CN110887625A - Method for detecting sealing performance of electronic component - Google Patents

Method for detecting sealing performance of electronic component Download PDF

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Publication number
CN110887625A
CN110887625A CN201911034864.4A CN201911034864A CN110887625A CN 110887625 A CN110887625 A CN 110887625A CN 201911034864 A CN201911034864 A CN 201911034864A CN 110887625 A CN110887625 A CN 110887625A
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CN
China
Prior art keywords
electronic component
circuit board
detected
pressure
pressure value
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Withdrawn
Application number
CN201911034864.4A
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Chinese (zh)
Inventor
王武斌
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Xi'an Zhiqiang Technology Co Ltd
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Xi'an Zhiqiang Technology Co Ltd
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Publication date
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Priority to CN201911034864.4A priority Critical patent/CN110887625A/en
Publication of CN110887625A publication Critical patent/CN110887625A/en
Withdrawn legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M3/00Investigating fluid-tightness of structures
    • G01M3/02Investigating fluid-tightness of structures by using fluid or vacuum
    • G01M3/36Investigating fluid-tightness of structures by using fluid or vacuum by detecting change in dimensions of the structure being tested

Abstract

The invention relates to the technical field of electronic element detection, and discloses a method for detecting the sealing property of an electronic element, which comprises the following steps: 1) cleaning the whole circuit board, removing dust, impurities and the like on the outer surface of the whole circuit board, counting the number and the type of each electronic component on the whole circuit board, and placing the whole circuit board in a pressure chamber of an optical leak detector. According to the method for detecting the sealing performance of the electronic component, the circuit board is cleaned integrally, dust, sundries and the like on the outer surface of the circuit board are removed, the number and the type of each electronic component on the circuit board are counted integrally, the circuit board is placed integrally in a pressure chamber of an optical leak detector for measurement, the detection accuracy of equipment can be effectively improved, the influence of external factors on the detection result of the sealing performance of the electronic component is avoided, and the electronic component X1 which can bear the minimum pressure can be detected firstly.

Description

Method for detecting sealing performance of electronic component
Technical Field
The invention relates to the technical field of electronic element detection, in particular to a method for detecting the sealing property of an electronic component.
Background
The leak tightness of an electronic component refers to the leak tightness of a packaging structure of the electronic component, and is an important detection item during production, the performance of a product is directly influenced by the quality of the leak tightness, the surface state of the electronic component is changed if the leak tightness is poor, the performance of the electronic component is degraded, and external air moisture and the like enter the electronic component and corrode if the leak tightness is poor, so that the electronic component is subjected to fatal failure such as open circuit and the like.
However, when various kinds and a plurality of electronic components are mounted on a wiring board, the following problems are encountered, the circuit board is required to be detected after the screened qualified electronic components are welded on the circuit board, the electronic components on the circuit board still can be found to have the sealing defects during the detection, this may mean that the soldering process introduces a hermetic failure in one or some of the electronic components, when the circuit board fails in the using process, whether electronic components on the circuit board have sealing defects or not needs to be determined, if the electronic components are unqualified in sealing property, the electronic components need to be replaced, so that the circuit board works normally, in the above two cases, in order to detect the electronic components with the sealing defects, the electronic components need to be removed one by one and then detected by the existing method, which is time-consuming, labor-consuming and high in detection cost.
In the prior art CN 106052981B, a method for detecting the sealing performance of an electronic component mounted on a circuit board is proposed, which is time-saving, labor-saving, low in detection cost, and suitable for popularization and application, but this method cannot accurately detect the electronic component with a problem in sealing performance when the pressure is the minimum value, and is prone to errors, so that a method for detecting the sealing performance of an electronic component is proposed to solve the above-mentioned problem.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the method for detecting the sealing performance of the electronic component, which has the advantages of accurate detection result, high detection efficiency and the like, and solves the problems that the electronic component with the problem of sealing performance cannot be accurately detected when the pressure is the minimum value, and errors are easy to occur.
(II) technical scheme
In order to achieve the purposes of accurate detection result and high detection efficiency, the invention provides the following technical scheme: a method for detecting the sealing performance of an electronic component comprises the following steps:
1) cleaning the whole circuit board, removing dust, impurities and the like on the outer surface of the whole circuit board, counting the number and the type of each electronic component on the whole circuit board, and placing the whole circuit board in a pressure chamber of an optical leak detector;
2) according to the model counted in the step 1), carrying out applicability judgment, judging whether the detected electronic components on the circuit board meet R4/ET3>2.54 x 10-7mm/Pa, if the detected electronic components on the circuit board meet the requirement, meeting the subsequent detection step, debugging the pressurization pressure of a pressure chamber of the optical leak detector, wherein the pressure value is the minimum value of the pressure which can be borne by each electronic component;
3) according to the pressure value Y of the pressure chamber of the optical leak detector in the debugging step 2), the pressure value is the pressure value Y1 which can be borne by the smallest electronic component at the beginning, the electronic component X1 with the smallest bearing pressure is firstly detected, the pressure value is ensured to be Y1, whether each detected electronic component X1 meets the detection sensitivity requirement is judged under the test time, if yes, the detected electronic component X1 does not meet the detection sensitivity requirement, the testing time is prolonged until all the electronic components X1 reach the requirement of detection sensitivity, the detection time of the component is determined S1, all the electronic components to be detected are detected step by step in sequence, obtaining the time S and the minimum pressure value Y which are required to be detected by each different electronic component, and finally carrying out labeling and statistics on the time S and the pressure value Y which are required to be detected by each different electronic component and the model according to the size of the minimum pressure value;
4) the tester calculates the leak rate of each detected electronic component, and can carry out targeted review according to the obtained data, so that the accuracy and the efficiency of the detection result can be further improved.
Preferably, in the step 2), R is a minimum width of the inner space of the package, E is an elastic modulus of the package material, and T is a package thickness.
Preferably, the pressure chamber changes the internal air pressure thereof by introducing helium gas and reaches a pressurization pressure, the equivalent standard leakage rate LHe of each electronic component to the helium gas is calculated in the step 4), and after the equivalent standard leakage rate LHe of the electronic component to the helium gas under the helium gas is obtained, the equivalent standard leakage rate LHe is converted into the equivalent standard leakage rate L to the air according to a formula L ═ 2.67.
Preferably, the typical pressurization pressure X that each detected electronic component can bear is obtained by calculating the volume of the inner cavity of each detected electronic component on the circuit board and according to the volume of the inner cavity of each detected electronic component on the circuit board.
Preferably, the calculation basis of the experimenter in the step 4) is whether the target electronic component deforms in the pressurizing process to judge whether the sealing performance is good or not in the step 3).
(III) advantageous effects
Compared with the prior art, the invention provides the method for detecting the sealing performance of the electronic component, which has the following beneficial effects:
the method for detecting the sealing performance of the electronic components has the advantages that the whole circuit board is cleaned, dust, impurities and the like on the outer surface of the whole circuit board are removed, the number and the types of all the electronic components on the whole circuit board are counted, the whole circuit board is placed in a pressure chamber of an optical leak detector for measurement, the detection accuracy of equipment can be effectively improved, the influence of external factors on the detection result of the sealing performance of the electronic components is avoided, the electronic component X1 which can bear the minimum pressure is detected firstly, the pressure value is ensured to be Y1, whether all the detected electronic components X1 meet the detection sensitivity requirement or not is judged within the test time, if the detected electronic component X1 does not meet the detection sensitivity requirement, the test time is prolonged until all the electronic components X1 meet the detection sensitivity requirement, and the detection time S1 of the component is determined, gradually detect all wait to detect electronic components in proper order, and obtain time S and minimum pressure value Y that every different electronic components need detect, can be accurate detect out different electronic components' S leakproofness, the effectual efficiency that detects and the precision that detects that has improved, change its inside atmospheric pressure and reach pressurization pressure through letting in the helium through the pressure chamber, can effectively reduce the influence of external factor to the testing result, when pressure is the minimum, electronic component that the leakproofness can not be accurate the detection that detects has a problem, the problem that the error appears easily is carried.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A method for detecting the sealing performance of an electronic component comprises the following steps:
1) cleaning the whole circuit board, removing dust, impurities and the like on the outer surface of the whole circuit board, counting the number and the type of each electronic component on the whole circuit board, and placing the whole circuit board in a pressure chamber of an optical leak detector;
2) according to the model counted in the step 1), carrying out applicability judgment, judging whether the detected electronic components on the circuit board meet R4/ET3>2.54 × 10-7mm/Pa, if the detected electronic components are qualified, meeting the subsequent detection step, debugging the pressurization pressure of a pressure chamber of the optical leak detector, wherein the pressure value is the minimum value of the pressure which can be borne by each electronic component, R is the minimum width of the internal space of the package, E is the elastic modulus of the packaging material, and T is the thickness of the package;
3) according to the pressure value Y of the pressure chamber of the optical leak detector in the debugging step 2), the pressure value is the pressure value Y1 which can be borne by the smallest electronic component at the beginning, the electronic component X1 with the smallest bearing pressure is firstly detected, the pressure value is ensured to be Y1, whether each detected electronic component X1 meets the detection sensitivity requirement is judged in the testing time, if the detected electronic component X1 does not meet the detection sensitivity requirement, the testing time is prolonged until all the electronic components X1 meet the detection sensitivity requirement, the detection time S1 of the element is determined, all the electronic components to be detected are sequentially and gradually detected, the time S and the minimum pressure value Y which need to be detected by each different electronic component are obtained, and finally, the time S and the pressure value Y which need to be detected by each different electronic component and the model are labeled and counted according to the size of the minimum pressure value, calculating the cavity volume of each detected electronic component on the circuit board according to the typical pressurizing pressure X which can be born by each detected electronic component, and obtaining the typical pressurizing pressure which can be born by each electronic component according to the cavity volume of each detected electronic component on the circuit board;
4) the leakage rate of each detected electronic component is calculated by a tester, the tester calculates the leakage rate according to the step 3), whether the target electronic component deforms in the pressurizing process to judge whether the sealing performance is good or not is judged, meanwhile, the target electronic component can be checked in a targeted manner according to the obtained data, the accuracy and the high efficiency of the detection result can be further improved, the pressure chamber changes the internal air pressure by introducing helium gas and reaches the pressurizing pressure, the equivalent standard leakage rate LHe of each electronic component to the helium gas is calculated, and after the equivalent standard leakage rate LHe of the electronic component to the helium gas under the helium gas is obtained, the equivalent standard leakage rate L to the air is converted according to the formula L (LHe)/2.67.
The invention has the beneficial effects that: the method for detecting the sealing performance of the electronic components has the advantages that the whole circuit board is cleaned, dust, impurities and the like on the outer surface of the whole circuit board are removed, the number and the types of all the electronic components on the whole circuit board are counted, the whole circuit board is placed in a pressure chamber of an optical leak detector for measurement, the detection accuracy of equipment can be effectively improved, the influence of external factors on the detection result of the sealing performance of the electronic components is avoided, the electronic component X1 which can bear the minimum pressure is detected firstly, the pressure value is ensured to be Y1, whether all the detected electronic components X1 meet the detection sensitivity requirement or not is judged within the test time, if the detected electronic component X1 does not meet the detection sensitivity requirement, the test time is prolonged until all the electronic components X1 meet the detection sensitivity requirement, and the detection time S1 of the component is determined, gradually detect all wait to detect electronic components in proper order, and obtain time S and minimum pressure value Y that every different electronic components need detect, can be accurate detect out different electronic components' S leakproofness, the effectual efficiency that detects and the precision that detects that has improved, change its inside atmospheric pressure and reach pressurization pressure through letting in the helium through the pressure chamber, can effectively reduce the influence of external factor to the testing result, when pressure is the minimum, electronic component that the leakproofness can not be accurate the detection that detects has a problem, the problem that the error appears easily is carried.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. A method for detecting the sealing performance of an electronic component is characterized by comprising the following steps:
1) cleaning the whole circuit board, removing dust, impurities and the like on the outer surface of the whole circuit board, counting the number and the type of each electronic component on the whole circuit board, and placing the whole circuit board in a pressure chamber of an optical leak detector;
2) according to the model counted in the step 1), carrying out applicability judgment, judging whether the detected electronic components on the circuit board meet R4/ET3>2.54 x 10-7mm/Pa, if the detected electronic components on the circuit board meet the requirement, meeting the subsequent detection step, debugging the pressurization pressure of a pressure chamber of the optical leak detector, wherein the pressure value is the minimum value of the pressure which can be borne by each electronic component;
3) according to the pressure value Y of the pressure chamber of the optical leak detector in the debugging step 2), the pressure value is the pressure value Y1 which can be borne by the smallest electronic component at the beginning, the electronic component X1 with the smallest bearing pressure is firstly detected, the pressure value is ensured to be Y1, whether each detected electronic component X1 meets the detection sensitivity requirement is judged under the test time, if yes, the detected electronic component X1 does not meet the detection sensitivity requirement, the testing time is prolonged until all the electronic components X1 reach the requirement of detection sensitivity, the detection time of the component is determined S1, all the electronic components to be detected are detected step by step in sequence, obtaining the time S and the minimum pressure value Y which are required to be detected by each different electronic component, and finally carrying out labeling and statistics on the time S and the pressure value Y which are required to be detected by each different electronic component and the model according to the size of the minimum pressure value;
4) the tester calculates the leak rate of each detected electronic component, and can carry out targeted review according to the obtained data, so that the accuracy and the efficiency of the detection result can be further improved.
2. The method for detecting the sealing property of the electronic component as claimed in claim 1, wherein in the step 2), R is a minimum width of an inner space of the package, E is an elastic modulus of the package material, and T is a thickness of the package.
3. The method for detecting the leak tightness of the electronic component according to claim 1, wherein the pressure chamber is filled with helium gas to change the internal air pressure thereof and reach the pressurization pressure, the equivalent standard leak rate LHe of each electronic component to the helium gas is calculated in the step 4), and after the equivalent standard leak rate LHe of the electronic component to the helium gas under the helium gas is obtained, the equivalent standard leak rate LHe is converted into the equivalent standard leak rate L to the air according to the formula L ═ LHe)/2.67.
4. The method for detecting the leak tightness of the electronic component according to claim 1, wherein the typical pressurizing pressure X that each detected electronic component can bear is obtained by calculating the volume of the inner cavity of each detected electronic component on the circuit board and according to the volume of the inner cavity of each detected electronic component on the circuit board.
5. The method for detecting the sealing performance of the electronic component as claimed in claim 1, wherein the calculation of the step 4) is based on whether the target electronic component is deformed during the pressurization process to determine whether the sealing performance is good or not according to the calculation of the experimenter in the step 3).
CN201911034864.4A 2019-10-29 2019-10-29 Method for detecting sealing performance of electronic component Withdrawn CN110887625A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911034864.4A CN110887625A (en) 2019-10-29 2019-10-29 Method for detecting sealing performance of electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911034864.4A CN110887625A (en) 2019-10-29 2019-10-29 Method for detecting sealing performance of electronic component

Publications (1)

Publication Number Publication Date
CN110887625A true CN110887625A (en) 2020-03-17

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105675224A (en) * 2016-01-21 2016-06-15 工业和信息化部电子第五研究所 Detection method of packaged shell sealing detection system
CN106052981A (en) * 2016-08-01 2016-10-26 中国航空综合技术研究所 Sealing detection method for electronic component installed on circuit board
CN107976287A (en) * 2017-11-19 2018-05-01 商亚锋 A kind of method for conducting leak test of electronic component

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105675224A (en) * 2016-01-21 2016-06-15 工业和信息化部电子第五研究所 Detection method of packaged shell sealing detection system
CN106052981A (en) * 2016-08-01 2016-10-26 中国航空综合技术研究所 Sealing detection method for electronic component installed on circuit board
CN107976287A (en) * 2017-11-19 2018-05-01 商亚锋 A kind of method for conducting leak test of electronic component

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