CN110933258A - Optical lens, camera module and assembling method thereof - Google Patents
Optical lens, camera module and assembling method thereof Download PDFInfo
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- CN110933258A CN110933258A CN201811100149.1A CN201811100149A CN110933258A CN 110933258 A CN110933258 A CN 110933258A CN 201811100149 A CN201811100149 A CN 201811100149A CN 110933258 A CN110933258 A CN 110933258A
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- camera module
- melt adhesive
- hot melt
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- adhesive
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
Abstract
The invention provides a camera module which comprises a plurality of camera module components, wherein at least two camera module components are connected through hot melt adhesive. The invention also provides a corresponding camera module assembling method, which comprises the following steps: adhering the camera module component through a hot melt adhesive to obtain a camera module; wherein, it includes to bond the module part of making a video recording through the hot melt adhesive: bonding at least two camera module components separated from each other by hot melt adhesive; or the connection between at least two camera module components is reinforced through hot melt adhesive. The invention can improve the repair rate of the camera module by adopting the hot melt adhesive; the optical performance variation of the camera module caused by the baking process can be avoided or reduced; external impact can be resisted through the adhesive force and toughness of the hot melt adhesive; can avoid or reduce gluey material powder or granule and cause the pollution to optical element when repairing or disassembling the module of making a video recording.
Description
Technical Field
The invention relates to the technical field of optical imaging, in particular to an optical lens, a camera module and an assembling method thereof.
Background
Along with the development of terminals such as mobile phones and computers, users have a great deal of improvement on various requirements, and particularly along with the development of mobile phones, the pursuit of users on shooting quality enables manufacturers to develop personalized and customized camera modules, such as large apertures and wide angles, lenses for solving the problem of a large number of lenses caused by aberration, and the like. This is on the one hand an increasing complexity in optical design and on the other hand the reality is that the complex optical system is sensitive, which poses a challenge to the yield of the manufacture and the quality of the product. Because the optical system of a large-aperture and large-wide-angle camera module is sensitive, and the reliability of the manufacturing process and the verification process of the camera module is weaker than that of the conventional design, a lens with a better structure is needed.
On the other hand, in order to meet the more and more extensive market demands, a high-pixel, small-size, large aperture is an irreversible development trend of the existing camera module. However, the need to achieve high pixel, small size, large aperture in the same imaging mold is very difficult. For example, the compact development of mobile phones and the increase of the mobile phone screen occupation ratio make the space inside the mobile phone available for the front camera module smaller and smaller, and the market puts forward higher and higher demands on the imaging quality of the camera module. In the field of compact camera modules (e.g., camera modules for mobile phones), the quality of the optical imaging lens and the manufacturing errors during the module packaging process often need to be considered. Specifically, in the manufacturing process of the optical imaging lens, factors affecting the lens resolving power come from errors in the respective elements and their assembly, errors in the thickness of the lens spacer elements, errors in the assembly fitting of the respective lenses, variations in the refractive index of the lens material, and the like. Because the factors influencing the resolution of the lens are very many and exist in a plurality of elements, the control of each factor has the limit of the manufacturing precision, if the precision of each element is simply improved, the improvement capability is limited, the improvement cost is high, and the increasingly improved imaging quality requirement of the market can not be met.
Further, the market also expects compact camera modules (e.g., for mobile phones) that can achieve high pixel, small size, large aperture, and reduced cost. Because the module of making a video recording is accurate optical system, its requirement to mechanical reliability is higher, generally uses thermosetting glue or UV hot strand glue to bond each module part of making a video recording among the prior art. The thermosetting adhesive and the UV hot strand adhesive have a large adhesive force and can resist the positional shift of the optical element caused by external impact, and thus can have high reliability. However, such camera modules are often difficult to rework. In actual production, a certain proportion of defective products inevitably occur. When the product is bad, above-mentioned module based on thermosetting glue or UV hot strand is glued often can only be whole scrapped, and this kind of phenomenon leads to making a video recording the cost of module to be difficult to reduce. In addition, thermosetting adhesive or UV hot strand adhesive is often cured through a baking process, and the applicant finds that the baking process may bring potential variation to the camera module, resulting in reduced module quality.
Disclosure of Invention
The present invention aims to provide a solution that overcomes at least one of the drawbacks of the prior art.
According to one aspect of the present invention, there is provided a camera module comprising a plurality of camera module components, wherein at least two of the camera module components are connected by a hot melt adhesive.
Wherein at least two of the camera module components separated from each other are bonded together by the hot melt adhesive.
Wherein, at least two the connection between the module part of making a video recording reinforces through the hot melt adhesive.
Wherein the camera module comprises a lens and a motor which are separated from each other, the lens and the motor are respectively used as one camera module component, and the lens and the motor are bonded together through the hot melt adhesive.
The camera module comprises a lens and a motor which are in threaded connection, the lens and the motor are respectively used as the camera module component, and the threaded connection between the lens and the motor is reinforced through the hot melt adhesive.
The camera shooting module comprises a support and a camera shooting module main body which are separated from each other, wherein the support and the camera shooting module main body are respectively used as a camera shooting module component, the support is provided with a containing hole, the camera shooting module main body is arranged in the containing hole, and the camera shooting module main body and the support are adhered together through the hot melt adhesive.
The camera shooting module comprises a support and a plurality of camera shooting module main bodies, wherein the support and each camera shooting module main body are respectively used as one camera shooting module component, the support is provided with a plurality of containing holes, the camera shooting module main bodies are respectively arranged in the containing holes, and the camera shooting module main bodies and the support are adhered together through the hot melt adhesive.
The camera module comprises a circuit board and a connecting band connected with the circuit board, the circuit board and the connecting band are respectively used as one camera module component, and the circuit board and the connecting band are connected through the hot melt adhesive for reinforcement.
The camera module comprises a photosensitive chip and a circuit board which are separated from each other, the photosensitive chip and the circuit board are respectively used as a camera module component, and the photosensitive chip is adhered to the circuit board through the hot melt adhesive.
The camera module comprises a circuit board and a metal sheet, wherein the circuit board and the metal sheet are respectively used as one camera module component, and the metal sheet is adhered to the circuit board through the hot melt adhesive to reinforce the circuit board.
Wherein, the circuit board is a soft board.
Wherein the hot melt adhesive is a reactive hot melt adhesive.
According to another aspect of the present invention, there is also provided a camera module assembling method, including: adhering the camera module component through a hot melt adhesive to obtain a camera module; wherein, it includes to bond the module part of making a video recording through the hot melt adhesive: bonding at least two camera module components separated from each other by hot melt adhesive; or the connection between at least two camera module components is reinforced through hot melt adhesive.
Wherein, it includes to bond the module part of making a video recording through the hot melt adhesive: preparing heated liquid hot melt adhesive; arranging the hot melt adhesive on the adhesive surface of the first camera module component; arranging a second camera module component, and adjusting the relative position of the first camera module component and the second camera module component within the opening time of the hot melt adhesive; waiting for the primary curing of the hot melt adhesive; after the opening time and before the complete curing, detecting a semi-finished product consisting of the first camera module component and the second camera module component, or detecting a camera module finished product; heating the semi-finished product or the finished product of the camera module which is judged to be bad to soften the hot melt adhesive; adjusting the relative positions of the first camera module component and the second camera module component to repair the detected problems; and completely curing the hot melt adhesive.
Wherein, in the step of softening the hot melt adhesive by heating, the temperature of the hot melt adhesive exceeds the glass transition temperature by heating.
Wherein, the step of preparing the heated liquid hot melt adhesive comprises: preheating the hot melt adhesive to a first temperature and to be in a liquid state; and heating the hot melt adhesive located at the injection valve to a second temperature, wherein the second temperature is greater than the first temperature.
Wherein, the step of arranging the hot melt adhesive on the adhesive surface of the first camera module component comprises: and spraying the adhesive surface heated to the second temperature to the first camera shooting module component.
Wherein the hot melt adhesive is a reactive hot melt adhesive; the preliminary curing is a state that the reactive hot melt adhesive is cooled and cured, the crosslinking reaction promoted by the reactive hot melt adhesive in a moisture environment is not completed before the complete curing, and the complete curing is a state that the crosslinking reaction promoted by the reactive hot melt adhesive in the moisture environment is completely completed.
Compared with the prior art, the invention has at least one of the following technical effects:
1. the invention can improve the repair rate of the camera module by adopting the hot melt adhesive, thereby reducing the production cost of the camera module.
2. The invention can avoid or reduce the optical performance variation of the camera module caused by the baking process.
3. The invention can resist external impact through the adhesive force and toughness of the hot melt adhesive, thereby ensuring the reliability of the camera module.
4. The invention can avoid or reduce the pollution of adhesive material powder or particles (the hot melt adhesive is not easy to generate particle problem) to the optical element when repairing or disassembling the camera module, thereby improving the repair rate.
5. The invention can finish the detection of the camera module within a certain time, and then repair the defective module by softening the hot melt adhesive, thereby repairing the partial defective module and further improving the product yield.
6. The invention can avoid or reduce the bad camera module caused by the cracking of the glue.
Drawings
Exemplary embodiments are illustrated in referenced figures of the drawings. The embodiments and figures disclosed herein are to be regarded as illustrative rather than restrictive.
FIG. 1 illustrates a camera module having a threaded motor in one embodiment of the present invention;
FIG. 2 illustrates a multi-camera module in one embodiment of the invention;
FIG. 3 illustrates a camera module for reinforcing the connection strap in an embodiment of the present invention;
FIG. 4 illustrates a schematic view of the photosensitive assembly of the camera module in one embodiment of the present invention;
fig. 5 is a schematic diagram of a photosensitive assembly of the camera module in one embodiment of the invention.
Detailed Description
For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.
In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.
It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "including," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after a list of listed features, the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.
As used herein, the terms "substantially," "about," and the like are used as terms of table approximation and not as terms of table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
According to one embodiment of the invention, a camera module assembled through hot melt adhesive is provided. The camera module comprises a plurality of camera module components, wherein at least two camera module components which are separated from each other are bonded together through hot melt adhesive. In this embodiment, the hot melt adhesive is preferably a reactive hot melt adhesive, and the hot melt adhesive is in a solid state initially, and can be changed into a liquid state by heating, and then coated on the camera module component. Due to the reduced temperature and the onset of cure of moisture in the air, hot melt adhesives can be cured for a significant portion of the time to achieve initial adhesion, and then the product is allowed to stand for an extended period of time (e.g., 72 hours) to achieve full cure. Curing in a short time, the tack of which is mainly that resulting from curing with a drop in temperature, of course also including that resulting from curing with a small fraction of moisture. The hot melt adhesive is completely cured mainly by moisture curing in the later placement.
The hot melt adhesive has strong toughness after being cured, and has good adhesive property for the adhesive surface, so the hot melt adhesive has good reliability. For example, the hot melt adhesive can buffer the stress among all parts in a mechanical test due to better toughness, so that the hot melt adhesive is not easy to crack and generate powder, and compared with UV (ultraviolet) glue, thermosetting glue or UV thermosetting glue, the hot melt adhesive is not easy to generate the problem of particle and the problem of glue cracking.
After the glue is primarily cured, the relative position of the camera module component is poor, the relative position of the camera module component can be directly adjusted in the opening time, the glue can be heated (for example, the whole module or the module component can be placed on a heating plate for heating) in a short time after the opening time, the temperature of the glue is increased to a certain temperature (for example, about 100 ℃) to soften the glue, the viscosity of the glue is reduced, and the relative position can be adjusted again. It is noted that heating to a temperature greater than the Tg causes the glue to soften. Wherein the Tg point may also be referred to as the Glass Transition Temperature. The glass transition temperature is the temperature at which a glassy material transitions between glassy and highly elastic states. For the high polymer, it is the temperature at which the high polymer changes from a glassy state to a high elastic state, and at the glass transition temperature, the specific heat capacity, thermal expansion coefficient, viscosity, refractive index, free volume, elastic modulus, etc. of the high polymer are all subjected to a sudden change. In terms of molecular structure, the glass transition temperature is a relaxation phenomenon of the amorphous portion of the polymer from a frozen state to a thawed state, and is a two-stage phase transition because it does not have the heat of phase transition as in the case of phase transition. Below the glass transition temperature, the polymer is in a glassy state, the molecular chain and the chain segment cannot move, and only the atoms (or groups) forming the molecules vibrate at the equilibrium positions; at the glass transition temperature, the molecular chain cannot move, but the chain segment starts to move to show high elasticity, and the temperature is increased again to move the whole molecular chain to show viscous flow property. In one example, the hot melt adhesive Tg point is 51.5 ℃. Wherein the open time is the time between the time the adhesive is applied to the surface of the first substrate and the time it is not effective to wet bond the second substrate, i.e., the workable time of the glue. In the embodiment, the opening time of the hot melt adhesive is about 3-4 minutes.
Further, in the module production process of making a video recording, the module (can be the module for short sometimes in this paper, no longer describe in the following) takes place badly, then can be through peeling off the hot melt adhesive this moment, make module part separation, also can be through heating this hot melt adhesive, make its temperature rise to certain temperature (the same with above-mentioned adjustment temperature), make glue soften, viscidity reduces, then directly peel off glue (in fact, can form elastic sticky tape after this glue solidification), because glue itself has stronger toughness, it is difficult to leave the cull on module part, very easily reprocesses.
Further, in another embodiment of the present invention, another camera module based on a hot melt adhesive is provided, in which the connection between at least two camera module components is reinforced by the hot melt adhesive.
Further, in one embodiment of the present invention, the hot melt adhesive is a PUR hot melt adhesive, i.e., a moisture-curable reactive polyurethane hot melt adhesive, and the main component of the hot melt adhesive is an isocyanate-terminated polyurethane prepolymer. The adhesion and toughness of the PUR hot melt adhesive can be adjusted, and the PUR hot melt adhesive has excellent adhesion strength, temperature resistance, chemical corrosion resistance and aging resistance. The PUR adhesive (i.e. PUR hot melt adhesive) is a polyurethane group (-NHCOO-) or isocyanate group (-NCO) which contains polarity and chemical activity in the molecular structure, and has excellent adhesive force with materials containing active hydrogen, such as porous materials of wood, leather, fabrics, paper, ceramics and the like, and surface-cleaning materials of plastics, metals, glass, rubber and the like. The PUR hot melt adhesive is melted into fluid under the condition of inhibiting chemical reaction (such as hot melting) so as to be convenient for coating, two adherends are bonded and cooled, then the adhesive layer is condensed to play a bonding role, and then the moisture existing in the air and the moisture attached to the surface of the adherends react with the two adherends to form a high polymer with high polymerization force through chain extension, so that the adhesive force, the heat resistance, the low temperature resistance and the like are obviously improved. The PUR hot melt adhesive can be solvent-free, so that the drying process is not required like a solvent-based adhesive, the problems of environmental pollution and toxicity caused by the solvent are avoided, and the environmental protection requirement is met. The bonding process is simple and convenient, and the glue applying methods such as roller coating or spraying can be adopted. The PUR hot melt adhesive has good operability. The two adherends can be fixed in a short time, so that the assembly part can be quickly transferred to the next processing procedure, thereby improving the working efficiency. Compared with the traditional hot melt adhesives (such as water-based/solvent-based adhesives), the cross-linked structure of the reactive hot melt adhesive greatly improves the bonding strength, and the reactive hot melt adhesive has excellent heat resistance, cold resistance, water vapor resistance, chemical resistance and solvent resistance.
Further, according to an embodiment of the present invention, another camera module is provided. The camera module can be an automatic focusing module (AF module) which comprises a photosensitive assembly and a lens motor assembly arranged on the photosensitive assembly. The lens motor assembly includes a lens and a motor separated from each other, and the lens and the motor are coupled by a lock attachment. In this embodiment, the lens and the motor may be respectively used as the camera module component, and the carrier of the lens and the carrier of the motor are bonded together by the hot melt adhesive. In this embodiment, the motor may be a non-threaded motor, and the lens and the motor carrier are connected at a fixed height by a hot melt adhesive.
Further, fig. 1 shows a camera module having a threaded motor in one embodiment of the present invention. The camera module comprises a lens 100 and a motor 200 which are connected by screw threads, the lens 100 and the motor 200 are respectively used as a camera module component, and the screw thread connection between the lens 100 and the motor 200 is reinforced by the hot melt adhesive 300. In this embodiment, the motor may be a threaded motor. The method for locking the lens 100 and the motor 200 comprises the following steps: screwing the lens into the motor, after the height is determined, dispensing and fixing between the lens 100 and the motor carrier 201 by using hot melt adhesive; wherein the relative position of the lens 100 and the motor carrier 201 can be adjusted during the open time. In the process of repairing the lens motor assembly, the glue can be directly peeled off to separate the lens and the motor.
Further, fig. 2 shows a multi-camera module in an embodiment of the present invention. The multi-camera module comprises a support 2000 and a camera module main body 1000 (namely a single camera module) which are separated from each other, wherein the support 2000 and the camera module main body 1000 are respectively used as a camera module component, the support 2000 is provided with a containing hole, the camera module main body 1000 is arranged in the containing hole, and the camera module main body 1000 and the support 2000 are bonded together through the hot melt adhesive 300. In the module of shooing more, the relative position of the module of making a video recording is fixed through the support to a plurality of monomer modules of making a video recording, through lay and solidify the relative position of hot melt adhesive in order to fix each monomer module of making a video recording between module of making a video recording and support. In the detection, possible fault points of the multi-camera module include the support frame is ultrahigh, the motor rotates (namely, the support frame and the motor are not aligned in the Z-axis direction and the horizontal direction, and the relative positions are not uniform), and the like. The hot melt adhesive is adopted for fixing, so that the repair can be facilitated, the yield is improved, and the cost is reduced.
Further, fig. 3 shows a camera module for reinforcing the connection belt according to an embodiment of the present invention. In this embodiment, the camera module includes a circuit board 401 and a connecting band 402 connected to the circuit board 401, the circuit board 401 and the connecting band 402 are respectively used as a camera module component, and the connection between the circuit board 401 and the connecting band 402 is reinforced by the hot melt adhesive 300. In this embodiment, adopt the rigid-flex board so that module and cell-phone installation of making a video recording. The soft and hard combined board is provided with a soft board area and a hard board area, and the soft board area forms a connecting belt. The hard board region forms a circuit board (the circuit board in this embodiment refers to a hard board or a PCB board). However, at the boundary between the soft board area and the hard board area of the soft and hard combination board, the connection belt may be separated by bending for many times, so in this embodiment, the hot melt adhesive may be coated, and the reliability of the connection position may be reinforced by the hot melt adhesive, thereby improving the toughness and strength of the connection position. Moreover, in the process of repairing the module, the glue can be directly stripped without residual glue. Or the glue may be heated to reduce the tack to facilitate peeling.
Further, fig. 4 shows a schematic diagram of a photosensitive assembly of the camera module according to an embodiment of the present invention. Referring to fig. 4, the photosensitive assembly includes a photosensitive chip 500 and a circuit board 401 separated from each other, the photosensitive chip 500 and the circuit board 401 each serve as one of the camera module components, and the photosensitive chip 500 is adhered to the circuit board 401 by the hot melt adhesive 300. In this embodiment, the photosensitive assembly includes a photosensitive chip and a circuit board (PCB), and the photosensitive chip and the circuit board need to be attached to the PCB in advance before electrical connection. Through hot melt adhesive dispensing equipment, the hot melt adhesive heated to the liquid state is laid on the PCB, and then the photosensitive chip is attached to the PCB. If the attaching position of the photosensitive chip is not correct, the adhesive can be directly adjusted in the opening time, after the opening time, the viscosity of the glue can be reduced by heating the bonding area, and then the relative position of the photosensitive chip and the PCB is adjusted. In the subsequent repair process, the glue can be directly peeled off or high temperature is applied to the bonding area, so that the softening viscosity of the hot melt adhesive is reduced, the photosensitive chip and the circuit board are separated, and the component with normal function is recovered.
Further, fig. 5 shows a schematic diagram of a photosensitive assembly of the camera module according to an embodiment of the present invention. In this embodiment, the photosensitive component of the camera module includes a circuit board 403 and a metal sheet 600, the circuit board 403 and the metal sheet 600 are respectively used as a component of the camera module, and the metal sheet 600 is adhered to the circuit board 403 by the hot melt adhesive 300 to reinforce the circuit board. In this embodiment, the circuit board 403 may be a flexible board. The flexible board may also be referred to as a flexible wiring board. When the photosensitive chip 500 is attached to a flexible printed circuit (i.e., the printed circuit 403 shown in fig. 5), the strength of the flexible printed circuit is not sufficient, and a metal sheet is often needed for reinforcement. The photosensitive chip and other components are attached to the flexible circuit board, and then the metal plate and the flexible circuit board are bonded through the hot melt adhesive, so that the reinforcing effect can be achieved, and the flatness of the circuit board can be improved. The metal sheet is bonded by using the hot melt adhesive, the bonding position of the metal sheet is not correct, the metal sheet can be directly adjusted in the opening time, and the viscosity of the glue can be reduced by heating the bonding area after the opening time, so that the relative position can be adjusted. In the subsequent repair process, the glue can be directly peeled off or high temperature is applied to the bonding area, so that the softening viscosity of the hot melt adhesive is reduced, the glue and the hot melt adhesive are separated, and the component with normal function is recovered.
It should be noted that the present invention can be implemented in more ways than the above-mentioned embodiments. Generally speaking, in a plurality of modules of making a video recording of module, at least two the module part of making a video recording passes through the hot melt adhesive and connects, can improve the rate of reprocessing of the module of making a video recording to reduce the manufacturing cost of the module of making a video recording. Wherein, two each other's separation the module part of making a video recording passes through the hot melt adhesive and is in the same place, perhaps two the connection between the module part of making a video recording carries out the reinforcement through the hot melt adhesive, all can regard as two the module part of making a video recording passes through the hot melt adhesive and connects.
Further, the invention also provides a camera module assembly method, which comprises the following steps: adhering the camera module component through a hot melt adhesive to obtain a camera module; wherein, it includes to bond the module part of making a video recording through the hot melt adhesive: bonding at least two camera module components separated from each other by hot melt adhesive; or the connection between at least two camera module components is reinforced through hot melt adhesive.
Further, in one embodiment, adhering the camera module components via hot melt adhesive includes the following steps.
Step S10, preparing the heated hot melt adhesive in liquid form.
And step S20, arranging the hot melt adhesive on the adhesive surface of the first camera module component.
And step S30, arranging a second camera module component, and adjusting the relative position of the first camera module component and the second camera module component in the opening time of the hot melt adhesive.
And step S40, waiting for the primary curing of the hot melt adhesive.
And step S50, after the opening time and before the complete solidification, detecting a semi-finished product formed by the first camera module component and the second camera module component, or detecting a camera module finished product. In this step, the semi-finished product or the finished product may be detected by an instrument (for example, by measuring the imaging quality of the optical system by an instrument), or may be detected by visual observation.
And step S60, heating the semi-finished product or the camera module finished product which is judged to be bad to soften the hot melt adhesive.
Step S70, adjusting the relative position of the first camera module component and the second camera module component to repair the detected problem.
And step S80, completely curing the hot melt adhesive.
Further, in one embodiment, in the step of softening the hot melt adhesive by heating (step S60), the heating makes the temperature of the hot melt adhesive exceed the Tg point.
Further, in one embodiment, the step of preparing the heated hot melt adhesive in a liquid state (step S10) includes: preheating the hot melt adhesive to a first temperature and to be in a liquid state; and heating the hot melt adhesive located at the injection valve to a second temperature, wherein the second temperature is greater than the first temperature. The first temperature may be 85 to 100 ℃ and the second temperature may be 120 to 165 ℃.
Further, in an embodiment, the step of disposing the hot melt adhesive on the adhesive surface of the first camera module component includes: and spraying the adhesive surface heated to the second temperature to the first camera shooting module component.
Further, in one embodiment, the hot melt adhesive is a reactive hot melt adhesive; the preliminary curing is a state that the reactive hot melt adhesive is cooled and cured, the crosslinking reaction promoted by the reactive hot melt adhesive in a moisture environment is not completed before the complete curing, and the complete curing is a state that the crosslinking reaction promoted by the reactive hot melt adhesive in the moisture environment is completely completed.
The above description is only a preferred embodiment of the present application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (18)
1. The utility model provides a camera module, its characterized in that includes a plurality of module parts of making a video recording, wherein at least two the module part of making a video recording passes through the hot melt adhesive and connects.
2. The camera module of claim 1, wherein at least two of the camera module components that are separated from each other are bonded together by the hot melt adhesive.
3. The camera module of claim 1, wherein the connection between at least two of said camera module components is reinforced with a hot melt adhesive.
4. The camera module of claim 2, wherein the camera module includes a lens and a motor that are separate from each other, the lens and the motor each being a component of the camera module, and the lens and the motor being bonded together by the hot melt adhesive.
5. The camera module of claim 3, wherein said camera module includes a screw-threaded lens and a motor, said lens and said motor each being part of one of said camera module components, and wherein said screw-threaded connection between said lens and said motor is reinforced by said hot melt adhesive.
6. The camera module according to claim 2, characterized in that the camera module comprises a stand and a camera module main body which are separated from each other, the stand and the camera module main body each serving as one of the camera module parts, the stand having a receiving hole in which the camera module main body is disposed, and the camera module main body and the stand being bonded together by the hot melt adhesive.
7. The camera module according to claim 2, characterized in that the camera module comprises a holder and a plurality of camera module main bodies separated from each other, the holder and each of the camera module main bodies respectively serve as one of the camera module components, the holder has a plurality of housing holes in which the plurality of camera module main bodies are respectively arranged, and the plurality of camera module main bodies and the holder are bonded together by the hot melt adhesive.
8. The camera module according to claim 3, wherein the camera module comprises a circuit board and a connecting strip connected with the circuit board, the circuit board and the connecting strip are respectively used as one of the camera module components, and the connection between the circuit board and the connecting strip is reinforced by the hot melt adhesive.
9. The camera module according to claim 2, wherein the camera module comprises a photosensitive chip and a wiring board which are separated from each other, the photosensitive chip and the wiring board are respectively provided as one of the camera module components, and the photosensitive chip is adhered to the wiring board by the hot-melt adhesive.
10. The camera module according to claim 2, wherein the camera module comprises a wiring board and a metal sheet, the wiring board and the metal sheet each serve as one of the camera module parts, and the metal sheet is adhered to the wiring board by the hot-melt adhesive to reinforce the wiring board.
11. The camera module of claim 10, wherein the circuit board is a flexible board.
12. The camera module of any of claims 1-11, wherein the hot melt adhesive is a reactive hot melt adhesive.
13. A camera module assembly method is characterized by comprising the following steps: adhering the camera module component through a hot melt adhesive to obtain a camera module;
wherein, it includes to bond the module part of making a video recording through the hot melt adhesive:
bonding at least two camera module components separated from each other by hot melt adhesive; or the connection between at least two camera module components is reinforced through hot melt adhesive.
14. The camera module assembling method according to claim 13, wherein the bonding of the camera module parts by the hot melt adhesive comprises:
preparing heated liquid hot melt adhesive;
arranging the hot melt adhesive on the adhesive surface of the first camera module component;
arranging a second camera module component, and adjusting the relative position of the first camera module component and the second camera module component within the opening time of the hot melt adhesive;
waiting for the primary curing of the hot melt adhesive;
after the opening time and before the complete curing, detecting a semi-finished product consisting of the first camera module component and the second camera module component, or detecting a camera module finished product;
heating the semi-finished product or the finished product of the camera module which is judged to be bad to soften the hot melt adhesive;
adjusting the relative positions of the first camera module component and the second camera module component to repair the detected problems; and
and completely curing the hot melt adhesive.
15. The camera module assembling method of claim 14, wherein said step of softening said hot melt adhesive by heating is carried out such that the temperature of said hot melt adhesive exceeds the glass transition temperature.
16. The camera module assembly method of claim 14, wherein said step of preparing a heated, liquid hot melt adhesive comprises:
preheating the hot melt adhesive to a first temperature and to be in a liquid state; and
the hot melt adhesive located at the injection valve is heated to a second temperature, wherein the second temperature is greater than the first temperature.
17. The camera module assembly method of claim 16, wherein said step of disposing said hot melt adhesive on said adhesive side of said first camera module component comprises:
and spraying the adhesive surface heated to the second temperature to the first camera shooting module component.
18. The camera module assembly method of claims 14-16, wherein said hot melt adhesive is a reactive hot melt adhesive; the preliminary curing is a state that the reactive hot melt adhesive is cooled and cured, the crosslinking reaction promoted by the reactive hot melt adhesive in a moisture environment is not completed before the complete curing, and the complete curing is a state that the crosslinking reaction promoted by the reactive hot melt adhesive in the moisture environment is completely completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811100149.1A CN110933258A (en) | 2018-09-20 | 2018-09-20 | Optical lens, camera module and assembling method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811100149.1A CN110933258A (en) | 2018-09-20 | 2018-09-20 | Optical lens, camera module and assembling method thereof |
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| CN110933258A true CN110933258A (en) | 2020-03-27 |
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