CN110917841B - Waste gas treatment system used in electroplating process and working method thereof - Google Patents
Waste gas treatment system used in electroplating process and working method thereof Download PDFInfo
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- CN110917841B CN110917841B CN201911007488.XA CN201911007488A CN110917841B CN 110917841 B CN110917841 B CN 110917841B CN 201911007488 A CN201911007488 A CN 201911007488A CN 110917841 B CN110917841 B CN 110917841B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
- B01D53/75—Multi-step processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
- B01D53/77—Liquid phase processes
- B01D53/78—Liquid phase processes with gas-liquid contact
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
- B01D53/86—Catalytic processes
Abstract
The invention relates to a waste gas treatment system used in an electroplating process and a working method thereof, wherein the waste gas treatment system comprises the following steps: a processing chamber and a processor; the processing chamber comprises an air pumping module and a reaction module; the processing chamber is provided with an air guide port which penetrates through the processing chamber; the air extraction module comprises a circulating pump and an air extraction pipeline; a plurality of first air inlets are arranged on the air exhaust pipeline; an air exhaust inner pipeline is arranged in the air exhaust pipeline, the air exhaust pipeline is sleeved outside the air exhaust inner pipeline, and a second air inlet is formed in the air exhaust inner pipeline; the reaction module comprises a photochemical reaction device, an oxidation device and a catalyst layer; the catalyst layer is arranged on the second air inlet and used for covering the second air inlet, and the electroplating waste gas passes through the catalyst layer and reacts with the catalyst layer; the photochemical reaction device is arranged around the inner side of the second air inlet; the oxidation device is arranged in the air exhaust inner pipeline and comprises an oxidation spray head and a liquid conveying pipeline, and the oxidation spray head is connected with the processor.
Description
Technical Field
The invention relates to electroplating waste gas treatment, in particular to a waste gas treatment system used in an electroplating process and a working method thereof.
Background
Electroplating is a small but indispensable basic technological industry in national economy, and is also a heavily polluted industry, and waste gas, waste water and waste residues generated by electroplating seriously influence the life and health of people.
Various additives and complexes in the formula of the electroplating process solution are dazzling. In addition, at present, a few plating species can not eliminate cyanide in a short period, so that cyanide-containing electroplating still exists in electroplating of some special products. Especially, the increase of the acid and alkali dosage during the surface treatment and deplating before plating and the like, which finally still inevitably generates a large amount of waste gas in the electroplating production process. The main components are metal dust, acid-base waste gas, organic waste gas, chromic acid mist and various waste gases emitted by heating various electroplating bath solutions, including ammonia-containing waste gas, cyanogen-containing waste gas and the like.
At present, an exhaust system is installed to convey polluted waste gas to a gas purification system so as to achieve the purpose of removing toxic and harmful gases. In the treatment of acid waste gas, the main method for purifying the acid waste gas is to spray the acid waste gas with three-stage alkali liquor and discharge the acid waste gas through a chimney.
However, it cannot solve the problem of immediately treating the exhaust gas after extracting the exhaust gas, and if the exhaust gas overflows in the transmission process, the environment and the human safety in the environment will be affected.
Disclosure of Invention
The purpose of the invention is as follows:
in view of the problems mentioned in the background art, the present invention provides an exhaust gas treatment system for use in an electroplating process and a method for operating the same.
The technical scheme is as follows:
an effluent treatment system for use in an electroplating process, comprising: the device comprises a processing chamber, a processor, an air pumping module and a reaction module; the processing chamber is provided with an air guide port which penetrates through the processing chamber;
the air extraction module comprises a circulating pump and an air extraction pipeline; the air exhaust pipeline is arranged on the outer side of the processing chamber and is connected with the circulating pump, and the circulating pump is connected with the processor; the processor outputs an opening signal or a closing signal to the circulating pump, and the circulating pump is opened or closed according to an instruction of the processor; the circulating pump pumps electroplating waste gas through the air pumping pipeline;
the air extraction pipeline is provided with a plurality of first air inlets, the first air inlets are uniformly distributed on one side of the air extraction pipeline, and the first air inlets are used for the entry of electroplating waste gas;
an air exhaust inner pipeline is arranged in the air exhaust pipeline, the air exhaust pipeline is sleeved outside the air exhaust inner pipeline, a second air inlet is arranged on the air exhaust inner pipeline, and the position of the second air inlet is not corresponding to that of the first air inlet;
the reaction module comprises a photochemical reaction device, an oxidation device and a catalyst layer;
the catalyst layer is arranged on the second air inlet and used for covering the second air inlet, and the electroplating waste gas passes through the catalyst layer and reacts with the catalyst layer; the photochemical reaction device is arranged around the inner side of the second air inlet and used for providing illumination for the catalyst layer to promote the reaction of the catalyst layer and electroplating waste gas;
the oxidation device is arranged in the air exhaust inner pipeline and comprises an oxidation spray head and a liquid conveying pipeline, the liquid conveying pipeline is connected with an oxidant storage tank, the liquid conveying pipeline outputs oxidant in the oxidant storage tank to the oxidation spray head, and the oxidation spray head sprays the oxidant into the air exhaust inner pipeline; the oxidation sprayer is connected with the processor, the processor outputs an opening signal or a closing signal to the oxidation sprayer, and the oxidation sprayer executes opening or closing operation according to an instruction of the processor.
As a preferred mode of the present invention, the processing chamber includes a processing module therein, the processing module includes a reaction tank and a vent pipe, the internal pumping pipeline is communicated with the vent pipe, and the vent pipe is communicated with the reaction tank; the reaction tank is internally stored with a reaction medicament, and the reaction medicament is used for reacting with electroplating waste gas.
As a preferable mode of the present invention, the reaction tank includes at least two reaction tanks, and a monitoring device is disposed in the reaction tank and connected to the processor;
the number of the vent pipes corresponds to that of the reaction tanks one by one, and the air exhaust inner pipeline is communicated with only one vent pipe at the same time; a switching device is arranged at the joint of the vent pipe and the air exhaust inner pipeline and is used for switching the connection of the air exhaust inner pipeline and different vent pipes;
the monitoring device outputs the concentration of the reaction medicament to the processor, if the concentration is lower than a preset concentration threshold value, the processor outputs a switching signal to the switching device, and the switching device switches the vent pipe connected with the air exhaust inner pipeline.
As a preferred mode of the invention, an updating module is arranged in the reaction tank, the updating module comprises a water suction pump, a water suction port and a water diversion pipe, the water suction pump is connected with the processor, the water suction port is arranged at the bottom of the reaction tank, the water diversion pipe is connected with the water suction port, and the water suction pump sucks out the solution in the reaction tank through the water diversion pipe;
and if the concentration of the solution monitored by the monitoring device is lower than a preset concentration threshold value, the processor outputs a starting signal to the water suction pump, and the water suction pump is started and extracts the solution in the reaction tank.
As a preferred mode of the present invention, a recovery module is disposed in the air exhaust pipeline, and the recovery module includes a sealing layer, a recovery port, and a drainage tube; the closed layer is arranged at the bottom of the air exhaust pipeline and used for closing the bottom of the air exhaust pipeline, the recovery port is arranged on the closed layer and used for collecting liquid in the air exhaust pipeline; the drainage tube is arranged in the closed layer, and the drainage tube leads out liquid in the closed layer to a waste liquid collecting position.
A method of operating an exhaust gas treatment system for use in an electroplating process, comprising the steps of:
the processor outputs a starting signal to the circulating pump, the circulating pump is started, and the circulating pump extracts electroplating waste gas from the air extraction pipeline;
the processor outputs a starting signal to the photochemical reaction device, the photochemical reaction device is started, and light irradiation is output to the catalyst layer;
the processor outputs a starting signal to the oxidation nozzle, the oxidation nozzle is started, and the oxidation nozzle sprays oxidant into the air exhaust pipeline.
The method comprises the following steps:
the monitoring device monitors the concentration of the solution in the reaction tank, generates a concentration value and outputs the concentration value to the processor;
the processor receives the real-time concentration value and compares the real-time concentration value with a preset concentration threshold value;
if the concentration value is lower than the preset concentration threshold value, the processor outputs a switching signal to the switching device;
the switching device switches the vent pipe connected with the air exhaust inner pipeline.
As a preferred embodiment of the present invention, if the concentration value is lower than the preset concentration threshold, the method further includes the following steps:
the processor outputs a starting signal to the water pump, and the water pump is started;
the water pump pumps the solution in the reaction tank through the water pumping port and the water conduit.
The invention realizes the following beneficial effects:
the electroplating waste gas is extracted and treated through the air extraction module and the reaction module. The photochemical reaction device is combined with the catalyst layer to improve the treatment efficiency of the electroplating waste gas, the treatment range of the electroplating waste gas is enlarged, the oxidation device is matched, the electroplating waste gas is extracted into the air exhaust pipeline and then is treated in real time, and the treatment efficiency is improved. The reaction tank in the treatment chamber prolongs the reaction time of the electroplating waste gas, avoids incomplete reaction of the electroplating waste gas and avoids environmental pollution caused by discharge.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a schematic view of an exhaust gas treatment system for use in an electroplating process according to the present invention;
FIG. 2 is a schematic view of an exhaust line of an exhaust gas treatment system for use in an electroplating process according to the present invention;
FIG. 3 is a schematic cross-sectional view of an exhaust line of an exhaust gas treatment system for use in an electroplating process according to the present invention;
FIG. 4 is a schematic cross-sectional view of an exhaust treatment system for use in an electroplating process according to the present invention;
FIG. 5 is a schematic view of a switching device for an exhaust gas treatment system used in an electroplating process according to the present invention;
FIG. 6 is a schematic view of a processing chamber of an exhaust treatment system for use in an electroplating process according to the present invention.
1. The device comprises a processing chamber, 2, an air exhaust pipeline, 21, a first air inlet, 3, an air exhaust inner pipeline, 31, a second air inlet, 32, a catalyst layer, 33, a photochemical reaction device, 34, an oxidation spray head, 4, a vent pipe, 5, a reaction tank and 6, a switching device.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example one
Reference is made to fig. 1-4 for example.
An effluent treatment system for use in an electroplating process, comprising: a processing chamber (1) and a processor.
The exhaust gas treatment system also comprises an air extraction module and a reaction module. The processing chamber is provided with an air guide port which penetrates through the processing chamber.
The air extraction module comprises a circulating pump and an air extraction pipeline 2. The air exhaust pipeline 2 is arranged on the outer side of the processing chamber, the air exhaust pipeline 2 is connected with the circulating pump, and the circulating pump is connected with the processor. The processor outputs an opening signal or a closing signal to the circulating pump, and the circulating pump is opened or closed according to an instruction of the processor. The circulating pump pumps electroplating waste gas through the air pumping pipeline 2.
The circulating pump is connected with air exhaust pipeline 2, and air exhaust pipeline 2 distributes in electroplating the environment, if there are a plurality of plating baths, then air exhaust pipeline 2 encircles the plating bath setting, improves electroplating waste gas's suction efficiency, avoids electroplating waste gas to disperse in the production environment.
The circulating pump can set up at least two wind-forces that improve the extraction to and avoid the mechanical fault of circulating pump to cause and can not extract electroplating waste gas.
A plurality of first air inlets 21 are arranged on the air exhaust pipeline 2, the first air inlets 21 are uniformly distributed on one side of the air exhaust pipeline 2, and the first air inlets 21 are used for allowing electroplating waste gas to enter.
The first air inlet 21 is disposed on the top or the side of the air exhaust duct 2, and if there is a plating tank, the first air inlet 21 faces the plating tank, and the plating waste gas is extracted.
An inner air exhaust pipeline 3 is arranged in the air exhaust pipeline 2, the air exhaust pipeline 2 is sleeved outside the inner air exhaust pipeline 3, a second air inlet 31 is arranged on the inner air exhaust pipeline 3, and the position of the second air inlet 31 is not corresponding to that of the first air inlet 21.
The inner air exhaust pipeline 3 is sleeved in the air exhaust pipeline 2, and the diameter of the inner air exhaust pipeline 3 is smaller than that of the air exhaust pipeline 2. The position of the second air inlet 31 can be arranged at the bottom or the side of the exhaust inner pipe 3, and the first air inlet 21 and the second air inlet 31 are not at the same corresponding position.
The reaction module comprises a photochemical reaction device 33, an oxidation device and a catalyst layer 32.
The catalyst layer 32 is disposed on the second air inlet 31, the catalyst layer 32 is used for covering the second air inlet 31, and the electroplating waste gas passes through the catalyst layer 32 and reacts with the catalyst layer 32. The photochemical reaction device 33 is disposed around the inner side of the second gas inlet 31, and the photochemical reaction device 33 is used for providing light to the catalyst layer 32 to promote the reaction between the catalyst layer 32 and the electroplating waste gas.
The catalyst layer 32 may be a dielectric layer containing a reactive material, and the catalyst layer 32 is capable of decomposing and contacting the plating waste gas after receiving the irradiation of the photo-chemical reaction device 33. The catalyst layer 32 can be replaced after being worn.
The photochemical reaction device 33 may be an ultraviolet lamp or an irradiation lamp of a specific wavelength.
The oxidation device is arranged in the exhaust inner pipeline 3, the oxidation device comprises an oxidation spray head 34 and a liquid conveying pipeline, the liquid conveying pipeline is connected with an oxidant storage tank, the liquid conveying pipeline outputs oxidant in the oxidant storage tank to the oxidation spray head 34, and the oxidation spray head 34 sprays the oxidant into the exhaust inner pipeline 3. The oxidation nozzle 34 is connected to the processor, the processor outputs an opening signal or a closing signal to the oxidation nozzle 34, and the oxidation nozzle 34 performs an opening or closing operation according to an instruction of the processor.
The oxidizer storage tank may store an oxidizer, which may be an alkaline substance, for neutralizing the plating off-gas. The oxidizing nozzle 34 sprays an oxidizing agent into the exhaust duct 2 to react with the plating waste gas that has come into contact therewith.
The processor outputs a starting signal to the circulating pump, the circulating pump is started, and the circulating pump extracts electroplating waste gas from the air extraction pipeline 2.
The processor outputs an on signal to the photochemical reaction device 33, and the photochemical reaction device 33 is turned on to output light to the catalyst layer 32.
The processor outputs an opening signal to the oxidation nozzle 34, the oxidation nozzle 34 is opened, and the oxidation nozzle 34 sprays the oxidant into the air exhaust pipeline 2.
Example two
Reference is made to fig. 5-6 for example.
The present embodiment is substantially the same as the previous embodiments, except that, as a preferred mode of the present embodiment, the processing chamber 1 includes a processing module, the processing module includes a reaction chamber 5 and a vent pipe 4, the pumping inner pipe 3 is communicated with the vent pipe 4, and the vent pipe 4 is communicated with the reaction chamber 5. The reaction tank 5 stores a reaction agent for reacting with the electroplating waste gas.
The electroplating waste gas in the pumping inner pipeline 3 is output to the vent pipe 4, and the vent pipe 4 introduces the electroplating waste gas into the reaction tank 5. The plating waste gas reacts with the solution in the reaction cell 5.
As a preferable mode of this embodiment, the reaction tank 5 includes at least two reaction tanks, and a monitoring device is disposed in the reaction tank 5, and the monitoring device is connected to the processor.
The monitoring device can be a pH value monitor or an ion concentration monitor, and the solubility of the solution is monitored by monitoring specified components in the solution.
The number of the vent pipes 4 corresponds to that of the reaction tanks 5, and the air exhaust inner pipeline 3 is communicated with only one vent pipe 4 at the same time. A switching device 6 is arranged at the joint of the air pipe 4 and the air exhaust inner pipeline 3, and the switching device 6 is used for switching the connection of the air exhaust inner pipeline 3 and different air pipes 4.
The switching device 6 can be a three-way valve or a multi-way valve which can switch the communicated pipelines.
The monitoring device outputs the concentration of the reaction medicament to the processor, if the concentration is lower than a preset concentration threshold value, the processor outputs a switching signal to the switching device 6, and the switching device 6 switches the vent pipe 4 connected with the air exhaust inner pipeline 3.
The preset concentration threshold value can be set according to the type of the solution, the effective substances in the solution are consumed after the solution reacts with the electroplating waste gas, and the concentration of the effective substances in the solution can be obtained by monitoring the concentration of the effective substances. If the concentration is lower than the preset concentration threshold, the solution in the reaction tank 5 needs to be replaced.
The monitoring device monitors the concentration of the solution in the reaction tank 5, generates a concentration value and outputs the concentration value to the processor.
The processor receives the real-time concentration value and compares the real-time concentration value with a preset concentration threshold value.
If the concentration value is lower than the preset concentration threshold value, the processor outputs a switching signal to the switching device 6.
The switching device 6 switches the air pipe 4 connected with the air exhaust inner pipeline 3.
As an optimal mode of this embodiment, be provided with the update module in the reaction tank 5, the update module includes the suction pump, draws water mouthful, leading water pipe, the suction pump with the treater is connected, draw water mouthful set up in the bottom of reaction tank 5, the leading water pipe with draw water mouthful and connect, the suction pump passes through the leading water pipe is extracted the solution in with reaction tank 5.
And if the concentration of the solution monitored by the monitoring device is lower than a preset concentration threshold value, the processor outputs a starting signal to the water suction pump, and the water suction pump is started and extracts the solution in the reaction tank 5.
The monitoring device monitors the concentration of the solution in the reaction tank 5, generates a concentration value and outputs the concentration value to the processor.
The processor receives the real-time concentration value and compares the real-time concentration value with a preset concentration threshold value.
If the concentration value is lower than the preset concentration threshold value, the processor outputs a starting signal to the water suction pump, and the water suction pump is started.
The water pump pumps the solution in the reaction tank 5 through the water pumping port and the water conduit.
EXAMPLE III
The present embodiment is substantially the same as the above embodiments, except that, as a preferable mode of the present embodiment, a recycling module is disposed in the air exhaust duct 2, and the recycling module includes a sealing layer, a recycling port, and a drainage tube. The sealing layer is arranged at the bottom of the air exhaust pipeline 2 and used for sealing the bottom of the air exhaust pipeline 2, the recovery port is arranged on the sealing layer and used for collecting liquid in the air exhaust pipeline 2. The drainage tube is arranged in the closed layer, and the drainage tube leads out liquid in the closed layer to a waste liquid collecting position.
The seal coat is used for separating liquid and electroplating waste gas, and the recovery mouth is used for the infiltration of liquid, and the drainage tube is embedded in exhaust duct 2 and is carried out the drainage to liquid.
Example four
A method of operating an exhaust gas treatment system for use in an electroplating process, comprising the steps of:
the processor outputs a starting signal to the circulating pump, the circulating pump is started, and the circulating pump extracts electroplating waste gas from the air extraction pipeline 2.
The processor outputs an on signal to the photochemical reaction device 33, and the photochemical reaction device 33 is turned on to output light to the catalyst layer 32.
The processor outputs an opening signal to the oxidation nozzle 34, the oxidation nozzle 34 is opened, and the oxidation nozzle 34 sprays the oxidant into the air exhaust pipeline 2.
As a preferable mode of the present embodiment, the method includes the steps of:
the monitoring device monitors the concentration of the solution in the reaction tank 5, generates a concentration value and outputs the concentration value to the processor.
The processor receives the real-time concentration value and compares the real-time concentration value with a preset concentration threshold value.
If the concentration value is lower than the preset concentration threshold value, the processor outputs a switching signal to the switching device 6.
The switching device 6 switches the air pipe 4 connected with the air exhaust inner pipeline 3.
As a preferable mode of this embodiment, if the concentration value is lower than the preset concentration threshold, the method further includes the following steps:
the processor outputs a starting signal to the water suction pump, and the water suction pump is started.
The water pump pumps the solution in the reaction tank 5 through the water pumping port and the water conduit.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and are intended to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (7)
1. An effluent treatment system for use in an electroplating process, comprising: the device comprises a processing chamber (1), a processor, an air pumping module and a reaction module; the treatment chamber (1) is provided with an air guide port which penetrates through the treatment chamber (1);
the air extraction module comprises a circulating pump and an air extraction pipeline (2); the air exhaust pipeline (2) is arranged on the outer side of the processing chamber, the air exhaust pipeline (2) is connected with the circulating pump, and the circulating pump is connected with the processor; the processor outputs an opening signal or a closing signal to the circulating pump, and the circulating pump is opened or closed according to an instruction of the processor; the circulating pump pumps electroplating waste gas through the air pumping pipeline (2);
the air extraction pipeline (2) is provided with a plurality of first air inlets (21), the first air inlets (21) are uniformly distributed on one side of the air extraction pipeline (2), and the first air inlets (21) are used for allowing electroplating waste gas to enter;
an air exhaust inner pipeline (3) is arranged in the air exhaust pipeline (2), the air exhaust pipeline (2) is sleeved outside the air exhaust inner pipeline (3), a second air inlet (31) is arranged on the air exhaust inner pipeline (3), and the position of the second air inlet (31) is not corresponding to that of the first air inlet (21);
the reaction module comprises a photochemical reaction device (33), an oxidation device and a catalyst layer (32);
the catalyst layer (32) is arranged on the second air inlet (31), the catalyst layer (32) is used for covering the second air inlet (31), and the electroplating waste gas passes through the catalyst layer (32) and reacts with the catalyst layer (32); the photochemical reaction device (33) is arranged around the inner side of the second air inlet (31), and the photochemical reaction device (33) is used for providing light for the catalyst layer (32) to promote the reaction of the catalyst layer (32) and electroplating waste gas;
the oxidation device is arranged in the air exhaust inner pipeline (3), the oxidation device comprises an oxidation spray head (34) and a liquid conveying pipeline, the liquid conveying pipeline is connected with an oxidant storage tank, the liquid conveying pipeline outputs oxidant in the oxidant storage tank to the oxidation spray head (34), and the oxidation spray head (34) sprays the oxidant into the air exhaust inner pipeline (3); the oxidation spray head (34) is connected with the processor, the processor outputs an opening signal or a closing signal to the oxidation spray head (34), and the oxidation spray head (34) executes opening or closing operation according to an instruction of the processor;
the processing chamber (1) comprises a processing module, the processing module comprises a reaction tank (5) and a vent pipe (4), the air pumping inner pipeline (3) is communicated with the vent pipe (4), and the vent pipe (4) is communicated with the reaction tank (5); and a reaction medicament is stored in the reaction tank (5), and is used for reacting with the electroplating waste gas.
2. The waste gas treatment system for the electroplating process according to claim 1, wherein the reaction tank (5) comprises at least two reaction tanks, and a monitoring device is arranged in the reaction tank (5) and connected with the processor;
the number of the vent pipes (4) corresponds to that of the reaction tanks (5) one by one, and the air exhaust inner pipeline (3) is communicated with only one vent pipe (4) at the same time; a switching device (6) is arranged at the joint of the vent pipe (4) and the air exhaust inner pipeline (3), and the switching device (6) is used for switching the connection of the air exhaust inner pipeline (3) and different vent pipes (4);
the monitoring device outputs the concentration of the reaction medicament to the processor, if the concentration is lower than a preset concentration threshold value, the processor outputs a switching signal to the switching device (6), and the switching device (6) switches the vent pipe (4) connected with the air exhaust inner pipeline (3).
3. The waste gas treatment system for the electroplating process according to claim 2, wherein an updating module is arranged in the reaction tank (5), the updating module comprises a water suction pump, a water suction port and a water conduit, the water suction pump is connected with the processor, the water suction port is arranged at the bottom of the reaction tank (5), the water conduit is connected with the water suction port, and the water suction pump extracts the solution in the reaction tank (5) through the water conduit;
if the concentration of the solution monitored by the monitoring device is lower than a preset concentration threshold value, the processor outputs a starting signal to the water suction pump, and the water suction pump is started and extracts the solution in the reaction tank (5).
4. The waste gas treatment system for the electroplating process according to claim 3, wherein a recovery module is arranged in the air exhaust pipeline (2), and the recovery module comprises a closed layer, a recovery port and a drainage pipe; the closed layer is arranged at the bottom of the air extraction pipeline (2), the closed layer is used for closing the bottom of the air extraction pipeline (2), the recovery port is arranged on the closed layer, and the recovery port is used for collecting liquid in the air extraction pipeline (2); the drainage tube is arranged in the closed layer, and the drainage tube leads out liquid in the closed layer to a waste liquid collecting position.
5. The method of claim 4, comprising the steps of:
the processor outputs a starting signal to the circulating pump, the circulating pump is started, and the circulating pump extracts electroplating waste gas from the air extraction pipeline (2);
the processor outputs a starting signal to the photochemical reaction device (33), the photochemical reaction device (33) is started, and light irradiation is output to the catalyst layer (32);
the processor outputs an opening signal to the oxidation spray nozzle (34), the oxidation spray nozzle (34) is opened, and the oxidation spray nozzle (34) sprays an oxidant into the air exhaust pipeline (2).
6. The method of claim 5, further comprising the steps of:
the monitoring device monitors the concentration of the solution in the reaction tank (5), generates a concentration value and outputs the concentration value to the processor;
the processor receives the real-time concentration value and compares the real-time concentration value with a preset concentration threshold value;
if the concentration value is lower than the preset concentration threshold value, the processor outputs a switching signal to the switching device (6);
the switching device (6) switches the vent pipe (4) connected with the air exhaust inner pipeline (3).
7. The method as claimed in claim 6, further comprising the step of, if the concentration value is lower than the predetermined concentration threshold value:
the processor outputs a starting signal to the water pump, and the water pump is started;
the water pump pumps the solution in the reaction tank (5) through the water pumping port and the water conduit.
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| CN202666658U (en) * | 2012-05-08 | 2013-01-16 | 张士昱 | Round pipe type wet separator with gas absorbed |
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| CN207179921U (en) * | 2017-06-08 | 2018-04-03 | 天津市管道工程集团有限公司 | A kind of discharge duct that may filter that cleaning |
| CN206996215U (en) * | 2017-07-12 | 2018-02-13 | 重庆第二师范学院 | Chemically react exhaust gas treating device |
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| CN110302670B (en) * | 2019-07-29 | 2021-10-22 | 平顶山瑞平石龙水泥有限公司 | High temperature industry flue gas desulfurization denitration treatment device |
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Effective date of registration: 20210902 Address after: 236300 Funan County Industrial Park in Fuyang, Anhui Applicant after: Anhui Hongyuan electroplating surface treatment Co.,Ltd. Address before: 215400 room 402, building 58, Dexing first village, Taicang City, Suzhou City, Jiangsu Province Applicant before: Jin Chi |
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