CN110883705A - Conductive resin binder grinding wheel and preparation process thereof - Google Patents
Conductive resin binder grinding wheel and preparation process thereof Download PDFInfo
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- CN110883705A CN110883705A CN201911266448.7A CN201911266448A CN110883705A CN 110883705 A CN110883705 A CN 110883705A CN 201911266448 A CN201911266448 A CN 201911266448A CN 110883705 A CN110883705 A CN 110883705A
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- grinding wheel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
- B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
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- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention designs a conductive resin bond grinding wheel based on the use requirement and the manufacturing method of a resin bond diamond grinding wheel, which is prepared by the following raw materials, by weight, 10% -55% of bismaleimide resin powder, 17% -45% of antimony powder, 12% -20% of green silicon carbide micro powder, 1% -5% of a silane coupling agent, and the balance of diamond powder. Compared with a metal bond diamond grinding wheel, the special-shaped diamond grinding wheel has the advantages of greatly improving the grinding sharpness, the surface quality of a workpiece and the like, and compared with a resin bond diamond grinding wheel, the special-shaped diamond grinding wheel has the advantages of high-efficiency and high-precision machining on a special-shaped working surface so as to meet the requirements of high-efficiency and high-precision machining on materials such as ultra-precision numerical control alloy cutters and special-shaped precision glass/ceramic electronic components.
Description
Technical Field
The invention belongs to the technical field of diamond grinding wheels, and particularly relates to a conductive resin bond grinding wheel and a preparation process thereof.
Background
The resin bond diamond grinding wheel has the advantages of good self-sharpening property, sharpness, heat resistance, acid resistance, micro elasticity and the like, and is widely applied to the field of fine grinding processing of workpieces made of materials such as hard alloy, stone, ceramic, glass, rare earth metal, nonferrous metal and the like. With the maturity, popularization and application of the 5G technology, advanced mobile communication technology and precise electronic technology also put higher requirements on matched hardware facilities, and further, the technical requirements on elements such as ultra-precise numerical control hard alloy cutters, special-shaped precise glass/ceramic electronic components and the like required by related accessories are greatly improved.
The grinding processing of materials such as special-shaped and precise hard alloy cutters, glass/ceramics and the like which are common in the market at present is generally available by two bonding agents, namely diamond grinding wheels. The resin binder diamond grinding wheel has good self-sharpening property, sharpness and micro elasticity, so that the advantages of high grinding efficiency, good surface quality, high yield and the like can be taken into consideration when a hard and brittle material is processed; however, the resin grinding wheel has the problems that the dimensional accuracy of the special-shaped (including concave, arc and other molded surfaces) is poor, the sub-micron-scale dimension and the form and position accuracy are difficult to achieve through conventional finishing, and the batch stable production of the special-shaped electronic components is difficult to achieve. The metal bond grinding wheel can control the form and position precision of the special-shaped grinding surface to be in a submicron level due to good conductivity, and can meet the special grinding processing requirement of special-shaped precise electronic components; however, the metal grinding wheel has high hardness of the binding agent and high rigidity of the grinding wheel layer, and has certain limitation in the application of soft elastic grinding.
Disclosure of Invention
The invention designs a conductive resin bond diamond grinding wheel based on the use requirement and the manufacturing method of the resin bond diamond grinding wheel, has the advantages of greatly improving and improving the grinding sharpness, the surface quality of a workpiece and the like compared with a metal bond diamond grinding wheel, and has the advantages of high-efficiency and high-precision processing on a special-shaped working surface compared with the resin bond diamond grinding wheel so as to meet the high-efficiency and high-precision processing requirements of materials such as an ultra-precision numerical control alloy cutter, special-shaped precision glass/ceramic electronic components and the like.
The invention adopts the following technical scheme:
the conductive resin bond grinding wheel is prepared from 10-55 wt% of bismaleimide resin powder, 17-45 wt% of antimony powder, 12-20 wt% of green silicon carbide micropowder, 1-5 wt% of silane coupling agent and the balance of diamond powder.
Preferably, the particle size of the bismaleimide resin powder is 15-35 μm.
Preferably, the particle size of the antimony powder is 35-55 μm; the grinding object of the invention is a diamond grinding wheel, the grinding object is a hard and brittle material such as alloy, stone, glass, ceramic and the like, the antimony powder plays a main role in the invention of electric conduction, and meanwhile, when the grinding object is hard alloy, the main components of the hard alloy material are metal elements such as cobalt, tungsten and the like, and the existence of the similar elements can seriously influence the grinding sharpness and the wear resistance of the grinding wheel. Therefore, the diamond grinding wheel of the invention adopts antimony powder.
Preferably, the particle size of the green silicon carbide micro powder is 3-6 μm.
Preferably, the silane coupling agent is a silane coupling agent A171, and the molecular structure of the silane coupling agent has a vinyl functional group containing an unsaturated double bond structure and three hydrolyzable alkoxy groups, so that the bonding strength of the diamond and the organic polymer material can be improved through bidirectional chemical reaction of the diamond and the organic polymer material, and the improvement of the profile retention capability of the diamond grinding wheel with the complex profile is facilitated.
Preferably, the diamond powder has a particle size of 45 to 53 μm.
The preparation process of the conductive resin binder grinding wheel is characterized by comprising the following steps of:
(1) mixing the silane coupling agent and methanol in a weight ratio of 1:10-1:30, and uniformly stirring to prepare a wetting agent; the temperature of the coupling agent and the methanol is preferably 70 ℃, the 70 ℃ is beneficial to the release of the methanol and the coupling agent in the blending process to reflect the activity, the silane coupling agent is ineffective due to overhigh temperature, the methanol is volatilized too fast, and the activity of the mixture is difficult to ensure due to overlow temperature; the subsequent mixing step is likewise preferably 70 ℃;
(2) uniformly mixing the diamond powder and the wetting agent prepared in the step (1) in a weight ratio of 100-120:1, and drying to constant weight;
(3) uniformly mixing the antimony powder and the wetting agent prepared in the step (1) in a weight ratio of 100-120:1, and drying to constant weight;
(4) uniformly mixing the green silicon carbide micro powder and the wetting agent prepared in the step (1) according to the weight ratio of 100-120:1, and then drying to constant weight;
(5) mixing the bismaleimide resin powder, the antimony powder treated in the step (3) and the green silicon carbide powder treated in the step (4), passing through a 180# standard screen, and uniformly mixing in a three-dimensional mixer to form a uniform binder system;
(6) and (3) uniformly mixing the diamond powder treated in the step (2) and the bonding agent system obtained in the step (5) in a three-dimensional mixer, and passing through a standard 150# screen for multiple times to finish mixing for later use.
(7) Pressing the mixed material obtained in the step (6) on a hot press to finish the pressing of the grinding material layer of the superhard diamond grinding wheel;
(8) the high-strength steel matrix containing the mounting hole required by the invention is prepared by using a 40Cr steel plate through the working procedures of turning, milling, clamping and the like;
(9) and (3) bonding the abrasive layer obtained in the step (7) and the high-strength steel substrate obtained in the step (8) together to prepare the conductive resin binder grinding wheel.
The invention has the following beneficial effects:
the invention aims to design and manufacture a conductive resin bond grinding wheel, which not only ensures the grinding wheel characteristics of high sharpness and micro elasticity of a resin bond, but also can utilize the additional conductivity of the resin bond to realize the electro-machining and trimming of the complex profile of the resin grinding wheel and the effective combination of the electro-machining and grinding of materials difficult to machine, thereby further meeting the high-efficiency and batch machining of high-precision and special-shaped electronic components, meeting the development trend of the application of the current advanced communication technology industry, and having great practical significance for the technical improvement in the field of diamond grinding wheels.
In order to realize the conductivity of the grinding wheel, antimony powder is selected, the microstructure and chemical properties of the antimony powder meet the requirements of electric spark machining and matching with a diamond grinding wheel, and the structural design of a special-shaped working layer of the resin binder diamond grinding wheel and the requirements of high-precision and high-wear resistance machining of materials such as alloy and precise ceramic can be met. And the 300-mesh 5N-grade antimony powder and the high-grade (99.999%) antimony powder with similar particle size to the diamond powder can well ensure the strength of the grinding wheel while improving the conductivity of the resin grinding wheel, so that the grinding wheel can ensure the profile retention capacity of the grinding wheel on a special-shaped working surface, and the grinding wheel with a sharp-angled shape is prevented from stripping and falling off in the processing process.
Furthermore, in order to ensure that the grinding wheel has good profile retention capacity during grinding operation, a micropowder-grade (W5) green silicon carbide filler is introduced, and a coupling agent is adopted to carry out surface treatment on the green silicon carbide, the diamond and the antimony powder so as to increase the binding power among the resin powder, the green silicon carbide micropowder, the diamond and the antimony powder and ensure the strength and the profile retention capacity of the grinding wheel during grinding processing of the special-shaped workpiece.
Therefore, the invention selects the diamond abrasive particles with proper grade and granularity, adds the metal powder capable of improving the shape retention and the electrical conductivity of the resin diamond grinding wheel, designs the high-strength resin binder formula system, ensures that the diamond grinding wheel designed by the invention has the capacity of electric processing by the existence of the components, ensures that the diamond grinding wheel has the process requirement of electric processing, avoids the problem that secondary clamping influences the precision of the grinding wheel, can realize the good shape retention and the machinability of the grinding wheel, manufactures the resin binder diamond grinding wheel with good sharpness, shape retention and special-shaped working surface, and meets the precision processing requirement of objects such as special-shaped alloys, precise glass/ceramic electronic components and the like.
Drawings
FIG. 1 is a cross-sectional view of a superhard grinding wheel design according to the present invention;
FIG. 2 is a detail view of the profile at I in FIG. 1;
wherein, the material comprises 1-superhard abrasive layer, 2-high strength steel substrate and 3-mounting hole.
Detailed Description
In order to make the technical purpose, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention are further described below with reference to the accompanying drawings and specific embodiments.
Examples 1 to 4 preferably use the following starting materials:
ultra-fine toughened polyimide resin (15-35 μm) produced by Wuhan Taige corporation;
zhengzhou abrasive grinding tool 3S diamond powder (270/325) developed by the institute of abrasives grinding limited;
5N antimony powder (300 mesh) purchased from Sichuan high-purity materials science and technology Limited;
white pigeon group limited purchases green silicon carbide powder (W5);
silane coupling agent (A171) available from Oncui chemical Co., Ltd, Nanjing.
The following grinding wheel manufacturing process is adopted in the embodiments 1 to 4, and the specific steps are as follows:
(1) mixing the coupling agent with methanol in a weight ratio of 1:20, and uniformly stirring at 70 ℃ to prepare a wetting agent;
(2) uniformly mixing the diamond abrasive and the wetting agent prepared in the step (1) in a weight ratio of 120:1, and drying at 70 ℃ to constant weight;
(3) uniformly mixing antimony powder and the wetting agent prepared in the step (1) in a weight ratio of 120:1, and drying at 70 ℃ to constant weight;
(4) uniformly mixing the green silicon carbide micro powder and the wetting agent prepared in the step (1) according to the weight ratio of 120:1, and then drying the mixture at 70 ℃ to constant weight;
(5) mixing bismaleimide resin powder with the antimony powder treated in the step (3) and the green silicon carbide micro powder treated in the step (4), passing through a 180# standard screen, and uniformly mixing in a three-dimensional mixer to form a uniform binder system;
(6) uniformly mixing the diamond abrasive processed in the step (2) and the bonding agent system processed in the step (5) in a three-dimensional mixer, and passing through a 150# standard screen for three times to finish mixing;
(7) pressing the mixed material obtained in the step (6) on a hot press to finish the pressing of the grinding material layer of the superhard diamond grinding wheel;
(8) the high-strength steel matrix containing the mounting hole required by the invention is prepared by using a 40Cr steel plate through the working procedures of turning, milling, clamping and the like;
(9) bonding the abrasive layer obtained in the step (7) and the high-strength steel substrate obtained in the step (8) together to prepare a semi-finished grinding wheel;
(10) then manufacturing a dual-shape copper electrode according to the shape required by the grinding wheel;
(11) mounting the grinding wheel semi-finished product manufactured in the step (9) and the copper electrode manufactured in the step (10) to electric spark dressing equipment, and electrically dressing through contact of the grinding wheel semi-finished product and the copper electrode to obtain the resin binder grinding wheel with the required complex profile; the profiled surfaces prepared in this example (as shown in fig. 1 and 2) are merely illustrative, and profiled surfaces of any desired shape can be prepared using the formulations of the present invention;
(12) and (4) cleaning and packaging the grinding wheel product obtained in the step (11), and finishing the manufacturing.
The steps 7 to 12 are not improvement points of the invention, and the conventional process for manufacturing the grinding wheel is adopted.
The diamond grinding wheel prepared by the process can meet the technical requirement of deviation of the profile arc degree of the grinding wheel below 0.05mm, and has good grinding performance, wear resistance, self-sharpening performance and profile holding capacity in the grinding application process.
The following is a detailed description of specific formulation examples:
example 1
55% of bismaleimide resin powder, 15% of 3S diamond powder, 17% of 5N antimony powder, 12% of green silicon carbide micro powder and 1% of coupling agent; the conductive resin binder grinding wheel is prepared by the process, and the resistivity of the grinding wheel is 0.78 multiplied by 10 after tests6Omega cm, the precision of the special-shaped arc is 0.100mm, and the workpiece is burnt and the abrasion resistance is poor during grinding.
Example 2
10% of bismaleimide resin powder, 20% of 3S diamond powder, 45% of 5N antimony powder, 20% of green silicon carbide micro powder and 5% of coupling agent; the conductive resin binder grinding wheel is prepared by the process, and the resistance of the grinding wheel is testedRate 1.12X 103Omega cm, the precision of the special-shaped arc is 0.050mm, and the grinding wheel structure is peeled off and the abrasion resistance is poor during grinding.
Example 3
21% of bismaleimide resin powder, 35% of 3S diamond powder, 28% of 5N antimony powder, 14% of green silicon carbide micro powder and 2% of coupling agent; the conductive resin binder grinding wheel is prepared by the process, and the resistivity of the grinding wheel is 0.55 multiplied by 10 after tests5Omega cm, the precision of the special-shaped arc is 0.070mm, the grinding wheel is good in sharpness during grinding, and the abrasion resistance is good even if the grinding wheel structure is peeled off.
Example 4
16% of bismaleimide resin powder, 31% of 3S diamond powder, 39% of 5N antimony powder, 12% of green silicon carbide micro powder and 2% of coupling agent; the conductive resin binder grinding wheel is prepared by the process, and the resistivity of the grinding wheel is 0.92 multiplied by 10 after tests4Omega cm, the precision of the special-shaped arc is 0.040mm, the grinding wheel is good in sharpness during grinding, the workpiece is not burnt, the grinding wheel layer is not peeled off, and the wear resistance is excellent.
The CBN grinding wheels designed according to different formula ratios are different in performance in the electric machining process of the same process, the CBN grinding wheels designed according to different formula ratios do not meet the grinding requirements of the same working condition, the formula is selected according to the accuracy requirement of ① use conditions on the grinding wheels, and the ② sharpness requirement.
Finally, it should be noted that: the above embodiments are merely illustrative and not restrictive of the technical solutions of the present invention, and any equivalent substitutions and modifications or partial substitutions made without departing from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.
Claims (7)
1. The conductive resin binder grinding wheel is characterized by being prepared from, by weight, 10% -55% of bismaleimide resin powder, 17% -45% of antimony powder, 12% -20% of green silicon carbide micro powder, 1% -5% of a silane coupling agent and the balance diamond powder.
2. The electrically conductive resin bond grinding wheel according to claim 1, wherein the particle size of the bismaleimide resin powder is 15 to 35 μm.
3. The electrically conductive resin bond grinding wheel according to claim 1, wherein the particle size of the antimony powder is 35-55 μm.
4. The conductive resinoid bond wheel of claim 1, wherein the green silicon carbide micropowder has a particle size of 3-6 μ ι η.
5. The electrically conductive resin bond grinding wheel as in claim 1, wherein said silane coupling agent is silane coupling agent a 171.
6. The electrically conductive resin bond grinding wheel according to claim 1, wherein the diamond powder has a particle size of 45-53 μm.
7. The process for preparing the conductive resin bonded grinding wheel according to claims 1 to 6, comprising the steps of:
(1) mixing the silane coupling agent and methanol in a weight ratio of 1:10-1:30, and uniformly stirring to prepare a wetting agent;
(2) uniformly mixing the diamond powder and the wetting agent prepared in the step (1) in a weight ratio of 100-120:1, and drying to constant weight;
(3) uniformly mixing the antimony powder and the wetting agent prepared in the step (1) in a weight ratio of 100-120:1, and drying to constant weight;
(4) uniformly mixing the green silicon carbide micro powder and the wetting agent prepared in the step (1) according to the weight ratio of 100-120:1, and then drying to constant weight;
(5) mixing the bismaleimide resin powder, the antimony powder treated in the step (3) and the green silicon carbide powder treated in the step (4), sieving, and uniformly mixing to form a uniform binder system;
(6) and (3) uniformly mixing the diamond powder treated in the step (2) with the bonding agent system obtained in the step (5), and sieving to finish mixing materials for later use.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911266448.7A CN110883705A (en) | 2019-12-11 | 2019-12-11 | Conductive resin binder grinding wheel and preparation process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911266448.7A CN110883705A (en) | 2019-12-11 | 2019-12-11 | Conductive resin binder grinding wheel and preparation process thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0773088A1 (en) * | 1995-11-08 | 1997-05-14 | Lam-Plan | Hone and manufacturing of the same |
| CN1589189A (en) * | 2001-11-21 | 2005-03-02 | 圣戈本磨料股份有限公司 | Porous abrasive tool and method for making the same |
| CN1943949A (en) * | 2006-10-26 | 2007-04-11 | 张付庭 | Composite conductive cutting sheet |
| CN108393792A (en) * | 2017-02-06 | 2018-08-14 | 蓝思科技（长沙）有限公司 | Active filler pore creating material, the resin abrasive tools and preparation method thereof containing this pore creating material |
| CN110202490A (en) * | 2019-06-26 | 2019-09-06 | 郑州磨料磨具磨削研究所有限公司 | A kind of carbide chip periphery mill hard grinding wheel and preparation method thereof |
-
2019
- 2019-12-11 CN CN201911266448.7A patent/CN110883705A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0773088A1 (en) * | 1995-11-08 | 1997-05-14 | Lam-Plan | Hone and manufacturing of the same |
| CN1589189A (en) * | 2001-11-21 | 2005-03-02 | 圣戈本磨料股份有限公司 | Porous abrasive tool and method for making the same |
| CN1943949A (en) * | 2006-10-26 | 2007-04-11 | 张付庭 | Composite conductive cutting sheet |
| CN108393792A (en) * | 2017-02-06 | 2018-08-14 | 蓝思科技（长沙）有限公司 | Active filler pore creating material, the resin abrasive tools and preparation method thereof containing this pore creating material |
| CN110202490A (en) * | 2019-06-26 | 2019-09-06 | 郑州磨料磨具磨削研究所有限公司 | A kind of carbide chip periphery mill hard grinding wheel and preparation method thereof |
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Application publication date: 20200317 |
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