CN110879653A - Heat abstractor is used in computer software development - Google Patents
Heat abstractor is used in computer software development Download PDFInfo
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- CN110879653A CN110879653A CN201911106436.8A CN201911106436A CN110879653A CN 110879653 A CN110879653 A CN 110879653A CN 201911106436 A CN201911106436 A CN 201911106436A CN 110879653 A CN110879653 A CN 110879653A
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- wall
- pipe
- mounting
- heat dissipation
- test box
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation device for computer software development, which comprises a test box, wherein the outer walls of two sides of the test box are respectively provided with a mounting groove, the inner wall of one side of each mounting groove is provided with a mounting port, the inner walls of the two mounting ports are respectively provided with a heat dissipation mechanism, each heat dissipation mechanism comprises a mounting pipe, the inner walls of two sides of each mounting pipe are respectively provided with a same threaded sleeve, the inner wall of each threaded sleeve is in threaded connection with a threaded pipe, the outer wall of the top of each threaded pipe is provided with a connecting pipe, the outer wall of the top of each connecting pipe is sleeved with a dust cover, the outer wall of each connecting pipe is sleeved with a spring, and one end of each. According to the invention, through the matching between the sealing plug in the heat dissipation mechanism and the conical tube, the heat dissipation mechanism is convenient to open and close, the situation that dust in the test box is generated when the test box is not used is avoided, and then the heat of the test box is convenient to dissipate through the matching between the fan and the heat conducting plate.
Description
Technical Field
The invention relates to the technical field of software development, in particular to a heat dissipation device for computer software development.
Background
Software development is the process of building a software system or software parts in a system according to user requirements. Software development is a system engineering that includes requirement capture, requirement analysis, design, implementation, and testing. Software is typically implemented in a programming language. Development is typically possible using software development tools. Software is divided into system software and application software, and includes not only programs that can be run on a computer, but files related to these programs are also generally considered to be part of the software. The general process of the software design idea and method includes the algorithm and method for designing the function and implementation of the software, the overall structural design and module design of the software, programming and debugging, program joint debugging and testing, and writing and submitting the program.
Software is required to be tested repeatedly in the development process of computer software, a test device can generate a large amount of heat in the process of overweight test of the software, and the heat is discharged in time to cause the service life of an electric element to be reduced.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a heat dissipation device for computer software development.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a heat abstractor for computer software development, includes the test box, the mounting groove has all been seted up to the both sides outer wall of test box, and the installing port has been seted up to one side inner wall of two mounting grooves, two the inner wall of installing port all is provided with heat dissipation mechanism, heat dissipation mechanism is including the installation pipe, the both sides inner wall of installation pipe is provided with same thread bush, and the inner wall spiro union of thread bush has the screwed pipe, the top outer wall of screwed pipe is provided with the connecting pipe, the dust cover has been cup jointed to connecting pipe top outer wall, the outer wall of connecting pipe has cup jointed the spring, and the one end of spring passes through the bolt fastening on the top inner wall of installation pipe, the connecting rod has all been welded to the both sides of screwed pipe bottom outer wall, and two connecting rod bottom outer walls pass through the bolt fastening have.
Preferably, the inner walls of the two sides of the installation pipe are provided with the same conical pipe, and the specification of the conical pipe is matched with that of the sealing plug.
Preferably, the outer wall of the top of the test box is provided with a rectangular opening, and the inner wall of one side of the rectangular opening is hinged with a box door.
Preferably, the inner walls of the two sides of the test box are fixed with the same mesh plate through bolts, and the outer walls of the bottom of the mesh plate are provided with heat conducting plates distributed equidistantly.
Preferably, the outer wall of the heat conducting plate is provided with through holes distributed at equal intervals, and fans are fixed on two sides of the outer wall of the bottom of the mesh plate through bolts.
Preferably, the fan is connected with a switch through a wire, and the switch is connected with a controller through a wire.
The invention has the beneficial effects that:
this heat abstractor for computer software development, through set up heat dissipation mechanism in the both sides of test box, through the cooperation between the sealing plug in the heat dissipation mechanism and the toper pipe, be convenient for carry out the switch to heat dissipation mechanism, the incasement and then the dust when avoiding the test box not using, the cooperation between rethread fan and the heat-conducting plate is convenient for dispel the heat to the test box.
Drawings
FIG. 1 is a schematic cross-sectional view of a heat dissipation device for computer software development according to the present invention;
FIG. 2 is a schematic front view of a heat dissipation device for developing computer software according to the present invention;
fig. 3 is a schematic structural diagram of a heat dissipation mechanism of a heat dissipation apparatus for computer software development according to the present invention.
In the figure: the test box comprises a test box 1, a box cover 2, a heat dissipation mechanism 3, a mesh plate 4, a heat conduction plate 5, a fan 6, a mounting pipe 7, a threaded sleeve 8, a threaded pipe 9, a connecting pipe 10, a spring 11, a connecting rod 12, a sealing plug 13, a conical pipe 14 and a dust cover 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-3, a heat dissipation device for computer software development, comprising a test box 1, wherein the outer walls of two sides of the test box 1 are respectively provided with a mounting groove, the inner wall of one side of the two mounting grooves is provided with a mounting port, the inner walls of the two mounting ports are respectively provided with a heat dissipation mechanism 3, the heat dissipation mechanism 3 comprises a mounting pipe 7, the inner walls of two sides of the mounting pipe 7 are respectively provided with the same thread bushing 8, the inner wall of the thread bushing 8 is screwed with a thread pipe 9, the outer wall of the top of the thread pipe 9 is provided with a connecting pipe 10, the outer wall of the top of the connecting pipe 10 is sleeved with a dust cover 15, the outer wall of the connecting pipe 10 is sleeved with a spring 11, one end of the spring 11 is fixed on the inner wall of the top of the mounting pipe 7 through a bolt, the two sides of the outer wall of the bottom of, the both sides inner wall of installation pipe 7 is provided with same toper pipe 14, and the specification of toper pipe 14 and the specification phase-match of sealing plug 13, the rectangle mouth has been seted up to 1 top outer wall of test box, and one side inner wall of rectangle mouth articulates there is chamber door 2, the both sides inner wall of test box 1 has same mesh board 4 through the bolt fastening, and mesh board 4 bottom outer wall all is provided with the heat-conducting plate 5 that the equidistance distributes, the through-hole that the equidistance distributes is seted up to heat-conducting plate 5's outer wall, the both sides of mesh board 4 bottom outer wall all have fan 6 through the bolt fastening, fan 6 is connected with the switch through the wire, and.
The working principle is as follows: during the use, when test box 1 uses, rotate two dust covers 15 earlier, dust cover 15 rotates and drives screwed pipe 9 and rotate, and then unloads screwed pipe 9 from thread bush 8, and screwed pipe 9 unloads back connecting pipe 10 and stretches out under the effect of spring 11, and then drives sealing plug 13 and rise, opens the conical duct 14 and is convenient for the air flow, and the air flow in start-up fan 6 acceleration test box 1 is with heat discharge.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. A heat dissipation device for computer software development comprises a test box (1) and is characterized in that mounting grooves are formed in the outer walls of the two sides of the test box (1), mounting ports are formed in the inner wall of one side of each of the two mounting grooves, heat dissipation mechanisms (3) are arranged on the inner walls of the two mounting ports, each heat dissipation mechanism (3) comprises a mounting pipe (7), the inner walls of the two sides of each mounting pipe (7) are provided with a same threaded sleeve (8), the inner wall of each threaded sleeve (8) is screwed with a threaded pipe (9), the outer wall of the top of each threaded pipe (9) is provided with a connecting pipe (10), the outer wall of the top of each connecting pipe (10) is sleeved with a dust cover (15), the outer wall of each connecting pipe (10) is sleeved with a spring (11), one end of each spring (11) is fixed to the inner wall of the top of each mounting pipe (7) through a bolt, connecting rods (, and the outer walls of the bottoms of the two connecting rods (12) are fixed with the same mounting disc through bolts, and the outer wall of the bottom of the mounting disc is fixed with a sealing plug (13) through a bearing.
2. The heat sink for computer software development according to claim 1, wherein the same tapered tube (14) is disposed on the inner wall of the mounting tube (7) on both sides, and the size of the tapered tube (14) matches the size of the sealing plug (13).
3. The heat dissipation device for computer software development as claimed in claim 1, wherein a rectangular opening is formed in an outer wall of the top of the test box (1), and a box door (2) is hinged to an inner wall of one side of the rectangular opening.
4. The heat dissipation device for computer software development according to claim 1, wherein the same mesh plate (4) is fixed on the inner walls of the two sides of the test box (1) through bolts, and the outer walls of the bottom of the mesh plate (4) are provided with heat conduction plates (5) distributed at equal intervals.
5. The heat dissipation device for computer software development according to claim 4, wherein the outer wall of the heat conduction plate (5) is provided with through holes distributed equidistantly, and the fans (6) are fixed on both sides of the outer wall of the bottom of the mesh plate (4) through bolts.
6. The heat sink for computer software development according to claim 5, wherein the fan (6) is connected to a switch through a wire, and the switch is connected to the controller through a wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911106436.8A CN110879653A (en) | 2019-11-13 | 2019-11-13 | Heat abstractor is used in computer software development |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911106436.8A CN110879653A (en) | 2019-11-13 | 2019-11-13 | Heat abstractor is used in computer software development |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110879653A true CN110879653A (en) | 2020-03-13 |
Family
ID=69729120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911106436.8A Pending CN110879653A (en) | 2019-11-13 | 2019-11-13 | Heat abstractor is used in computer software development |
Country Status (1)
| Country | Link |
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| CN (1) | CN110879653A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108052160A (en) * | 2017-12-04 | 2018-05-18 | 企客科技（广州）有限公司 | A kind of software development desk-top organizer |
| CN208384508U (en) * | 2018-06-15 | 2019-01-15 | 林玉峰 | A kind of computer radiator with dust reduction capability |
| CN109375733A (en) * | 2018-12-03 | 2019-02-22 | 南昌科悦企业管理咨询有限公司 | A kind of anticlogging computer heat radiation host computer case |
| CN110209251A (en) * | 2019-06-24 | 2019-09-06 | 淮南联合大学 | A kind of computer cabinet improving computer-internal heat-dissipating space |
| KR20190106400A (en) * | 2018-03-09 | 2019-09-18 | 조경헌 | Support apparatus for computer main body |
-
2019
- 2019-11-13 CN CN201911106436.8A patent/CN110879653A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108052160A (en) * | 2017-12-04 | 2018-05-18 | 企客科技（广州）有限公司 | A kind of software development desk-top organizer |
| KR20190106400A (en) * | 2018-03-09 | 2019-09-18 | 조경헌 | Support apparatus for computer main body |
| CN208384508U (en) * | 2018-06-15 | 2019-01-15 | 林玉峰 | A kind of computer radiator with dust reduction capability |
| CN109375733A (en) * | 2018-12-03 | 2019-02-22 | 南昌科悦企业管理咨询有限公司 | A kind of anticlogging computer heat radiation host computer case |
| CN110209251A (en) * | 2019-06-24 | 2019-09-06 | 淮南联合大学 | A kind of computer cabinet improving computer-internal heat-dissipating space |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200313 |
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| RJ01 | Rejection of invention patent application after publication |