CN110903464A - Preparation method of microcapsule type rapid curing agent with polyvinyl chloride as wall material for epoxy resin - Google Patents

Preparation method of microcapsule type rapid curing agent with polyvinyl chloride as wall material for epoxy resin Download PDF

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Publication number
CN110903464A
CN110903464A CN201911236872.7A CN201911236872A CN110903464A CN 110903464 A CN110903464 A CN 110903464A CN 201911236872 A CN201911236872 A CN 201911236872A CN 110903464 A CN110903464 A CN 110903464A
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China
Prior art keywords
curing agent
polyvinyl chloride
epoxy resin
wall material
type rapid
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Pending
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CN201911236872.7A
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Chinese (zh)
Inventor
徐忠海
赫晓东
蔡朝灿
白玉娇
王荣国
刘文博
董旭伦
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Zhaoqing Haite Composite Technology Research Institute
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Zhaoqing Haite Composite Technology Research Institute
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Priority to CN201911236872.7A priority Critical patent/CN110903464A/en
Publication of CN110903464A publication Critical patent/CN110903464A/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • C08G59/5053Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02Making microcapsules or microballoons
    • B01J13/06Making microcapsules or microballoons by phase separation

Abstract

The invention discloses a preparation method of a microcapsule type rapid curing agent taking polyvinyl chloride as a wall material for epoxy resin, and relates to the field of preparation of microcapsule type rapid curing agents. The invention aims to solve the technical problem that the storage life of epoxy resin is reduced due to the fact that the microcapsule wall material is broken in advance to initiate a curing reaction in the existing method for preparing the microcapsule type curing agent. The core material of the microcapsule type rapid curing agent is an imidazole curing agent, and the wall material is polyvinyl chloride; the method comprises the following steps: firstly, preparing an oil phase solution; secondly, preparing an aqueous phase solution; thirdly, obtaining an oil-in-water emulsion; fourthly, obtaining a solution containing a curing agent to form microcapsules; fifthly, suction filtering and drying. The invention uses PVC to prepare the microcapsule, which can ensure the mechanical property of the epoxy resin product. The microcapsule type rapid curing agent prepared by the invention is applied to the fields of automobiles, sports products and aerospace.

Description

Preparation method of microcapsule type rapid curing agent with polyvinyl chloride as wall material for epoxy resin
Technical Field
The invention relates to the field of preparation of microcapsule type rapid curing agents.
Background
The epoxy resin is a typical thermosetting resin, a molecular chain contains more than two epoxy groups, the epoxy resin is viscous liquid at normal temperature, and the epoxy resin and a curing agent are cured and crosslinked to form a three-dimensional network type macromolecular structure. Epoxy resin has excellent mechanical and physical properties, good chemical stability, low molding shrinkage and good dimensional stability, and therefore, the epoxy resin has been widely used in the fields of electronic packaging, construction, aerospace, automobiles and the like. In industrial production, the epoxy resin and the curing agent are required to be stored separately, and then are prepared again when being used, and are uniformly stirred and cured, so that the efficiency of producing epoxy resin products is greatly reduced, and the use of the epoxy resin is limited. If the epoxy resin prepreg is prepared for the next production of epoxy resin, the production speed can be greatly improved, and the quality of the prepreg can determine the performance of the product to a great extent. Generally, epoxy resin prepregs have a short storage life at room temperature and need to be stored at low temperature, which increases the difficulty and cost of transportation. Therefore, the microcapsule technology is applied to the preparation of latent curing agents to coat curing agent molecules, so that the room-temperature storage period of the system is greatly prolonged, and the epoxy resin is rapidly cured after heating.
The preparation method in the prior art is complex to operate, and the microcapsule wall materials are mostly polymers with low heat resistance, and are easy to decompose or volatilize in advance in the storage process of the epoxy resin, so that the storage life of the epoxy resin is reduced. In addition, the existing microcapsule wall material is easy to break in advance in the epoxy resin curing process, so that the epoxy resin curing reaction is caused in advance, and the performance of the cured epoxy resin is influenced.
Disclosure of Invention
The invention provides a preparation method of a microcapsule type rapid curing agent with polyvinyl chloride as a wall material for epoxy resin, aiming at solving the technical problem that the storage life of the epoxy resin is reduced due to premature rupture of the microcapsule wall material and initiation of a curing reaction in the preparation of the microcapsule type curing agent by the existing method.
A preparation method of a microcapsule type rapid curing agent taking polyvinyl chloride for epoxy resin as a wall material is disclosed, wherein a core material of the microcapsule type rapid curing agent is an imidazole curing agent, and the wall material is polyvinyl chloride; the imidazole curing agent is imidazole, an imidazole derivative or a complex of an imidazole compound and copper bromide;
the method for preparing the microcapsule type rapid curing agent comprises the following steps:
mixing imidazole curing agents and polyvinyl chloride, putting the mixture into an organic solvent, and performing ultrasonic dispersion and dissolution to obtain an oil phase solution;
secondly, mixing a dispersing agent with deionized water to obtain an aqueous phase solution;
mixing the oil phase solution obtained in the step one and the water phase solution obtained in the step two, and stirring at a high speed by adopting a high-speed homogenizer to obtain an oil-in-water emulsion;
fourthly, adding the oil-in-water emulsion obtained in the third step into a stabilizer solution, heating and stirring at a low speed to obtain a solution containing a curing agent to form microcapsules;
and fifthly, carrying out suction filtration on the solution containing the curing agent microcapsule obtained in the step four, and putting the precipitate after suction filtration into a vacuum drying oven for drying to obtain the microcapsule type rapid curing agent with the polyvinyl chloride as the wall material for the epoxy resin.
When the microcapsule type rapid curing agent taking polyvinyl chloride as a wall material for epoxy resin and epoxy resin E-51 or E-20 are cured, the addition amount of the microcapsule type rapid curing agent is 10-30 wt% of the epoxy resin.
The invention has the beneficial effects that:
the invention realizes the solvent volatilization method of microencapsulation by a physical method, and has the advantages of no interface polymerization method and no phase separation method. And PVC with good affinity with epoxy resin is used for preparing the microcapsule, so that the mechanical property of an epoxy resin product cannot be reduced, the glass transition temperature of the PVC is 87 ℃, and the storage property of the microcapsule is good at normal temperature. The verification shows that after the curing agent prepared by the invention is mixed with epoxy resin E-20 and E-51, the mixture is cured for 30min at 120 ℃, and the normal-temperature storage period of the prepared prepreg can reach more than 2 months.
Therefore, the invention can quickly cure the epoxy resin, solves the two problems of quick curing of the single-component epoxy resin and prolonging the storage period of the material, is suitable for preparing the epoxy resin prepreg reinforced by fibers such as carbon fibers, glass fibers and the like and fabrics thereof, and can be applied to the fields of automobiles, sports products, aerospace and the like.
The microcapsule type rapid curing agent prepared by the invention is applied to the fields of automobiles, sports products and aerospace.
Detailed Description
The technical solution of the present invention is not limited to the specific embodiments listed below, and includes any combination of the specific embodiments.
The first embodiment is as follows: the preparation method of the microcapsule type rapid curing agent with polyvinyl chloride as the wall material for epoxy resin in the embodiment comprises the following steps of (1) taking a core material of the microcapsule type rapid curing agent as an imidazole curing agent and taking polyvinyl chloride as the wall material; the imidazole curing agent is imidazole, an imidazole derivative or a complex of an imidazole compound and copper bromide;
the method for preparing the microcapsule type rapid curing agent comprises the following steps:
mixing imidazole curing agents and polyvinyl chloride, putting the mixture into an organic solvent, and performing ultrasonic dispersion and dissolution to obtain an oil phase solution;
secondly, mixing a dispersing agent with deionized water to obtain an aqueous phase solution;
mixing the oil phase solution obtained in the step one and the water phase solution obtained in the step two, and stirring at a high speed by adopting a high-speed homogenizer to obtain an oil-in-water emulsion;
fourthly, adding the oil-in-water emulsion obtained in the third step into a stabilizer solution, heating and stirring at a low speed to obtain a solution containing a curing agent to form microcapsules;
and fifthly, carrying out suction filtration on the solution containing the curing agent microcapsule obtained in the step four, and putting the precipitate after suction filtration into a vacuum drying oven for drying to obtain the microcapsule type rapid curing agent with the polyvinyl chloride as the wall material for the epoxy resin.
The second embodiment is as follows: the first difference between the present embodiment and the specific embodiment is: the imidazole derivative is 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, benzimidazole, 2-phenyl-4-methylimidazole or 2-ethyl-4-methylimidazole. The rest is the same as the first embodiment.
The third concrete implementation mode: the present embodiment differs from the first or second embodiment in that: the complex of the imidazole compound and the cupric bromide is prepared by mixing the imidazole compound and the cupric bromide according to the molar ratio of 1: 1. The other is the same as in the first or second embodiment.
The fourth concrete implementation mode: the difference between this embodiment mode and one of the first to third embodiment modes is: in the first step, the mass ratio of the active curing agent to the polyvinyl chloride is (0.5-5) to 1. The others are the same as in one of the first to third embodiments.
The fifth concrete implementation mode: the difference between this embodiment and one of the first to fourth embodiments is: in the first step, the organic solvent is an organic matter which is mutually soluble with the polyvinyl chloride. The other is the same as one of the first to fourth embodiments.
The sixth specific implementation mode: the difference between this embodiment and one of the first to fifth embodiments is: in the first step, the organic solvent is dichloromethane. The other is the same as one of the first to fifth embodiments.
The seventh embodiment: the difference between this embodiment and one of the first to sixth embodiments is: the dispersant in the second step is sodium dodecyl sulfate, tween-20 or OP-10; the addition amount of the dispersing agent is 0.5-5% of the mass of the aqueous phase solution. The other is the same as one of the first to sixth embodiments.
The specific implementation mode is eight: the present embodiment differs from one of the first to seventh embodiments in that: in the third step, the volume ratio of the oil phase solution to the water phase solution is 1: 3; and during high-speed stirring, controlling the rotating speed of the high-speed homogenizer to be 12000r/min, and stirring for 30-40 min. The other is the same as one of the first to seventh embodiments.
The specific implementation method nine: the present embodiment differs from the first to eighth embodiments in that: in the fourth step, the stabilizer solution is PVA water solution with the mass percentage content of 1%, and the volume ratio of the stabilizer solution to the oil-in-water emulsion is 1: 2. The rest is the same as the first to eighth embodiments.
The detailed implementation mode is ten: the present embodiment differs from one of the first to ninth embodiments in that: in the fourth step, the rotation speed of low-speed stirring is 600r/min, the stirring time is 4-4.5 h, and the temperature is increased to 40-42 ℃. The other is the same as one of the first to ninth embodiments.
The following examples were used to demonstrate the beneficial effects of the present invention:
the first embodiment is as follows:
the preparation method of the microcapsule type rapid curing agent with polyvinyl chloride as the wall material for epoxy resin in the embodiment comprises the following steps:
the core material of the microcapsule type rapid curing agent is a complex of 2-methylimidazole and copper bromide, and the wall material is polyvinyl chloride;
the method for preparing the microcapsule type rapid curing agent comprises the following steps:
mixing a complex of 2-methylimidazole and copper bromide and polyvinyl chloride, putting the mixture into 20mL of organic solvent dichloromethane, and performing ultrasonic dispersion and dissolution to obtain an oil phase solution; wherein the mass ratio of the complex of the 2-methylimidazole and the copper bromide to the polyvinyl chloride is 0.5: 1;
mixing lauryl sodium sulfate with 40mL of deionized water to obtain an aqueous phase solution; the mass percentage of the sodium dodecyl sulfate in the aqueous phase solution is 1 percent;
mixing the oil phase solution obtained in the step one and the water phase solution obtained in the step two, and stirring at a high speed by using a high-speed homogenizer, wherein the rotating speed of the high-speed homogenizer is controlled to be 12000r/min, and the stirring time is 30min, so as to obtain an oil-in-water emulsion; the volume ratio of the oil phase solution to the water phase solution is 1: 3;
fourthly, adding the oil-in-water emulsion obtained in the third step into a stabilizer solution, heating to 40 ℃, and stirring at a low speed, wherein the rotating speed of the low-speed stirring is 600r/min, and the stirring time is 4 hours, so as to obtain a solution containing a curing agent to form microcapsules; the stabilizer solution is PVA water solution with the mass percentage content of 1 percent, and the volume ratio of the stabilizer solution to the oil-in-water emulsion is 1: 2;
and fifthly, carrying out suction filtration on the solution containing the curing agent microcapsule obtained in the step four, and putting the precipitate after suction filtration into a vacuum drying oven for drying to obtain the microcapsule type rapid curing agent with the polyvinyl chloride as the wall material for the epoxy resin.
After the microcapsule-type rapid curing agent with polyvinyl chloride as the wall material for epoxy resin prepared in this embodiment is mixed with epoxy resin E-20 (the addition amount of the microcapsule-type rapid curing agent is 10 wt% of the epoxy resin), the mixture is cured at 140 ℃ for 30min, and the normal-temperature storage period of the prepared prepreg can reach more than 2 months.
Example two:
the preparation method of the microcapsule type rapid curing agent with polyvinyl chloride as the wall material for epoxy resin in the embodiment comprises the following steps:
the core material of the microcapsule type rapid curing agent is 2-methylimidazole, and the wall material is polyvinyl chloride;
the method for preparing the microcapsule type rapid curing agent comprises the following steps:
mixing 2-methylimidazole and polyvinyl chloride, putting the mixture into 20mL of organic solvent dichloromethane, and performing ultrasonic dispersion and dissolution to obtain an oil phase solution; wherein the mass ratio of the 2-methylimidazole to the polyvinyl chloride is 0.5: 1;
mixing lauryl sodium sulfate with 40mL of deionized water to obtain an aqueous phase solution; the mass percentage of the sodium dodecyl sulfate in the aqueous phase solution is 1 percent;
mixing the oil phase solution obtained in the step one and the water phase solution obtained in the step two, and stirring at a high speed by using a high-speed homogenizer, wherein the rotating speed of the high-speed homogenizer is controlled to be 12000r/min, and the stirring time is 30min, so as to obtain an oil-in-water emulsion; the volume ratio of the oil phase solution to the water phase solution is 1: 3;
fourthly, adding the oil-in-water emulsion obtained in the third step into a stabilizer solution, stirring at a low speed, heating to 40 ℃, wherein the rotating speed of the low-speed stirring is 600r/min, and the stirring time is 4 hours, so as to obtain a solution containing a curing agent to form microcapsules; the stabilizer solution is PVA water solution with the mass percentage content of 1 percent, and the volume ratio of the stabilizer solution to the oil-in-water emulsion is 1: 2;
and fifthly, carrying out suction filtration on the solution containing the curing agent microcapsule obtained in the step four, and putting the precipitate after suction filtration into a vacuum drying oven for drying to obtain the microcapsule type rapid curing agent with the polyvinyl chloride as the wall material for the epoxy resin.
After the microcapsule-type rapid curing agent with polyvinyl chloride as the wall material for epoxy resin prepared in this embodiment is mixed with epoxy resin E-20 (the addition amount of the microcapsule-type rapid curing agent is 10 wt% of the epoxy resin), the mixture is cured at 120 ℃ for 30min, and the normal-temperature storage period of the prepared prepreg can reach more than 2 months.
Example three:
the preparation method of the microcapsule type rapid curing agent with polyvinyl chloride as the wall material for epoxy resin in the embodiment comprises the following steps:
the core material of the microcapsule type rapid curing agent is 2-phenylimidazole, and the wall material is polyvinyl chloride;
the method for preparing the microcapsule type rapid curing agent comprises the following steps:
mixing 2-phenylimidazole and polyvinyl chloride, putting into 20mL of organic solvent dichloromethane, and performing ultrasonic dispersion and dissolution to obtain an oil phase solution; wherein the mass ratio of the 2-methylimidazole to the polyvinyl chloride is 1: 1;
mixing lauryl sodium sulfate with 40mL of deionized water to obtain an aqueous phase solution; the mass percentage of the sodium dodecyl sulfate in the aqueous phase solution is 1 percent;
mixing the oil phase solution obtained in the step one and the water phase solution obtained in the step two, and stirring at a high speed by using a high-speed homogenizer, wherein the rotating speed of the high-speed homogenizer is controlled to be 12000r/min, and the stirring time is 30min, so as to obtain an oil-in-water emulsion; the volume ratio of the oil phase solution to the water phase solution is 1: 3;
fourthly, adding the oil-in-water emulsion obtained in the third step into a stabilizer solution, stirring at a low speed, heating to 40 ℃, wherein the rotating speed of the low-speed stirring is 600r/min, and the stirring time is 4 hours, so as to obtain a solution containing a curing agent to form microcapsules; the stabilizer solution is PVA water solution with the mass percentage content of 1 percent, and the volume ratio of the stabilizer solution to the oil-in-water emulsion is 1: 2;
and fifthly, carrying out suction filtration on the solution containing the curing agent microcapsule obtained in the step four, and putting the precipitate after suction filtration into a vacuum drying oven for drying to obtain the microcapsule type rapid curing agent with the polyvinyl chloride as the wall material for the epoxy resin.
After the microcapsule-type rapid curing agent with polyvinyl chloride as the wall material for epoxy resin prepared in this example is mixed with epoxy resin E-51 (the addition amount of the microcapsule-type rapid curing agent is 10 wt% of the epoxy resin), the mixture is cured at 120 ℃ for 30min, and the normal-temperature storage period of the prepared prepreg can reach more than 2 months.

Claims (10)

1. A preparation method of a microcapsule type rapid curing agent taking polyvinyl chloride for epoxy resin as a wall material is characterized in that a core material of the microcapsule type rapid curing agent is an imidazole curing agent, and the wall material is polyvinyl chloride; the imidazole curing agent is imidazole, an imidazole derivative or a complex of an imidazole compound and copper bromide;
the method for preparing the microcapsule type rapid curing agent comprises the following steps:
mixing imidazole curing agents and polyvinyl chloride, putting the mixture into an organic solvent, and performing ultrasonic dispersion and dissolution to obtain an oil phase solution;
secondly, mixing a dispersing agent with deionized water to obtain an aqueous phase solution;
mixing the oil phase solution obtained in the step one and the water phase solution obtained in the step two, and stirring at a high speed by adopting a high-speed homogenizer to obtain an oil-in-water emulsion;
fourthly, adding the oil-in-water emulsion obtained in the third step into a stabilizer solution, heating and stirring at a low speed to obtain a solution containing a curing agent to form microcapsules;
and fifthly, carrying out suction filtration on the solution containing the curing agent microcapsule obtained in the step four, and putting the precipitate after suction filtration into a vacuum drying oven for drying to obtain the microcapsule type rapid curing agent with the polyvinyl chloride as the wall material for the epoxy resin.
2. The method for preparing the microcapsule-type rapid curing agent with polyvinyl chloride as a wall material for epoxy resin according to claim 1, wherein the imidazole derivative is 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, benzimidazole, 2-phenyl-4-methylimidazole or 2-ethyl-4-methylimidazole.
3. The preparation method of the microcapsule type rapid curing agent with polyvinyl chloride as a wall material for epoxy resin according to claim 1, characterized in that the complex of the imidazole compound and the copper bromide is prepared by mixing the imidazole compound and the copper bromide according to a molar ratio of 1: 1.
4. The preparation method of the microcapsule type rapid curing agent with polyvinyl chloride as a wall material for epoxy resin according to claim 1, wherein the mass ratio of the imidazole type curing agent to the polyvinyl chloride in the step one is (0.5-5): 1.
5. The method for preparing the microcapsule-type rapid curing agent with polyvinyl chloride as the wall material according to claim 1, wherein the organic solvent in the step one is an organic substance miscible with polyvinyl chloride.
6. The method for preparing the microcapsule-type rapid curing agent with polyvinyl chloride as the wall material for epoxy resin according to claim 1, wherein the organic solvent in the step one is dichloromethane.
7. The method for preparing the microcapsule type rapid curing agent with polyvinyl chloride as the wall material for epoxy resin according to claim 1, wherein the dispersant in the second step is sodium dodecyl sulfate, tween-20 or OP-10; the addition amount of the dispersing agent is 0.5-5% of the mass of the aqueous phase solution.
8. The preparation method of the microcapsule type rapid curing agent with polyvinyl chloride as wall material for epoxy resin according to claim 1, characterized in that the volume ratio of the oil phase solution and the water phase solution in the third step is 1: 3; and during high-speed stirring, controlling the rotating speed of the high-speed homogenizer to be 12000r/min, and stirring for 30-40 min.
9. The method for preparing the microcapsule type rapid curing agent with polyvinyl chloride as the wall material for epoxy resin according to claim 1, wherein the stabilizer solution in the fourth step is a PVA aqueous solution with a mass percentage of 1%, and the volume ratio of the stabilizer solution to the oil-in-water emulsion is 1: 2.
10. The preparation method of the microcapsule type rapid curing agent with polyvinyl chloride as wall material for epoxy resin as claimed in claim 1, wherein the rotation speed of the low-speed stirring in the fourth step is 600r/min, the stirring time is 4-4.5 h, and the temperature is raised to 40-42 ℃.
CN201911236872.7A 2019-12-05 2019-12-05 Preparation method of microcapsule type rapid curing agent with polyvinyl chloride as wall material for epoxy resin Pending CN110903464A (en)

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CN112011269A (en) * 2020-09-09 2020-12-01 长沙三思新材料科技有限公司 Double-component water-based long-acting anti-icing coating

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Publication number Priority date Publication date Assignee Title
CN111849336A (en) * 2020-08-26 2020-10-30 长沙三思新材料科技有限公司 Odorless aromatic two-component waterborne polyurethane coating
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