CN110913585B - Circuit board prepreg stacking alignment jig - Google Patents
Circuit board prepreg stacking alignment jig Download PDFInfo
- Publication number
- CN110913585B CN110913585B CN201911062108.2A CN201911062108A CN110913585B CN 110913585 B CN110913585 B CN 110913585B CN 201911062108 A CN201911062108 A CN 201911062108A CN 110913585 B CN110913585 B CN 110913585B
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- China
- Prior art keywords
- plate
- strip
- bearing
- middle plate
- bottom plate
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- 230000009471 action Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a circuit board prepreg stacking pair Ji Zhi which comprises a carrier plate inclined plane, a groove and a base, wherein the groove is arranged on two adjacent edges of the carrier plate inclined plane, and the bottom of the groove is vertical to the carrier plate inclined plane; two angles of the inclined surface of the bearing plate adjacent to the vertical groove are triangle unfilled angles, and the inclined surface of the bearing plate is arranged on the base. The base is divided into a middle plate, a bottom plate and a bracket, the inclined surface of the bearing plate is movably connected with a strip-shaped block arranged on the middle plate, the strip-shaped block deviates from the central line of the middle plate, and two or more torsion springs are further arranged on the strip-shaped block in the direction close to the central line of the middle plate; the middle plate is movably connected with a strip-shaped block arranged on the bottom plate, the strip-shaped block is offset from the central line of the bottom plate, and two or more torsion springs are further arranged on the strip-shaped block in the direction close to the central line of the bottom plate; the middle plate bar block is mutually perpendicular to the bottom plate bar block; the bottom plate is fixed on the bracket. The invention has simple structure, reasonable design and convenient use, and can be used for quickly and automatically aligning the prepregs of the multilayer circuit board.
Description
Technical Field
The invention relates to the field of PCB processing and manufacturing, in particular to a circuit board prepreg stacking pair Ji Zhi used in the circuit board processing process.
Background
In the production process of the multilayer circuit board, the lamination process needs to use a dielectric layer, namely a prepreg, and the material is very thin and basically below 0.15mm thick, and the lamination process of the high-level circuit board, particularly the riveting process of the circuit inner layer laminate and the dielectric layer, is realized through rivet riveting, so that interlayer offset can not occur in the hot pressing and the process. After the prepreg is cut to the processing size, the prepreg is pre-drilled to accommodate rivets, and the current method is to align a stack of prepregs with the thickness of about 20mm and then lay the aligned prepregs on the table top of the numerical control drilling machine.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a circuit board prepreg stacking pair Ji Zhi which has the advantages of simple structure, reasonable design and convenience in use and can automatically align circuit board prepregs.
The technical scheme adopted by the invention is that the circuit board prepreg stacking pair Ji Zhi comprises a carrier plate inclined plane, a groove and a base, wherein the groove is arranged on two adjacent edges of the carrier plate inclined plane, and the bottom of the groove is vertical to the carrier plate inclined plane; two angles of the inclined surface of the bearing plate adjacent to the vertical groove are triangular unfilled angles, and the inclined surface of the bearing plate is arranged on the base;
The base is divided into a middle plate, a bottom plate and a bracket, the inclined surface of the bearing plate is movably connected with a strip block arranged on the middle plate, the strip block deviates from the central line of the middle plate, two or more torsion springs are further arranged on the strip block in the direction close to the central line of the middle plate, and the inclined surface of the bearing plate is horizontal when no bearing object is ensured under the action of the torsion springs; the middle plate is movably connected with a strip-shaped block arranged on the bottom plate, the strip-shaped block is offset from the central line of the bottom plate, two or more torsion springs are further arranged on the strip-shaped block in the direction close to the central line of the bottom plate, and the bottom plate is horizontal when no bearing object is ensured under the action of the torsion springs; the strip-shaped blocks on the middle plate are mutually perpendicular to the strip-shaped blocks on the bottom plate; the bottom plate is fixed on the bracket; the strip-shaped blocks on the middle plate are welded with the middle plate.
The movable connection between the bearing inclined plane and the strip-shaped block on the middle plate and between the middle plate and the strip-shaped block on the bottom plate is hinge connection or hinge connection.
The bearing force of the torsion spring bearing the inclined surface of the bearing plate is smaller than that of the torsion spring bearing the middle plate.
When all the torsion springs bear the same force, the number of the torsion springs bearing the inclined plane of the bearing plate is smaller than that of the torsion springs bearing the middle plate.
The support comprises three mutually perpendicular surfaces which are combined together, wherein the bottom surface is matched with the triangular unfilled corner on the inclined surface of the carrier plate.
Compared with the prior art, the invention has the beneficial effects that: the grooves are arranged at the two adjacent ends of the inclined surface of the carrier plate, and the grooves are perpendicular to the inclined surface of the carrier plate, so that the smooth circuit board prepreg can be aligned in two directions, and the alignment is quick and simple. Furthermore, by adding the torsion spring at the non-central line position of the inclined surface of the carrier plate, the carrier plate can keep horizontal when the prepreg is carried, and incline towards the central line direction when the prepreg is carried, so that the carrier plate is flush in one direction; meanwhile, a plurality of groups of torsion springs are additionally arranged at the non-central line position of the middle plate, and the bearing inclined plane can be inclined again after being inclined. Reaching the level of the other direction. The torsion springs arranged on the middle plate and the bottom plate bear different forces or numbers, and the time for tilting is also sequential, so that the two directions are flush no matter what the sequential order is.
The angle support is added, so that the circuit board curing sheet can be supported after being leveled, and the circuit board curing sheet cannot be displaced again;
In conclusion, the multi-layer circuit board prepreg has the advantages of simple structure, reasonable design and convenience in use, and can be aligned rapidly and automatically.
Drawings
The invention is described in further detail below in connection with the embodiments in the drawings, but is not to be construed as limiting the invention in any way.
Fig. 1 is a schematic side view of the present invention.
Fig. 2 is a right-side view of the present invention.
FIG. 3 is a schematic view of the inclined surface structure of the carrier plate according to the present invention.
Reference numerals: 1. a groove; 2. a carrier plate inclined plane; 3. bar block 4, torsion spring 5, medium plate 6, bottom plate 7, support.
Detailed Description
Referring to the drawings, the circuit board prepreg stack pair Ji Zhi of the invention comprises a carrier plate inclined plane, a groove and a base, wherein the groove is arranged on two adjacent edges of the carrier plate inclined plane, and the bottom of the groove is vertical to the carrier plate inclined plane; two angles of the inclined surface of the bearing plate adjacent to the vertical groove are triangle unfilled angles, and the inclined surface of the bearing plate is arranged on the base. The groove can be in various forms, so long as the groove direction can be vertical to the carrier plate inclined plane when the circuit board prepreg is placed on the carrier plate inclined plane, and the circuit board prepreg can be flush in the groove direction.
As a further improvement, one embodiment of the present invention is: the base is divided into a middle plate, a bottom plate and a bracket, the inclined surface of the bearing plate is movably connected with a strip block arranged on the middle plate, the strip block deviates from the central line of the middle plate, two or more torsion springs are further arranged on the strip block in the direction close to the central line of the middle plate, and the inclined surface of the bearing plate is horizontal when no bearing object is ensured under the action of the torsion springs; the middle plate is movably connected with a strip-shaped block arranged on the bottom plate, the strip-shaped block is offset from the central line of the bottom plate, two or more torsion springs are further arranged on the strip-shaped block in the direction close to the central line of the bottom plate, and the bottom plate is horizontal when no bearing object is ensured under the action of the torsion springs; the strip-shaped blocks on the middle plate are mutually perpendicular to the strip-shaped blocks on the bottom plate; the bottom plate is fixed on the bracket.
The strip blocks, the middle plate and the bottom plate can be welded or otherwise connected and fixed; the torsional spring sets up in the junction of bar piece and carrier plate inclined plane and the junction of bar piece and bottom plate, when no bearing object, can keep the horizontal balance of carrier plate inclined plane and medium plate respectively. Simultaneously, the torsion generated by the torsion spring on the middle plate can just maintain the balance of the inclined plane of the carrier plate. The torsion force generated by the torsion spring on the bottom plate can just maintain the balance of the middle plate.
The movable connection between the bearing inclined plane and the strip-shaped block on the middle plate and between the middle plate and the strip-shaped block on the bottom plate is hinge connection or hinge connection.
As a third embodiment, the torsion spring bearing the inclined surface of the bearing plate is smaller in bearing force than the torsion spring bearing the middle plate. Based on the fact that the gravity born by the bottom plate is larger than the gravity born by the inclined surface of the bearing plate, when the torsion spring is designed, torsion force of the torsion spring on the bottom plate can be selected to be larger than torsion force of the torsion spring on the middle plate.
As a third embodiment, when all the torsion springs bear the same force, the number of the torsion springs bearing the inclined surface of the bearing plate is smaller than that of the torsion springs bearing the middle plate. Based on the fact that the gravity born by the bottom plate is larger than the gravity born by the inclined surface of the bearing plate, when all torsion springs are identical in torsion, the number of the torsion springs on the bottom plate can be selected to be larger than that of the torsion springs on the middle plate when the torsion springs are designed.
As a fourth embodiment, the invention also comprises an angle bracket, wherein the angle bracket comprises three mutually perpendicular surfaces which are combined together, and the bottom surface is matched with the triangular unfilled corner on the inclined surface of the carrier plate.
The invention has the following effects: firstly, placing the circuit board prepreg on a carrier plate inclined plane, wherein the bearing capacity of the carrier plate inclined plane is larger than the bearing capacity of a torsion spring, the carrier plate inclined plane inclines, the inclined direction faces to a groove on the carrier plate inclined plane, the circuit board prepreg is flush in the direction, and at the moment, one side of the carrier plate inclined plane inclines to the middle plate; at this time, the middle plate is inclined in another direction under the action of the bearing capacity larger than the torsion spring, and the direction is another groove direction on the inclined surface of the carrier plate, so that the middle plate is inclined to the bottom plate, and the prepreg of the circuit board on the inclined surface of the carrier plate is flushed in the two groove directions.
And an operator supports the leveled circuit board prepregs from the inclined planes of the bearing plates through the corner supports in two opposite angles, and sends the circuit board prepregs to processing equipment for subsequent processing operation.
Compared with the prior art, the invention has the beneficial effects that: the grooves are arranged at the two adjacent ends of the inclined surface of the carrier plate, and the grooves are perpendicular to the inclined surface of the carrier plate, so that the smooth circuit board prepreg can be aligned in two directions, and the alignment is quick and simple. Furthermore, by adding the torsion spring at the non-central line position of the inclined surface of the carrier plate, the carrier plate can keep horizontal when the prepreg is carried, and incline towards the central line direction when the prepreg is carried, so that the carrier plate is flush in one direction; meanwhile, a plurality of groups of torsion springs are additionally arranged at the non-central line position of the middle plate, and the bearing inclined plane can be inclined again after being inclined. Reaching the level of the other direction. The torsion springs arranged on the middle plate and the bottom plate bear different forces or numbers, and the time for tilting is also sequential, so that the two directions are flush no matter what the sequential order is.
The angle support is added, so that the circuit board curing sheet can be supported after being leveled, and the circuit board curing sheet cannot be displaced again;
In conclusion, the multi-layer circuit board prepreg has the advantages of simple structure, reasonable design and convenience in use, and can be aligned rapidly and automatically.
The above examples are provided for convenience of description of the present invention and are not to be construed as limiting the invention in any way, and any person skilled in the art will make partial changes or modifications to the invention by using the disclosed technical content without departing from the technical features of the invention.
Claims (5)
1. The utility model provides a circuit board prepreg stacks pair Ji Zhi utensil which characterized in that: the support plate comprises a support plate inclined plane, grooves and a base, wherein the grooves are arranged on two adjacent edges of the support plate inclined plane, and the bottoms of the grooves are perpendicular to the support plate inclined plane; two angles of the inclined surface of the bearing plate adjacent to the vertical groove are triangular unfilled angles, and the inclined surface of the bearing plate is arranged on the base;
The base is divided into a middle plate, a bottom plate and a bracket, the inclined surface of the bearing plate is movably connected with a strip block arranged on the middle plate, the strip block deviates from the central line of the middle plate, two or more torsion springs are further arranged on the strip block in the direction close to the central line of the middle plate, and the inclined surface of the bearing plate is horizontal when no bearing object is ensured under the action of the torsion springs; the middle plate is movably connected with a strip-shaped block arranged on the bottom plate, the strip-shaped block is offset from the central line of the bottom plate, two or more torsion springs are further arranged on the strip-shaped block in the direction close to the central line of the bottom plate, and the bottom plate is horizontal when no bearing object is ensured under the action of the torsion springs; the strip-shaped blocks on the middle plate are mutually perpendicular to the strip-shaped blocks on the bottom plate; the bottom plate is fixed on the bracket; the strip-shaped blocks on the middle plate are welded with the middle plate.
2. The pair Ji Zhi of circuit board prepreg stacks of claim 1, wherein: the movable connection between the inclined surface of the bearing plate and the strip-shaped block on the middle plate and between the middle plate and the strip-shaped block on the bottom plate is hinge connection or hinged connection.
3. The pair Ji Zhi of circuit board prepreg stacks of claim 1, wherein: the bearing force of the torsion spring bearing the inclined surface of the bearing plate is smaller than that of the torsion spring bearing the middle plate.
4. The pair Ji Zhi of circuit board prepreg stacks of claim 1, wherein: when all the torsion springs bear the same force, the number of the torsion springs bearing the inclined plane of the bearing plate is smaller than that of the torsion springs bearing the middle plate.
5. The pair Ji Zhi of circuit board prepreg stacks according to any one of claims 1 to 4, wherein: the support comprises three mutually perpendicular surfaces which are combined together, wherein the bottom surface is matched with the triangular unfilled corner on the inclined surface of the carrier plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911062108.2A CN110913585B (en) | 2019-11-02 | 2019-11-02 | Circuit board prepreg stacking alignment jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911062108.2A CN110913585B (en) | 2019-11-02 | 2019-11-02 | Circuit board prepreg stacking alignment jig |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110913585A CN110913585A (en) | 2020-03-24 |
| CN110913585B true CN110913585B (en) | 2024-05-17 |
Family
ID=69816228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911062108.2A Active CN110913585B (en) | 2019-11-02 | 2019-11-02 | Circuit board prepreg stacking alignment jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110913585B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114828425B (en) * | 2022-03-23 | 2024-04-16 | 惠州市兴顺和电子有限公司 | Production equipment for printed density electronic circuit board |
| CN116600497B (en) * | 2023-04-24 | 2023-10-24 | 新沂合翎机械设备有限公司 | Multilayer circuit board hot pressing coincide device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3946879A (en) * | 1973-09-26 | 1976-03-30 | Lindaco Ltd. | Device for crosswise laying of rectangular bundles of paper, or the like |
| JP2000177917A (en) * | 1998-12-14 | 2000-06-27 | Nec Corp | Paper sheet arranging device and method |
| JP2003025536A (en) * | 2001-07-16 | 2003-01-29 | Fuji Photo Film Co Ltd | Stacking apparatus for lithographic printing plate |
| JP2006321581A (en) * | 2005-05-17 | 2006-11-30 | Nk Techno:Kk | Device and method for stacking packaging plastic film piece |
| JP2012091372A (en) * | 2010-10-26 | 2012-05-17 | Amaz Techno-Consultant Llc | Apparatus and method for manufacturing laminate |
| CN102706380A (en) * | 2012-05-23 | 2012-10-03 | 苏州慧利仪器有限责任公司 | Bearing platform for optical measurement mechanism |
| CN102992084A (en) * | 2011-09-21 | 2013-03-27 | 哈尔滨和鑫包装印刷有限公司 | Paper finishing machine |
| CN108656181A (en) * | 2018-05-04 | 2018-10-16 | 项梦蝶 | A kind of paper cutting mechanism |
| CN208104855U (en) * | 2018-04-26 | 2018-11-16 | 赣州大良贸易有限公司 | A kind of prepreg process units of pcb board |
| CN211959679U (en) * | 2019-11-02 | 2020-11-17 | 奥士康科技股份有限公司 | Circuit board prepreg stacking and aligning jig |
-
2019
- 2019-11-02 CN CN201911062108.2A patent/CN110913585B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3946879A (en) * | 1973-09-26 | 1976-03-30 | Lindaco Ltd. | Device for crosswise laying of rectangular bundles of paper, or the like |
| JP2000177917A (en) * | 1998-12-14 | 2000-06-27 | Nec Corp | Paper sheet arranging device and method |
| JP2003025536A (en) * | 2001-07-16 | 2003-01-29 | Fuji Photo Film Co Ltd | Stacking apparatus for lithographic printing plate |
| JP2006321581A (en) * | 2005-05-17 | 2006-11-30 | Nk Techno:Kk | Device and method for stacking packaging plastic film piece |
| JP2012091372A (en) * | 2010-10-26 | 2012-05-17 | Amaz Techno-Consultant Llc | Apparatus and method for manufacturing laminate |
| CN102992084A (en) * | 2011-09-21 | 2013-03-27 | 哈尔滨和鑫包装印刷有限公司 | Paper finishing machine |
| CN102706380A (en) * | 2012-05-23 | 2012-10-03 | 苏州慧利仪器有限责任公司 | Bearing platform for optical measurement mechanism |
| CN208104855U (en) * | 2018-04-26 | 2018-11-16 | 赣州大良贸易有限公司 | A kind of prepreg process units of pcb board |
| CN108656181A (en) * | 2018-05-04 | 2018-10-16 | 项梦蝶 | A kind of paper cutting mechanism |
| CN211959679U (en) * | 2019-11-02 | 2020-11-17 | 奥士康科技股份有限公司 | Circuit board prepreg stacking and aligning jig |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110913585A (en) | 2020-03-24 |
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