CN110925283B - Forming method for array antenna metal plate core glue array panel - Google Patents
Forming method for array antenna metal plate core glue array panel Download PDFInfo
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- CN110925283B CN110925283B CN201911161763.3A CN201911161763A CN110925283B CN 110925283 B CN110925283 B CN 110925283B CN 201911161763 A CN201911161763 A CN 201911161763A CN 110925283 B CN110925283 B CN 110925283B
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- Prior art keywords
- embedded part
- skin
- feed
- bonding
- adhesive
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 24
- 239000002184 metal Substances 0.000 title claims abstract description 24
- 239000003292 glue Substances 0.000 title description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 29
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 230000003647 oxidation Effects 0.000 claims abstract description 11
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 11
- 230000005855 radiation Effects 0.000 claims abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 9
- 238000007664 blowing Methods 0.000 claims abstract description 8
- 239000004576 sand Substances 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims abstract description 6
- 238000004381 surface treatment Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 16
- 239000002313 adhesive film Substances 0.000 claims description 14
- 239000006260 foam Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 238000007743 anodising Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920001821 foam rubber Polymers 0.000 description 2
- AHOUBRCZNHFOSL-YOEHRIQHSA-N (+)-Casbol Chemical compound C1=CC(F)=CC=C1[C@H]1[C@H](COC=2C=C3OCOC3=CC=2)CNCC1 AHOUBRCZNHFOSL-YOEHRIQHSA-N 0.000 description 1
- NDAUXUAQIAJITI-UHFFFAOYSA-N albuterol Chemical compound CC(C)(C)NCC(O)C1=CC=C(O)C(CO)=C1 NDAUXUAQIAJITI-UHFFFAOYSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229960002052 salbutamol Drugs 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention provides a method for molding an array panel bonded by a metal plate core of an array antenna, which is characterized in that the surface treatment modes of a skin and a feed embedded part are firstly sand blowing, then alotin oxidation is carried out on the treated part, a chemical conversion film layer is formed on the surfaces of the skin and the embedded part after the alotin oxidation enables the part to have conductivity, the skin, a porous aluminum honeycomb core, the feed embedded part and a radiation unit installation embedded part are bonded by adopting a secondary bonding autoclave curing process after being positioned by a positioning plate, and meanwhile, conductive adhesive is coated on the bonding surface of the skin and the feed embedded part of a working surface, so that the bonding surface of the skin and the feed embedded part of the working surface is ensured to be conductive. The forming method provided by the invention solves the problem that the conventional metal bonding process cannot meet the requirement of the conduction between the feed embedded part and the skin of the array panel.
Description
Technical Field
The invention relates to the field of manufacturing of array antennas, in particular to the technical field of forming of array panels of a metal plate core glue joint structure for installing radiation units in the array antennas.
Background
The array antenna is a special antenna which is formed by at least two radiating elements which are regularly or randomly arranged and obtain the radiation characteristics through proper excitation, and is a novel antenna produced under the environment of rapid development of the communication knowledge and technology of the antenna at present. The array panel is a carrier for mounting the radiation units in the array antenna, and the regular arrangement of the antenna units can be realized by arranging the antenna unit mounting interfaces which are distributed according to a certain rule on the array panel.
The metal adhesive bonding process is a manufacturing process which utilizes the adhesive force between the adhesive and the metal parts to connect the metal parts into a whole and has certain mechanical properties. With the continuous improvement of metal bonding process technology, the strength of a bonding structure has made an important breakthrough in the aspects of reliability and durability, and the metal bonding structure is increasingly applied in the aerospace field. The metal plate core bonding structure is a structure for bonding the aluminum honeycomb core between metal parts through a structural bonding process, and the structure has good structural strength and an excellent weight reduction effect, so that the metal plate core bonding structure is widely applied to multiple fields.
The satellite antenna systems of various models in China all adopt metal plate core glue joint structure array panels. According to the design requirements, the array panel is a plate core glue joint structure assembly formed by a working surface skin, a non-working surface skin, a porous aluminum honeycomb and a plurality of aluminum embedded parts through a metal glue joint process. Each radiation unit installation position on the array panel is provided with a feed embedded part, and in order to ensure that the electrical performance of an antenna system meets the design requirement, the bonding surface of the feed embedded part and the skin must be conductive. According to the general metal bonding process flow, other metal parts except the aluminum honeycomb core need to be subjected to phosphoric acid anodizing surface treatment, the surface of the part to be bonded is coated with primer, a glue film is laid and then assembled, and heating and pressurizing curing molding is carried out in an autoclave. However, an oxide film formed on the surface of the aluminum part after phosphoric acid anodizing is not conductive, and the requirement of conductivity of the bonding surface of the skin and the embedded part cannot be met. Therefore, the conventional metal structure bonding process cannot meet the electrical performance requirements of the antenna.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a method for forming a metal plate core of an array antenna by bonding an array panel, which solves the problem that the conventional metal bonding process cannot satisfy the requirement of the electrical conduction between a feed embedded part and a front panel skin.
A method for forming an array panel by bonding a metal plate core of an array antenna is characterized in that sand blowing is firstly carried out on a surface treatment mode of a skin and a feed embedded part, then, alotin oxidation is carried out on the treated part, a chemical conversion film layer formed on the surfaces of the skin and the feed embedded part after the alotin oxidation enables the part to have conductivity, the skin, a porous aluminum honeycomb core, the feed embedded part and a radiation unit installation embedded part are positioned by a positioning plate and then bonded by adopting a secondary bonding autoclave curing process, and meanwhile, conductive adhesive is coated on a bonding surface of the working surface skin and the feed embedded part to ensure that the bonding surface of the working surface skin and the feed embedded part is conductive, and the method comprises the following specific steps:
fixing a non-working surface skin on a positioning plate through a positioning pin, paving an adhesive film on a surface to be bonded of the non-working surface skin, then placing a porous aluminum honeycomb core, filling foam adhesive in the cells of the porous aluminum honeycomb core at the mounting positions of all embedded parts, fixing the feed embedded part and the radiation unit mounting embedded part through the positioning hole on the positioning plate, placing a strippable protective layer on the honeycomb core, then placing a uniform pressing plate, and performing primary bonding in an autoclave after manufacturing a vacuum bag;
and 3, checking whether the surface of the part feed embedded part after solidification has foam rubber. If so, removing the foam adhesive on the end face of the embedded part in time by using a polishing pad to expose the chemical conversion film layer on the surface of the embedded part;
and 5, vacuumizing after the vacuum bag is manufactured, standing at room temperature until the conductive adhesive is cured, and then performing secondary adhesive bonding and curing in an autoclave.
The invention has the beneficial effects that:
(1) and performing sand blowing treatment on the surfaces to be bonded of the skin and the feed embedded part, and then performing alodine oxidation. The sand blowing treatment can ensure the bonding strength of the array panel, and in addition, the chemical conversion film layer formed on the surface of the covering and the embedded part after the albuterol is oxidized enables the part to have conductivity. The problem that parts are not conductive due to the generated oxide film layer when parts are anodized by phosphoric acid in the conventional metal bonding process and only meet the requirement of bonding strength is solved.
(2) The skin, the porous aluminum honeycomb core and the feed embedded part are molded by a secondary bonding autoclave curing process, namely, the skin, the aluminum honeycomb core and the feed embedded part on the non-working surface are firstly subjected to primary bonding curing and then subjected to secondary bonding with the skin on the working surface. And after one-time bonding, foam adhesive silt on the end face of the feed embedded part is removed in time, so that the problem that the feed embedded part and the skin are not conductive due to the foam adhesive silt is effectively avoided.
(3) Before the working face skin is bonded, a layer of conductive adhesive is uniformly coated on the end face of the feed embedded part, and the adhesive film at the mounting position of the feed embedded part on the skin is removed, so that the problem that the conductive requirement of the feed embedded part cannot be met by bonding the feed embedded part and the skin by using the adhesive film is solved.
(4) And after the conductive adhesive is cured, secondary bonding and curing are carried out in the autoclave, so that the problem that the feed embedded part and the skin are not conductive because the silt adhesive of the adhesive film permeates between the feed embedded part and the skin in the secondary curing process in the autoclave is effectively solved.
Description of the drawings:
FIG. 1 is a front view of an array antenna panel
FIG. 2 is a cross-sectional view A-A of a front view of an array antenna panel
FIG. 3 array antenna array panel rear view
FIG. 4 is a cross-sectional view taken along line B-B of a rear view of a panel of the array antenna array
The numbering in the figures illustrates: 1-a perforated aluminum honeycomb core; 2-installing an embedded part in a radiation unit and 3-covering a working surface; 4-non-working face skin; 5-feeding embedded parts.
The specific implementation mode is as follows:
example 1 was carried out: certain type satellite array antenna array panel
Raw materials: working face and non-working face skins (aluminum), a perforated aluminum honeycomb core (BC 1.8-3/8P), a feeding embedded part (aluminum), a radiating unit installation embedded part (aluminum), a REDOX 312UL glue film, a foam adhesive FM 410-1, a conductive adhesive Chomerics 0584-.
As shown in figures 1-4, the surface treatment method of the array antenna metal plate core glue-joint array panel comprises the steps of firstly blowing sand, then carrying out alotin oxidation on the treated part, enabling the part to have conductivity by a chemical conversion film layer formed on the surfaces of the skin and the feed embedded part 5 after the alotin oxidation, positioning the skin, the perforated aluminum honeycomb core 1, the feed embedded part 5 and the radiation unit installation embedded part through a positioning plate, then bonding by adopting a secondary glue-joint autoclave curing process, simultaneously coating conductive glue on the bonding surface of the working surface skin 3 and the feed embedded part 5, and ensuring the bonding surface of the working surface skin and the feed embedded part 5 to be conductive
1) Sand blasting is firstly carried out on the surfaces to be glued of the working surface skin 3, the non-working surface skin 4 and the feeding embedded part 5, and Arotin 1200S oxidation is carried out on the surface of the treated part.
2) Fixing a non-working face skin 4 on a positioning plate through a positioning pin, paving a layer of adhesive film REDUX312UL on a to-be-bonded face of the non-working face skin 4, then placing a porous aluminum honeycomb core BC 1.8-3/8P, filling foam adhesive FM 410-1 in the porous honeycomb core cells of all embedded part mounting positions, wherein the adhesive filling range is 10-15 mm larger than that of the embedded part mounting positions, fixing a feed embedded part 5 through the positioning hole on the positioning plate, placing a peelable protective layer on the porous aluminum honeycomb core 1, then placing a uniform pressing plate, and performing primary adhesive bonding in an autoclave according to curing parameters of the adhesive film after manufacturing a vacuum bag.
3) And checking whether the surface of the part feeding embedded part 5 has foam rubber after being cured. If so, the polishing pad is used for removing the foam adhesive on the end face of the embedded part in time to expose the chemical conversion film layer on the surface of the embedded part.
4) Uniformly coating a layer of conductive adhesive Chomerics 0584-0029 on the end face of the feeding embedded part 5, laying a layer of adhesive film REDUC 312UL on the working face skin 3, removing the adhesive film on the mounting position of the feeding embedded part 5 on the working face skin 3, and then combining the working face skin 3 on the porous honeycomb core 1.
5) And (3) vacuumizing after manufacturing a vacuum bag, standing for 24 hours at room temperature until the conductive adhesive is cured, and then performing secondary adhesive bonding and curing in an autoclave according to curing parameters of the adhesive film.
The invention has been successfully applied to the development and production of Beidou navigation satellites in China. The conductivity and the bonding strength of the array panel manufactured by the forming method of the invention completely meet the design requirements, and the array panel has good running effect in the actual use process.
Claims (4)
1. A method for forming an array panel by bonding an array antenna metal plate core is characterized in that the surface treatment mode of a skin and a feed embedded part is that sand blowing is carried out firstly, the treated part is oxidized by alotin, a chemical conversion film layer formed on the surface of the skin and the surface of the embedded part after the alotin oxidation enables the part to have conductivity, the skin, a porous aluminum honeycomb core, the feed embedded part and a radiation unit installation embedded part are positioned by a positioning plate and then bonded by adopting a secondary bonding autoclave curing process, and meanwhile, conductive adhesive is coated on the bonding surface of the working surface skin and the feed embedded part to ensure that the bonding surface of the working surface skin and the feed embedded part is conductive, and the method comprises the following specific steps:
step 1, performing sand blowing on surfaces to be glued of working surface skin, non-working surface skin and feed embedded parts, and performing alodine oxidation on the surfaces of the treated parts;
fixing a non-working surface skin on a positioning plate through a positioning pin, paving an adhesive film on a surface to be bonded of the non-working surface skin, then placing a porous aluminum honeycomb core, filling foam adhesive in the cells of the porous aluminum honeycomb core at the mounting positions of all embedded parts, fixing the feed embedded part and the radiation unit mounting embedded part through the positioning plate, placing a strippable protective layer on the honeycomb core, then placing a uniform pressing plate, and performing primary bonding in an autoclave after manufacturing a vacuum bag;
step 3, checking whether foam adhesive exists on the surface of the part feed embedded part after solidification; if so, removing the foam adhesive on the end face of the embedded part in time by using a polishing pad to expose the chemical conversion film layer on the surface of the embedded part;
step 4, uniformly coating a layer of conductive adhesive on the end face of the feed embedded part, laying a layer of adhesive film on the working face skin, removing the adhesive film on the mounting position of the feed embedded part on the working face skin, and then combining the working face skin on the honeycomb core;
and 5, vacuumizing after the vacuum bag is manufactured, standing at room temperature until the conductive adhesive is cured, and then performing secondary adhesive bonding and curing in an autoclave.
2. The method of claim 1, wherein the positioning plate has positioning holes, and the feeding embedded part and the radiating element mounting embedded part are fixed by the positioning holes of the positioning plate in a hole-pin fit manner.
3. The method according to claim 1, wherein in step 3, if the foam adhesive exists on the surface of the feeding embedded part of the cured part, the polishing pad is used to remove the foam adhesive on the end surface of the embedded part in time to expose the chemical conversion film on the surface of the embedded part.
4. The method as claimed in claim 1, wherein the step 5 is performed at room temperature for 24 hours until the conductive adhesive is cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911161763.3A CN110925283B (en) | 2019-11-22 | 2019-11-22 | Forming method for array antenna metal plate core glue array panel |
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| CN201911161763.3A CN110925283B (en) | 2019-11-22 | 2019-11-22 | Forming method for array antenna metal plate core glue array panel |
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| CN110925283A CN110925283A (en) | 2020-03-27 |
| CN110925283B true CN110925283B (en) | 2021-07-16 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673880A (en) * | 2009-10-21 | 2010-03-17 | 中国电子科技集团公司第五十四研究所 | Method for manufacturing antenna reflecting surface with aluminum skin honeycomb sandwich structure |
| CN201655975U (en) * | 2009-10-21 | 2010-11-24 | 中国电子科技集团公司第五十四研究所 | High-precision antenna reflector panel with light high-rigidity structure |
| CN204323706U (en) * | 2014-12-09 | 2015-05-13 | 中国科学院上海技术物理研究所 | The metal honeycomb core composite material single plate structure of electrostatic prevention |
| CN106393710A (en) * | 2016-11-08 | 2017-02-15 | 深圳市知宇新材料应用研究院有限公司 | Gluing method, structure and parts of micro-perforated panel and honeycomb sandwich structure |
| CN107378388A (en) * | 2017-06-14 | 2017-11-24 | 中山市恒润金属制品有限公司 | A kind of processing technology of lightning protection device |
| CN110171183A (en) * | 2019-05-24 | 2019-08-27 | 北京康姆特科技发展有限公司 | A kind of the positioning pressure-equalizing device and forming method of the honeycomb sandwich construction containing built-in fitting |
| CN110239200A (en) * | 2019-07-24 | 2019-09-17 | 哈尔滨玻璃钢研究院有限公司 | A kind of preparation method of lightweight grid covering honeycomb |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8077040B2 (en) * | 2000-01-24 | 2011-12-13 | Nextreme, Llc | RF-enabled pallet |
| US7046209B1 (en) * | 2004-10-21 | 2006-05-16 | The Boeing Company | Design and fabrication methodology for a phased array antenna with shielded/integrated feed structure |
-
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- 2019-11-22 CN CN201911161763.3A patent/CN110925283B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673880A (en) * | 2009-10-21 | 2010-03-17 | 中国电子科技集团公司第五十四研究所 | Method for manufacturing antenna reflecting surface with aluminum skin honeycomb sandwich structure |
| CN201655975U (en) * | 2009-10-21 | 2010-11-24 | 中国电子科技集团公司第五十四研究所 | High-precision antenna reflector panel with light high-rigidity structure |
| CN204323706U (en) * | 2014-12-09 | 2015-05-13 | 中国科学院上海技术物理研究所 | The metal honeycomb core composite material single plate structure of electrostatic prevention |
| CN106393710A (en) * | 2016-11-08 | 2017-02-15 | 深圳市知宇新材料应用研究院有限公司 | Gluing method, structure and parts of micro-perforated panel and honeycomb sandwich structure |
| CN107378388A (en) * | 2017-06-14 | 2017-11-24 | 中山市恒润金属制品有限公司 | A kind of processing technology of lightning protection device |
| CN110171183A (en) * | 2019-05-24 | 2019-08-27 | 北京康姆特科技发展有限公司 | A kind of the positioning pressure-equalizing device and forming method of the honeycomb sandwich construction containing built-in fitting |
| CN110239200A (en) * | 2019-07-24 | 2019-09-17 | 哈尔滨玻璃钢研究院有限公司 | A kind of preparation method of lightweight grid covering honeycomb |
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