittance of the light-transmitting region a12 and improving the imaging quality of the light-emitting region a 11. Then, a third photoresist 90 is coated on the encapsulation layer 50, and the third photoresist 90 is patterned to form a patterned third photoresist 90. Then, the cathode layer 40 and the light emitting function layer 30 in the light transmitting region a12 are etched away, and the third photoresist 90 is stripped, while patterning the cathode layer 40 and the light emitting function layer 30 in the light emitting region a 11. In this way, the transparent isolation layer 20 is only provided in the light-transmitting area a12, and the cathode layer 40 and the light-emitting functional layer 30 of the light-emitting area a11 are effectively packaged by the transparent isolation layer 20, so that the higher transmittance of the light-transmitting area a12 is ensured, and the imaging quality of the light-transmitting area a12 is improved. Fig. 14 is a process flow chart corresponding to step S301 to step S304.
In the embodiment of the present invention, as shown in fig. 15, in step S201: before forming the transparent insulating layer on the substrate base plate, the method further comprises:
s401: forming a pixel circuit in the light emitting region;
s402: a first insulating layer is formed over the pixel circuit.
In the implementation process, the specific implementation process of step S401 to step S403 is as follows:
First, for the first display area a, the pixel circuit 110 may be formed only in the light emitting area a11, and the pixel unit in the corresponding light emitting area a11 may be controlled to emit light by the pixel circuit 110, thereby realizing control of the display effect of the display panel. Then, the first insulating layer 60 is formed on the pixel circuit 110, and interference of external signals to the pixel circuit 110 is effectively prevented by the first insulating layer 60, thereby ensuring display quality of the display panel.
Based on the same inventive concept, an embodiment of the present invention also provides a display device, as shown in fig. 16, including the display panel 200 as described above.
The principle of the display device for solving the problems is similar to that of the display panel, so that the implementation of the display device can be referred to the implementation of the display panel, and the repetition is omitted.
In a specific implementation process, in the display device provided in the embodiment of the present invention, as shown in fig. 16, the display device further includes an under-screen sensor 120 located in the first display area A1, and the under-screen sensor 120 is located at a side of the light emitting functional layer 30 of the first display area A1 away from the light emitting surface of the display panel 200. And the front projection of the under-screen sensor 120 on the display panel 200 is located in the first display area A1. In an implementation, the under-screen sensor 120 includes at least one of an optical sensor, a distance sensor, a camera, a headset, an iris recognition sensor, and a depth sensor. Of course, those skilled in the art can select the corresponding off-screen sensor 120 according to actual needs, and will not be described in detail herein.
In a specific implementation process, the display device provided by the embodiment of the invention may be a mobile phone as shown in fig. 16, and of course, the display device provided by the embodiment of the invention may also be any product or component with a display function, such as a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like. Other essential components of the display device will be understood by those skilled in the art, and will not be described herein in detail, nor should they be considered as limiting the invention.
The display panel, the manufacturing method thereof and the display device provided by the embodiment of the invention are characterized in that the transparent isolation layer is arranged only in the light transmission area of the semi-transparent area of the sensor under the screen, the luminous functional layer is arranged only in the luminous area of the sensor under the screen, the cathode layer is arranged on the luminous functional layer, the packaging layer is arranged on the cathode layer, the packaging layer, the luminous functional layer and the cathode layer are isolated through the transparent isolation layer, and the edges of the luminous functional layer and the cathode layer are packaged through the transparent isolation layer. Therefore, on one hand, the patterning treatment of the cathode layer is realized through the transparent partition layer, in the translucent area, only the light-emitting area is provided with the cathode layer, no cathode layer is arranged in the light-transmitting area, the light transmittance of the light-transmitting area is improved, on the other hand, the encapsulation of the edges of the light-emitting functional layer and the cathode layer is realized through the transparent partition layer, the encapsulation effect of the display panel is improved, the light transmittance of light in the translucent area is improved through the transparent partition layer, the imaging quality of the sensor arranged under the screen in the translucent area is improved, and meanwhile the encapsulation effect of the display panel is improved.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (11)
1. A method for manufacturing a display panel, the display panel comprising: a substrate base; the first display area comprises a light-emitting area and a light-transmitting area, the first display area and the second display area jointly form a display area, the first display area is an area which corresponds to an off-screen sensor and can be displayed in the display area, and the second display area is other display areas except the first display area in the display area; for the first display area, a transparent isolating layer is arranged in the light-transmitting area only; for the first display region, only a light-emitting functional layer, a cathode layer positioned on the light-emitting functional layer and an encapsulation layer positioned on the cathode layer are arranged in the light-emitting region; in the direction parallel to the plane of the substrate base plate, the transparent isolation layer and the packaging layer are overlapped with each other, the light-emitting functional layer and the transparent isolation layer are overlapped with each other, the side edge of the transparent isolation layer is in direct contact with the side edge of the packaging layer, and the side edge of the light-emitting functional layer is in direct contact with the side edge of the transparent isolation layer; wherein the method comprises the following steps:
forming a pattern of the transparent barrier layer within the light-transmitting region;
Evaporating the light-emitting functional layer and the cathode layer on the transparent isolation layer, wherein the transparent isolation layer is used for isolating the light-emitting functional layer and the cathode layer and encapsulating edges of the light-emitting functional layer and the cathode layer;
Forming an encapsulation layer on the cathode layer;
and sequentially etching the packaging layer, the cathode layer and the luminous functional layer which are positioned in the light transmission area by using a composition process to respectively form a pattern of the packaging layer, a pattern of the cathode layer and a pattern of the luminous functional layer.
2. The method of claim 1, wherein the forming the pattern of transparent barrier layers within the light-transmissive region comprises:
Forming the transparent barrier layer on the substrate base plate;
coating a first photoresist on the transparent isolation layer, and patterning the first photoresist to form a patterned first photoresist;
Etching the transparent isolation layer in the light-emitting area, stripping the first photoresist, and forming a pattern of the transparent isolation layer in the light-transmitting area.
3. The method of claim 1, wherein sequentially etching the encapsulation layer, the cathode layer, and the light emitting function layer in the light transmitting region using a patterning process to form a pattern of the encapsulation layer, a pattern of the cathode layer, and a pattern of the light emitting function layer, respectively, comprises:
Coating a second photoresist on the packaging layer, and patterning the second photoresist to form a patterned second photoresist;
etching the packaging layer in the light-transmitting area, stripping the second photoresist, and forming a pattern of the packaging layer in the light-emitting area;
Coating a third photoresist on the packaging layer, and patterning the third photoresist to form a patterned third photoresist;
Etching the cathode layer and the light-emitting functional layer in the light-transmitting area, stripping the third photoresist, and forming patterns of the cathode layer and the light-emitting functional layer in the light-emitting area.
4. The method of claim 2, wherein prior to forming the transparent barrier layer on the substrate base plate, the method further comprises:
Forming a pixel circuit in the light emitting region;
A first insulating layer is formed over the pixel circuit.
5. A display panel manufactured by the manufacturing method according to any one of claims 1 to 4, comprising:
a substrate base;
The first display area comprises a light-emitting area and a light-transmitting area, the first display area and the second display area jointly form a display area, the first display area is an area which corresponds to an off-screen sensor and can be displayed in the display area, and the second display area is other display areas except the first display area in the display area;
for the first display area, a transparent isolating layer is arranged in the light-transmitting area only;
for the first display region, only a light-emitting functional layer, a cathode layer positioned on the light-emitting functional layer and an encapsulation layer positioned on the cathode layer are arranged in the light-emitting region;
In the direction parallel to the plane of the substrate, the transparent isolation layer and the packaging layer are mutually overlapped, the light-emitting functional layer and the transparent isolation layer are mutually overlapped, the side edge of the transparent isolation layer is in direct contact with the side edge of the packaging layer, and the side edge of the light-emitting functional layer is in direct contact with the side edge of the transparent isolation layer.
6. The display panel according to claim 5, wherein an edge of the light-emitting function layer has a step that decreases in a direction approaching the substrate base plate.
7. The display panel according to claim 5, wherein a pixel circuit is provided between the light-emitting function layer and the substrate base plate, a first insulating layer is provided between the pixel circuit and the light-emitting function layer, and a thickness of the transparent insulating layer is larger than a sum of a thickness of the light-emitting function layer and a thickness of the first insulating layer.
8. The display panel of claim 5, wherein a thickness of the transparent barrier layer is less than a thickness of the encapsulation layer.
9. The display panel of claim 5, wherein the transparent barrier layer has a thickness of greater than or equal to 3 microns in a direction perpendicular to the substrate base plate.
10. The display panel of any one of claims 6-9, wherein the material of the transparent insulating layer comprises at least one of silicon nitride and silicon oxide.
11. A display device comprising a display panel as claimed in any one of claims 5-10.
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