CN110936516A - Z-pin variable density preform and Z-pin large-thickness implantation method - Google Patents

Z-pin variable density preform and Z-pin large-thickness implantation method Download PDF

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Publication number
CN110936516A
CN110936516A CN201911327625.8A CN201911327625A CN110936516A CN 110936516 A CN110936516 A CN 110936516A CN 201911327625 A CN201911327625 A CN 201911327625A CN 110936516 A CN110936516 A CN 110936516A
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pin
thickness
implantation
preform carrier
blank
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CN110936516B (en
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李勇
李丽沙
还大军
肖军
刘洪全
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Nanjing University of Aeronautics and Astronautics
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Nanjing University of Aeronautics and Astronautics
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/14—Making preforms characterised by structure or composition
    • B29B11/16—Making preforms characterised by structure or composition comprising fillers or reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/04—Making preforms by assembling preformed material

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

The invention relates to a Z-pin variable density preform and a Z-pin large-thickness implantation method, belonging to the technical field of three-dimensional reinforcement of composite materials. The method for realizing the Z-pin large-thickness implantation comprises the following steps: selecting a proper Z-pin system according to the implantation requirement of the prepreg blank to be reinforced, determining the length of the Z-pin system, calculating the total thickness of the foam carrier according to the length of the Z-pin system, designing the density distribution of the foam carrier, and preparing a corresponding prefabricated body by adopting an implanter; starting a heating device to heat a prepreg blank to be reinforced, placing a preform above the blank, separating the preform by a high-temperature resistant isolating film in the middle, implanting Z-pins after the blank is uniformly heated, firstly implanting the exposed Z-pins into the blank under the action of an ultrasonic gun, then removing the top layer of foam, continuing implanting the exposed Z-pins into the blank, repeating the actions of removing the foam and continuing implanting until all the Z-pins are implanted, and realizing the large-thickness implantation target.

Description

Z-pin variable density preform and Z-pin large-thickness implantation method
Technical Field
The invention belongs to the technical field of three-dimensional reinforcement of composite materials, and particularly relates to a variable density preform structure for realizing Z-pin large-thickness implantation and an ultrasonic-assisted layer-by-layer implantation method.
Background
The composite material has the unique advantages of light weight and high strength, and has wide application in the field of aerospace, but the lower interlayer strength becomes the bottleneck of the application. In order to improve the interlayer performance and the interface connection performance of the traditional composite material, a three-dimensional weaving reinforced composite material, a Z-pin three-dimensional reinforcing technology, a 2.5D interlayer reinforcing technology and the like appear at home and abroad, and the principle is to introduce a reinforcing phase in the thickness direction of a workpiece to improve the interlayer strength. The Z-pin three-dimensional reinforcement technology is characterized in that a discontinuous sewing method is used for reference, composite micro rods are implanted into a composite laminated board blank at a certain angle and density, and a layer in the laminated board is combined with the layer to form a whole, so that the interlayer strength and toughness of the composite are remarkably improved.
The common Z-pin implantation method is an ultrasonic auxiliary implantation method and mainly comprises three technological processes of Z-pin pultrusion, preform preparation and ultrasonic implantation. The pultrusion process is that continuous fiber yarns and other reinforcing materials soaked with glue solution are subjected to pultrusion through a mould and heating and curing in an oven under the action of traction force to produce continuous Z-pins; the preparation process of the prefabricated body cuts off and implants the continuous Z-pin into the foam carrier according to a pre-designed scheme through a numerical control implanter (hereinafter referred to as implanter) to form the prefabricated body; the ultrasonic implantation process is to implant the Z-pin in the prefabricated body into the laid prepreg blank by an ultrasonic implantation gun (hereinafter referred to as an ultrasonic gun) and remove foam to obtain the Z-pin reinforced laminated plate to be cured. The implantation depth of the Z-pin in the method is slightly different due to the difference of the raw materials of the Z-pin, and generally does not exceed 12 mm.
The resin-based composite material structure becomes an important development situation in the aerospace field, more and more functional composite materials such as ablation-resistant heat-proof composite materials, high-heat-conductivity composite materials and the like appear along with the increasing application proportion of the composite materials, and a part develops from an early small-size secondary bearing part to a direction of a large-thickness main bearing structure. The Z-pin is a needle-shaped thin rod structure which is prepared by impregnating fibers in resin and co-curing the fibers through a pultrusion process, the axial modulus of the reinforced fibers is low, the rigidity of the reinforced fibers is insufficient, the resistance is large when the reinforced fibers are implanted in a large thickness (more than or equal to 20 mm), the Z-pin is easy to bend and destabilize, the existing implantation technology cannot match the application requirement of the composite material with the large thickness, the unique advantages of the composite material are difficult to give full play, and the further development of the composite material is restricted.
Therefore, a process method capable of realizing the large-thickness implantation of the Z-pin is urgently needed to promote the application development of the composite material in multiple fields.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a Z-pin variable density preform and a Z-pin large thickness implanting method for implanting Z-pins into a prepreg blank having a thickness of 20mm or more, in view of the problems of the background art.
In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows:
a Z-pin variable density preform comprising a large thickness preform carrier and Z-pins, wherein: the large-thickness preform carrier is formed by detachably and fixedly stacking a plurality of foam layers together, the density of the foam layers is gradually increased from top to bottom, Z-pins are implanted into the large-thickness preform carrier and penetrate through the plurality of foam layers up and down, and when the Z-pins are implanted into the prepreg blank, the lower surface of the large-thickness preform carrier is in contact with the prepreg blank.
In order to optimize the technical scheme, the specific measures adopted further comprise:
the Z-pin is carbon fiber, glass fiber or quartz fiber.
A method for Z-pin high thickness implantation, wherein: the method comprises the following steps:
selecting foam layers with proper density and thickness, stacking the foam layers according to the distribution of small upper layer density and large lower layer density until the foam layers meet the thickness requirement of prepreg blank implantation, and fixing the stacked foam layers in a state that contact surfaces are close to each other to obtain a large-thickness preform carrier;
step two, implanting Z-pin into the large-thickness prefabricated body carrier, wherein the Z-pin vertically penetrates through the multiple foam layers; the upper end of the Z-pin is exposed out of the upper surface of the large-thickness preform carrier, and the lower end of the Z-pin is positioned in the large-thickness preform carrier or is flush with the lower surface of the large-thickness preform carrier or slightly extends out of the lower surface of the large-thickness preform carrier;
step three, heating the large-thickness prepreg blank to be reinforced, and after the large-thickness prepreg blank is completely and uniformly heated, placing and fixing the large-thickness preform carrier on the prepreg blank;
step four, using an ultrasonic gun, taking the upper end of the Z-pin as a section to be implanted into the Z-pin, completely implanting the section into the uppermost foam layer of the large-thickness preform carrier, and implanting the lower end of the Z-pin into the prepreg blank at the moment;
fifthly, removing the foam layer on the uppermost layer of the large-thickness preform carrier, wherein the Z-pin is not connected or the direction of the Z-pin is not changed when the foam layer is removed, and after the foam layer on the upper layer is completely removed, the newly exposed upper end of the Z-pin becomes the next Z-pin section to be implanted;
and step six, repeating the step four and the step five until all the foam layers are uncovered, and implanting the upper end of the Z-pin into the prepreg blank to complete the large-thickness implantation of the Z-pin.
In the first step, before selecting a foam layer with proper density and thickness, selecting a proper Z-pin system according to the implantation requirement of a prepreg blank to be reinforced, and determining the length, diameter and implantation interval parameters of the Z-pin system; and calculating the thickness of the large-thickness preform carrier by taking the length of the Z-pin as a reference, so that the exposed length of the upper end of the Z-pin in the large-thickness preform carrier to be prepared is within the range of 5-10mm, the thickness of the large-thickness preform carrier is more than or equal to three fifths of the length of the Z-pin, and then selecting a plurality of foam layers with proper density and thickness by analyzing the self rigidity of the Z-pin and the resistance of the large-thickness preform carrier during ultrasonic implantation and combining the thicknesses of the large-thickness preform carrier.
And in the second step, the method for implanting the Z-pin into the large-thickness preform carrier is to fix the large-thickness preform carrier on an implanter, and the implanter sets a program according to the length, the diameter and the implantation distance parameters of the Z-pin and implants the Z-pin into the large-thickness preform carrier.
And in the third step, after the large-thickness prepreg blank is heated uniformly, tearing the backing paper on the upper surface of the prepreg blank, attaching a high-temperature resistant isolating film on the upper surface of the prepreg blank, and then placing and fixing the large-thickness preform carrier on the isolating film. The high-temperature resistant isolating film is tightly attached to the surface of the prepreg blank as much as possible without wrinkles.
Step six, after the large-thickness implantation of the Z-pin is completed, processing the implantation surface of the prepreg blank to be flat, tearing off the high-temperature resistant isolating film, and attaching back lining paper; and then, turning off the heating and ultrasonic gun power supply, after the prepreg blank implanted with the Z-pin is cooled to room temperature, sealing and packaging the prepreg blank, marking, and putting the prepreg blank into a low-temperature environment for refrigeration and standby.
In step one, the density of adjacent foam layers may be the same.
And in the third step, a heating device is adopted to heat the bottom and the periphery of the large-thickness prepreg blank to be reinforced. The blank edge is prevented from being lower in temperature due to the hotter heat dissipation.
The prepreg matrix of the present invention may be selected from epoxy resin, phenol resin, bismaleimide resin, and the like. And in the step one, parameters such as the diameter, the implantation interval and the like of the Z-pin can be selected according to the implantation requirements of the composite blank to be reinforced. The density of the foam layer is selected to take into account both the penetration of the foam layer by the Z-pins during preparation of the preform and to provide sufficient support for the Z-pins during ultrasonic implantation, so that the density does not generally exceed 31kg/m3. The foam thickness is typically 5mm, but is not limited to 5 mm. The heating temperature of the prepreg blank to be reinforced is determined according to the viscosity-temperature curve of the resin in the prepreg, and the lower the viscosity of the prepreg blank is, the better the prepreg blank is on the premise of avoiding the curing reaction of the resin. In the implantation process, in order to ensure that the implantation depth of the Z-pin is close to the target, the implantation angle of the Z-pin is ensured to be consistent with the design angle as much as possible. And fifthly, when the foam layer is torn off, the foam layer can be divided into small blocks which are convenient to uncover, but the Z-pin cannot be damaged in the operation process. The last layer of Z-pin section to be implanted has the largest resistance during implantation, the number of the Z-pins to be implanted can be reduced, or the ultrasonic source parameters can be adjusted in a small amplitude manner, so that the implant quality is ensuredAmount of the compound (A).
Compared with the prior art, the invention has the following advantages:
1. the invention provides a method for preparing a large-thickness prefabricated body by adopting a foam carrier with gradient density, which increases rigid support for Z-pin and improves the stability of the Z-pin and the precision of an implantation angle during implantation.
2. The invention realizes the Z-pin large-thickness implantation of the reinforced composite material by a variable-density prefabricated body structure and an ultrasonic-assisted layer-by-layer implantation method, and breaks through the bottleneck of the conventional Z-pin implantation thickness.
3. The application range of the Z-pin technology is expanded, and the interlayer reinforcement of the composite material with large thickness can be realized, and the method can also be applied to the structure reinforcement of local large thickness.
4. The invention is simple and convenient to operate, and is improved only on the basis of the existing Z-pin implantation technology.
Drawings
FIG. 1 is a schematic view of a Z-pin preform;
FIG. 2 is a schematic illustration of the implantation of a first layer of Z-pins;
FIG. 3 is a schematic view of the first layer of foam being removed;
fig. 4 is a schematic diagram of a subsequent ultrasonic implantation process.
Number designation in the figures: z-pin1, a large-thickness preform carrier 2, a first foam layer 21, a second foam layer 22, a third foam layer 23, a high-temperature-resistant isolating film 3, a prepreg blank 4, an ultrasonic gun 5 and a heating device 6.
Detailed Description
Embodiments of the present invention are described in further detail below with reference to the accompanying drawings.
The variable density preform of Z-pin of this example comprises a large thickness preform carrier 2 and Z-pin1, wherein: big thickness preform carrier 2 by the detachable stack of multilayer foam layer fixed together and constitute, foam layer density from last to increasing gradually down, Z-pin1 plant in big thickness preform carrier 2, and Z-pin1 runs through multilayer foam layer from top to bottom, when implanting Z-pin1 in prepreg blank 4, big thickness preform carrier 2 lower surface contacts with prepreg blank 4.
This embodiment will be described in further detail by taking an example of the application of the Z-pin three-dimensional reinforcement technology of the present invention to a heat shielding member with a large thickness.
The thickness of the prepreg 4 is 25mm, the Z-pin1 system is required to be a heat-proof material, the length is 25mm, the total thickness of the large-thickness preform carrier 2 is 15mm, the large-thickness preform carrier is composed of 3 layers of foams with the thickness of 5mm, and the first layer of foams 21 from top to bottom is low-density EPS foam (the density is 10 kg/m)3) The second layer of foam 22 is a high density EPS foam (density of 20 kg/m)3) The third layer of foam 23 was 31IGPMI foam (density 31 kg/m)3) Preparing a preform as shown in FIG. 1; starting a heating device 6 to heat the prepreg blank 4, implanting Z-pin1 after the prepreg blank is uniformly heated, and firstly implanting the Z-pin1 exposed out of the foam into the prepreg blank 4 under the ultrasonic assistance, as shown in figure 2; the first layer of foam 21 is then removed by peeling, as shown in figure 3; the implantation of the exposed Z-pin1 into the blank is continued and the "strip foam-continue implant" action is repeated until all Z-pins have been implanted, as shown in fig. 4, and the full thickness implant is completed, resulting in a Z-pin reinforced prepreg sheet, as shown in fig. 4 (f).
In the example, the reinforcing phase of Z-pin1 includes high-heat-resistant fibers such as high silica fibers, glass fibers, and quartz fibers, and the matrix includes heat-resistant resins such as phenol resin and bismaleimide resin.
Example the diameter, implantation spacing, etc. of Z-pin1 in the preform of fig. 1 may be selected according to the implantation requirements of prepreg blank 4.
The heating temperature of the prepreg 4 to be reinforced in the embodiment is determined according to the viscosity-temperature curve of the resin in the prepreg, and the lower the viscosity of the resin is, the better the resin is, on the premise of avoiding the curing reaction of the resin.
Example during implantation, to achieve the implant depth target of Z-pin1, the stability of Z-pin1 should be guaranteed so that its implant angle is consistent with the design angle.
An ultrasonic-assisted layer-by-layer implantation method for realizing Z-pin large-thickness implantation comprises the following steps:
the method comprises the following steps: according to the implantation requirement of the prepreg blank 4, a heat-proof material series is selected from Z-pin1, the length is 25mm, the diameter is 0.5mm, the implantation distance is 5mm multiplied by 5mm, and the implantation angle is 90 degrees;
step two: the thickness of the large-thickness preform carrier 2 was 15mm, so that the exposed length of Z-pin in the preform of fig. 1 prepared was 10mm;
step three: by analyzing the stiffness of Z-pin1 itself and the resistance to ultrasonic implantation, in combination with a foam carrier having a total thickness of 15mm, a density of 10kg/m was chosen, respectively3First foam layer 21, 20kg/m3 Second foam layer 22, 31kg/m3The third foam layer 23 of (a) three foams, and each foam has a thickness of 5 mm;
step four: stacking and fixing the foam selected in the step three according to the sequence of the first foam layer 21, the second foam layer 22 and the third foam layer 23 from top to bottom, and ensuring that the foam layers do not move, wherein the obtained foam is a large-thickness prefabricated body carrier 2;
step five: fixing the large-thickness preform carrier 2 on an implanter, and preparing the preform shown in the figure 1 according to the implantation parameter setting program obtained in the step one;
step six: starting a heating device 6 to heat a prepreg blank 4 to be implanted, tearing off backing paper on the upper surface of the blank after the blank is completely and uniformly heated, then attaching a high-temperature resistant isolating film 3, and placing and fixing the prefabricated body in the figure 1 on the high-temperature resistant isolating film 3;
step seven: starting a special ultrasonic gun 5 for implanting the Z-pin, implanting the exposed Z-pin in the prefabricated body into the prepreg blank 4 by using the ultrasonic gun 5, and keeping the angle of the Z-pin1 until the upper end of the Z-pin1 is completely immersed into the first foam layer 21, as shown in FIG. 2;
step eight: the first layer of foam layer 21 is removed by tearing it off, taking care not to carry the Z-pin or change its direction when tearing it off, and after the whole layer of foam is completely removed, the newly exposed Z-pin becomes the next layer of Z-pin to be implanted, as shown in fig. 3.
Step nine: repeating the seventh step and the eighth step until all the foam layers are removed, after the last layer of the Z-pin section is implanted, processing the implanted surface of the prepreg blank 4 to be flat, tearing off the high-temperature resistant isolating film 3, and pasting back lining paper, as shown in fig. 4;
step ten: and (4) closing the heating and ultrasonic gun power supply, cooling the prepreg blank implanted with the Z-pin to room temperature, sealing and packaging the prepreg blank, marking, and placing the prepreg blank in a low-temperature environment for refrigeration for later use.
In the first step, the reinforcing phase in the heat-proof material series comprises high-silica fiber, glass fiber, quartz fiber and other heat-resistant fibers, and the matrix comprises phenolic resin, bismaleimide resin and other heat-proof resins.
The foam thickness in step three is typically 5mm, but is not limited to 5 mm.
Step four the large thickness preform carrier 2 can be fully pierced by Z-pin1 during the preparation of the preform of fig. 1 without affecting the normal operation of the implanter.
In step four, when the foams are stacked, two layers of foams with the same density can be stacked adjacently.
In the sixth step, the heating device 6 can heat the bottom and the periphery of the prepreg 4, so that the edge of the prepreg is prevented from being low in temperature due to relatively high heat dissipation.
And in the sixth step, the heating temperature of the prepreg 4 is determined according to the viscosity-temperature curve of the resin, and on the premise that the resin does not generate a curing reaction, the viscosity of the resin is reduced, so that the implantation resistance is reduced, and the large-thickness implantation target is favorably realized.
In the sixth step, the high-temperature-resistant isolating film 3 is tightly attached to the surface of the prepreg blank 4 as much as possible without wrinkles, and the bottom surface of the preform shown in figure 1 is in contact with the isolating film.
And when the foam layer is removed in the step eight, the foam can be divided into small blocks so as to be conveniently uncovered, but the Z-pin cannot be damaged in the operation process.
And the last layer of Z-pin to be implanted in the ninth step has the largest resistance during implantation, so that the number of the Z-pins to be implanted simultaneously can be reduced or the ultrasonic source parameters can be adjusted in a small amplitude, and the implantation quality is ensured.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above-mentioned embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may be made by those skilled in the art without departing from the principle of the invention.

Claims (9)

  1. A Z-pin variable density preform comprising a large thickness preform carrier (2) and Z-pin (1), characterized by: big thickness preform carrier (2) can be liftoff fixed together by the detachable stack of multilayer foam layer and constitute, foam layer density from last to increasing gradually down, Z-pin (1) plant in big thickness preform carrier (2), and Z-pin (1) run through multilayer foam layer from top to bottom, when implanting Z-pin (1) in prepreg blank (4), big thickness preform carrier (2) lower surface and prepreg blank (4) contact.
  2. 2. The variable density preform of Z-pin as claimed in claim 1, wherein: the Z-pin (1) is carbon fiber or glass fiber or quartz fiber.
  3. The Z-pin large-thickness implantation method is characterized in that: the method comprises the following steps:
    step one, selecting foam layers with proper density and thickness, stacking the foam layers according to the distribution of small upper layer density and large lower layer density until the foam layers meet the thickness requirement of embedding a prepreg blank (4), and fixing the stacked foam layers in a state that contact surfaces are close to each other to obtain a large-thickness preform carrier (2);
    step two, implanting the Z-pin (1) into the large-thickness prefabricated body carrier (2), wherein the Z-pin (1) penetrates through the multiple foam layers up and down; the upper end of the Z-pin (1) is exposed out of the upper surface of the large-thickness preform carrier (2), and the lower end of the Z-pin is positioned in the large-thickness preform carrier (2) or is flush with the lower surface of the large-thickness preform carrier (2) or slightly extends out of the lower surface of the large-thickness preform carrier (2);
    step three, heating the large-thickness prepreg blank (4) to be reinforced, and after the large-thickness prepreg blank (4) is completely and uniformly heated, placing and fixing the large-thickness preform carrier (2) on the prepreg blank (4);
    step four, using an ultrasonic gun (5), taking the upper end of the Z-pin (1) as a section to be implanted into the Z-pin, and completely implanting the section into the uppermost foam layer of the large-thickness preform carrier (2), wherein the lower end of the Z-pin (1) is implanted into the prepreg blank (4);
    fifthly, removing the foam layer on the top of the large-thickness preform carrier (2), wherein the Z-pin (1) is not connected or the direction of the Z-pin (1) is not changed when the foam layer is removed, and after the foam layer on the upper layer is completely removed, the newly exposed upper end of the Z-pin becomes the next Z-pin section to be implanted;
    and step six, repeating the step four and the step five until all the foam layers are uncovered, and implanting the upper end of the Z-pin into the prepreg blank (4) to complete the large-thickness implantation of the Z-pin.
  4. 4. A method of Z-pin high thickness implantation according to claim 3, characterized in that: in the first step, before selecting a foam layer with proper density and thickness, selecting a proper Z-pin system according to the implantation requirement of a prepreg blank (4) to be reinforced, and determining the length, diameter and implantation interval parameters of the Z-pin system; and calculating the thickness of the large-thickness preform carrier (2) by taking the length of the Z-pin as a reference, so that the exposed length of the upper end of the Z-pin in the large-thickness preform carrier (2) to be prepared is within the range of 5-10mm, the thickness of the large-thickness preform carrier (2) is more than or equal to three fifths of the length of the Z-pin, and then selecting a plurality of foam layers with proper density and thickness by analyzing the self rigidity of the Z-pin and the resistance in ultrasonic implantation and combining the thickness of the large-thickness preform carrier (2).
  5. 5. A method of Z-pin high thickness implantation according to claim 3, characterized in that: and in the second step, the method for implanting the Z-pin (1) into the large-thickness preform carrier (2) is to fix the large-thickness preform carrier (2) on an implanter, and the implanter sets a program according to the length, the diameter and the implantation distance parameters of the Z-pin and implants the Z-pin (1) into the large-thickness preform carrier (2).
  6. 6. A method of Z-pin high thickness implantation according to claim 3, characterized in that: in the third step, after the large-thickness prepreg blank (4) is heated uniformly, the backing paper on the upper surface of the prepreg blank (4) is torn off, then the high-temperature resistant isolating film (3) is attached to the upper surface of the prepreg blank (4), and then the large-thickness preform carrier (2) is placed on the isolating film and fixed.
  7. 7. A method of Z-pin high thickness implantation according to claim 3, characterized in that: step six, after the large-thickness implantation of the Z-pin is completed, the implantation surface of the prepreg blank (4) is processed to be flat, the high-temperature resistant isolating film (3) is torn, and the back lining paper is attached back; and then, the power supply of the heating and ultrasonic gun (5) is closed, after the prepreg blank (4) implanted with the Z-pin is cooled to room temperature, the prepreg blank is sealed and packaged, and then the prepreg blank is marked and placed in a low-temperature environment for refrigeration and standby.
  8. 8. A method of Z-pin high thickness implantation according to claim 3, characterized in that: in step one, the density of adjacent foam layers may be the same.
  9. 9. A method of Z-pin high thickness implantation according to claim 3, characterized in that: and in the third step, a heating device (6) is adopted to heat the bottom and the periphery of the large-thickness prepreg blank (4) to be reinforced.
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CN115057432A (en) * 2022-06-17 2022-09-16 常州富烯科技股份有限公司 Graphene foam block, heat conducting sheet, gasket, arrangement device and preparation method

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