CN110899393A - Method for correcting space envelope forming envelope mold of thin-wall high-rib wallboard component - Google Patents
Method for correcting space envelope forming envelope mold of thin-wall high-rib wallboard component Download PDFInfo
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- CN110899393A CN110899393A CN201911177185.2A CN201911177185A CN110899393A CN 110899393 A CN110899393 A CN 110899393A CN 201911177185 A CN201911177185 A CN 201911177185A CN 110899393 A CN110899393 A CN 110899393A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D3/00—Straightening or restoring form of metal rods, metal tubes, metal profiles, or specific articles made therefrom, whether or not in combination with sheet metal parts
- B21D3/16—Straightening or restoring form of metal rods, metal tubes, metal profiles, or specific articles made therefrom, whether or not in combination with sheet metal parts of specific articles made from metal rods, tubes, or profiles, e.g. crankshafts, by specially adapted methods or means
Abstract
The invention relates to a method for correcting a space envelope forming envelope mold of a thin-wall high-rib wallboard component, which comprises the following steps of: s1, establishing a rectangular coordinate system; s2, determining the coordinate w (x, y, z) of any point in the envelope mode interference region and the corresponding interference plane equation Ax + By + Cz + D as 0, and calculating the maximum interference amount of the point; s3, determining a correction amount k and a point w after the point w is corrected according to the interference plane equation and the maximum interference amount in the step S2cCoordinate (x)c，yc，zc) Thereby correcting the interference region; s4, judging whether the envelope mould and the wallboard component after correction interfere with each other, and if so, correcting the area still having interference again by increasing the correction amount; and S5, repeating the step S4 until a non-interference envelope modulus is obtained. The envelope model correction method can eliminate the interference area on the envelope model and the wallboard component, and obtain the non-interference envelope model.
Description
Technical Field
The invention relates to the field of space envelope forming, in particular to a method for correcting a space envelope forming envelope mold of a thin-wall high-rib wallboard component.
Background
The thin-wall high-rib wallboard component has light weight and high bearing capacity, and is an important component of a storage box body, an airplane cabin body and a ship hull. However, the thin-wall high-rib wallboard component has complex geometric shape, large rib height-thickness ratio and large manufacturing difficulty, and the manufacturing method with high performance and high precision is always a hot point of research at home and abroad.
The space enveloping forming method is a new continuous local plastic forming method, and the blank is subjected to multi-pass local rolling forming through enveloping motion of an enveloping die, so that the thin-wall high-rib wallboard component is manufactured at high performance and low cost. However, in the space envelope forming process, the envelope mold and the wallboard member may interfere with each other, and after the interference between the envelope mold and the wallboard member, the forming accuracy of the formed wallboard member is reduced, and the surface quality is reduced. Therefore, in order to eliminate the interference between the enveloping die and the wallboard member and improve the forming accuracy and surface quality of the wallboard member, the spatial enveloping die needs to be modified. At present, no report about a method for correcting a space envelope forming envelope model of a thin-wall high-rib wallboard component exists.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a method for correcting a space enveloping forming enveloping die of a thin-wall high-rib wall plate component, which can eliminate interference areas on the enveloping die and the wall plate component and obtain a non-interference enveloping die.
The technical scheme adopted by the invention for solving the technical problems is as follows: a method for correcting space envelope forming enveloping die of a thin-wall high-rib wallboard component is constructed, and comprises the following steps:
s1, establishing a rectangular coordinate system; establishing a rectangular coordinate system O-xyz by taking the envelope central point of the envelope model as a coordinate origin O, taking a vertical axis passing through the coordinate origin as a z-axis and taking a horizontal plane where the coordinate origin O is located as an xOy plane;
s2, determining the coordinate w (x, y, z) of any point in the envelope mode interference region and the corresponding interference plane equation Ax + By + Cz + D as 0, and calculating the maximum interference amount delta at the pointmax；
S3, determining a correction amount k and a point w after the point w is corrected according to the interference plane equation and the maximum interference amount in the step S2cCoordinate (x)c，yc，zc) Thereby correcting the interference region;
s4, judging whether the envelope mould and the wallboard component after correction interfere with each other, and if so, correcting the area still having interference again by increasing the correction amount;
and S5, repeating the step S4 until a non-interference envelope modulus is obtained.
In the above scheme, the maximum interference amount ΔmaxIs shown in equation (1):
in the formula (I), the compound is shown in the specification,
is the envelope mode cone angle.
In the above scheme, the calculation equation of the correction amount k is shown in formula (2):
|k|＝Δmax+nΔk (2)
in the formula, k is a negative value when the plurality of involved areas are positioned on the outer side of the plane, and k is a positive value when the plurality of involved areas are positioned on the inner side of the plane; Δ k is an adjustment amount, and the smaller Δ k is, the higher correction precision is; n is the number of corrections.
In the above scheme, the corrected point wcCoordinate (x)c，yc，zc) As shown in equation (3).
The implementation of the space enveloping forming enveloping die correcting method for the thin-wall high-rib wallboard component has the following beneficial effects:
(1) eliminating interference areas on the enveloping die and the wall plate component by a thin-wall high-rib wall plate component space enveloping forming enveloping die correcting method to obtain an noninterference enveloping die;
(2) the method for correcting the space envelope forming envelope mold of the thin-wall high-rib wallboard component can improve the forming precision of the wallboard component, reduce surface defects, improve mechanical properties and prolong the service life;
(3) the correction quantity is determined through the maximum interference quantity, the times of envelope model correction can be reduced, and the correction efficiency is improved.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a flow chart of a modification process of a space enveloping forming enveloping die of a thin-wall high-rib wall plate;
FIG. 2 is a three-dimensional model of a thin-walled high-rib wallboard member;
FIG. 3 is a schematic view of point w on the envelope mold and the location of maximum interference of the wallboard member;
FIG. 4 is a three-dimensional model of an envelope model with interference cancellation.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
As shown in fig. 1, the method for modifying the space envelope forming envelope mold of the thin-wall high-rib wallboard component of the present invention comprises the following steps:
and S1, determining the correction principle of the space envelope forming envelope mold of the thin-wall high-rib wallboard component. Calculating the maximum interference amount of each point in the interference area in the same specific rectangular coordinate system, further determining the correction amount and the correction equation of each point, correcting the envelope mode interference area through the correction equation, if the interference area cannot be completely eliminated, increasing the correction amount of each point in the interference area which is not eliminated, correcting again, and repeating the steps until the interference area is completely eliminated, as shown in fig. 1.
And S2, establishing a rectangular coordinate system. And establishing a rectangular coordinate system O-xyz by taking the envelope central point of the envelope model as a coordinate origin O, taking a vertical axis passing through the coordinate origin as a z-axis and taking a horizontal plane where the coordinate origin O is positioned as an xOy plane, as shown in FIG. 2. The thin-wall high-rib wall plate is 140mm long, 140mm wide and 2mm thick in web plate, four ribs are arranged transversely and longitudinally, the rib thickness is 3mm, and the rib height is 20 mm.
S3, determining the coordinate w (-17.56, -17.56,13) of any point in the envelope mode interference region and the corresponding interference plane equation x + y + 35.12-0, and calculating the maximum interference quantity delta at the pointmaxAs shown in fig. 3. Determining a correction quantity and a point w after point w correction according to the interference plane equation and the maximum interference quantitycCoordinate (x)c，yc，zc) Thereby correcting the interference region;
s4, judging whether the envelope mould and the wallboard component after correction interfere with each other, and if so, correcting the area still having interference again by increasing the correction amount;
and S5, repeating the step S4 until a non-interference envelope modulus is obtained, as shown in FIG. 4.
Further, the cone angle of the envelope mode
Calculating the maximum interference quantity delta of the point w according to the formula (1)max＝0.47。
Further, the maximum interference amount ΔmaxWhen the adjustment amount Δ k is 0.0001, the correction order n is 1, and the interference region is outside the plane, the equation for calculating the correction amount k is shown in equation (2).
k＝-(Δmax+nΔk)＝-0.4701 (2)
Further, the corrected point wcCoordinate (x)c，yc，zc) As shown in equation (3).
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (4)
1. A method for correcting a space envelope forming envelope mold of a thin-wall high-rib wallboard component is characterized by comprising the following steps of:
s1, establishing a rectangular coordinate system; establishing a rectangular coordinate system O-xyz by taking the envelope central point of the envelope model as a coordinate origin O, taking a vertical axis passing through the coordinate origin as a z-axis and taking a horizontal plane where the coordinate origin O is located as an xOy plane;
s2, determining the coordinate w (x, y, z) of any point in the envelope mode interference region and the corresponding interference plane equation Ax + By + Cz + D as 0, and calculating the maximum interference amount delta at the pointmax；
S3, determining a correction amount k and a point w after the point w is corrected according to the interference plane equation and the maximum interference amount in the step S2cCoordinate (x)c，yc，zc) Thereby correcting the interference region;
s4, judging whether the envelope mould and the wallboard component after correction interfere with each other, and if so, correcting the area still having interference again by increasing the correction amount;
and S5, repeating the step S4 until a non-interference envelope modulus is obtained.
2. The method of claim 1, wherein the maximum interference amount Δ is a maximum interference amountmaxIs shown in equation (1):
in the formula (I), the compound is shown in the specification,
is the envelope mode cone angle.
3. The method for correcting the space envelope shaping envelope of the thin-walled high-strength wallboard component according to claim 2, wherein the equation for correcting the correction k is shown in formula (2):
|k|＝Δmax+nΔk (2)
in the formula, k is a negative value when the plurality of involved areas are positioned on the outer side of the plane, and k is a positive value when the plurality of involved areas are positioned on the inner side of the plane; Δ k is an adjustment amount, and the smaller Δ k is, the higher correction precision is; n is the number of corrections.
4. The method for modifying the spatial envelope shaping envelope of a thin-walled high-stiffness wallboard component of claim 3, wherein the modified point wcCoordinate (x)c，yc，zc) As shown in equation (3).
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113083974A (en) * | 2021-03-30 | 2021-07-09 | 武汉理工大学 | Rolling-flexible growth composite forming method for thin-wall grid rib cylinder part |
| CN113515817A (en) * | 2021-04-14 | 2021-10-19 | 武汉理工大学 | High-rib thin-wall component space envelope forming precision control method |
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