CN110911339A - Force-controlled swing arm assembly - Google Patents

Force-controlled swing arm assembly Download PDF

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Publication number
CN110911339A
CN110911339A CN201911238931.4A CN201911238931A CN110911339A CN 110911339 A CN110911339 A CN 110911339A CN 201911238931 A CN201911238931 A CN 201911238931A CN 110911339 A CN110911339 A CN 110911339A
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CN
China
Prior art keywords
force
arm
piece
wafer
picking
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911238931.4A
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Chinese (zh)
Inventor
陈勇伶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Silicon Valley Semiconductor Equipment Co Ltd
Original Assignee
Shenzhen Silicon Valley Semiconductor Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Silicon Valley Semiconductor Equipment Co Ltd filed Critical Shenzhen Silicon Valley Semiconductor Equipment Co Ltd
Priority to CN201911238931.4A priority Critical patent/CN110911339A/en
Publication of CN110911339A publication Critical patent/CN110911339A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to the technical field of manipulators, and particularly discloses a force control type swing arm assembly, wherein a spring piece is arranged on a force arm seat, a force arm piece is arranged on the spring piece, the other end of the force arm piece acts on a force measuring unit, and the joint of the spring piece and the force arm piece is positioned between a picking piece and the force measuring unit; the force arm piece is connected with the force arm base through the elastic piece to form a lever, when the power mechanism drives the force arm piece through the force arm base to enable the picking piece to act on the wafer, the wafer triggers the force measuring unit through the reaction force of the picking piece on the force arm piece, the force value measured by the force measuring unit directly reacts on the moving distance of the force arm piece, the moving distance of the force arm piece is regulated and controlled through the force value displayed by the force measuring unit, the picking piece is prevented from crushing the wafer, the picking piece is ensured to accurately pick the wafer, and the picking yield of the wafer is improved; the position of the force arm piece with the picking piece to move the wafer is accurately controlled, the consistency of the thickness of glue between the wafer and the wafer to be placed is ensured, and the transfer yield and the assembly yield of the wafer are improved.

Description

Force-controlled swing arm assembly
Technical Field
The invention relates to the technical field of manipulators, and particularly discloses a force control type swing arm assembly.
Background
In order to improve the transfer efficiency of the wafer, the improvement of transferring the wafer by using a manipulator instead of manpower appears in the prior art, when the wafer transfer device is used, the manipulator is firstly used for grabbing the wafer, and the manipulator moves to drive the grabbed wafer to move, so that the automatic transfer of the wafer is completed.
However, due to the unreasonable structural design of the manipulator in the prior art, in the process of grabbing the wafer by the manipulator, the manipulator collides with the wafer to damage the wafer, and the manipulator moves to cause inaccurate wafer transfer position due to vibration or self-shaking, so that the wafer is transferred badly.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide a force control type swing arm assembly, wherein the force value measured by a force measuring unit regulates and controls the movement of a power mechanism driving a force arm seat, so that the lifting or the descending of a picked piece is completed, the picked piece is prevented from damaging a wafer of the piece to be picked, the picking yield of the wafer is improved, meanwhile, the wafer picked by the picked piece is ensured to accurately move to a required position, and the transfer yield and the assembly yield of the wafer are improved.
In order to achieve the above object, the force control type swing arm assembly of the present invention includes a force arm base, a force arm member, a spring piece, a picking piece and a force measuring unit, wherein the spring piece is disposed on the force arm base, the force arm member is disposed on the spring piece, the picking piece is disposed at one end of the force arm member and is used for picking up an external wafer, the other end of the force arm member acts on the force measuring unit, a connection portion between the spring piece and the force arm member is located between the picking piece and the force measuring unit, the external power mechanism drives the force arm member through the force arm base to enable the picking piece to act on the wafer, the wafer triggers the force measuring unit through a reaction force of the picking piece on the force arm member, and the force value measured by the force measuring unit regulates and.
The force measuring unit comprises a force sensor and a signal converter electrically connected with the force sensor, and the other end of the force arm piece acts on the force sensor.
Furthermore, the arm base is provided with a pressure plate, and the force sensor is respectively connected to the pressure plate and the other end of the arm.
Wherein, force control formula swing arm subassembly still includes the regulating unit, and the regulating unit includes threaded rod, nut spare and spring, and the threaded rod sets up in power arm spare, and the junction of threaded rod and the arm of force spare is located between bullet piece and the dynamometry unit, and the arm of force seat is equipped with the shrinkage pool of holding the threaded rod of establishing, and the aperture of shrinkage pool is greater than the external diameter of threaded rod, and nut spare spiro union cover is established in the threaded rod outside, and the spring housing is established in the outside of threaded rod, and the both ends of spring are supported respectively and are touched arm seat.
Furthermore, the arm seat is provided with a yielding hole, the other end of the arm piece is movably accommodated in the yielding hole, and the concave hole is communicated with the yielding hole; the force arm seat is provided with a slotted hole communicated with the abdicating hole, and the force measuring unit is positioned in the slotted hole.
The picking piece is a suction nozzle which is used for sucking an external wafer, one end of the force arm piece is provided with two clamping parts, a yielding gap is formed between the two clamping parts, one sides of the two clamping parts, which are close to each other, are respectively provided with a limiting groove, and the suction nozzle is clamped between the two clamping parts and is accommodated in the limiting groove.
Further, the arm of force spare is equipped with the fastener, and the fastener runs through two clamping parts, and the fastener adjusts and controls the width size of the clearance of stepping down between two clamping parts and then makes two clamping parts stabilize and clip the suction nozzle.
The elastic piece is made of metal materials, the elastic piece is approximately a rectangular flat plate, and two ends of the elastic piece are respectively connected to the force arm seat and the force arm piece.
Furthermore, the arm piece comprises a base part, a first arm part and a second arm part, wherein the first arm part and the second arm part are respectively arranged on two sides of the base part; the thickness of the base part is greater than that of the second arm part, the second arm part is positioned in the force arm seat, a gap is formed between the base part and the force arm seat, and a gap is formed between the second arm part and the force arm seat; the end of the second arm remote from the base acts on the force-measuring cell.
The first arm part is conical, and the outer diameter of one end, far away from the base part, of the first arm part is smaller than that of one end, close to the base part, of the first arm part; the first arm comprises a first plate body, a second plate body and a third plate body which are arranged on the same side of the first plate body respectively, reinforcing ribs for connecting the first plate body, the second plate body and the third plate body are arranged on the first plate body, and material reducing holes are formed in the first plate body, the second plate body and the third plate body and penetrate through the plate bodies.
Has the advantages that: the force arm piece is connected with the force arm base through the elastic piece to form a lever, when the power mechanism drives the force arm piece through the force arm base to enable the picking piece to act on the wafer, the wafer triggers the force measuring unit through the reaction force of the picking piece on the force arm piece, the force value measured by the force measuring unit directly reacts on the moving distance of the force arm piece, the moving distance of the force arm piece is regulated and controlled through the force value displayed by the force measuring unit, the picking piece is prevented from crushing the wafer, the picking piece is ensured to accurately pick the wafer, and the picking yield of the wafer is improved; the position of the force arm piece with the picking piece to move the wafer is accurately controlled, the consistency of the thickness of glue between the wafer and the wafer to be placed is ensured, and the transfer yield and the assembly yield of the wafer are improved.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is an exploded view of a hidden signal converter according to the present invention.
Fig. 3 is a perspective view of the force arm of the present invention.
The reference numerals include:
1-force arm seat 2-force arm piece 3-spring piece
4-picking member 5-force measuring unit 6-force sensor
7-signal converter 8-pressing plate 9-regulating unit
11-threaded rod 12-nut member 13-spring
14-hole of stepping down 15-clamping part 16-spacing recess
17-base 18-first arm 19-second arm
21-first plate 22-second plate 23-third plate
24-reinforcing ribs 25-relief holes.
Detailed Description
The present invention will be further described with reference to the following examples and the accompanying drawings.
Referring to fig. 1-3, the force control type swing arm assembly of the present invention includes a force arm base 1, a force arm 2, a spring piece 3, a picking piece 4 and a force measuring unit 5, wherein the spring piece 3 is installed on the force arm base 1, the force arm 2 is installed on the spring piece 3, the force arm 2 is not in contact with the force arm base 1, the picking piece 4 is installed on one end of the force arm 2 and is used for picking up an external wafer, and the other end of the force arm 2 acts on the force measuring unit 5.
The joint of the elastic piece 3 and the force arm piece 2 is positioned between the picking piece 4 and the force measuring unit 5, an external power mechanism is connected with the force arm base 1, the power mechanism drives the force arm piece 2 through the force arm base 1 to enable the picking piece 4 to act on the wafer, the wafer triggers the force measuring unit 5 through the reaction force of the picking piece 4 on the force arm piece 2, and the force value measured through the force measuring unit 5 regulates and controls the movement of the force arm base 1 through the driving force of the power mechanism.
The force arm member 2 is connected with the force arm base 1 through the elastic piece member 3 to form a lever, when the power mechanism drives the force arm member 2 through the force arm base 1 to enable the picking member 4 to act on the wafer, the wafer triggers the force measuring unit 5 through the reaction force of the picking member 4 on the force arm member 2, the force value measured through the force measuring unit 5 directly reflects the utilization distance of the force arm member 2, the moving distance of the force arm member 2 is directly regulated and controlled through the force value displayed by the force measuring unit 5, the phenomenon that the picking member 4 crushes the wafer due to the fact that the force arm member 2 descends too far is avoided, and the picking yield of the wafer is improved. The moving stroke of the force arm piece 2 is accurately controlled through the force value displayed by the force measuring unit 5, so that the force arm piece 2 and the picking piece 4 are ensured to accurately move, and the picking piece 4 can accurately suck the wafer; meanwhile, the consistency of the thickness of the glue between the wafer picked by the picking piece 4 and the bracket to be placed is ensured, the phenomenon that the glue is too thin or the wafer is suspended due to the unevenness of the bracket or the clamp is avoided, and the transfer yield and the assembly yield of the wafer are improved.
The force-measuring cell 5 comprises a force sensor 6 and a signal converter 7 electrically connected to the force sensor 6, the other end of the force arm 2 acting on the force sensor 6. When the wafer triggers the force measuring unit 5 through the reaction force of the picking piece 4 on the force arm 2, the signal converter 7 converts and amplifies the pressure signal received by the force sensor 6 into a digital signal, and the magnitude of the force value is displayed through a display screen and the like which are matched with the digital signal, so that a user can visually observe the actual magnitude of the force exerted on the wafer by the picking piece 4.
The arm seat 1 is provided with a pressing plate 8, and the force sensor 6 is respectively connected on the pressing plate 8 and the other end of the arm part 2. In this embodiment, the pressure plates 8 are substantially U-shaped, and the force sensor 6 is located between the pressure plates 8. When the wafer triggers the force measuring unit 5 through the reaction force of the picking piece 4 to the force arm 2, the force arm 2 will move relative to the force arm base 1, the moving force arm base 1 presses the force sensor 6, and the pressing plate 8 pushes against and stops the force sensor 6, so as to prevent the force sensor 6 from moving excessively and being badly used.
The force control type swing arm assembly further comprises an adjusting unit 9, the adjusting unit 9 comprises a threaded rod 11, a nut piece 12 and a spring 13, the threaded rod 11 is arranged on the force arm piece 2, and the joint of the threaded rod 11 and the force arm piece 2 is located between the elastic piece 3 and the force sensor 6 of the force measuring unit 5.
A concave hole for accommodating the threaded rod 11 is formed in the arm base 1, and the aperture of the concave hole is larger than the outer diameter of the threaded rod 11, so that the threaded rod 11 is prevented from contacting the arm base 1; the nut member 12 is screwed and sleeved on the outer side of the threaded rod 11, the spring 13 is sleeved on the outer side of the threaded rod 11, and two ends of the spring 13 respectively abut against the arm base 1 and the nut member 12. Through the arrangement of the adjusting unit 9, the nut member 12 can be rotated to enable the nut member 12 to ascend and descend along the threaded rod 11 as required, the nut member 12 ascending and descending along the threaded rod 11 adjusts the magnitude of the elastic force applied between the force arm member 2 and the force arm base 1 by the spring 13, and then the proportion of the reaction force of the wafer on the force arm member 2 through the picking member 4 to the force sensor 6 is adjusted, so that the wafer impact force bearing magnitude can be adjusted conveniently according to different wafers.
The arm seat 1 is provided with a yielding hole 14, the other end of the arm part 2 is movably accommodated in the yielding hole 14, the aperture of the yielding hole 14 is larger than the outer diameter of the other end of the arm part 2, and the other end of the arm part 2 is prevented from contacting the inner hole wall of the yielding hole 14. The concave hole is communicated with the abdicating hole 14 and penetrates through the top wall of the arm seat 1. The arm seat 1 is provided with a slot hole communicated with the abdicating hole 14, and the force sensor 6 of the force measuring unit 5 is positioned in the slot hole, so that the force sensor 6 can be conveniently and accurately assembled to a required position.
The picking part 4 is a suction nozzle which is used for sucking an external wafer, one end of the force arm part 2 is provided with two clamping parts 15, and a yielding gap is formed between the two clamping parts 15, so that the two clamping parts 15 can be close to or far away from each other, and the suction nozzle can be conveniently placed between the two clamping parts 15. One side of each of the two clamping parts 15, which is close to each other, is provided with a limiting groove 16, and the suction nozzle is clamped between the two clamping parts 15 and is accommodated in the limiting groove 16; the inner groove wall of the limiting groove 16 is used for abutting and stopping the suction nozzle, so that the suction nozzle is prevented from moving relative to the clamping part 15.
The force arm member 2 is provided with a fastening member, the fastening member penetrates through the two clamping portions 15, and the fastening member regulates and controls the width of the abdicating gap between the two clamping portions 15 so that the two clamping portions 15 can stably clamp the suction nozzle. The two clamping portions 15 are driven to approach each other by the fastener, so that the two clamping portions 15 stably clamp the suction nozzle, preventing the suction nozzle from falling.
The elastic piece 3 is made of metal materials, and the service life of the elastic piece 3 is prolonged by the metal materials. The elastic piece 3 is a substantially rectangular flat plate, the structural design of the elastic piece 3 is simplified, the manufacturing cost of the elastic piece 3 is reduced, and two ends of the elastic piece 3 are respectively connected to the arm seat 1 and the arm 2.
The force arm 2 comprises a base part 17, a first arm part 18 and a second arm part 19 which are respectively arranged at the left side and the right side of the base part 17, the first arm part 18 and the second arm part 19 are of an integrated structure, the base part 17 is arranged on the elastic piece 3, and the picking piece 4 is arranged on the side, away from the base part 17, of the first arm part 18.
The thickness of the base part 17 is larger than that of the second arm part 19, the second arm part 19 is positioned in the force arm seat 1, a gap is formed between the base part 17 and the force arm seat 1, a gap is formed between the second arm part 19 and the force arm seat 1, and the base arm contacts with the force arm seat 1 or the second arm part 19 contacts with the force arm seat 1 to cause poor use; the end of the second arm 19 remote from the base 17 acts on the force sensor 6 of the force-measuring cell 5.
The first arm portion 18 is tapered, and the outer diameter of the end of the first arm portion 18 away from the base portion 17 is smaller than the outer diameter of the end of the first arm portion 18 close to the base portion 17; the first arm 18 includes a first plate 21, second and third plates 22 and 23 respectively disposed on the same side of the first plate 21, and a reinforcing rib 24 connecting the first, second and third plates 21, 22 and 23. The second plate 22 and the second plate 22 are spaced apart from each other and arranged in parallel, and the number of the reinforcing ribs 24 is plural, and the plural reinforcing ribs 24 are arranged in parallel along the longitudinal direction of the first arm portion 18. First plate body 21, second plate body 22, third plate body 23 all are equipped with and subtract material hole 25, subtract material hole 25 and run through the plate body, subtract the weight that the arm piece 2 was reduced on the one hand to the setting of material hole 25, and on the other hand reduces the loss of material.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the invention.

Claims (10)

1. A force-controlled swing arm assembly, comprising: the force arm seat is arranged on the elastic piece seat, the force arm piece is arranged at one end of the force arm piece and used for picking up an external wafer, the other end of the force arm piece acts on the force measuring unit, the joint of the elastic piece and the force arm piece is located between the picking piece and the force measuring unit, the external power mechanism drives the force arm piece through the force arm seat to enable the picking piece to act on the wafer, the wafer triggers the force measuring unit through the counterforce of the picking piece on the force arm piece, and the force value measured through the force measuring unit regulates and controls the movement of the power mechanism driving the force arm seat.
2. The force controlled swing arm assembly of claim 1, wherein: the force measuring unit comprises a force sensor and a signal converter electrically connected with the force sensor, and the other end of the force arm piece acts on the force sensor.
3. The force controlled swing arm assembly of claim 2, wherein: the pressure plate is installed to the arm of force seat, and force transducer is connected to the other end of pressure plate and arm of force piece respectively.
4. The force controlled swing arm assembly of claim 1, wherein: the force control type swing arm assembly further comprises an adjusting unit, the adjusting unit comprises a threaded rod, a nut piece and a spring, the threaded rod is arranged on the force arm piece, the joint of the threaded rod and the force arm piece is located between the elastic piece and the force measuring unit, the force arm seat is provided with a concave hole for accommodating the threaded rod, the aperture of the concave hole is larger than the outer diameter of the threaded rod, the nut piece is sleeved on the outer side of the threaded rod in a threaded mode, the spring sleeve is arranged on the outer side of the threaded rod, and two ends of the spring respectively abut.
5. The force controlled swing arm assembly of claim 4, wherein: the arm seat is provided with a yielding hole, the other end of the arm piece is movably accommodated in the yielding hole, and the concave hole is communicated with the yielding hole; the force arm seat is provided with a slotted hole communicated with the abdicating hole, and the force measuring unit is positioned in the slotted hole.
6. The force controlled swing arm assembly of claim 1, wherein: the picking piece is a suction nozzle which is used for sucking an external wafer, one end of the force arm piece is provided with two clamping parts, a yielding gap is formed between the two clamping parts, one sides of the two clamping parts, which are close to each other, are respectively provided with a limiting groove, and the suction nozzle is clamped between the two clamping parts and is accommodated in the limiting groove.
7. The force controlled swing arm assembly of claim 6, wherein: the force arm piece is provided with a fastener, the fastener penetrates through the two clamping parts, and the fastener regulates and controls the width of the yielding gap between the two clamping parts so that the two clamping parts can stably clamp the suction nozzle.
8. The force controlled swing arm assembly of claim 1, wherein: the elastic piece is made of metal materials and is approximately a rectangular flat plate, and two ends of the elastic piece are respectively connected to the force arm seat and the force arm piece.
9. The force controlled swing arm assembly of claim 1, wherein: the arm part comprises a base part, a first arm part and a second arm part, wherein the first arm part and the second arm part are respectively arranged on two sides of the base part; the thickness of the base part is greater than that of the second arm part, the second arm part is positioned in the force arm seat, a gap is formed between the base part and the force arm seat, and a gap is formed between the second arm part and the force arm seat; the end of the second arm remote from the base acts on the force-measuring cell.
10. The force controlled swing arm assembly of claim 9, wherein: the first arm part is conical, and the outer diameter of one end of the first arm part, which is far away from the base part, is smaller than that of one end of the first arm part, which is close to the base part; the first arm comprises a first plate body, a second plate body and a third plate body which are arranged on the same side of the first plate body respectively, reinforcing ribs for connecting the first plate body, the second plate body and the third plate body are arranged on the first plate body, and material reducing holes are formed in the first plate body, the second plate body and the third plate body and penetrate through the plate bodies.
CN201911238931.4A 2019-12-06 2019-12-06 Force-controlled swing arm assembly Pending CN110911339A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911238931.4A CN110911339A (en) 2019-12-06 2019-12-06 Force-controlled swing arm assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911238931.4A CN110911339A (en) 2019-12-06 2019-12-06 Force-controlled swing arm assembly

Publications (1)

Publication Number Publication Date
CN110911339A true CN110911339A (en) 2020-03-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911238931.4A Pending CN110911339A (en) 2019-12-06 2019-12-06 Force-controlled swing arm assembly

Country Status (1)

Country Link
CN (1) CN110911339A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112908906A (en) * 2021-03-09 2021-06-04 深圳新益昌科技股份有限公司 Automatic pressure switching type swing arm

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112908906A (en) * 2021-03-09 2021-06-04 深圳新益昌科技股份有限公司 Automatic pressure switching type swing arm

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