CN110919201A - Laser rubber cutting machine for cutting rubber of PCB - Google Patents
Laser rubber cutting machine for cutting rubber of PCB Download PDFInfo
- Publication number
- CN110919201A CN110919201A CN201911173637.XA CN201911173637A CN110919201A CN 110919201 A CN110919201 A CN 110919201A CN 201911173637 A CN201911173637 A CN 201911173637A CN 110919201 A CN110919201 A CN 110919201A
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- China
- Prior art keywords
- pcb
- guide rail
- laser
- cutting
- plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention relates to a laser rubber cutting machine for cutting rubber of a PCB (printed circuit board), which belongs to the field of PCBs (printed circuit boards), and comprises a rack, wherein a first guide rail is arranged on the rack, and a transfer mechanism is movably arranged on the first guide rail; the transfer mechanism comprises a bottom plate movably arranged on the first guide rail, the bottom plate is in driving connection with a first driving mechanism arranged on the rack and used for driving the bottom plate to reciprocate along the first guide rail, brackets are arranged at the front end and the rear end of the bottom plate, a supporting plate for placing a PCB is arranged on each bracket, and a rotary lifting mechanism is further arranged on the rack; the frame is also provided with laser cutters which are positioned at the left side and the right side of the first guide rail. Compared with the method for cutting the adhesive tape on the PCB by using the cutting blade, the method for cutting the adhesive tape on the PCB by using the laser does not need to replace the blade, so that the cutting efficiency is increased, the condition that the adhesive cutting is not continuous can not occur, and the cutting quality and the cutting efficiency can be effectively increased.
Description
Technical Field
The invention relates to the field of PCBs, in particular to a laser rubber cutting machine for cutting rubber of PCBs.
Background
In the PCB industry, before a PCB drilling process, PIN is required to be punched on a PCB lamination, the edge of the PCB lamination is encapsulated, and after the drilling is finished, PIN removal, tapping and separation are required to be carried out on the PCB lamination. At present, rubber tapping equipment after a PCB is disassembled in the market is not stable, rubber tapping is performed in a blade cutting mode, and the service life of a blade is short, so that the blade needs to be replaced every 1 hour at ordinary times, four blades need to be replaced every time, and the time is about 15 minutes; the production efficiency is greatly reduced; in addition, the blade fixing seat adopts an elastic mechanism, so that the phenomenon of rubber tapping and cutting is easy to occur, the PCB is taken up and falls down in the subsequent board splitting process of the mechanical arm, equipment alarms, and normal operation is influenced.
Disclosure of Invention
Based on this, it is necessary to provide a laser rubber cutting machine for cutting rubber of a PCB, which includes a rack, wherein a first guide rail is arranged on the rack, and a transfer mechanism is movably arranged on the first guide rail; the transfer mechanism comprises a bottom plate movably arranged on the first guide rail, the bottom plate is in driving connection with a first driving mechanism arranged on the rack and used for driving the bottom plate to reciprocate along the first guide rail, brackets are arranged at the front end and the rear end of the bottom plate, a supporting plate for placing a PCB is arranged on each bracket, a rotary lifting mechanism is further arranged on the rack and arranged between the brackets at the front end and the rear end of the bottom plate; the frame is also provided with laser cutters which are positioned at the left side and the right side of the first guide rail.
The first driving mechanism can be a driving structure in the prior art such as a driving air cylinder, and the laser cutter is a carbon dioxide laser cutter.
When the PCB adhesive tape cutting machine is used, the first driving mechanism drives the transfer mechanism to move to the front end of the first guide rail, then the transfer mechanism of the equipment in the previous process places the PCB after PIN removal on the supporting plate on the transfer mechanism, then the transfer mechanism moves the PCB on the transfer mechanism to a position between the laser cutters on the rack, the laser cutters carry out laser cutting on the adhesive tape on the PCB, and in the cutting process, the transfer mechanism can horizontally move along the first guide rail so that the PCB can horizontally move along the first guide rail, and therefore the laser cutters can be guaranteed to cut all the adhesive tapes on one side of the PCB.
The support plates arranged on the supports at the front end and the rear end of the bottom plate are positioned on the same horizontal plane and are used for supporting the PCB together to enable the PCB to keep horizontal.
The tape on the PCB is cut by the laser, and compared with the method for cutting the tape by using a cutting blade, the method does not need to replace the blade, so that the cutting efficiency is increased; in addition, compared with a cutting blade installed by using an elastic cutter holder, the invention can not generate the condition of continuous tapping and cutting, thereby avoiding the condition that the PCB boards are still adhered together after the adhesive tape is cut, and effectively increasing the cutting quality and the cutting efficiency.
Furthermore, the rotary lifting mechanism comprises a base plate, the base plate is arranged on the bottom plate in a vertically movable mode through a first lifting cylinder, a lifting plate is arranged above the base plate, and the lifting plate is arranged on the base plate through a rotary cylinder.
Wherein, lift cylinder is used for promoting the base plate and reciprocates, and revolving cylinder is used for driving the jacking board and rotates, therefore rotatory elevating system can push away the PCB board of placing in the backup pad from the PCB board to rotate the PCB board 90, so that the laser cutting ware of first guide rail both sides can cut gluey processing to four limits of PCB board.
Furthermore, the supporting plate is arranged on the support through a second lifting cylinder.
The second lift cylinder is used for driving the supporting plate to move up and down, so that the height of the supporting plate is adjusted, the height of the PCB can be adjusted, the laser ejection position of the laser cutter is matched with the position of the adhesive tape on the PCB, and the accuracy of laser cutting is guaranteed.
Further, be located still be provided with the guide arm between the support at both ends around the bottom plate, the guide arm is fixed set up in on the support, movably be provided with first mounting panel on the guide arm, just first mounting panel through telescopic cylinder with leg joint, be provided with third lift cylinder on the first mounting panel, third lift cylinder is connected with the depression bar, the backup pad corresponds the depression bar is provided with long banding opening, the opening along the length direction of guide bar sets up, the depression bar extends up the opening just the upper end orientation of depression bar the inside bending type of first mounting panel sets up and forms the portion of compressing tightly.
The number of the guide rods is at least two, and the first mounting plate is movably arranged on the guide rods through linear bearings.
The utility model discloses a PCB board, including the guide bar, the depression bar, telescopic cylinder, the third lift cylinder, the telescopic cylinder pushes away first mounting panel and moves the side of depression bar and supports with the side of PCB board, then the third lift cylinder drives the depression bar and moves down, make the portion of compressing tightly on the surface of PCB board, can compress tightly the PCB board and fix in the backup pad this moment, prevent that the PCB board from taking place the displacement relative to the backup pad, and then improve laser cutting's precision.
Furthermore, a second guide rail is further arranged on the machine frame and is perpendicular to the first guide rail, the laser cutter is movably connected with the second guide rail through a sliding block, and the sliding block is in driving connection with a second driving mechanism arranged on the machine frame and used for driving the sliding block to reciprocate along the second guide rail.
The second driving mechanism can be a driving mechanism in the prior art such as a driving cylinder, and the second driving mechanism is used for driving the laser cutter to move on the second guide rail to be close to or far away from the first guide rail, so that the distance between the laser cutter and the PCB on the supporting plate can be adjusted, and further, the distance between the laser ejection position of the laser cutter and the distance between the adhesive tapes on the edge energy of the PCB can be kept consistent when the PCB with different specifications is subjected to adhesive cutting treatment, and therefore, the laser adhesive cutting machine can be suitable for the laser adhesive cutting operation of the PCB with different specifications.
Furthermore, a second mounting plate is further arranged on the sliding block, a plurality of guide wheels are rotatably arranged on one side, facing the first guide rail, of the second mounting groove, and the upper ends of the guide wheels are located on the same horizontal plane.
The upper end of the guide rail forms a supporting station for supporting the PCB, the guide rail on the guide rail is relatively fixed with the position of the laser cutter, so that the PCB can be placed on the supporting station formed by the guide wheels to fix the position of the PCB in the vertical direction relative to the laser cutter, the cutting precision can be improved, and the supporting station is formed by the guide wheels, so that the PCB can still horizontally move on the supporting station after being placed on the supporting station.
The step of placing the PCB on the supporting station comprises the following steps: firstly, the PCB is moved between two laser cutters on the support by the moving mechanism, then the PCB on the support plate is jacked up by the rotating and lifting mechanism, then the two laser cutters on the support move towards the PCB, so that the guide wheel moves to the lower part of the PCB, then the rotating and lifting mechanism descends, the two sides of the PCB are placed at the upper end of the guide wheel, then the PCB is pressed on the guide wheel by the pressing rod, and at the moment, the step of placing the PCB on the support station is completed. The PCB is clamped between the pressure rods at the front end and the rear end of the bottom plate by the pressure rods at the front end and the rear end of the bottom plate, so that the PCB is fixed on the transfer mechanism, and the transfer mechanism can drive the PCB to horizontally move along a supporting station formed by the guide wheels.
Wherein, still be provided with dust extraction on the mounting panel corresponding laser cutting ware, dust extraction is used for collecting the tiny particulate matter that produces when the laser cutting.
The principle and effect of the present invention will be further explained by combining the above technical scheme and the accompanying drawings:
the tape on the PCB is cut by the laser, and compared with the method for cutting the tape by using a cutting blade, the method does not need to replace the blade, so that the cutting efficiency is increased; in addition, compared with a cutting blade installed by using an elastic cutter holder, the invention can not generate the condition of continuous tapping and cutting, thereby avoiding the condition that the PCB boards are still adhered together after the adhesive tape is cut, and effectively increasing the cutting quality and the cutting efficiency.
Drawings
FIG. 1 is a schematic structural diagram of a laser rubber cutting machine for cutting rubber of a PCB according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a rotary lifting mechanism according to an embodiment of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 2;
fig. 4 is a schematic view of a connection structure between a laser cutter and a frame according to an embodiment of the present invention.
Description of reference numerals:
1-a rack, 11-a first guide rail, 12-a second guide rail, 121-a slider, 122-a second mounting plate, 1221-a guide wheel, 1222-a dust collector, 2-a rotary lifting mechanism, 21-a bottom plate, 22-a bracket, 221-a guide rod, 222-a support plate, 2221-an opening, 223-a second lifting cylinder, 23-a base plate, 24-a first lifting cylinder, 25-a rotary cylinder, 26-a first mounting plate, 261-a third lifting cylinder, 262-a pressure rod, 2621-a pressing part, 3-a laser cutter and 4-a PCB.
Detailed Description
For the convenience of understanding of those skilled in the art, the present invention will be described in further detail below with reference to the accompanying drawings and examples:
as shown in fig. 1-4, a laser rubber cutting machine for cutting rubber of a PCB comprises a frame 1, wherein a first guide rail 11 is arranged on the frame 1, and a transfer mechanism is movably arranged on the first guide rail 11; the transfer mechanism comprises a bottom plate 21 movably arranged on the first guide rail 11, the bottom plate 21 is in driving connection with a first driving mechanism arranged on the rack 1 and used for driving the bottom plate 21 to reciprocate along the first guide rail 11, brackets 22 are arranged at the front end and the rear end of the bottom plate 21, a support plate 222 used for placing a PCB 4 is arranged on each bracket 22, a rotary lifting mechanism 2 is further arranged on the rack 1, and the rotary lifting mechanism 2 is arranged between the brackets 22 at the front end and the rear end of the bottom plate 21; the machine frame 1 is also provided with laser cutters 3, and the laser cutters 3 are positioned on the left side and the right side of the first guide rail 11.
The first driving mechanism may be a driving mechanism of the prior art such as a driving cylinder, and the laser cutter 3 may be a carbon dioxide laser cutter.
When the invention is used, firstly, the first driving mechanism drives the transfer mechanism to move to the front end of the first guide rail 11, then the transfer mechanism of the equipment in the previous process places the PCB 4 after PIN removal on the support plate 222 on the transfer mechanism, then the transfer mechanism moves the PCB 4 on the transfer mechanism to a position between the laser cutters 3 on the rack 1, the laser cutters 3 carry out laser cutting on the adhesive tape on the PCB 4, and in the cutting process, the transfer mechanism can horizontally move along the first guide rail 11 so as to enable the PCB 4 to horizontally move along the first guide rail 11, thereby ensuring that the laser cutters 3 can cut all the adhesive tapes on one side of the PCB.
Wherein, the support plates 222 disposed on the brackets 22 at the front and rear ends of the base plate 21 are located on the same horizontal plane, and are used to jointly support the PCB 4 so as to keep the PCB 4 horizontal.
The tape on the PCB 4 is cut by the laser, and compared with the method for cutting the tape by using a cutting blade, the method does not need to replace the blade, so that the cutting efficiency is improved; in addition, compared with a cutting blade installed by using an elastic cutter holder, the invention can not generate the condition of continuous tapping and cutting, thereby avoiding the condition that the PCB boards 4 are still adhered together after the adhesive tape is cut, and effectively increasing the cutting quality and the cutting efficiency.
Further, the rotary lifting mechanism 2 includes a base plate 23, the base plate 23 is disposed on the bottom plate 21 by a first lifting cylinder 24 in a vertically movable manner, and a lifting plate is disposed above the base plate 23 and disposed on the base plate 23 by a rotary cylinder 25.
Wherein, lift cylinder is used for promoting base plate 23 and reciprocates, and revolving cylinder 25 is used for driving the jacking board and rotates, therefore rotatory elevating system 2 can push away PCB 4 of placing on backup pad 222 PCB 4 to rotate PCB 4 90 to make the laser cutting ware 3 of first guide rail 11 both sides can cut gluey processing to four limits of PCB 4.
Further, the support plate 222 is disposed on the support 22 by a second elevating cylinder 223.
The second lifting cylinder 223 is used for driving the supporting plate 222 to move up and down, so that the height of the supporting plate 222 is adjusted, the height of the PCB 4 can be adjusted, the laser emitting position of the laser cutter 3 is matched with the position of the adhesive tape on the PCB 4, and the accuracy of laser cutting is guaranteed.
Further, still be provided with the guide arm 221 between the support 22 that is located both ends around the bottom plate 21, the guide arm 221 is fixed set up in on the support 22, movably be provided with first mounting panel 26 on the guide arm 221, just first mounting panel 26 through telescopic cylinder with the support 22 is connected, be provided with third lift cylinder 261 on the first mounting panel 26, third lift cylinder 261 is connected with depression bar 262, the backup pad 222 corresponds depression bar 262 is provided with rectangular form opening 2221, opening 2221 along the length direction of guide arm 221 sets up, depression bar 262 extends up opening 2221 just the upper end of depression bar 262 is towards the inboard bending type of first mounting panel 26 forms clamping part 2621.
Wherein the number of the guide rods 221 is at least two, the first mounting plate 26 is movably disposed on the guide rods 221 through linear bearings.
The pressing rod 262 and the pressing portion 2621 on the pressing rod 262 are used for fixing the PCB 4 on the supporting plate 222, wherein the telescopic cylinder is used for driving the first mounting plate 26 to horizontally move on the guide rod 221, the third lifting cylinder 261 is used for driving the pressing rod 262 to move up and down, after the PCB 4 is placed on the supporting plate 222, the telescopic cylinder pushes the first mounting plate 26 to move towards the PCB 4 until the side surface of the pressing rod 262 abuts against the side edge of the PCB 4, then the third lifting cylinder 261 drives the pressing rod 262 to move down, so that the pressing portion 2621 is pressed on the surface of the PCB 4, at this time, the PCB 4 can be pressed and fixed on the supporting plate 222, the PCB 4 is prevented from being displaced relative to the supporting plate 222, and the precision of laser cutting is further improved.
Further, a second guide rail 12 is further disposed on the machine frame 1, the second guide rail 12 is perpendicular to the first guide rail 11, the laser cutter 3 is movably connected with the second guide rail 12 through a slider 121, and the slider 121 is in driving connection with a second driving mechanism disposed on the machine frame 1 to drive the slider 121 to reciprocate along the second guide rail 12.
The second driving mechanism can be a driving mechanism in the prior art such as a driving cylinder, and the second driving mechanism is used for driving the laser cutter 3 to move on the second guide rail 12 to be close to or far away from the first guide rail 11, so that the distance between the laser cutter 3 and the PCB 4 on the supporting plate 222 can be adjusted, and further, the distance between the laser emitting position of the laser cutter 3 and the distance between the adhesive tapes on the edge energy of the PCB 4 can be kept consistent when the adhesive cutting processing is carried out on the PCBs 4 with different specifications, and therefore, the laser adhesive cutting device can be suitable for the laser adhesive cutting operation of the PCBs 4 with different specifications.
Further, a second mounting plate 122 is further disposed on the sliding block 121, a plurality of guide wheels 1221 are rotatably disposed on one side of the second mounting groove facing the first guide rail 11, and the upper ends of the guide wheels 1221 are located on the same horizontal plane.
Wherein, the upper end of guide rail forms a support station for support PCB board 4, because the guide rail on the guide rail is relatively fixed with the position of laser cutter 3, consequently place PCB board 4 and can fix PCB board 4 for the ascending position in vertical direction of laser cutter 3 on the support station that the guide pulley 1221 formed, and then can improve cutting accuracy, and because the support station is formed by guide pulley 1221, consequently PCB board 4 is placing the back on the support station, PCB board 4 still can be on the support station horizontal migration.
The step of placing the PCB 4 on the support station is: firstly, the PCB 4 is moved between the two laser cutters 3 on the support 22 by the moving mechanism, then the PCB 4 on the support plate 222 is jacked up by the rotary lifting mechanism 2, then the two laser cutters 3 on the support 22 move towards the PCB 4, so that the guide wheel 1221 moves to the lower part of the PCB 4, then the rotary lifting mechanism 2 descends, the two sides of the PCB 4 are placed at the upper end of the guide wheel 1221, then the PCB 4 is pressed on the guide wheel 1221 by the pressing rod 262, and at this moment, the step of placing the PCB 4 on the support station is completed. Because the pressing rods 262 at the front and rear ends of the bottom plate 21 clamp the PCB 4 between the pressing rods 262 at the front and rear ends of the bottom plate 21, the PCB 4 is fixed on the transfer mechanism, and the transfer mechanism can drive the PCB 4 to move horizontally along the supporting station formed by the guide wheels 1221.
The mounting plate 122 is further provided with a dust collector 1222 corresponding to the laser cutter 3, and the dust collector 1222 is used for collecting fine particles generated during laser cutting.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. A laser rubber cutting machine for cutting rubber of a PCB is characterized by comprising a rack, wherein a first guide rail is arranged on the rack, and a transfer mechanism is movably arranged on the first guide rail; the transfer mechanism comprises a bottom plate movably arranged on the first guide rail, the bottom plate is in driving connection with a first driving mechanism arranged on the rack and used for driving the bottom plate to reciprocate along the first guide rail, brackets are arranged at the front end and the rear end of the bottom plate, a supporting plate for placing a PCB is arranged on each bracket, a rotary lifting mechanism is further arranged on the rack and arranged between the brackets at the front end and the rear end of the bottom plate; the frame is also provided with laser cutters which are positioned at the left side and the right side of the first guide rail.
2. The laser rubber cutting machine for PCB rubber cutting as claimed in claim 1, wherein the rotary lifting mechanism comprises a base plate, the base plate is arranged on the bottom plate in a manner of moving up and down through a first lifting cylinder, a lifting plate is arranged above the base plate, and the lifting plate is arranged on the base plate through a rotary cylinder.
3. The laser rubber cutting machine for PCB rubber cutting of claim 1, wherein the supporting plate is arranged on the bracket through a second lifting cylinder.
4. The laser rubber cutting machine for PCB rubber cutting as claimed in claim 3, wherein a guide rod is further arranged between the brackets at the front and rear ends of the bottom plate, the guide rod is fixedly arranged on the brackets, a first mounting plate is movably arranged on the guide rod, the first mounting plate is connected with the brackets through a telescopic cylinder, a third lifting cylinder is arranged on the first mounting plate, a pressing rod is connected with the third lifting cylinder, the supporting plate is provided with an elongated opening corresponding to the pressing rod, the opening is arranged along the length direction of the guide rod, the pressing rod extends upwards out of the opening, and the upper end of the pressing rod is bent towards the inner side of the first mounting plate to form a pressing part.
5. The laser rubber cutting machine for PCB rubber cutting as claimed in claim 1, wherein a second guide rail is further arranged on the rack, the second guide rail is arranged perpendicular to the first guide rail, the laser cutter is movably connected with the second guide rail through a slider, and the slider is in driving connection with a second driving mechanism arranged on the rack and used for driving the slider to reciprocate along the second guide rail.
6. A laser rubber cutting machine for PCB rubber cutting as claimed in claim 5, wherein a second mounting plate is further provided on the slider, a plurality of guide wheels are rotatably provided on one side of the second mounting plate facing the first guide rail, and upper ends of the guide wheels are located on the same horizontal plane.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911173637.XA CN110919201A (en) | 2019-11-26 | 2019-11-26 | Laser rubber cutting machine for cutting rubber of PCB |
| PCT/CN2019/123154 WO2021103083A1 (en) | 2019-11-26 | 2019-12-05 | Laser cutting machine for cutting adhesive tape on pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911173637.XA CN110919201A (en) | 2019-11-26 | 2019-11-26 | Laser rubber cutting machine for cutting rubber of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110919201A true CN110919201A (en) | 2020-03-27 |
Family
ID=69852060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911173637.XA Pending CN110919201A (en) | 2019-11-26 | 2019-11-26 | Laser rubber cutting machine for cutting rubber of PCB |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110919201A (en) |
| WO (1) | WO2021103083A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113877938A (en) * | 2021-10-20 | 2022-01-04 | 惠州市成泰自动化科技有限公司 | Full-automatic PIN removing method and device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201585202U (en) * | 2009-11-27 | 2010-09-15 | 深圳市大族激光科技股份有限公司 | Automatic laser tapping machine |
| CN101870039B (en) * | 2010-06-12 | 2014-01-22 | 中国电子科技集团公司第四十五研究所 | Double-workbench drive laser processing machine and processing method thereof |
| CN105479012A (en) * | 2015-12-25 | 2016-04-13 | 苏州爱能杰节能科技有限公司 | Laser marking device for automatic laser marking machine |
| CN207710103U (en) * | 2017-12-28 | 2018-08-10 | 鞍山盛雄激光设备有限公司 | A kind of high-accuracy CO2 laser cutting machines |
| CN208178716U (en) * | 2018-03-12 | 2018-12-04 | 深圳市前景自动化科技有限公司 | A kind of Novel PCB board laser cutting machine |
-
2019
- 2019-11-26 CN CN201911173637.XA patent/CN110919201A/en active Pending
- 2019-12-05 WO PCT/CN2019/123154 patent/WO2021103083A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113877938A (en) * | 2021-10-20 | 2022-01-04 | 惠州市成泰自动化科技有限公司 | Full-automatic PIN removing method and device |
| CN113877938B (en) * | 2021-10-20 | 2024-02-27 | 惠州市成泰自动化科技有限公司 | Full-automatic PIN disassembling method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021103083A1 (en) | 2021-06-03 |
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