CN110890391A - Wafer level lens unit and manufacturing method thereof - Google Patents
Wafer level lens unit and manufacturing method thereof Download PDFInfo
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- CN110890391A CN110890391A CN201910990711.0A CN201910990711A CN110890391A CN 110890391 A CN110890391 A CN 110890391A CN 201910990711 A CN201910990711 A CN 201910990711A CN 110890391 A CN110890391 A CN 110890391A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 39
- 238000000465 moulding Methods 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 description 5
- 238000003848 UV Light-Curing Methods 0.000 description 4
- 238000001029 thermal curing Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention provides a wafer level lens unit and a manufacturing method thereof, wherein the wafer level lens unit comprises a substrate, a lens, a cofferdam and a CMOS image sensor chip; the lens and the cofferdam are arranged on the upper surface of the substrate, the cofferdam is formed at the periphery of the lens, and the lens and the cofferdam are of an integrally formed structure; the CMOS image sensor chip is arranged on the lower surface of the substrate, and is attached to the substrate through the DAF film. The invention has the advantages that when the lens is pressed, the cofferdam structure is directly pressed on the periphery of the edge of the lens, and the cofferdam is added on the periphery of the lens to play a role of protecting the lens; the lens and the cofferdam are manufactured by the coining process and are of an integrally formed structure, the yield of finished products is high, the consistency is good, and the miniaturization of the size of a lens unit is facilitated.
Description
Technical Field
The invention relates to the technical field of optics, in particular to a wafer level lens unit and a manufacturing method thereof.
Background
With the promotion of markets such as smart phones, security protection, automotive electronics and the like to the purchase demand of the camera, the camera industry is explosively upgraded, the market puts higher demands on the camera, and the trend of miniaturization of the camera makes a wafer level optical lens (WLO) attract attention.
When the existing wafer-level optical lens works, because no frame enclosing wall design exists at the periphery of the lens, the risk and the defect that the lens is damaged exist, and the yield of finished products is low.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention provides a wafer level lens unit, comprising: a substrate, a lens, a dam, a CMOS Image Sensor (CIS) chip; wherein,
the lens and the cofferdam are arranged on the upper surface of the substrate, the cofferdam is formed at the periphery of the lens, and the lens and the cofferdam are of an integrally formed structure;
the CMOS image sensor chip is disposed on the lower surface of the substrate, and the CMOS image sensor chip is bonded to the substrate through a daf (die attach film) film.
Preferably, the lens and the banks are formed by an embossing process from a curable material, which may be a UV curable material, a thermally curable material, or a combination thereof.
Preferably, the bank is an annular structure surrounding the lens.
Preferably, the height of the cofferdam is not lower than the height of the lens in order that the cofferdam can protect the lens.
Preferably, the cofferdam is designed to have a structure with a narrow upper part and a wide lower part, such as a trapezoid, a circular arc, etc.
In a preferable scheme, when the cofferdam is in a trapezoidal structure, two corners at the upper part of the cofferdam are arc corners.
Preferably, the substrate is a glass substrate.
The invention also provides a manufacturing method of the wafer-level lens unit, which comprises the following steps:
firstly, providing a cleaning substrate;
secondly, coating a curable material on the upper surface of the substrate, and preparing a plurality of lenses and cofferdams through coining processing;
thirdly, adhering a DAF film on the lower surface of the substrate;
fourthly, stacking a CMOS image sensor chip on the DAF film on the lower surface of the substrate;
and fifthly, cutting and singulating the structure formed in the fourth step along a preset cutting path to obtain the wafer level lens unit.
Preferably, the substrate is a glass substrate.
In a preferred embodiment, in the second step, a curable material is coated on the upper surface of the substrate by a dispensing device, an imprint template molding surface is used for applying pressure on the curable material, the imprint template molding surface has a predetermined imprint pattern to be transferred on the curable material, so as to form an uncured imprint structure, and the uncured imprint structure is subjected to curing treatment, such as thermal curing or UV curing or a combination of the thermal curing and the UV curing, so as to form a cured imprint structure, i.e. a plurality of lenses integrally molded and a cofferdam around each lens; wherein the curable material may be a UV curable material, a thermally curable material, or a combination thereof, the curable material being deformable, capable of being shaped by an external force applied thereto, and capable of hardening.
In the imprinting process, in order to facilitate the removal of the imprinting mold from the surface of the curable material and prevent the curable material from adhering to the molding surface of the imprinting mold, the cofferdam transferred by the molding surface of the imprinting mold is designed into a structure with a narrow upper part and a wide lower part, such as a trapezoid, an arc and the like.
Preferably, when the cofferdam is of a trapezoidal structure, the angle of the upper part of the cofferdam close to the lens is an arc angle.
Preferably, in the fifth step, the cutting mode includes laser cutting and mechanical cutting.
Compared with the prior art, the invention has the beneficial effects that:
1. when the lens is stamped, the cofferdam structure is directly stamped on the periphery of the edge of the lens, and the cofferdam is additionally arranged on the periphery of the lens to play a role in protecting the lens.
2. The lens and the cofferdam are manufactured by the coining process and are of an integrally formed structure, the yield of finished products is high, the consistency is good, and the miniaturization of the size of a lens unit is facilitated.
3. The cofferdam is designed into a structure with a narrow upper part and a wide lower part, adhesion of the curable material on the molding surface of the imprinting mold can be reduced or avoided through the design of an inclined surface or an arc surface, the imprinting mold can be favorably removed from the surface of the curable material, and the size precision of the lens and the cofferdam is ensured.
Drawings
Fig. 1 is a schematic structural diagram of a wafer level lens unit according to an embodiment of the invention.
Fig. 2-6 are schematic flow charts illustrating a method for manufacturing a wafer level lens unit according to an embodiment of the invention.
The following description of the reference numerals refers to the accompanying drawings:
1-a substrate; 2-a lens; 3, cofferdam; 4-DAF film; 5-CMOS image sensor chip; 6-single wafer level lens unit.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper surface", "lower surface", "periphery", "upper part", "lower part", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing technical solutions of the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Fig. 1 is a schematic structural diagram of a wafer level lens unit according to an embodiment of the invention. The wafer level lens unit comprises a substrate 1, a lens 2, a cofferdam 3 and a CMOS image sensor chip 5; the lens 2 and the bank 3 are disposed on the upper surface of the substrate 1, the bank 3 is formed on the periphery of the lens 2, and the lens 2 and the bank 3 are integrally formed. The CMOS image sensor chip 5 is disposed on the lower surface of the substrate 1, and the CMOS image sensor chip 5 is bonded to the substrate 1 through the DAF film 4.
In this embodiment, the substrate 1 is a glass substrate, the lenses 2 and the banks 3 are made of a curable material by an imprinting process, and the banks 3 are ring-shaped structures surrounding the lenses 2, wherein the curable material is selected from a UV curable material, a thermal curable material, or a combination thereof.
The height of the banks 3 is not lower than the height of the lenses 2 in order to achieve the effect of protecting the lenses.
Because the lens 2 and the cofferdam 3 are made of curable material by imprinting, in order to avoid adhesion of the curable material on the imprinting mold in the process of removing the imprinting mold, in the embodiment, the cofferdam 3 is designed into a trapezoidal structure with a narrow upper part and a wide lower part, the angle of the upper part of the cofferdam 3 close to the lens 2 is an arc angle, and the inclined plane design and the arc angle design of the side wall of the cofferdam 3 are beneficial to removing the imprinting mold from the surface of the curable material.
In another embodiment the weir 3 may be designed as a circular arc, the circular arc design also making it easier for the imprint mold to be removed from the surface of the curable material.
Referring to fig. 2 to 6, a method for manufacturing the wafer level lens unit will be further described.
A method for manufacturing a wafer level lens unit comprises the following steps:
first, a cleaning substrate 1 is provided, as shown in fig. 2.
Secondly, coating a curable material on the upper surface of the substrate 1, and preparing a plurality of lenses 2 and cofferdams 3 through embossing processing, as shown in fig. 3; the specific operation method comprises the following steps: applying a curable material on the upper surface of the substrate 1 by using a dispensing device, applying pressure on the curable material by using an imprint template molding surface, wherein the imprint template molding surface has a predetermined imprint pattern to transfer on the curable material to form an uncured imprint structure, and performing curing treatment, such as thermal curing or UV curing or combination of the thermal curing and the UV curing, on the uncured imprint structure to form a cured imprint structure, i.e. a plurality of lenses 2 integrally molded and a cofferdam 3 at the periphery of each lens 2. The curable material is deformable, capable of being shaped by an external force applied thereto and capable of hardening.
In the imprinting process of the second step, in order to facilitate the removal of the imprinting mold from the surface of the curable material and prevent the curable material from adhering to the molding surface of the imprinting mold, the cofferdam 3 for the transfer printing of the molding surface of the imprinting mold is designed to be a structure with a narrow upper part and a wide lower part, in this embodiment, the cofferdam 3 is trapezoidal, and the angle of the upper part of the cofferdam 3 adjacent to the lens 2 is an arc angle.
Thirdly, as shown in fig. 4, a DAF film 4 is adhered to the lower surface of the substrate 2.
Fourthly, as shown in fig. 5, a CMOS image sensor chip 5 is stacked on the DAF film 4 on the lower surface of the substrate 1.
And fifthly, as shown in fig. 6, cutting and singulating the structure formed in the fourth step along a preset cutting path (indicated by a dotted line in fig. 6) by means of laser cutting, mechanical cutting and the like to obtain single wafer-level lens units 6 separated from each other.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A wafer level lens unit, comprising: the device comprises a substrate, a lens, a cofferdam and a CMOS image sensor chip; wherein,
the lens and the cofferdam are arranged on the upper surface of the substrate, the cofferdam is formed at the periphery of the lens, and the lens and the cofferdam are of an integrally formed structure;
the CMOS image sensor chip is arranged on the lower surface of the substrate, and is attached to the substrate through the DAF film.
2. The wafer-level lens unit of claim 1, wherein the lens and the dam are formed of a curable material by a stamping process.
3. The wafer-level lens unit of claim 1, wherein the dam is a ring-shaped structure surrounding the lens.
4. The wafer-level lens unit of claim 1, wherein the height of the dam is not less than the height of the lens.
5. The wafer-level lens unit of claim 1, wherein the dam is designed to be a structure with a narrow upper portion and a wide lower portion.
6. The wafer-level lens unit of claim 1, wherein the dam is trapezoidal, and two corners of the upper portion of the dam are rounded.
7. A method for manufacturing a wafer level lens unit comprises the following steps:
firstly, providing a cleaning substrate;
secondly, coating a curable material on the upper surface of the substrate, and preparing a plurality of lenses and cofferdams through coining processing;
thirdly, adhering a DAF film on the lower surface of the substrate;
fourthly, stacking a CMOS image sensor chip on the DAF film on the lower surface of the substrate;
and fifthly, cutting and singulating the structure formed in the fourth step along a preset cutting path to obtain the wafer level lens unit.
8. The method as claimed in claim 7, wherein in the second step, a dispensing device is used to coat the curable material on the upper surface of the substrate, and the imprint template molding surface is used to press the curable material, the imprint template molding surface has a predetermined imprint pattern to transfer onto the curable material, so as to form an uncured imprint structure, and the uncured imprint structure is cured to form a plurality of integrally molded lenses and a bank around each lens.
9. The method of claim 8, wherein the curable material is a UV curable material, a thermally curable material, or a combination thereof, and wherein the curable material is deformable, shaped by an external force applied thereto, and capable of hardening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910990711.0A CN110890391A (en) | 2019-10-18 | 2019-10-18 | Wafer level lens unit and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910990711.0A CN110890391A (en) | 2019-10-18 | 2019-10-18 | Wafer level lens unit and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN110890391A true CN110890391A (en) | 2020-03-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910990711.0A Pending CN110890391A (en) | 2019-10-18 | 2019-10-18 | Wafer level lens unit and manufacturing method thereof |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040012698A1 (en) * | 2001-03-05 | 2004-01-22 | Yasuo Suda | Image pickup model and image pickup device |
| TWI267208B (en) * | 2006-01-18 | 2006-11-21 | Visera Technologies Co Ltd | Image sensor module |
| CN102023324A (en) * | 2009-09-16 | 2011-04-20 | 富士胶片株式会社 | Forming method of wafer scale lens array, wafer scale lens array, lens module and image pickup unit |
| CN102263112A (en) * | 2010-05-28 | 2011-11-30 | 鸿富锦精密工业（深圳）有限公司 | Image pickup module and manufacturing method thereof |
| CN103376527A (en) * | 2012-04-11 | 2013-10-30 | 全视技术有限公司 | Lens plate for wafer-level camera and method of manufacturing same |
| US20170312950A1 (en) * | 2016-04-28 | 2017-11-02 | Anteryon Wafer Optics B.V. | Replication tool |
| CN107863363A (en) * | 2017-11-20 | 2018-03-30 | 苏州晶方半导体科技股份有限公司 | Encapsulating structure of chip and preparation method thereof |
| CN108139507A (en) * | 2017-12-05 | 2018-06-08 | 深圳市汇顶科技股份有限公司 | The manufacturing method and lenticule of lenticule |
| CN108873119A (en) * | 2018-06-12 | 2018-11-23 | 华天慧创科技（西安）有限公司 | A kind of wafer level optical elements and preparation method thereof |
-
2019
- 2019-10-18 CN CN201910990711.0A patent/CN110890391A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040012698A1 (en) * | 2001-03-05 | 2004-01-22 | Yasuo Suda | Image pickup model and image pickup device |
| TWI267208B (en) * | 2006-01-18 | 2006-11-21 | Visera Technologies Co Ltd | Image sensor module |
| CN102023324A (en) * | 2009-09-16 | 2011-04-20 | 富士胶片株式会社 | Forming method of wafer scale lens array, wafer scale lens array, lens module and image pickup unit |
| CN102263112A (en) * | 2010-05-28 | 2011-11-30 | 鸿富锦精密工业（深圳）有限公司 | Image pickup module and manufacturing method thereof |
| CN103376527A (en) * | 2012-04-11 | 2013-10-30 | 全视技术有限公司 | Lens plate for wafer-level camera and method of manufacturing same |
| US20170312950A1 (en) * | 2016-04-28 | 2017-11-02 | Anteryon Wafer Optics B.V. | Replication tool |
| CN107863363A (en) * | 2017-11-20 | 2018-03-30 | 苏州晶方半导体科技股份有限公司 | Encapsulating structure of chip and preparation method thereof |
| CN108139507A (en) * | 2017-12-05 | 2018-06-08 | 深圳市汇顶科技股份有限公司 | The manufacturing method and lenticule of lenticule |
| CN108873119A (en) * | 2018-06-12 | 2018-11-23 | 华天慧创科技（西安）有限公司 | A kind of wafer level optical elements and preparation method thereof |
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