CN110920153B - Quick-acting manufacturing method for honeycomb plate - Google Patents
Quick-acting manufacturing method for honeycomb plate Download PDFInfo
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- CN110920153B CN110920153B CN201910989104.2A CN201910989104A CN110920153B CN 110920153 B CN110920153 B CN 110920153B CN 201910989104 A CN201910989104 A CN 201910989104A CN 110920153 B CN110920153 B CN 110920153B
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- epoxy resin
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- honeycomb
- resin adhesive
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 78
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 78
- 239000010410 layer Substances 0.000 claims abstract description 72
- 239000000853 adhesive Substances 0.000 claims abstract description 65
- 230000001070 adhesive effect Effects 0.000 claims abstract description 65
- 239000012792 core layer Substances 0.000 claims abstract description 35
- 238000001035 drying Methods 0.000 claims abstract description 25
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 39
- 239000003795 chemical substances by application Substances 0.000 claims description 21
- 239000004593 Epoxy Substances 0.000 claims description 14
- 239000011256 inorganic filler Substances 0.000 claims description 13
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 239000003085 diluting agent Substances 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 6
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical group CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 claims description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 3
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 238000010422 painting Methods 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 229960001124 trientine Drugs 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 13
- 238000000576 coating method Methods 0.000 abstract description 13
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000004816 latex Substances 0.000 description 6
- 229920000126 latex Polymers 0.000 description 6
- 239000000178 monomer Substances 0.000 description 4
- 239000011087 paperboard Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- -1 nitrogen atom forms secondary amine Chemical class 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical group 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 150000003335 secondary amines Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a quick-acting manufacturing method of a honeycomb plate, which uses an innovative epoxy resin adhesive to bond an upper plate layer, a honeycomb core layer and a lower plate layer, does not need to spread and scrape an adhesive coating by hands and extrude by equipment, can automatically trowel the epoxy resin adhesive, can better play a bonding role under the heating condition of 120 ℃ in a drying room, and improves the processing speed and the bonding quality. The bonding speed of the honeycomb plates can be greatly improved in a drying room heating mode, the time for producing the same number of honeycomb plates is shortened, the production efficiency is improved, and the production cost is reduced. And the size specification of the honeycomb panel is not limited and can be made according to actual requirements.
Description
Technical Field
The invention relates to the technical field of plate processing, in particular to a quick-acting manufacturing method of a honeycomb plate.
Background
The honeycomb panel is a plate made of two thinner panels, which need an adhesive to be firmly bonded on two sides of a thicker honeycomb core material, and is also called a honeycomb sandwich structure. The use of honeycomb panel adhesives can have an effect on the effectiveness of the honeycomb panel. The solid content of the adhesive is not easy to be too small, otherwise, the adhesive is diffused along with the water, so that the viscosity of the honeycomb plate is not enough, and the problem of weak adhesion is caused. However, if the solid content is increased, the viscosity is too thick, the flowing speed is slow, so that the adhesive is not easy to permeate into the paperboard, most of the adhesive is dried on the surface of the paperboard, and the phenomenon of false adhesion is caused. If the performance of the selected adhesive is poor, the problem that the strength of the honeycomb plate is reduced because the adhesion between the paperboard and the core layer is not firm and the honeycomb plate falls off easily occurs.
In the prior art, when an adhesive coating is applied, hands are often required to spread and scrape, after smearing is finished, a press is required to extrude a honeycomb plate to flatten the adhesive so as to adhere the honeycomb plate, but the method has limited disposable products and limits the size and specification of the honeycomb plate, so that the production efficiency for preparing the honeycomb plate is low.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a formula of an epoxy resin adhesive, wherein the viscosity of the epoxy resin adhesive is less than 200cP, the epoxy resin adhesive is lower than that of the traditional adhesive, and a scratch-off coating is not required to be spread by hands when the adhesive is coated on a paperboard. The invention also aims to provide a quick-acting manufacturing method of the honeycomb plate, the honeycomb plate bonded by the epoxy resin adhesive is firmer, the plate manufacturing speed and quality are improved, and the honeycomb plate is beneficial to playing the self-action.
The purpose of the invention is realized by adopting the following technical scheme:
a quick-acting manufacturing method of a honeycomb plate comprises an upper surface plate layer, a lower surface plate layer and a honeycomb core layer arranged between the upper surface plate layer and the lower surface plate layer, and comprises the following steps:
1) Bonding the upper panel layer with the upper layer of the honeycomb core layer by using an epoxy resin adhesive;
2) Drying the bonded upper plate layer and the honeycomb core layer at 120 ℃ and preserving heat for 1 hour;
3) Bonding the lower panel layer with the lower layer of the honeycomb core layer obtained in the step 2) through an epoxy resin adhesive;
4) Drying the bonded upper plate layer, lower plate layer and honeycomb core layer at 120 ℃ and preserving heat for 1 hour;
wherein the viscosity of the epoxy resin adhesive is less than 200cP; the epoxy resin adhesive is composed of a component A and a component B, wherein the mass ratio of the component A to the component B is 100:25-30; the component A is prepared from the following components in percentage by weight of 6:4:1, a water-based epoxy resin, an inorganic filler and a diluent, wherein the diluent is a compound containing an oxetane monomer or a vinyl ether monomer; the component B is prepared from the following components in percentage by weight 5:1 aqueous epoxy curing agent and imidazole curing accelerator, wherein the aqueous epoxy curing agent is an amine curing agent, and the imidazole curing accelerator comprises one or more of 2-methylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 705 curing agent and 708 curing agent.
The epoxy resin adhesive adopted by the invention only needs to be manually coated with a brush or poured into a proper amount of the epoxy resin adhesive to be spread on the upper panel layer and the lower panel layer, when the upper panel layer or the lower panel layer is contacted with the honeycomb core layer, extrusion is not needed, and the epoxy resin adhesive has the characteristic of automatic leveling. The upper plate layer, the honeycomb core layer and the lower plate layer coated with the epoxy resin adhesive are placed at 120 ℃ for heat preservation for 1 hour, so that the epoxy resin adhesive can play a role in bonding, a traditional equipment pressing mode is not needed, and the processing efficiency is improved.
In addition, in a heating environment of 120 ℃, a bonding film of the epoxy resin adhesive can grow moderately, so that the honeycomb core layer can be bonded with the intersection position of the upper plate layer and the lower plate layer fully, and the bonding quality is improved. The water-based epoxy curing agent is amine curing agent, and the curing effect of primary amine and secondary amine on the water-based epoxy resin is that active hydrogen on a nitrogen atom opens an epoxy group to be crosslinked and cured. The diluent has an oxetane monomer or a vinyl ether monomer, so that the epoxy resin adhesive has the characteristics of low viscosity, high reactivity and high crosslinking, the epoxy resin adhesive can rapidly react at the temperature of 120 ℃, and the heat resistance and the moisture resistance are further improved. The imidazole is a five-membered ring containing two nitrogen atoms, one nitrogen atom forms secondary amine, the other nitrogen atom forms tertiary amine, active hydrogen of secondary amine can be used for addition reaction of epoxy resin, and the epoxy resin can be cured by using the tertiary nitrogen atom as an anionic polymerization type curing agent like tertiary amine.
The honeycomb plates in batches can be stacked into a plurality of layers in the drying room, which is beneficial to the emission of hot air. Generally, in the prior art, a press is adopted in glue smearing of honeycomb plates to enable the honeycomb plates to be attached, but because the pressing area of the press is certain, the number of the honeycomb plates pressed at one time is limited, and the size specification of the honeycomb plates is limited. The drying step of the technical scheme is carried out in the drying room, batch semi-finished products or finished honeycomb plates can be dried at the same time, the one-time yield is far higher than that of a press, the investment of equipment is reduced, the time for producing the same number of honeycomb plates is shortened, the production efficiency is improved, and the production cost is reduced. And the size specification of the honeycomb panel is not limited and can be made according to actual requirements.
Specifically, the holding time in step 2) and step 4) was 1 hour.
The preparation method of the epoxy resin adhesive comprises the following steps:
i) adding waterborne epoxy resin into a planetary vacuum stirrer, adding waterborne epoxy resin and a diluent, keeping vacuum, stirring at a rotating speed of 200 +/-10 rpm until the mixture is uniformly mixed, and controlling the temperature to be 60-75 ℃;
II) setting the temperature of the circulating water bath at 30 +/-5 ℃, adding the inorganic filler after the temperature is reduced to 30 +/-5 ℃, continuously stirring in vacuum at the rotating speed of 200 +/-10 rpm until the mixture is uniformly mixed, and controlling the temperature to be 60-75 ℃ to obtain a component A;
III) mixing the waterborne epoxy curing agent with the imidazole curing accelerator, and stirring for 20-40 minutes in vacuum at the rotating speed of 300 +/-10 rpm to obtain a component B;
and IV) mixing the component A obtained in the step 2) with the component B obtained in the step 3), adjusting the rotating speed of a planetary vacuum mixer to be 50 +/-10 rpm, defoaming in vacuum for 10-20 minutes, filtering a screen mesh, and subpackaging to obtain the epoxy resin adhesive.
Specifically, the inorganic filler is added into the mixture for three times after the temperature is reduced to 30 ℃ in the step II).
Further, the inorganic filler comprises one or more of calcium carbonate, aluminum hydroxide, titanium dioxide and carbon black.
Still further, the water-based epoxy resin comprises one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol A type epoxy resin and aliphatic epoxy resin. Specifically, the above-mentioned aqueous epoxy resins are all aqueous epoxy resins having two functional groups. The above-mentioned epoxy resins are characterized by low viscosity, high Tg and high flexibility.
Further, the water-based epoxy curing agent comprises ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine and diethylaminopropylamine. Aliphatic polyamines such as ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, diethylaminopropylamine, etc. have high activity and can crosslink and cure the waterborne epoxy resin at room temperature.
Still further, the diluent is 3-ethyl-3-oxetanemethanol and/or 3-ethyl-3-epoxypropylmethyl acrylate.
Further, the method for preparing the epoxy resin adhesive in the steps 1) and 3) is smearing and/or spraying.
Still further, step (ii)1) And the coating amount of the epoxy resin adhesive in the step 3) is 1cm 2 0.4-0.6kg, and the coating area is the periphery of the upper plate layer and the lower plate layer which are respectively contacted with the honeycomb core layer.
Further, the coating area of the epoxy resin adhesive in the step 1) and the step 3) is the periphery of the upper plate layer and the lower plate layer which are respectively contacted with the honeycomb core layer.
Compared with the prior art, the invention has the beneficial effects that:
(1) The innovative epoxy resin adhesive is used for bonding the upper plate layer, the honeycomb core layer and the lower plate layer, the adhesive coating is not required to be spread by hands and scraped, and the extrusion is not required to be carried out by utilizing equipment, the epoxy resin adhesive can be automatically leveled, the epoxy resin adhesive can better play a bonding role at the temperature of 120 ℃, and the processing rate and the bonding quality are improved.
(2) The drying of the honeycomb plate is carried out in the drying room, so that the one-time yield of the honeycomb plate can be improved, the production time is shortened, the production efficiency is improved, and the production cost is reduced. And the size specification of the honeycomb panel is not limited and can be made according to actual needs.
Detailed Description
The present invention is further described below with reference to specific embodiments, and it should be noted that, without conflict, various embodiments or technical features described below may be arbitrarily combined to form a new embodiment.
Example 1
A quick-acting manufacturing method of a honeycomb plate comprises the following steps:
1) Bonding the upper panel layer with the upper layer of the honeycomb core layer by using an epoxy resin adhesive;
2) Placing the bonded upper plate layer and the honeycomb core layer into a drying room, drying at 120 ℃ and preserving heat for 1 hour;
3) Bonding the lower panel layer with the lower layer of the honeycomb core layer obtained in the step 2) through an epoxy resin adhesive;
4) Placing the bonded upper plate layer, lower plate layer and honeycomb core layer into a drying room, drying at 120 ℃ and preserving heat for 1 hour; wherein the viscosity of the epoxy resin adhesive is less than 200cP; the epoxy resin adhesive is composed of a component A and a component B, wherein the mass ratio of the component A to the component B is 100:25; the component A is prepared from the following components in percentage by weight of 6:4:1, the component B comprises 5:1 aqueous epoxy curing agent and imidazole curing accelerator.
In particular, the method of the epoxy resin adhesive in step 1) and step 3) is painting. The coating amount of the epoxy resin adhesive is 1cm 2 0.4kg, and the coating area is the periphery of the upper plate layer and the lower plate layer which are respectively contacted with the honeycomb core layer.
Wherein, the waterborne epoxy resin is hydrogenated bisphenol A epoxy resin, the inorganic filler is calcium carbonate, the waterborne epoxy curing agent is diethylaminopropylamine, the diluent is 3-ethyl-3-oxetanyl methanol, and the imidazole curing accelerator is 2-methylimidazole.
The preparation method of the epoxy resin adhesive comprises the following steps:
i) adding waterborne epoxy resin into a planetary vacuum stirrer, adding waterborne epoxy resin and a diluent, keeping vacuum, stirring at a rotating speed of 200rpm until the mixture is uniformly mixed, and controlling the temperature to be 60 ℃;
II) setting the temperature of the circulating water bath at 30 ℃, adding the inorganic filler for three times after the temperature is reduced to 30 ℃, continuously stirring in vacuum at the rotating speed of 200rpm until the inorganic filler is uniformly mixed, and controlling the temperature to be 60 ℃ to obtain a component A;
III) mixing the waterborne epoxy curing agent with the imidazole curing accelerator, and stirring for 40 minutes in vacuum at the rotating speed of 300rpm to obtain a component B;
and IV) mixing the component A obtained in the step 2) with the component B obtained in the step 3), adjusting the rotating speed of a planetary vacuum stirrer to 50pm, carrying out vacuum defoaming for 20 minutes, filtering a screen mesh, and then carrying out subpackaging to obtain the epoxy resin adhesive.
Example 2
A quick-acting manufacturing method of a honeycomb plate comprises the following steps:
1) Bonding the upper panel layer with the upper layer of the honeycomb core layer by using an epoxy resin adhesive;
2) Placing the bonded upper plate layer and the honeycomb core layer into a drying room, drying at 120 ℃ and preserving heat for 1 hour;
3) Bonding the lower panel layer with the lower layer of the honeycomb core layer obtained in the step 2) through an epoxy resin adhesive;
4) Placing the bonded upper plate layer, lower plate layer and honeycomb core layer into a drying room, drying at 120 ℃ and preserving heat for 1 hour; wherein the viscosity of the epoxy resin adhesive is less than 200cP; the epoxy resin adhesive consists of a component A and a component B, wherein the mass ratio of the component A to the component B is 100:30, of a nitrogen-containing gas; the component A is prepared from the following components in percentage by weight of 6:4:1, the component B comprises 5:1 aqueous epoxy curing agent and imidazole curing accelerator.
Particularly, the method for applying the epoxy resin adhesive in the steps 1) and 3) is spraying. The coating amount of the epoxy resin adhesive is 1cm 2 0.6kg, and the coating area is the periphery of the upper plate layer and the lower plate layer which are respectively contacted with the honeycomb core layer.
Wherein, the waterborne epoxy resin is bisphenol A epoxy resin, the inorganic filler is aluminum hydroxide, the waterborne epoxy curing agent is diethylenetriamine, the diluent is 3-ethyl-3-epoxypropyl methyl acrylate, and the imidazole curing accelerator is 1-cyanoethyl-2-ethyl-4-methylimidazole.
The preparation method of the epoxy resin adhesive comprises the following steps:
i) adding waterborne epoxy resin into a planetary vacuum stirrer, adding waterborne epoxy resin and a diluent, keeping vacuum, stirring at the rotating speed of 210rpm until the mixture is uniformly mixed, and controlling the temperature to be 75 ℃;
II) setting the temperature of the circulating water bath to be 35 ℃, adding the inorganic filler for three times after the temperature is reduced to 35 ℃, continuously stirring in vacuum at the rotating speed of 200 +/-10 rpm until the inorganic filler is uniformly mixed, and controlling the temperature to be 60-75 ℃ to obtain a component A;
III) mixing the waterborne epoxy curing agent with the imidazole curing accelerator, and stirring for 20 minutes in vacuum at the rotating speed of 310rpm to obtain a component B;
and IV) mixing the component A obtained in the step 2) with the component B obtained in the step 3), adjusting the rotating speed of a planetary vacuum stirrer to 60pm, carrying out vacuum defoaming for 10 minutes, filtering a screen mesh, and then carrying out subpackaging to obtain the epoxy resin adhesive.
Control group 1
A quick-acting manufacturing method of a honeycomb plate comprises the following steps:
1) Bonding the upper panel layer with the upper layer of the honeycomb core layer through white latex;
2) Placing the bonded upper plate layer and the honeycomb core layer into a drying room, drying at 120 ℃ and preserving heat for 1 hour;
3) Bonding the lower plate layer with the lower layer of the honeycomb core layer obtained in the step 2) through white latex;
4) And (3) placing the bonded upper plate layer, lower plate layer and honeycomb core layer into a drying room, drying at 120 ℃ and preserving heat for 1 hour.
In particular, the method of applying the white latex in the steps 1) and 3) is smearing. The coating amount of the white latex was 1cm 2 0.4kg, and the coating area is the periphery of the upper plate layer and the lower plate layer which are respectively contacted with the honeycomb core layer.
Adhesion test
The bonding force tests of examples 1-2 and control 1 were conducted to measure the plane tensile bonding strength, plane compressive strength, plane shear strength and peel strength of the honeycomb panel. (according to GJB130-1986 standard)
TABLE 1 adhesion parameters for examples 1-2 and control 1
As can be seen from Table 1, the plane tensile bond strength, the plane compressive strength, the plane shear strength and the peel strength of examples 1-2 are superior to those of the white latex, and the white latex requires manual leveling when being coated, while examples 1-2 do not require manual leveling and automatically level after being coated or sprayed on a honeycomb panel.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (7)
1. A quick-acting manufacturing method of a honeycomb plate comprises an upper plate layer, a lower plate layer and a honeycomb core layer arranged between the upper plate layer and the lower plate layer, and is characterized by comprising the following steps:
1) Bonding the lower layer of the upper panel layer with the upper layer of the honeycomb core layer by using an epoxy resin adhesive;
2) Placing the bonded upper plate layer and the honeycomb core layer into a drying room, drying at 120 ℃ and preserving heat;
3) Bonding the upper layer of the lower panel layer with the lower layer of the honeycomb core layer obtained in the step 2) through an epoxy resin adhesive; when the upper panel layer or the lower panel layer is in contact with the honeycomb core layer, extrusion is not needed, and the epoxy resin adhesive is automatically leveled;
4) Placing the bonded upper plate layer, lower plate layer and honeycomb core layer into a drying room, drying at 120 ℃ and preserving heat;
wherein the viscosity of the epoxy resin adhesive is less than 200cP; the epoxy resin adhesive is composed of a component A and a component B, wherein the mass ratio of the component A to the component B is 100:25-30; the component A is prepared from the following components in percentage by weight of 6:4:1, a water-based epoxy resin, an inorganic filler and a diluent; the component B is prepared from the following components in percentage by weight: 1, a water-based epoxy curing agent and an imidazole curing accelerator, wherein the imidazole curing accelerator comprises one or more of 2-methylimidazole, 2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 705 curing agent and 708 curing agent; the inorganic filler comprises one or more of calcium carbonate, aluminum hydroxide, titanium dioxide and carbon black; the waterborne epoxy resin comprises one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol A type epoxy resin and aliphatic epoxy resin; the water-based epoxy curing agent comprises ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylene tetramine and diethylaminopropylamine.
2. The method for rapidly manufacturing a honeycomb panel according to claim 1, wherein the heat-preserving time in step 2) and step 4) is 1 hour.
3. The quick-acting manufacturing method of the honeycomb plate as claimed in claim 1, wherein the preparation method of the epoxy resin adhesive comprises the following steps:
i) adding waterborne epoxy resin and a diluent into a planetary vacuum stirrer, keeping vacuum, stirring at a rotating speed of 200 +/-10 rpm until the mixture is uniformly mixed, and controlling the temperature to be 60-75 ℃;
II) setting the temperature of the circulating water bath at 30 +/-5 ℃, adding the inorganic filler after the temperature is reduced to 30 +/-5 ℃, continuously stirring in vacuum at the rotating speed of 200 +/-10 rpm until the mixture is uniformly mixed, and controlling the temperature to be 60-75 ℃ to obtain a component A;
III) mixing the waterborne epoxy curing agent with imidazole curing accelerator, and stirring for 20-40 minutes in vacuum at the rotating speed of 300 +/-10 rpm to obtain a component B;
and IV) mixing the component A obtained in the step 2) with the component B obtained in the step 3), adjusting the rotating speed of a planetary vacuum stirrer to be 50 +/-10 rpm, carrying out vacuum defoaming for 10-20 minutes, filtering a screen mesh, and then subpackaging to obtain the epoxy resin adhesive.
4. The method of claim 1, wherein the diluent is 3-ethyl-3-oxetanemethanol and/or 3-ethyl-3-epoxypropylmethyl acrylate.
5. The quick-acting manufacturing method of the honeycomb plate as set forth in claim 1, wherein the epoxy resin adhesive is applied by painting and/or spraying in the steps 1) and 3).
6. The method of claim 1, wherein the epoxy resin adhesive is applied in an amount of 0.4-0.6kg/cm in steps 1) and 3) 2 。
7. The method for rapidly manufacturing the honeycomb panel according to claim 1, wherein in the step 1) and the step 3), the epoxy resin adhesive is coated on the periphery of the upper panel layer and the lower panel layer which are respectively contacted with the honeycomb core layer.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103112202A (en) * | 2013-03-07 | 2013-05-22 | 辽阳艺蒙织毯有限公司 | Honeycomb core board |
| CN106281160A (en) * | 2016-08-08 | 2017-01-04 | 武汉新欣正源技术工程有限公司 | A kind of normal temperature cure flexible epoxy adhesive and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103112202A (en) * | 2013-03-07 | 2013-05-22 | 辽阳艺蒙织毯有限公司 | Honeycomb core board |
| CN106281160A (en) * | 2016-08-08 | 2017-01-04 | 武汉新欣正源技术工程有限公司 | A kind of normal temperature cure flexible epoxy adhesive and preparation method thereof |
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