CN110911354A - Flexible substrate, preparation method thereof and preparation method of flexible panel - Google Patents
Flexible substrate, preparation method thereof and preparation method of flexible panel Download PDFInfo
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- CN110911354A CN110911354A CN201911074965.4A CN201911074965A CN110911354A CN 110911354 A CN110911354 A CN 110911354A CN 201911074965 A CN201911074965 A CN 201911074965A CN 110911354 A CN110911354 A CN 110911354A
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- 239000000758 substrate Substances 0.000 title claims abstract description 186
- 238000002360 preparation method Methods 0.000 title abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 52
- 238000005192 partition Methods 0.000 claims abstract description 39
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims abstract description 30
- 230000000994 depressogenic effect Effects 0.000 claims abstract description 6
- 239000004642 Polyimide Substances 0.000 claims description 25
- 229920001721 polyimide Polymers 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000000059 patterning Methods 0.000 claims description 6
- 238000010329 laser etching Methods 0.000 claims description 5
- 239000011521 glass Substances 0.000 abstract description 38
- 239000007788 liquid Substances 0.000 abstract description 13
- 239000010408 film Substances 0.000 description 29
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000001723 curing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000005034 decoration Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a flexible substrate and a preparation method thereof, and a preparation method of a flexible panel. According to the invention, the substrate base plate is partitioned according to the graph of the flexible display panel, and the groove is formed on the substrate base plate at the periphery of the partition, so that the coating of the flexible material is changed from the whole-surface coating into the coating according to the partition of the panel, the coating area of the flexible material is reduced, and the warping phenomenon is reduced; and because the liquid flexible material can flow into the groove, the flexible material coating is realized by taking the groove as a depressed area, the occupied area of the depressed area is reduced, the unusable areas of the glass substrate and the flexible substrate are greatly reduced, and the utilization rate of the glass substrate and the flexible substrate is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible substrate base plate capable of reducing warping degree of a flexible substrate and increasing utilization rate of a glass base plate, a preparation method of the flexible substrate base plate and a preparation method of a flexible panel.
Background
With the development of Display technology, flat panel Display devices such as Liquid Crystal Displays (LCDs), Organic Light-Emitting diodes (OLEDs), and the like are increasingly getting deeper into people's daily lives. The Flexible Display panel (Flexible Display) has the characteristics of being bendable, light and thin and not easy to damage, has high support degree for narrow frames and spliced screens, and has wide potential application in the fields of portable equipment, wearable equipment, carrier Display, Internet of things, commercial Display and the like.
The flexible display panel is prepared by fabricating a Thin Film Transistor (TFT) array substrate and a color Film substrate on a flexible substrate, and combining them into a display panel of various shapes or sizes. Since the flexible substrate is flexible, easily wrinkled and flexible, and has a thickness of about one fifth to one tenth of that of a conventional glass substrate, the flexible substrate cannot be directly placed on a TFT array substrate production line of a current glass substrate for production and handling. At present, a glass substrate is generally used as a hard substrate, a flexible substrate is prepared on the glass substrate, a subsequent related panel process is performed, and then the flexible substrate is separated from the glass substrate, so as to obtain a flexible display. Polyimide (PI) is widely used as a flexible substrate, and is generally prepared by spraying a spray head on a glass substrate, and then baking at a high temperature to cure the substrate to form the flexible substrate.
Referring to fig. 1A to fig. 1C, a flow chart of a conventional flexible display panel is shown. Which comprises the following steps:
1) in the way of the head coating, Polyimide (PI)11 in liquid form is sprayed onto the glass substrate 10 through the head 19, and the PI pattern (pattern) cannot be coated on the edge of the glass substrate due to the flow property of the liquid, as shown in fig. 1A.
2) Then the flexible substrate 12 is formed after high-temperature baking and curing; the central area of the flexible substrate 12 is a film formation guarantee area 121, which can be used for performing subsequent related panel processes; however, since the liquid polyimide 11 cannot be coated on the edge of the glass substrate 10, the PI may have uneven film thickness (the film thickness in the edge region is thinner than that in the central region) after curing, and the edge region is not a straight line phenomenon and is defined as a Hollow (Hollow) region 122, and the width D of the Hollow region 122 can reach 5mm to 10mm, as shown in fig. 1B.
3) The design of the panel pattern 13 is performed in the film-forming guarantee region 121, and the subsequent related panel process is performed, so that the process panel 13 is shown in FIG. 1C. Since the recess 122 is not linear and has uneven film thickness, the design of the panel pattern cannot be performed in the recess 122, which results in a decrease in the utilization of the glass substrate 10 and the flexible substrate 12, an increase in panel cost, and a decrease in productivity.
Referring to fig. 2A-2B, side views of a conventional flexible substrate are shown. The glass substrate 10 is used as a hard base, the PI in a liquid form is sprayed on the glass substrate 10, and the flexible substrate 12 is formed after the PI is baked and cured at a high temperature, as shown in fig. 2A. Due to the non-uniform Coefficients of Thermal Expansion (CTE) of the PI and the glass substrate, global warpage of the glass substrate and the flexible substrate may occur after the high temperature bake, as shown in fig. 2B. The degree of warpage of the glass substrate and the flexible substrate is related to the contact area of the glass substrate and the flexible substrate, and the larger the contact area is, the more severe the warpage condition is. Since it is common to coat the entire surface PI on a glass substrate, the warpage is severe. The overall warping of the glass substrate and the flexible substrate may affect the subsequent panel manufacturing process (may cause uneven film thickness of the conductive film layer and the insulating film layer, which may ultimately affect the electrical performance of the TFT), and the machine may be easily alarmed during the production process.
Therefore, it is a technical problem to be solved urgently at present to design a preparation method of a flexible substrate that can reduce the warpage of the flexible substrate and improve the utilization rate of the glass substrate and the flexible substrate.
Disclosure of Invention
The invention aims to provide a flexible substrate base plate, a preparation method thereof and a preparation method of a flexible panel aiming at the problems of the existing preparation method of the flexible substrate, which can reduce the warping degree of the flexible substrate, improve the utilization rate of a glass base plate and the flexible substrate, reduce the cost of the panel and improve the productivity.
In order to achieve the above object, the present invention provides a method for manufacturing a flexible substrate for carrying at least one flexible display panel, the method comprising: providing a substrate base plate, wherein the substrate base plate is provided with at least one partition, and the shape of the partition is matched with the graph of the flexible display panel; carrying out patterning treatment on the substrate base plate on the periphery of the partition to form a groove; coating a flexible material within the partition; and solidifying the flexible material to form a flexible substrate, wherein a film forming guarantee area of the flexible substrate is formed in the subarea, and a concave area of the flexible substrate is formed in the groove.
In order to achieve the above object, the present invention further provides a flexible substrate for carrying at least one flexible display panel, the flexible substrate comprising: the substrate base plate is provided with at least one partition, and the shape of the partition is matched with the graph of the flexible display panel; at least one groove arranged on the periphery of the partition; and the flexible substrate comprises a film forming guarantee area arranged in the subarea and a depressed area arranged in the annular groove.
In order to achieve the above object, the present invention further provides a method for manufacturing a flexible display panel, including: providing a substrate base plate, wherein the substrate base plate is provided with at least one partition, and the shape of the partition is matched with the graph of the flexible display panel; carrying out patterning treatment on the substrate base plate on the periphery of the partition to form a groove; coating a flexible material within the partition; solidifying the flexible material to form a flexible substrate, wherein a film forming guarantee area of the flexible substrate is formed in the subarea, and a concave area of the flexible substrate is formed in the groove; forming a laminated structure on the film forming guarantee area of the flexible substrate; and stripping the substrate base plate to obtain the flexible display panel.
The invention has the advantages that: according to the invention, the substrate base plate is partitioned according to the graph of the flexible display panel, and the groove is formed on the substrate base plate at the periphery of the partition, so that the coating of the flexible material is changed from the whole-surface coating into the coating according to the partition of the panel, the coating area of the flexible material is reduced, and the warping phenomenon is reduced; and because the liquid flexible material can flow into the groove, the flexible material coating is realized by taking the groove as a depressed area, the occupied area of the depressed area is reduced, the unusable areas of the glass substrate and the flexible substrate are greatly reduced, the utilization rate of the glass substrate and the flexible substrate is improved, the panel cost is reduced, and the productivity is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1A to 1C are flow charts of a conventional flexible display panel;
fig. 2A-2B, side views of a prior art flexible substrate.
FIG. 3 is a flow chart of a method for manufacturing a flexible display panel according to the present invention;
FIGS. 4A-4F are flow charts illustrating a method for manufacturing a flexible display panel according to an embodiment of the present invention;
fig. 5A-5C are schematic structural diagrams of the flexible substrate of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. The terms "first," "second," "third," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the objects so described are interchangeable under appropriate circumstances. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover a non-exclusive inclusion. The directional phrases used in this disclosure include, for example: up, down, left, right, front, rear, inner, outer, lateral, etc., are simply directions with reference to the drawings. The embodiments described below by referring to the drawings and directional terms used are exemplary only, are used for explaining the present invention, and are not construed as limiting the present invention. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
According to the invention, the coating mode of the existing flexible substrate is changed, the substrate base plate is partitioned according to the graph of the flexible display panel, and the groove is formed on the substrate base plate at the periphery of the partition, so that the whole surface coating of the flexible material is changed into the partition coating according to the panel, the coating area of the flexible material is reduced, and the warping phenomenon is reduced; and because the liquid flexible material can flow into the groove, the flexible material coating is realized by taking the groove as a Hollow area, so that the occupied area of the Hollow area is reduced, the unusable areas of the glass substrate and the flexible substrate are greatly reduced, the utilization rate of the glass substrate and the flexible substrate is improved, the panel cost is reduced, and the productivity is improved.
Referring to fig. 3 and fig. 4A to 4F together, fig. 3 is a flowchart illustrating a method for manufacturing a flexible display panel according to the present invention, and fig. 4A to 4F are flowcharts illustrating a method for manufacturing a flexible display panel according to an embodiment of the present invention.
The preparation method of the flexible display panel comprises the following steps: s31: providing a substrate base plate, wherein the substrate base plate is provided with at least one partition, and the shape of the partition is matched with the graph of the flexible display panel; s32: carrying out patterning treatment on the substrate base plate on the periphery of the partition to form a groove; s33: coating a flexible material within the partition; s34: solidifying the flexible material to form a flexible substrate, wherein a film forming guarantee area of the flexible substrate is formed in the subarea, and a concave area of the flexible substrate is formed in the groove; s35: forming a laminated structure on the film forming guarantee area of the flexible substrate; and S36: stripping the substrate base plate to obtain the flexible display panel; the following detailed description is made with reference to the accompanying drawings.
Regarding step S31: referring to fig. 3 and 4A together, a substrate base plate is provided, where the substrate base plate has at least one partition, and the shape of the partition matches with the pattern of the flexible display panel, where fig. 4A is a schematic view of the substrate base plate 40, and the partition 401 is illustrated by a dashed frame. In a further embodiment, the substrate 40 is a glass substrate, which is used as a rigid base for subsequent deposition of flexible materials and is peeled off after the flexible display panel is manufactured.
Regarding step S32: referring to fig. 3 and 4B together, a recess is formed by patterning the substrate at the periphery of the partition, wherein fig. 4B is a schematic diagram of the formed recess 402.
In a further embodiment, the recess 402 is formed by laser etching. The laser type is not limited, the wavelength can be from an infrared region to an ultraviolet region, and the groove can be etched on the glass substrate by adjusting laser parameters. The laser path of the laser etching is an editable path, so that the shape of the groove 402 is not limited, the groove can be designed according to the shape of the panel, and the laser path with the required shape can be edited by software. In other embodiments, the groove 402 may be formed by dry etching, wet etching or stamping.
In a further embodiment, the groove 402 is an annular groove, so that when the subsequent flexible material is coated, a flow area of the subsequent flexible material is defined, so that the liquid flexible material outside the subarea 401 flows into the groove 402, and thus the cured flexible substrate is realized by taking the groove 402 as a Hollow area, and the area occupied by the Hollow area is reduced.
In a further embodiment, the width and depth of the groove 402 are not limited, and may be defined according to the fluidity of the flexible material to be coated later, so that the width and depth match the fluidity of the flexible material. Optionally, the width of the groove 402 is about 50um to 1000um, which may be 80um, 100um, 200um, 500um, 800 um; the depth of the groove 402 is greater than 0um and less than the thickness of the glass substrate.
In a further embodiment, the distance between the outer edge of the groove 402 and the outer edge of the glass substrate is not limited, and may be greater than a predetermined margin, and specifically may be set according to the precision of the equipment platform in the panel manufacturing process.
Regarding step S33: fig. 3 and 4C are also shown for the flexible material coated in the subarea, wherein fig. 4C is a schematic diagram of the flexible material coating. In the present embodiment, the flexible material 11 in liquid form is sprayed onto the base substrate 40 by a head 49 in a head coating manner. Due to the fluid nature of the liquid, the flexible material 11 may be coated anywhere on the substrate 40 within the zone 401, preferably centrally.
In a further embodiment, the flexible material 11 is Polyimide (PI), which includes transparent polyimide and yellow polyimide. In other embodiments, the flexible material may be other malleable, curable materials.
Regarding step S34: and curing the flexible material to form a flexible substrate, wherein a film formation guarantee region of the flexible substrate is formed in the subarea, and a concave region of the flexible substrate is formed in the groove, please refer to fig. 3 and 4D together, wherein fig. 4D is a schematic diagram of the cured flexible material. The flexible substrate 42 formed after curing includes a film formation ensuring region 421 and a recessed region 422. The film formation guarantee area 421 is formed in the subarea 401 and is used for subsequently preparing a film layer structure of the panel; the concave region 422 is formed in the groove 402, so that the occupied area of the concave region 422 is reduced, the unavailable area of the substrate base plate 40 and the flexible substrate 42 is greatly reduced, and the utilization rate of the glass substrate and the flexible substrate is improved. And through the groove 402, the flexible material is coated in a partitioned manner according to the panel instead of being coated on the whole surface, so that the coating area of the flexible material is reduced, the contact area of the cured flexible substrate 42 and the substrate base plate 40 is reduced, and the warping phenomenon is effectively reduced.
In this embodiment, the substrate 40 coated with the liquid polyimide is baked and cured at a high temperature (the temperature value is greater than a preset temperature value). In other embodiments, curing methods such as ultraviolet light curing may also be used.
Therefore, the flexible substrate of the invention is prepared, and then the subsequent related panel manufacturing process can be carried out on the prepared flexible substrate, and then the flexible substrate and the substrate are separated, and finally the flexible display panel is obtained.
Regarding step S35: please refer to fig. 3 and fig. 4E together, in which fig. 4E is a schematic diagram of a laminated structure 43 for preparing a panel film layer. The laminated structure may comprise any of the existing display structures, such as LEDs, OLEDs, LCDs, ELs, etc.
In an embodiment, the flexible display panel is a flexible liquid crystal display panel, and the stacked structure 43 includes a TFT array substrate and a color film substrate that are packed in the film formation guarantee region 421. Specifically, the TFT array layer and the color film layer are respectively prepared on the film formation guarantee region 421, so as to respectively form a TFT array substrate and a color film substrate; and then, the TFT array substrate and the color film substrate are attached to form a box (cell) plywood, and liquid crystal is dripped to form the flexible liquid crystal display panel. The TFT array layer and the color film layer can be prepared by various methods well known in the art.
In one embodiment, the flexible display panel is a flexible OLED display panel, and the stacked structure 43 includes an active array layer and an organic light emitting layer sequentially deposited on the film formation ensuring region 421. The active array layer and the organic light emitting layer can be prepared by various preparation methods known in the art.
Regarding step S36: please refer to fig. 3 and fig. 4F together, in which fig. 4F is a schematic diagram of the flexible display panel 40, which includes the flexible substrate 42 and the laminated structure 43. The substrate 40 may be peeled off by various preparation methods known in the art.
According to the invention, the coating mode of the existing flexible substrate is changed, the substrate is partitioned according to the graph of the flexible display panel, and the PI coating is changed from the whole-surface coating to the panel partition coating by forming the groove on the substrate at the periphery of the partition, so that the PI coating area is reduced, and the warping phenomenon is reduced; and because the liquid PI can flow into the groove, the PI coating is realized by taking the groove as a Hollow area, so that the occupied area of the Hollow area is reduced, the unusable areas of the glass substrate and the flexible substrate are greatly reduced, the utilization rate of the glass substrate and the flexible substrate is improved, the panel cost is reduced, and the productivity is improved.
Based on the same inventive concept, the invention also provides a flexible substrate base plate, and the flexible substrate base plate is used for bearing at least one flexible display panel. Referring to fig. 5A-5C, a structure of a flexible substrate according to the present invention is schematically illustrated.
As shown in fig. 5A, a sectional view of a front view of the flexible substrate 50 of the present invention includes: a substrate base 40, at least one groove 402, and a flexible substrate 42.
The substrate base plate 40 is provided with at least one subarea 401, and the shape of the subarea 401 is matched with the pattern of the flexible display panel to be carried. In a further embodiment, the substrate 40 is a glass substrate, which is used as a rigid base for subsequent deposition of flexible materials and is peeled off after the flexible display panel is manufactured.
The recess 402 may be formed by laser etching. The laser path of the laser etching is an editable path, so that the shape of the groove 402 is not limited, the groove can be designed according to the shape of the panel, and the laser path with the required shape can be edited by software. In other embodiments, the groove 402 may be formed by dry etching, wet etching or stamping.
In a further embodiment, the groove 402 is an annular groove, as shown in fig. 5B, so that when the subsequent flexible material is coated, a flow area of the subsequent flexible material is defined, and the liquid flexible material outside the partition 401 flows into the groove 402, so that the cured flexible substrate is implemented by taking the groove 402 as a recessed area, and the area occupied by the recessed area is reduced. In a further embodiment, the distance L1 between the outer edge of the groove 402 and the outer edge of the glass substrate is not limited and may be larger than a predetermined margin, as shown in fig. 5B, and may be specifically set according to the precision of the equipment in the panel manufacturing process. Fig. 5B is a schematic top view enlarged view of the groove shown in fig. 5A for clearly illustrating and explaining the groove.
In a further embodiment, the width and depth of the groove 402 are not limited, and may be defined according to the fluidity of the flexible material to be coated later, so that the width and depth match the fluidity of the flexible material. Optionally, the width W1 of the groove 402 is about 50um to 1000um, which may be 80um, 100um, 200um, 500um, 800 um; the depth D1 of the groove 402 is greater than 0um and less than the thickness of the glass substrate, as shown in fig. 5C. Fig. 5C is an enlarged schematic view of the groove shown in fig. 5A for clearly illustrating and explaining the groove.
With reference to fig. 5A, the flexible substrate 42 includes a film-forming guarantee region 421 and a recess region 422. The film formation guarantee area 421 is formed in the subarea 401 and is used for subsequently preparing a film layer structure of the panel; the concave region 422 is formed in the groove 402, so that the occupied area of the concave region 422 is reduced, the unavailable area of the substrate base plate 40 and the flexible substrate 42 is greatly reduced, and the utilization rate of the glass substrate and the flexible substrate is improved. And the contact area between the flexible substrate 42 and the substrate base plate 40 is smaller, so that the warping phenomenon is effectively reduced.
In a further embodiment, the flexible material used for the flexible substrate 42 is Polyimide (PI), which includes transparent polyimide and yellow polyimide. In other embodiments, the flexible material may be other malleable materials.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A method for preparing a flexible substrate for carrying at least one flexible display panel, the method comprising:
providing a substrate base plate, wherein the substrate base plate is provided with at least one partition, and the shape of the partition is matched with the graph of the flexible display panel;
carrying out patterning treatment on the substrate base plate on the periphery of the partition to form a groove;
coating a flexible material within the partition; and
and curing the flexible material to form a flexible substrate, wherein a film forming guarantee area of the flexible substrate is formed in the subarea, and a concave area of the flexible substrate is formed in the groove.
2. The method of claim 1, wherein the grooves are formed by laser etching.
3. The method of claim 2, wherein the laser etched laser path is an editable path.
4. The method of claim 1, wherein the width and depth of the grooves match the flow of the flexible material.
5. The method of claim 1, wherein the flexible material is a polyimide.
6. A flexible substrate for carrying at least one flexible display panel, the flexible substrate comprising:
the substrate base plate is provided with at least one partition, and the shape of the partition is matched with the graph of the flexible display panel;
at least one groove arranged on the periphery of the partition; and
and the flexible substrate comprises a film forming guarantee area arranged in the subarea and a depressed area arranged in the annular groove.
7. The flexible substrate of claim 6, wherein the groove is an annular groove.
8. The flexible substrate of claim 6, wherein the width of the groove is 50um to 1000 um.
9. The flexible substrate base of claim 6, wherein the depth of the recess is less than the thickness of the substrate base.
10. A method for manufacturing a flexible display panel, the method comprising:
providing a substrate base plate, wherein the substrate base plate is provided with at least one partition, and the shape of the partition is matched with the graph of the flexible display panel;
carrying out patterning treatment on the substrate base plate on the periphery of the partition to form a groove;
coating a flexible material within the partition;
solidifying the flexible material to form a flexible substrate, wherein a film forming guarantee area of the flexible substrate is formed in the subarea, and a concave area of the flexible substrate is formed in the groove;
forming a laminated structure on the film forming guarantee area of the flexible substrate; and
and stripping the substrate base plate to obtain the flexible display panel.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911074965.4A CN110911354A (en) | 2019-11-06 | 2019-11-06 | Flexible substrate, preparation method thereof and preparation method of flexible panel |
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| CN201911074965.4A CN110911354A (en) | 2019-11-06 | 2019-11-06 | Flexible substrate, preparation method thereof and preparation method of flexible panel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113024125A (en) * | 2021-02-26 | 2021-06-25 | 深圳市华星光电半导体显示技术有限公司 | Substrate base plate and preparation method thereof and display panel |
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|---|---|---|---|---|
| US20160107926A1 (en) * | 2014-10-20 | 2016-04-21 | Shenzhen China Star Optelectronics Technology Co., Ltd | Manufacturing method of flexible substrate |
| CN107359282A (en) * | 2017-07-12 | 2017-11-17 | 武汉华星光电半导体显示技术有限公司 | display panel and preparation method thereof, display |
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2019
- 2019-11-06 CN CN201911074965.4A patent/CN110911354A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160107926A1 (en) * | 2014-10-20 | 2016-04-21 | Shenzhen China Star Optelectronics Technology Co., Ltd | Manufacturing method of flexible substrate |
| CN107359282A (en) * | 2017-07-12 | 2017-11-17 | 武汉华星光电半导体显示技术有限公司 | display panel and preparation method thereof, display |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113024125A (en) * | 2021-02-26 | 2021-06-25 | 深圳市华星光电半导体显示技术有限公司 | Substrate base plate and preparation method thereof and display panel |
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Application publication date: 20200324 |