CN110923689A - Precise metal mold protection method and structure - Google Patents
Precise metal mold protection method and structure Download PDFInfo
- Publication number
- CN110923689A CN110923689A CN201911141144.8A CN201911141144A CN110923689A CN 110923689 A CN110923689 A CN 110923689A CN 201911141144 A CN201911141144 A CN 201911141144A CN 110923689 A CN110923689 A CN 110923689A
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- CN
- China
- Prior art keywords
- metal
- metal mold
- layer
- isolation layer
- mold
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/73—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals characterised by the process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Abstract
The invention discloses a method and a structure for protecting a precision metal mold, wherein the method comprises the following steps: manufacturing an isolation layer on the surface of the metal mold in a chemical reaction or vapor deposition mode; depositing a metal protective layer on the isolation layer in an electrochemical deposition mode; when the metal mold is used, the metal protective layer is peeled off. Through making the one deck isolation layer on the metal mold surface, deposit one deck metal protection layer on the isolation layer, peel off metal protection layer when using the mould in the later stage that can make things convenient for, because metal protection layer is formed by metal ion deposition, and high with metal mold's degree of agreeing with, and have certain hardness, can prevent effectively that the mould from being contaminated and scratch scheduling problem, the save transportation of the mould of being convenient for improves the life of mould, practices thrift the mould expense to reduction in production cost.
Description
Technical Field
The invention belongs to the field of structural design, and relates to a method and a structure for protecting a precision metal mold.
Background
In order to protect the surface of a mold in the transportation process of a high-precision metal mold, the surface of the mold is generally simply covered by a PE protective film and then transported and stored, and the protection method has insufficient protection force on the precision mold and easily causes the problems of mold scratching, pollution and the like.
Disclosure of Invention
The invention aims to: the protection method can effectively prevent the metal die from being polluted or scratched, prolong the service life of the die, reduce the production cost and facilitate the storage and transportation of the die.
The technical scheme of the invention is as follows:
in a first aspect, a method of precision metal mold protection, the method comprising: manufacturing an isolation layer on the surface of the metal mold in a chemical reaction or vapor deposition mode;
depositing a metal protective layer on the isolation layer by means of electrochemical deposition;
and peeling off the metal protective layer when the metal mold is used.
The further technical scheme is as follows: the metal mold is provided with metal micro-textures;
the method for manufacturing the isolating layer on the surface of the metal mold in a chemical reaction or vapor deposition mode comprises the following steps:
manufacturing a transparent isolating layer on the surface of the metal mold in a chemical reaction or vapor deposition mode;
depositing a metal protective layer on the isolation layer by means of electrochemical deposition, wherein the metal protective layer comprises:
and depositing a metal protective layer with mirror image micro texture on the isolation layer in an electrochemical deposition mode, wherein the mirror image micro texture and the metal micro texture are in a mirror image structure relationship.
The further technical scheme is as follows: the chemical reaction comprises soaking for a predetermined length of time with a predetermined concentration of potassium permanganate or potassium dichromate solution.
The further technical scheme is as follows: the vapor deposition includes at least one of an evaporation coating and a sputtering coating.
The further technical scheme is as follows: the metal protective layer adopts at least one of copper, nickel, chromium and cadmium.
The further technical scheme is as follows: the isolating layer is made of oxide or compound.
In a second aspect, a precision metal mold protection structure manufactured by the precision metal mold protection method according to the first aspect includes: an isolation layer and a metal protection layer; the isolation layer covers the surface of the metal mold, and the metal protection layer covers the surface of the isolation layer.
The further technical scheme is as follows: the method for protecting a precision metal mold according to the first possible embodiment of the first aspect is used to manufacture the metal mold, wherein the isolation layer is transparent, the metal protection layer has mirror micro-textures, and the mirror micro-textures of the metal protection layer and the metal micro-textures on the surface of the metal mold are in mirror image relation with respect to the isolation layer.
The further technical scheme is as follows: the thickness of the isolation layer is 5-10 nm.
The further technical scheme is as follows: the thickness of the metal protection layer is 0.1-0.2 mm.
The invention has the advantages that:
1. the isolation layer is manufactured on the surface of the metal mold, the metal protection layer is deposited on the isolation layer, so that the metal protection layer can be conveniently stripped in the later use of the mold, and the metal protection layer is formed by metal ion deposition, has high degree of fit with the metal mold and has certain hardness, so that the problems of pollution, scratching and the like of the mold can be effectively prevented, the mold is convenient to store and transport, the service life of the mold is prolonged, the mold cost is saved, and the production cost is reduced;
2. by manufacturing the transparent isolation layer, the metal micro-texture on the surface of the metal mold can be copied during electrochemical deposition, and the stripped metal protection layer can also be used as a sub-mold of the original metal mold.
Drawings
The invention is further described with reference to the following figures and examples:
FIG. 1 is a flow chart of a method of precision metal mold protection provided by one embodiment of the present application;
fig. 2 is a schematic view of a protection structure of a precision metal mold according to an embodiment of the present application.
Detailed Description
Example (b): the application provides a method for protecting a precise metal mold, which can comprise the following steps as shown in figure 1:
The isolation layer is used for isolating the metal mold from the metal protection layer, so that the metal protection layer can be conveniently stripped when the metal mold is used.
Typically, the surface of the high precision metal mold has a metal microtexture.
Optionally, the barrier layer is transparent.
Optionally, the isolation layer is an oxide or a compound.
Alternatively, the chemical reaction comprises soaking for a predetermined length of time with a solution of potassium permanganate or potassium dichromate of a predetermined concentration. For example, soaking the substrate in 3% potassium permanganate or potassium dichromate solution for about 1-10 minutes.
Optionally, the vapor deposition includes at least one of evaporation coating and sputtering coating.
For example, the material of the metal mold may be copper, chromium, nickel, etc., and the composition of the isolation layer may be copper oxide, chromium oxide, silicon oxide, nickel chromate, etc.
Step 200, depositing a metal protective layer on the isolation layer by means of electrochemical deposition.
The metal protective layer is formed by metal ion deposition, has high degree of fit with the original metal mould and certain hardness, can effectively prevent the metal mould from being polluted or scratched and the like, and is convenient for storage and transportation of the mould.
Optionally, the metal protective layer has a mirror image micro texture, and the mirror image micro texture and the metal micro texture are in a mirror image structure relationship.
Because the metal protective layer is made in an electrochemical deposition mode, the microstructure on the surface of the original metal mold can be copied, but the copied microstructure is a mirror image of the original structure. The electrochemical deposition mode is a process of reducing metal ions into metal by electrons at a cathode, and is deposited by taking atoms as a unit, and the surface microstructure of the original metal mold is copied during deposition.
Optionally, the metal protective layer is at least one of copper, nickel, chromium and cadmium.
And step 300, stripping the metal protective layer when the metal mold is used.
The mirror image micro texture on the metal protective layer is in mirror image relation with the metal micro texture of the metal mold, and the stripped metal protective layer can be used as a sub mold of the metal mold.
The present application also provides a precision metal mold protection structure, which is manufactured by the precision metal mold protection method shown in fig. 1, with reference to fig. 2, and includes: isolation layer 1 and metal protection layer 2, isolation layer 1 covers on 3 surfaces of metal mold, and metal protection layer 2 covers on 1 surfaces of isolation layer.
Optionally, the metal protection layer 2 has a mirror image micro-texture 4, and the mirror image micro-texture 4 of the metal protection layer 2 is in a mirror image relationship with the metal micro-texture 5 of the surface of the metal mold 3 with respect to the isolation layer 1.
Optionally, the thickness of the isolation layer 1 is 5-10 nm.
Optionally, the thickness of the metal protection layer 2 is 0.1-0.2 mm.
To sum up, the application provides a precision metal mold protection method and structure, through at the one deck isolation layer of metal mold surface preparation, deposit one deck metallic protective layer on the isolation layer, peel off metallic protective layer when can make things convenient for later stage to use the mould, because metallic protective layer is formed by metal ion deposition, with metal mold's degree of agreeing with height, and have certain hardness, can effectively prevent that the mould from being contaminated and scratch scheduling problem, the save transportation of the mould of being convenient for improves the life of mould, practices thrift the mould expense, thereby reduction in production cost.
In addition, by manufacturing the transparent isolation layer, the metal micro-texture on the surface of the metal mold can be copied during electrochemical deposition, and the stripped metal protection layer can also be used as a sub-mold of the original metal mold.
The terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying a number of the indicated technical features. Thus, a defined feature of "first", "second", may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
The above-mentioned serial numbers of the embodiments of the present application are merely for description and do not represent the merits of the embodiments.
Persons of ordinary skill in the art will appreciate that all or part of the steps in implementing the above embodiments may be implemented by hardware, or may be implemented by instructions associated with a program, where the program is stored in a computer-readable storage medium, and the storage medium may be a read-only memory, a magnetic or optical disk, etc.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A method of protecting a precision metal mold, the method comprising:
manufacturing an isolation layer on the surface of the metal mold in a chemical reaction or vapor deposition mode;
depositing a metal protective layer on the isolation layer by means of electrochemical deposition;
and peeling off the metal protective layer when the metal mold is used.
2. The precise metal mold protection method according to claim 1, wherein the metal mold has a metal micro-texture thereon;
the method for manufacturing the isolating layer on the surface of the metal mold in a chemical reaction or vapor deposition mode comprises the following steps:
manufacturing a transparent isolating layer on the surface of the metal mold in a chemical reaction or vapor deposition mode;
depositing a metal protective layer on the isolation layer by means of electrochemical deposition, wherein the metal protective layer comprises:
and depositing a metal protective layer with mirror image micro texture on the isolation layer in an electrochemical deposition mode, wherein the mirror image micro texture and the metal micro texture are in a mirror image structure relationship.
3. The method of claim 2, wherein the chemical reaction comprises soaking for a predetermined length of time with a solution of potassium permanganate or potassium dichromate at a predetermined concentration.
4. The method of claim 2, wherein the vapor deposition comprises at least one of an evaporation coating and a sputter coating.
5. The method for protecting a precision metal mold according to any one of claims 1 to 4, wherein the metal protective layer is at least one of copper, nickel, chromium and cadmium.
6. The method of protecting a precision metal mold according to any one of claims 1 to 4, wherein the composition of the separation layer is an oxide or a compound.
7. A precision metal mold protection structure manufactured by the precision metal mold protection method according to claim 1, comprising: an isolation layer and a metal protection layer; the isolation layer covers the surface of the metal mold, and the metal protection layer covers the surface of the isolation layer.
8. The precision metal mold protection structure according to claim 7, wherein the isolation layer is transparent, the metal protection layer has mirror micro-texture, and the mirror micro-texture of the metal protection layer is mirror image of the metal micro-texture of the metal mold surface with respect to the isolation layer.
9. The precise metal mold protection structure of claim 7 or 8, wherein the thickness of the isolation layer is 5-10 nm.
10. The protection structure of a precise metal mold according to claim 7 or 8, wherein the thickness of the metal protection layer is 0.1-0.2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911141144.8A CN110923689A (en) | 2019-11-20 | 2019-11-20 | Precise metal mold protection method and structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911141144.8A CN110923689A (en) | 2019-11-20 | 2019-11-20 | Precise metal mold protection method and structure |
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| CN110923689A true CN110923689A (en) | 2020-03-27 |
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| CN201911141144.8A Pending CN110923689A (en) | 2019-11-20 | 2019-11-20 | Precise metal mold protection method and structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113351827A (en) * | 2021-05-24 | 2021-09-07 | 西安交通大学 | Metal-based metamaterial preparation method based on indirect additive manufacturing |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5891377A (en) * | 1995-05-02 | 1999-04-06 | Texas Instruments Incorporated | Dambarless leadframe for molded component encapsulation |
| US20040040263A1 (en) * | 2002-09-04 | 2004-03-04 | The Boeing Company | Method of supplying a net moulded syntactic article and related shipping packages |
| CN1926262A (en) * | 2004-02-20 | 2007-03-07 | 天野繁久 | Protective film agent and method for forming protective film |
| CN102066512A (en) * | 2008-06-27 | 2011-05-18 | 屈德加薄膜产品股份有限公司 | Protective film with release surface |
| CN103938230A (en) * | 2013-01-21 | 2014-07-23 | 鸿富锦精密工业（深圳）有限公司 | Manufacturing method for light guide plate mold insert |
| CN109722666A (en) * | 2017-10-31 | 2019-05-07 | 香港科技大学 | The preparation method and metallic film mold intermediate of metallic film mold with surface micro-nano structure |
-
2019
- 2019-11-20 CN CN201911141144.8A patent/CN110923689A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5891377A (en) * | 1995-05-02 | 1999-04-06 | Texas Instruments Incorporated | Dambarless leadframe for molded component encapsulation |
| US20040040263A1 (en) * | 2002-09-04 | 2004-03-04 | The Boeing Company | Method of supplying a net moulded syntactic article and related shipping packages |
| CN1926262A (en) * | 2004-02-20 | 2007-03-07 | 天野繁久 | Protective film agent and method for forming protective film |
| CN102066512A (en) * | 2008-06-27 | 2011-05-18 | 屈德加薄膜产品股份有限公司 | Protective film with release surface |
| CN103938230A (en) * | 2013-01-21 | 2014-07-23 | 鸿富锦精密工业（深圳）有限公司 | Manufacturing method for light guide plate mold insert |
| CN109722666A (en) * | 2017-10-31 | 2019-05-07 | 香港科技大学 | The preparation method and metallic film mold intermediate of metallic film mold with surface micro-nano structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113351827A (en) * | 2021-05-24 | 2021-09-07 | 西安交通大学 | Metal-based metamaterial preparation method based on indirect additive manufacturing |
| CN113351827B (en) * | 2021-05-24 | 2022-08-05 | 西安交通大学 | Metal-based metamaterial preparation method based on indirect additive manufacturing |
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Application publication date: 20200327 |