CN110938343A - High-precision coating base plate for PCB drilling - Google Patents
High-precision coating base plate for PCB drilling Download PDFInfo
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- CN110938343A CN110938343A CN201911197310.6A CN201911197310A CN110938343A CN 110938343 A CN110938343 A CN 110938343A CN 201911197310 A CN201911197310 A CN 201911197310A CN 110938343 A CN110938343 A CN 110938343A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
- C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09D161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
- C09D161/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/43—Thickening agents
- C09D7/44—Combinations of two or more thickening agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/017—Additives being an antistatic agent
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Paints Or Removers (AREA)
Abstract
The invention relates to the technical field of PCB (printed circuit board) drilling base plates, in particular to a high-precision coating base plate for PCB drilling and a preparation method thereof. A high-precision coating base plate for PCB drilling comprises a base material and coatings coated on the upper surface and the lower surface of the base material; wherein, the coating at least comprises the following components in parts by weight: 20-50 parts of resin, 50-70 parts of filler, 20-45 parts of thickening agent, 1-5 parts of defoaming agent, 1-5 parts of antistatic agent, 1-5 parts of curing agent and 45-65 parts of water. The PCB backing plate prepared by the invention has a heat dissipation function, so that on one hand, the temperature of the drill point can be reduced, the drill point cannot deform, and the drilling precision is enhanced; on the other hand, the abrasion degree of the drill point can be reduced, the service life of the drill point is prolonged, and the broken-pin rate is reduced; and the coating backing plate is not easy to absorb moisture in the storage and use processes, and has small warping degree and good flatness.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) drilling base plates, in particular to a high-precision coating base plate for PCB drilling and a preparation method thereof.
Background
The backing plate is a material which is arranged below a board to be processed when a printed circuit board (PCB for short) is mechanically drilled so as to meet the requirements of the processing technology. The main effects of the backing plate are as follows: 1. reducing burrs at the drilling hole of the base material; 2. the drilling machine has the advantages that the drilling machine can perform drilling processing on the PCB, and the table board of the drilling machine is protected; 3. the temperature of the drill bit is reduced, and the abrasion of the drill bit is reduced; 4. cleaning part of drilling dirt on the drill bit; 5. the positioning effect is exerted to a certain extent, and the drilling precision is improved. The backing plate for PCB drilling generally comprises a high-density wood fiber plate, a melamine wood backing plate, a composite wood backing plate, a phenolic paper backing plate and the like, and is influenced by the technical requirements and cost requirements of the existing market, the middle-grade backing plate such as the melamine wood backing plate, the composite wood backing plate and the like still keeps higher market share, but the backing plates with high manufacturing cost cannot meet the cost control requirements of the market along with the increase of labor cost and the environmental protection requirements. Meanwhile, with the improvement of the PCB drilling technology and requirements, the requirements on the surface hardness, the warping deformation, the thickness tolerance, the smoothness and the flatness, the environmental protection and the like of the base plate are higher.
The backing plate for PCB drilling is easy to absorb moisture in the storage and use processes, so that the backing plate for PCB drilling is large in warpage and poor in flatness. Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In order to solve the above technical problems, a first aspect of the present invention provides a high-precision coated backing plate for PCB drilling, comprising a substrate and coatings coated on upper and lower surfaces of the substrate; wherein, the coating at least comprises the following components in parts by weight: 20-50 parts of resin, 50-70 parts of filler, 20-45 parts of thickening agent, 1-5 parts of defoaming agent, 1-5 parts of antistatic agent, 1-5 parts of curing agent and 45-65 parts of water.
In a preferred embodiment of the present invention, the resin is at least one selected from the group consisting of phenol resin, urea resin, epoxy resin, melamine resin, polyurethane resin, polyester acrylic resin, polyether acrylic resin, and acrylate resin.
As a preferred technical scheme of the invention, the filler is selected from at least one of gypsum powder, kaolin, titanium dioxide, aluminum powder, zinc powder, calcium oxide, calcium carbonate and talcum powder.
As a preferred technical scheme of the invention, the filler is a combination of gypsum powder and titanium dioxide, and the weight ratio is (1-2): 1.
in a preferred embodiment of the present invention, the thickener is at least one selected from the group consisting of erucamide, oleamide, stearamide, sweet potato acid amide, oleoyl palmitamide, ethylene bis stearamide, stearic acid erucamide, ethylene bis oleamide, polyamide wax, silicone oil, silicone, stearic acid, stearyl alcohol, pentaerythritol stearate, montan wax, polyethylene wax, polypropylene wax, paraffin wax, and oxidized polyethylene wax.
As a preferred technical scheme of the invention, the thickening agent is a combination of erucamide, oleamide, polyamide wax and polyethylene wax, and the weight ratio is (4-7): (3-6): (0.5-1.5): (3-5).
In a preferred embodiment of the present invention, the defoaming agent is at least one selected from mineral oils, silicones, and polyethers.
In a preferred embodiment of the present invention, the curing agent is at least one selected from the group consisting of aliphatic amines, aromatic amines, amides, and ammonium salts.
As a preferred technical solution of the present invention, the preparation method of the coating at least comprises the following steps:
(1) mixing the resin with water at normal temperature, and stirring for 15-30 min;
(2) adding the filler, the thickening agent, the defoaming agent and the antistatic agent into the step (1) in sequence and stirring for 20-40 min;
(3) before use, adding a curing agent into the step (2), uniformly stirring, and discharging to obtain the coating;
the second aspect of the invention provides a preparation method of the coating base plate, which at least comprises the following steps:
(A) coating a coating on the upper surface of the base material, rolling by using a rubber roller, flattening by using an anilox roller, and curing;
(B) after the upper surface of the base material is cured, coating a coating on the lower surface of the base material, firstly rolling by using a rubber roller, then flattening by using an anilox roller, and then curing to obtain the coating;
the curing temperature is 150 ℃ and 180 ℃, and the curing time is 10-30 min.
Has the advantages that: the invention provides a high-precision coating base plate for PCB drilling, which comprises a base material and a coating. The PCB backing plate has a heat dissipation function, so that on one hand, the temperature of the drill point can be reduced, the drill point cannot deform, and the drilling precision is enhanced; on the other hand, the abrasion degree of the drill point can be reduced, the service life of the drill point is prolonged, and the broken-pin rate is reduced; and the coating backing plate is not easy to absorb moisture in the storage and use processes, and has small warping degree and good flatness.
Detailed Description
The disclosure may be understood more readily by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.
The term "prepared from …" as used herein is synonymous with "comprising". The terms "comprises," "comprising," "includes," "including," "has," "having," "contains," "containing," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
The conjunction "consisting of …" excludes any unspecified elements, steps or components. If used in a claim, the phrase is intended to claim as closed, meaning that it does not contain materials other than those described, except for the conventional impurities associated therewith. When the phrase "consisting of …" appears in a clause of the subject matter of the claims rather than immediately after the subject matter, it defines only the elements described in the clause; other elements are not excluded from the claims as a whole.
When an amount, concentration, or other value or parameter is expressed as a range, preferred range, or as a range of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when a range of "1 to 5" is disclosed, the described range should be interpreted to include the ranges "1 to 4", "1 to 3", "1 to 2 and 4 to 5", "1 to 3 and 5", and the like. When a range of values is described herein, unless otherwise stated, the range is intended to include the endpoints thereof and all integers and fractions within the range.
The singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. "optional" or "any" means that the subsequently described event or events may or may not occur, and that the description includes instances where the event occurs and instances where it does not.
Approximating language, as used herein throughout the specification and claims, is intended to modify a quantity, such that the invention is not limited to the specific quantity, but includes portions that are literally received for modification without substantial change in the basic function to which the invention is related. Accordingly, the use of "about" to modify a numerical value means that the invention is not limited to the precise value. In some instances, the approximating language may correspond to the precision of an instrument for measuring the value. In the present description and claims, range limitations may be combined and/or interchanged, including all sub-ranges contained therein if not otherwise stated.
In addition, the indefinite articles "a" and "an" preceding an element or component of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the element or component. Thus, "a" or "an" should be read to include one or at least one, and the singular form of an element or component also includes the plural unless the stated number clearly indicates that the singular form is intended.
In order to solve the above technical problems, a first aspect of the present invention provides a high-precision coated backing plate for PCB drilling, comprising a substrate and coatings coated on upper and lower surfaces of the substrate; wherein, the coating at least comprises the following components in parts by weight: 20-50 parts of resin, 50-70 parts of filler, 20-45 parts of thickening agent, 1-5 parts of defoaming agent, 1-5 parts of antistatic agent, 1-5 parts of curing agent and 45-65 parts of water.
Preferably, the coating at least comprises the following components in parts by weight: 35 parts of resin, 61 parts of filler, 32 parts of thickening agent, 2 parts of defoaming agent, 2 parts of antistatic agent, 3 parts of curing agent and 52 parts of water.
Base material
In the invention, the base material is a wood fiberboard.
Resin composition
In the invention, the resin is at least one selected from phenolic resin, urea resin, epoxy resin, melamine resin, polyurethane resin, polyester acrylic resin, polyether acrylic resin and acrylate resin.
Preferably, the resin is a phenolic resin and/or a urea resin.
Preferably, the urea resin is not particularly limited, and is commercially available from, but not limited to, Shandong Moore chemical Co., Ltd.
Filler material
In the invention, the filler is selected from at least one of gypsum powder, kaolin, titanium dioxide, aluminum powder, zinc powder, calcium oxide, calcium carbonate and talcum powder.
More preferably, the filler is a combination of gypsum powder and titanium dioxide, and the weight ratio is (1-2): 1.
most preferably, the weight ratio of the gypsum powder to the titanium dioxide is 1.5: 1.
the inventor thinks that the use of titanium dioxide can play a role in improving the whiteness and the covering of a coating, and the invention adopts the compound use of gypsum powder and titanium dioxide, particularly when the weight ratio of the gypsum powder to the titanium dioxide is 1.5: 1, the production cost of the product is reduced while the whiteness and the covering effect of the coating are ensured.
Thickening agent
In the present invention, the thickener is at least one selected from the group consisting of erucamide, oleamide, stearamide, sweet potato acid amide, oleoyl palmitamide, ethylene bis stearamide, stearic acid erucamide, ethylene bis oleamide, polyamide wax, silicone oil, silicone, stearic acid, stearyl alcohol, pentaerythritol stearate, montan wax, polyethylene wax, polypropylene wax, paraffin wax, and oxidized polyethylene wax.
Preferably, the thickening agent is a combination of erucamide, oleamide, polyamide wax and polyethylene wax, and the weight ratio is (4-7): (3-6): (0.5-1.5): (3-5).
More preferably, the weight ratio of the erucamide to the oleamide to the polyamide wax to the polyethylene wax is 6: 5: 1: 4.
in the invention, the thickener is used for improving the viscosity of the coating and keeping the paint in uniform and stable viscosity. The inventor surprisingly finds that the polyethylene wax can also improve the moisture absorption prevention performance of the backing plate for PCB drilling, the moisture absorption prevention effect of the backing plate is related to the proportion of the added polyethylene wax, and the larger the polyethylene wax addition proportion is, the better the moisture prevention effect is. When the amount of the polyethylene wax added is less than 3%, the moisture absorption preventing effect of the backing plate is insignificant because the amount of the polyethylene wax molecules is too small to form a monolayer wax film on the substrate. However, when the polyethylene wax is added in a too large proportion, the viscosity of the urea-formaldehyde resin glue solution is affected, and the bonding performance between the coating and the base material is also affected, so that the addition proportion of the polyethylene wax is preferably 3-6%.
Defoaming agent
In the present invention, the defoaming agent is at least one selected from mineral oils, silicones, and polyethers.
Preferably, the defoamer is a polysiloxane.
In the present invention, the polysiloxane is not particularly limited, and is commercially available from, but not limited to, Federal Fine chemical Co., Ltd in the Guangdong province.
Antistatic agent
In the present invention, the antistatic agent is not particularly limited, and cationic antistatic agents, anionic antistatic agents, nonionic antistatic agents may be mentioned.
Preferably, the antistatic agent is ditetradecyldimethylammonium chloride.
In the invention, the ditetradecyl dimethyl ammonium chloride can be purchased but not limited to Nanjing Cyanea dye printing auxiliary agent factory.
Curing agent
In the present invention, the curing agent is at least one selected from the group consisting of aliphatic amines, aromatic amines, amides, and ammonium salts.
Preferably, the curing agent is ammonium chloride.
In the invention, the preparation method of the coating at least comprises the following steps:
(1) mixing the resin with water at normal temperature, and stirring for 15-30 min;
(2) adding the filler, the thickening agent, the defoaming agent and the antistatic agent into the step (1) in sequence and stirring for 20-40 min;
(3) before use, adding a curing agent into the step (2), uniformly stirring, and discharging to obtain the coating;
most preferably, the coating is used up within 48 hours after preparation is complete.
According to the invention, the addition of the curing agent before use can avoid the occurrence of polyethylene wax demulsification caused by the curing agent. The inventors consider that possible reasons are: the curing agent is added before use, so that the demulsification influence of the curing agent on the emulsified wax can be weakened, the demulsification of the emulsified wax is inhibited, the demulsification time is prolonged, and the polyethylene wax forms a uniform wax film on the base plate, so that the moisture absorption resistance of the base plate is improved.
The second aspect of the invention provides a preparation method of the coating base plate, which at least comprises the following steps:
(A) coating a coating on the upper surface of the base material, rolling by using a rubber roller, flattening by using an anilox roller, and curing;
(B) after the upper surface of the base material is cured, coating a coating on the lower surface of the base material, firstly rolling by using a rubber roller, then flattening by using an anilox roller, and then curing to obtain the coating;
the curing temperature is 150 ℃ and 180 ℃, and the curing time is 10-30 min.
Preferably, the thickness of the coating is 20-30 μm.
The inventor thinks that the coating on the PCB cushion plate has certain hardness and good lubricating and heat conducting effects, and can effectively inhibit the burr problem at the drilled hole of the circuit board; meanwhile, the smoothness and the density of the resin layer are improved by using the wood fiberboard as a base material, and the wood fiberboard has good buffering and heat insulation effects, plays a role in protecting the drill bit and improves the drilling processability. In addition, the upper and lower coatings of the invention are firstly made into viscous resin glue and then are cured and molded together with the base material in the molding process, and no extra adhesive is added in the coating and the base material, thereby effectively preventing the influence of the adhesive on the drill point and improving the drilling precision.
The present invention will be specifically described below by way of examples. It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
In addition, the starting materials used are all commercially available, unless otherwise specified.
Examples
Embodiment 1 provides a high-precision coated base plate for PCB drilling, which includes a base material and coatings coated on the upper and lower surfaces of the base material; wherein, the coating at least comprises the following components in parts by weight: 35 parts of resin, 61 parts of filler, 32 parts of thickening agent, 2 parts of defoaming agent, 2 parts of antistatic agent, 3 parts of curing agent and 52 parts of water.
The base material is a wood fiberboard and is purchased from the building materials ltd of new su of Jiangsu.
The resin is urea-formaldehyde resin, and is purchased from Shandong Moore chemical industry Co.
The filler is a combination of gypsum powder and titanium dioxide, and the weight ratio is 1.5: 1.
the thickening agent is a combination of erucamide, oleamide, polyamide wax and polyethylene wax, and the weight ratio is 6: 5: 1: 4.
the defoamer was a polysiloxane purchased from federal fine chemicals limited, guangdong.
The antistatic agent is ditetradecyl dimethyl ammonium chloride, and is purchased from Nanjing Cyanea dye printing auxiliary agent factory.
The curing agent is ammonium chloride.
The preparation method of the coating at least comprises the following steps:
(1) mixing the resin with water at normal temperature, and stirring for 20 min;
(2) adding the filler, the thickening agent, the defoaming agent and the antistatic agent into the step (1) in sequence and stirring for 30 min;
(3) before use, adding a curing agent into the step (2), uniformly stirring, and discharging to obtain the coating;
the preparation method of the coating base plate at least comprises the following steps:
(A) coating a coating on the upper surface of the base material, rolling by using a rubber roller, flattening by using an anilox roller, and curing;
(B) after the upper surface of the base material is cured, coating a coating on the lower surface of the base material, firstly rolling by using a rubber roller, then flattening by using an anilox roller, and then curing to obtain the coating;
the curing temperature is 160 ℃, and the curing time is 20 min.
Example 2
Embodiment 2 provides a high-precision coated base plate for PCB drilling, which includes a base material and coatings coated on the upper and lower surfaces of the base material; wherein, the coating at least comprises the following components in parts by weight: 20 parts of resin, 50 parts of filler, 20 parts of thickening agent, 1 part of defoaming agent, 1 part of antistatic agent, 1 part of curing agent and 45 parts of water.
The base material is a wood fiberboard and is purchased from the building materials ltd of new su of Jiangsu.
The resin is urea-formaldehyde resin, and is purchased from Shandong Moore chemical industry Co.
The filler is a combination of gypsum powder and titanium dioxide, and the weight ratio is 1: 1.
the thickening agent is a combination of erucamide, oleamide, polyamide wax and polyethylene wax, and the weight ratio is 4: 3: 0.5: 3.
the defoamer was a polysiloxane purchased from federal fine chemicals limited, guangdong.
The antistatic agent is ditetradecyl dimethyl ammonium chloride, and is purchased from Nanjing Cyanea dye printing auxiliary agent factory.
The curing agent is ammonium chloride.
The preparation method of the coating at least comprises the following steps:
(1) mixing the resin with water at normal temperature, and stirring for 20 min;
(2) adding the filler, the thickening agent, the defoaming agent and the antistatic agent into the step (1) in sequence and stirring for 30 min;
(3) before use, adding a curing agent into the step (2), uniformly stirring, and discharging to obtain the coating;
the preparation method of the coating base plate at least comprises the following steps:
(A) coating a coating on the upper surface of the base material, rolling by using a rubber roller, flattening by using an anilox roller, and curing;
(B) after the upper surface of the base material is cured, coating a coating on the lower surface of the base material, firstly rolling by using a rubber roller, then flattening by using an anilox roller, and then curing to obtain the coating;
the curing temperature is 160 ℃, and the curing time is 20 min.
Example 3
Embodiment 3 provides a high-precision coated base plate for PCB drilling, which includes a base material and coatings coated on the upper and lower surfaces of the base material; wherein, the coating at least comprises the following components in parts by weight: 50 parts of resin, 70 parts of filler, 45 parts of thickening agent, 5 parts of defoaming agent, 5 parts of antistatic agent, 5 parts of curing agent and 65 parts of water.
The base material is a wood fiberboard and is purchased from the building materials ltd of new su of Jiangsu.
The resin is urea-formaldehyde resin, and is purchased from Shandong Moore chemical industry Co.
The filler is a combination of gypsum powder and titanium dioxide, and the weight ratio is 2: 1.
the thickening agent is a combination of erucamide, oleamide, polyamide wax and polyethylene wax, and the weight ratio is 7: 6: 1.5: 5.
the defoamer was a polysiloxane purchased from federal fine chemicals limited, guangdong.
The antistatic agent is ditetradecyl dimethyl ammonium chloride, and is purchased from Nanjing Cyanea dye printing auxiliary agent factory.
The curing agent is ammonium chloride.
The preparation method of the coating at least comprises the following steps:
(1) mixing the resin with water at normal temperature, and stirring for 20 min;
(2) adding the filler, the thickening agent, the defoaming agent and the antistatic agent into the step (1) in sequence and stirring for 30 min;
(3) before use, adding a curing agent into the step (2), uniformly stirring, and discharging to obtain the coating;
the preparation method of the coating base plate at least comprises the following steps:
(A) coating a coating on the upper surface of the base material, rolling by using a rubber roller, flattening by using an anilox roller, and curing;
(B) after the upper surface of the base material is cured, coating a coating on the lower surface of the base material, firstly rolling by using a rubber roller, then flattening by using an anilox roller, and then curing to obtain the coating;
the curing temperature is 160 ℃, and the curing time is 20 min.
Example 4
Example 4 differs from example 1 in that the thickener is a combination of erucamide, oleamide, polyamide wax in a weight ratio of 6: 5: 1.
example 5
Example 5 differs from example 1 in that the thickener is a combination of erucamide, oleamide, polyamide wax, polyethylene wax, in a weight ratio of 6: 5: 1: 1.
example 6
Example 6 differs from example 1 in that ammonium chloride is added to the coating as it is prepared.
Performance testing
Water absorption: the coated mats prepared in examples 1 to 6 were used as test samples, and square test specimens of 10 × 10cm were selected for each sample from the edges of the board and 5 points in the board. And weighing and recording the mass of the sample, completely soaking the sample in water for about 24 hours, taking out the sample, and measuring the test mass to obtain the water absorption. Water absorption (% after immersion-weight before immersion)/weight before immersion × 100. The water absorption rate is less than 10 percent, which is qualified. The results of the absorbance measurements are shown in table 1.
TABLE 1 results of absorbency test of coated backing plates prepared in examples 1-6
The foregoing examples are merely illustrative and serve to explain some of the features of the method of the present invention. The appended claims are intended to claim as broad a scope as is contemplated, and the examples presented herein are merely illustrative of selected implementations in accordance with all possible combinations of examples. Accordingly, it is applicants' intention that the appended claims are not to be limited by the choice of examples illustrating features of the invention. Also, where numerical ranges are used in the claims, subranges therein are included, and variations in these ranges are also to be construed as possible being covered by the appended claims.
Claims (10)
1. A high-precision coating base plate for PCB drilling is characterized in that the coating base plate comprises a base material and coatings coated on the upper surface and the lower surface of the base material; wherein, the coating at least comprises the following components in parts by weight: 20-50 parts of resin, 50-70 parts of filler, 20-45 parts of thickening agent, 1-5 parts of defoaming agent, 1-5 parts of antistatic agent, 1-5 parts of curing agent and 45-65 parts of water.
2. The coated mat of claim 1, wherein the resin is selected from at least one of phenolic resin, urea resin, epoxy resin, melamine resin, polyurethane resin, polyester acrylic resin, polyether acrylic resin, and acrylate resin.
3. The coated gasket of claim 1, wherein the filler is selected from at least one of gypsum powder, kaolin, titanium dioxide, aluminum powder, zinc powder, calcium oxide, calcium carbonate, and talc.
4. The coated underlay sheet of claim 3, wherein the filler is a combination of gypsum powder and titanium dioxide in the weight ratio (1-2): 1.
5. the coated mat of claim 1, wherein the thickener is selected from at least one of erucamide, oleamide, stearamide, sweet potato acid amide, oleoyl palmitate amide, ethylene bis stearamide, stearic acid erucamide, ethylene bis oleamide, polyamide wax, silicone oil, silicone, stearic acid, stearyl alcohol, pentaerythritol stearate, montan wax, polyethylene wax, polypropylene wax, paraffin wax, oxidized polyethylene wax.
6. The coated mat of claim 5, wherein the thickener is a combination of erucamide, oleamide, polyamide wax, polyethylene wax, in a weight ratio of (4-7): (3-6): (0.5-1.5): (3-5).
7. The coated pallet of claim 1, wherein the anti-foaming agent is selected from at least one of mineral oils, silicones, polyethers.
8. The coated pallet according to claim 1, wherein the curing agent is selected from at least one of aliphatic amines, aromatic amines, amides, and ammonium salts.
9. The coated mat according to claim 1, wherein the coating is prepared by a method comprising at least the steps of:
(1) mixing the resin with water at normal temperature, and stirring for 15-30 min;
(2) adding the filler, the thickening agent, the defoaming agent and the antistatic agent into the step (1) in sequence and stirring for 20-40 min;
(3) before use, adding the curing agent in the step (2), uniformly stirring, and discharging to obtain the coating.
10. A method of making a coated mat according to claim 1, comprising at least the steps of:
(A) coating a coating on the upper surface of the base material, rolling by using a rubber roller, flattening by using an anilox roller, and curing;
(B) after the upper surface of the base material is cured, coating a coating on the lower surface of the base material, firstly rolling by using a rubber roller, then flattening by using an anilox roller, and then curing to obtain the coating;
the curing temperature is 150 ℃ and 180 ℃, and the curing time is 10-30 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911197310.6A CN110938343A (en) | 2019-11-29 | 2019-11-29 | High-precision coating base plate for PCB drilling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911197310.6A CN110938343A (en) | 2019-11-29 | 2019-11-29 | High-precision coating base plate for PCB drilling |
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| Publication Number | Publication Date |
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| CN110938343A true CN110938343A (en) | 2020-03-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911197310.6A Withdrawn CN110938343A (en) | 2019-11-29 | 2019-11-29 | High-precision coating base plate for PCB drilling |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112851993A (en) * | 2021-01-12 | 2021-05-28 | 深圳市宏宇辉科技有限公司 | Lubricating phenolic plate |
| CN114231124A (en) * | 2021-12-21 | 2022-03-25 | 深圳市图特美高分子材料有限公司 | High-performance aluminum sheet coating liquid and preparation method and application thereof |
| CN114536932A (en) * | 2022-02-18 | 2022-05-27 | 深圳市宏宇辉科技有限公司 | PCB (printed circuit board) base plate with hardened layer and preparation method and application thereof |
| CN114773942A (en) * | 2022-04-02 | 2022-07-22 | 广东希贵光固化材料有限公司 | LED curing coating |
| CN115058168A (en) * | 2021-08-09 | 2022-09-16 | 东莞市项华电子科技有限公司 | Coating base plate for PCB drilling and preparation method thereof |
-
2019
- 2019-11-29 CN CN201911197310.6A patent/CN110938343A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112851993A (en) * | 2021-01-12 | 2021-05-28 | 深圳市宏宇辉科技有限公司 | Lubricating phenolic plate |
| CN115058168A (en) * | 2021-08-09 | 2022-09-16 | 东莞市项华电子科技有限公司 | Coating base plate for PCB drilling and preparation method thereof |
| CN114231124A (en) * | 2021-12-21 | 2022-03-25 | 深圳市图特美高分子材料有限公司 | High-performance aluminum sheet coating liquid and preparation method and application thereof |
| CN114536932A (en) * | 2022-02-18 | 2022-05-27 | 深圳市宏宇辉科技有限公司 | PCB (printed circuit board) base plate with hardened layer and preparation method and application thereof |
| CN114773942A (en) * | 2022-04-02 | 2022-07-22 | 广东希贵光固化材料有限公司 | LED curing coating |
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