CN110871549A - Switching card seat, power failure recognition device, injection mold and demolding method - Google Patents

Switching card seat, power failure recognition device, injection mold and demolding method Download PDF

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Publication number
CN110871549A
CN110871549A CN201911239751.8A CN201911239751A CN110871549A CN 110871549 A CN110871549 A CN 110871549A CN 201911239751 A CN201911239751 A CN 201911239751A CN 110871549 A CN110871549 A CN 110871549A
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CN
China
Prior art keywords
groove
groove body
mold
installation groove
wall
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CN201911239751.8A
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Chinese (zh)
Inventor
刘忠阳
尹旭
谢海兵
徐鉴
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BEIJING ZHENZHONG ELECTRONIC TECHNOLOGY Co Ltd
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BEIJING ZHENZHONG ELECTRONIC TECHNOLOGY Co Ltd
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Priority to CN201911239751.8A priority Critical patent/CN110871549A/en
Publication of CN110871549A publication Critical patent/CN110871549A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/4005—Ejector constructions; Ejector operating mechanisms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The invention relates to the technical field of power failure recognition equipment, in particular to a switching card seat, a power failure recognition device, an injection mold and a demolding method. The switching card seat comprises a shell; the shell comprises a host installation groove body and a main board installation groove body; the inner groove wall of the host installation groove body and the inner groove wall of the main board installation groove body are both provided with draft angles; the outer groove wall of the host installation groove body is parallel to the groove depth direction of the host installation groove body, and the outer groove wall of the main board installation groove body is parallel to the groove depth direction of the main board installation groove body. The power failure recognition device comprises the adapter card seat. The injection mold is used for injection molding of the shell of the switching clamping seat. The demolding method is applied to the injection mold. The switching card seat, the power failure recognition device, the injection mold and the injection molding method provided by the invention have the advantages that the demolding difficulty and the molding difficulty are low, and sink marks are not easy to appear.

Description

Switching card seat, power failure recognition device, injection mold and demolding method
Technical Field
The invention relates to the technical field of power failure recognition equipment, in particular to a switching card seat, a power failure recognition device, an injection mold and a demolding method.
Background
The power failure recognition device is a common device for recognizing power failure, and mainly comprises a failure recognition host and a switching card seat, wherein the switching card seat is a switching structure arranged between the failure recognition host and an ammeter and comprises a shell, and the shell mainly comprises a host installation groove body for installing the host and a mainboard installation groove body for installing a mainboard.
The host installation groove body and the main board installation groove body of the shell of the adapter are respectively formed by injection molding through a first mold assembly and a second mold assembly, and after the cooling step is completed in the process of injection molding of the shell of the adapter, the first mold assembly is separated from the host installation groove body along the reverse direction of the depth of the host installation groove body, so that the demolding step of the host installation groove body is completed; a certain distance exists between the inner side reverse spigot of the main board installation groove body of the existing switching clamping seat and the groove bottom, therefore, when in demoulding, the part of the second mould assembly, which is positioned in the groove of the main board installation groove body, can firstly walk to the inner position to adapt to the existence of the reverse spigot, and then the second mould assembly is separated from the main board installation groove body along the reverse direction of the depth of the main board installation groove body, so that the demoulding step of the main board installation groove body is completed.
In order to ensure that the shell of the switching clamping seat can be smoothly demoulded, a draft slope which is not less than 1 degree needs to be arranged on the first die assembly and the second die assembly, therefore, a host installation groove body and a mainboard installation groove body of the shell of the switching clamping seat formed by adopting the current injection molding mode are adopted, the two sides of the groove wall are both slopes corresponding to a die cavity with the draft slope, namely, the two sides of the groove wall are inclined towards the direction close to each other from the groove bottom to the groove top, therefore, the groove wall can be gradually thickened from the groove bottom to the groove top, certain requirements on the groove depth of the host installation groove body and the mainboard installation groove body are met by the shell of the switching clamping seat, and the problems that the wall thickness of the shell is not uniform, the part of the groove wall close to the groove bottom is too thick and/or the part of the groove wall close.
The wall thickness of the shell is not uniform, and sink mark defects are easy to occur due to the fact that the solidification speed is not uniform; the thick wall part of the groove on the shell is easy to stick the shell on a mould and difficult to demould due to too large pressurization; the problem of unsmooth glue running and difficult molding is easily caused by the thin wall part of the groove on the shell. In addition, because the shell of the switching clamping seat is deeper than the grooves of the host installation groove body and the main board installation groove body, even if the first die assembly and the second die assembly are provided with enough draft angles, the demoulding is still difficult.
In summary, how to overcome the above-mentioned defects of the conventional adaptor socket housing is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide an adapter card seat, a power failure recognition device, an injection mold and a demolding method, which are used for solving the problems that the wall thickness of a shell of the adapter card seat obtained by the demolding method of the shell of the adapter card seat in the prior art is not uniform, and the part of a groove wall close to the bottom of a groove is too thick and/or the part of the groove wall close to the top of the groove is too thin.
The invention provides an adapter card holder which comprises a shell.
The shell comprises a host installation groove body used for installing the fault recognition host and a main board installation groove body used for installing a main board; the inner groove wall of the host installation groove body and the inner groove wall of the main board installation groove body are provided with draft angles.
The outer groove wall of the host installation groove body is parallel to the groove depth direction of the host installation groove body, and the outer groove wall of the main board installation groove body is parallel to the groove depth direction of the main board installation groove body.
Preferably, as an implementation mode, the wall thickness of the bottom end of the groove wall of the host installation groove body is 3.4-3.6 mm, and is preferably 3.5 mm; the wall thickness of the top end of the groove wall of the host installation groove body is 3.0-3.2 mm, and preferably 3.1 mm.
Preferably, as an implementation mode, the wall thickness of the top end of the groove wall of the main plate installation groove body is 2.2-2.5 mm, and preferably 2.3 mm; the wall thickness of the bottom end of the groove wall of the main board installation groove body is 2.6-2.9 mm, and preferably 2.7 mm.
Preferably, as an implementable mode, be provided with on the interior cell wall of mainboard installation cell body and follow the groove depth direction of mainboard installation cell body extends the anti-tang that sets up, anti-tang extends to the tank bottom of mainboard installation cell body.
The invention also provides a power failure recognition device which comprises a failure recognition host and the switching card seat, wherein the failure recognition host is arranged in the host mounting groove body.
Correspondingly, the invention provides an injection mold for injection molding of the shell of the adapter card seat, which comprises a fixed mold, a movable mold and at least two outer molds, wherein the outer molds are provided with molding surfaces.
The molding surface is used for molding the outer groove wall of the host installation groove body of the shell and the outer groove wall of the main board installation groove body of the shell, and the outer dies can move towards the direction deviating from each other respectively to be demolded.
The cover half is used for the shaping of the interior cell wall of host installation cell body and tank bottom, the movable mould is used for the shaping of the interior cell wall of mainboard installation cell body and tank bottom, the movable mould can be towards deviating from the direction removal drawing of patterns of cover half.
The molding surface on each outer mold is parallel to the moving direction of the fixed mold.
Preferably, as an implementation mode, an injection molding groove used for forming a back seam allowance on the main board installation groove body is formed in the movable mold, and the injection molding groove extends to one end of the movable mold, which forms the groove bottom of the main board installation groove body.
Preferably, as an embodiment, the draft of the fixed mold is 0.1 to 0.2 degrees, preferably 0.2 degrees; and/or the drawing degree of the movable mold is 0.1-0.2 degrees, preferably 0.2 degrees.
The invention also provides a demolding method applied to the injection mold, and the demolding method comprises the following steps:
and the outer dies move towards the directions deviating from each other respectively, and when the clearance between the outer dies and the shell reaches the size required by shell demoulding, the outer dies are in place.
When the outer molds are in place, the movable mold moves in the direction away from the fixed mold; and when the distance between the movable mold and the fixed mold reaches the size required by demolding of the shell, the movable mold stops moving.
When the movable mold stops moving, the movable mold acts, and the shell is separated from the movable mold.
Preferably, as an implementation manner, the step of moving the mold specifically includes the following steps: and the ejector rod connected to the movable die ejects the shell.
Compared with the prior art, the invention has the advantages that:
the switching card holder comprises a shell, wherein the shell comprises a host installation groove body used for installing a fault recognition host and a main board installation groove body used for installing a main board, and the inner groove wall of the host installation groove body and the inner groove wall of the main board installation groove body both have draft slopes so as to ensure smooth demoulding.
The outer groove wall of the host installation groove body is parallel to the groove depth direction of the host installation groove body, the outer groove wall of the main board installation groove body is parallel to the groove depth direction of the main board installation groove body, namely the outer groove wall of the host installation groove body and the outer groove wall of the main board installation groove body do not have a draft angle, so that the wall thickness of the shell is uniform, the problem that sink marks are prone to occurring on the groove wall of the shell is solved, and the quality of the shell after being formed is improved; the thickness of the groove wall of the host installation groove body and/or the main board installation groove body close to the groove bottom is convenient to be reduced to a proper size, so that the problem that the position with too thick groove wall is easy to stick to a mold is solved, and the demolding difficulty is reduced; the thickness of the part, close to the groove top, of the groove wall of the host installation groove body and/or the main board installation groove body is convenient to increase to a proper size, so that the problem that glue is not smooth when the groove wall is too thin is solved, and the forming difficulty is reduced.
The utility model provides a power failure recognition device, which mainly comprises a failure recognition host and the switching clamping seat, wherein the failure recognition host is arranged in the host mounting groove body.
Therefore, the power failure recognition device provided by the invention has all the advantages of the adapter card seat due to the inclusion of the adapter card seat, and is low in demoulding difficulty and forming difficulty and not easy to generate sink marks.
The injection mold provided by the invention mainly comprises a fixed mold, a movable mold and at least two outer molds, wherein after the fixed mold, the movable mold and the outer molds are assembled, a mold cavity for injecting the shell of the adapter card seat can be formed.
Each external mold is at least used for molding the outer groove wall of the host installation groove body of the switching card seat shell and the outer groove wall of the main board installation groove body of the switching card seat shell, wherein the molding surfaces of the external mold used for molding the outer groove wall of the host installation groove body and the molding surfaces of the outer groove wall of the main board installation groove body are molding surfaces, and when demolding is carried out, the external molds respectively move towards the directions deviating from each other, so that the separation of each external mold and the switching card seat shell is completed.
The fixed die is used for molding the inner slot wall and the slot bottom of the host installation slot body, the movable die is used for molding the inner slot wall and the slot bottom of the main board installation slot body, and the movable die can move in the direction departing from the fixed die to be demoulded so as to complete the separation of the fixed die and the switching card seat shell; finally, the switching cassette shell can be hung on the movable mold, and at the moment, the switching cassette shell is only required to be taken down.
That is to say, the mold opening direction of each external mold is different from the extending direction of the groove wall of the host installation groove body and the extending direction of the groove wall of the host installation groove body of the formed switching card seat shell, so that each external mold does not need to be provided with a mold drawing slope, and the forming surface on each external mold can be arranged in parallel to the moving direction of the fixed mold.
Therefore, the outer groove wall of the host installation groove body and the outer groove wall of the main board installation groove body of the switching card seat shell injected by the injection mold provided by the invention have no draft inclination, so that the wall thickness difference of two ends of the groove wall of the switching card seat shell can be conveniently reduced, the problem of uneven wall thickness of the switching card seat shell is solved, the problem of easy occurrence of sink marks on the groove wall of the switching card seat shell is solved, and the quality of the switching card seat shell after molding is improved. In addition, the wall thickness of the groove wall close to the bottom of the groove can be reduced according to the requirement, so that the problem that the part of the groove wall close to the bottom of the groove is too thick is solved, the problem that the position of the outer shell of the switching clamping seat, which is too thick, is easy to stick to a mold can be solved, and the demolding difficulty is reduced; the wall thickness of the part, close to the top of the groove, of the groove wall can be increased as required to solve the problem that the part, close to the top of the groove, of the groove wall is too thin, further, the problem that glue cannot smoothly flow at the too thin position of the groove wall of the shell of the switching clamping seat can be solved, and the forming difficulty is reduced.
The demolding method provided by the invention is applied to the injection mold. During demolding, the outer dies move towards the directions of departing from each other, and the movement of the outer dies can be carried out simultaneously or sequentially. When the clearance between the outer mold and the shell of the adapter card seat reaches the size required by demolding of the shell of the adapter card seat (the value can be determined according to the size of the shell of the adapter card seat), the outer mold is in place. When the outer molds are in place, the movable mold moves in the direction away from the fixed mold; when the distance between the movable mold and the fixed mold reaches the size required by demolding of the adapter card seat shell (the value can be determined according to the size of the adapter card seat shell), the movable mold stops moving. And when the movable mold stops moving, the shell of the switching card seat is positioned on the movable mold, and the movable mold acts to separate the shell of the switching card seat from the movable mold.
Therefore, the outer groove wall of the adapter card seat shell obtained by the demolding method provided by the invention has no draft, the problems of uneven wall thickness of the adapter card seat shell, too thick part of the groove wall close to the groove bottom and/or too thin part of the groove wall close to the groove top are solved, the demolding difficulty and the molding difficulty are low, and sink marks are not easy to appear.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic perspective view of a housing of an adapter according to an embodiment of the present invention;
fig. 2 is a schematic front view of a housing of an adaptor socket according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an outer mold of the injection mold and a housing of the adapter card holder provided in the embodiment of the present invention before demolding.
Icon: 10-a housing; 20-external mold;
11-installing a groove body on the host machine; 12-installing a groove body on the main board; 13-counter stop.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The present invention will be described in further detail below with reference to specific embodiments and with reference to the attached drawings.
Referring to fig. 1 and 2, the embodiment provides an adapter card seat, which includes a housing 10, the housing 10 includes a host installation slot 11 for installing a fault recognition host and a motherboard installation slot 12 for installing a motherboard, both the inner slot wall of the host installation slot 11 and the inner slot wall of the motherboard installation slot 12 have draft angles, so as to ensure smooth demolding, and at the same time, the host installation slot 11 and the fault recognition host can still be well matched, and the motherboard installation slot 12 and the motherboard can still be well matched.
The outer groove wall of the host installation groove body 11 is parallel to the groove depth direction of the host installation groove body 11, the outer groove wall of the main board installation groove body 12 is parallel to the groove depth direction of the main board installation groove body 12, namely, the outer groove wall of the host installation groove body 11 and the outer groove wall of the main board installation groove body 12 do not have draft angles, so that the wall thickness of the shell 10 is uniform, the problem that sink marks are easy to appear on the groove wall of the shell is solved, and the quality of the shell after being formed is improved; the thicknesses of the groove walls of the host installation groove body 11 and/or the main board installation groove body 12 close to the groove bottom are convenient to reduce to proper sizes, so that the problem that the position with too thick groove walls is easy to adhere to a mold is solved, and the demolding difficulty is reduced; the thickness of the part, close to the groove top, of the groove wall of the host installation groove body 11 and/or the main board installation groove body 12 is convenient to increase to a proper size, so that the problem that glue is not smoothly moved at the position where the groove wall is too thin is solved, and the forming difficulty is reduced.
The wall thickness of the thickest position (namely the position close to the bottom of the groove) of the groove wall of the host installation groove body 11 of the shell 10 of the traditional switching card holder is about 4.5mm, and the wall thickness is too thick and is easy to be stuck on a mould, so that the demoulding is difficult. However, the wall thickness range of the bottom end of the groove wall of the host installation groove body 11 provided by the embodiment is 3.4-3.6 mm, preferably 3.5mm, and the pressurization value can be maintained in a proper range, so that the shell 10 is not easy to adhere to a mold, the demolding difficulty is reduced, and the yield is improved.
The problem of uneven wall thickness of a host installation groove body 11 of a shell 10 of the conventional adapter card seat is obvious, and sink marks are easily generated when the wall thickness difference is about 0.8 mm. However, the wall thickness of the top end of the slot wall of the host installation slot body 11 provided by the embodiment is in the range of 3.0-3.2 mm, preferably 3.1mm, that is, the wall thickness difference of the slot wall of the host installation slot body 11 provided by the embodiment is in the range of 0.2-0.6 mm, preferably 0.4mm, and in this range, sink marks are not easily generated on the slot wall of the host installation slot body 11.
The wall thickness of the thinnest position (namely the position close to the groove top) of the groove wall of the main board installation groove body 12 of the shell 10 of the traditional switching clamping seat is about 1.9mm, the wall thickness is too thin, glue is easy to flow, smoothness is not achieved, and the forming difficulty is high. However, the wall thickness range of the top end of the groove wall of the main board installation groove body 12 provided by this embodiment is 2.2-2.5, preferably 2.3mm, and in this range, the problem that the glue running at the top end of the groove wall of the main board installation groove body 12 is not smooth is alleviated, and the molding difficulty is low.
Further, the wall thickness of the bottom end of the groove wall of the main board installation groove body 12 provided by the present embodiment is 2.6-2.9 mm, preferably 2.7mm, that is, the wall thickness difference of the groove wall of the main board installation groove body 12 provided by the present embodiment is between 0.1-0.6 mm, preferably 0.4mm, which belongs to a suitable range, and sink marks are not easy to generate.
Specifically, a back stop 13 extending along the groove depth direction of the main board installation groove 12 is provided on the inner groove wall of the main board installation groove 12.
Preferably, the back seam allowance 13 on the main board installation groove body 12 can be extended to the groove bottom of the main board installation groove body 12, so that the inner walking position is not needed during injection molding, and the structure of an injection mold for injection molding of the shell 10 of the adapter socket can be simplified; in addition, the length of the counter stop 13 is extended, the structural strength of the counter stop 13 can be improved, and the counter stop 13 is not easily damaged.
Referring to fig. 1 and fig. 2, the present embodiment further provides an electrical fault recognition apparatus, which mainly comprises a fault recognition host and the above-mentioned adaptor socket, wherein the fault recognition host is installed in the host installation slot 11.
Therefore, the power failure recognition device provided by the embodiment has all the advantages of the adapter, and is low in demolding difficulty and molding difficulty and not easy to generate sink marks due to the fact that the power failure recognition device comprises the adapter.
Referring to fig. 1 to 3, the present embodiment provides an injection mold, which mainly comprises a fixed mold, a movable mold and at least two outer molds 20, wherein the fixed mold, the movable mold and each outer mold 20 are assembled to form a mold cavity for injection molding of the adapter socket housing 10.
Each outer mold 20 is at least used for molding the outer groove wall of the host mounting groove 11 of the adapter housing 10 and the outer groove wall of the main board mounting groove 12 of the adapter housing 10, wherein the molding surfaces of the outer mold 20 for molding the outer groove wall of the host mounting groove 11 and the molding surfaces of the outer groove wall of the main board mounting groove 12 are molding surfaces, and when demolding is performed, each outer mold 20 moves towards directions (directions shown by arrows in fig. 3) which are deviated from each other, so that the separation of each outer mold 20 from the adapter housing 10 is completed.
The fixed die is used for molding the inner slot wall and the slot bottom of the host installation slot body 11, the movable die is used for molding the inner slot wall and the slot bottom of the main board installation slot body 12, and the movable die can move in the direction departing from the fixed die to be demoulded so as to complete the separation of the fixed die and the switching card seat shell 10; finally, the adapter housing 10 is suspended on the movable mold, and at this time, the adapter housing 10 is removed.
That is, the mold opening direction of each outer mold 20 is different from the extending direction of the groove wall of the host installation groove body 11 and the extending direction of the groove wall of the host installation groove body 11 of the formed adapter card seat shell 10, so that each outer mold 20 does not need to be provided with a draft angle, and the forming surface on each outer mold 20 can be arranged parallel to the moving direction of the fixed mold.
Therefore, the outer groove wall of the host installation groove body 11 and the outer groove wall of the main board installation groove body 12 of the switching card seat shell 10 injected by the injection mold provided by the embodiment do not have a draft angle, so that the wall thickness difference at the two ends of the groove wall of the switching card seat shell 10 can be conveniently reduced, the problem of uneven wall thickness of the shell 10 is solved, the problem of sink marks easily occurring on the groove wall of the switching card seat shell 10 is solved, and the quality of the switching card seat shell 10 after molding is improved. In addition, the wall thickness of the groove wall close to the bottom of the groove can be reduced according to the requirement, so that the problem that the part of the groove wall close to the bottom of the groove is too thick is solved, the problem that the position of the switching card seat shell 10 with too thick groove wall is easy to stick to a mold can be solved, and the demolding difficulty is reduced; the wall thickness of the part of the groove wall close to the groove top can be increased according to needs to solve the problem that the part of the groove wall close to the groove top is too thin, further, the problem that glue cannot smoothly flow at the too thin position of the groove wall of the switching card seat shell 10 can be solved, and the forming difficulty is reduced.
Specifically, the main board mounting groove 12 of the adaptor socket housing 10 has a back stop 13 therein, so that an injection groove for molding the back stop 13 is formed on the movable mold of the injection mold provided in this embodiment.
Referring to fig. 1 to 3, the present embodiment also provides a demolding method applied to the injection mold. During demolding, the outer molds 20 are moved in directions away from each other (as indicated by arrows in fig. 3), and the movement of the outer molds 20 may be performed simultaneously or sequentially. The outer mold 20 is in place when the outer mold 20 is moved to a clearance from the adapter socket housing 10 that is of a size required for de-molding of the adapter socket housing 10 (this value may be determined based on the dimensions of the adapter socket housing 10). When the outer dies 20 are in place, the movable die moves in the direction away from the fixed die; when the distance between the movable mold and the fixed mold reaches the size required for demolding of the adapter card seat shell 10 (the value can be determined according to the size of the adapter card seat shell 10), the movable mold stops moving. When the movable mold stops moving, the adapter holder housing 10 is positioned on the movable mold, and the movable mold acts to separate the adapter holder housing 10 from the movable mold.
Therefore, the outer groove wall of the adapter card seat shell 10 obtained by the demolding method provided by the embodiment has no draft angle, so that the problems of uneven wall thickness of the adapter card seat shell 10 and too thick part of the groove wall close to the groove bottom and/or too thin part of the groove wall close to the groove top are solved, the quality of the adapter card seat shell 10 is improved, and the demolding difficulty and the molding difficulty are reduced.
In the specific structure of the injection mold, the injection groove on the movable mold can be extended to one end of the groove bottom of the main plate installation groove body 12 formed by the movable mold, so that the movable mold does not need to avoid the back seam allowance 13 in the process that the adapter card seat shell 10 is separated from the movable mold, namely, the movable mold does not need to move inwards, and the structure of the injection mold can be simplified; in addition, because the length of the injection molding groove is longer than that of the prior art, the length of the reverse spigot 13 can be increased, and further, the structural strength of the reverse spigot 13 is improved, so that the injection molding groove is not easy to damage.
Specifically, the range of the draft degree of the fixed mold can be set to 0.1-0.2 degrees, so that the draft of the fixed mold can be smoothly completed.
Preferably, the draft of the stationary mold may be set to 0.2 degrees so that the stationary mold can perform the draft more smoothly.
The range of the drawing degree of the movable die can be set to be 0.1-0.2 degrees so as to smoothly finish the drawing of the movable die.
Preferably, the draft of the movable mold may be set to 0.2 degrees so that the movable mold can perform the draft more smoothly.
In the above-described demolding method, after the movable mold stops moving, the ejector rod connected to the movable mold can eject the adapter holder housing 10, so that the adapter holder housing 10 is detached from the movable mold.
Specifically, the injection mold described above includes a controller that can control the movement of the movable mold and each of the outer molds 20, and can control the ejector pin action on the movable mold.
In summary, the invention discloses an adapter card seat, a power failure recognition device, an injection mold and a demolding method, which overcome many technical defects of the traditional adapter card seat shell. The switching card seat, the power failure recognition device, the injection mold and the demolding method provided by the embodiment have the advantages that demolding difficulty and molding difficulty are low, and sink marks are not prone to occurring.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. An adaptor socket, comprising a housing (10);
the shell (10) comprises a host installation groove body (11) for installing a fault recognition host and a main board installation groove body (12) for installing a main board; the inner groove wall of the host installation groove body (11) and the inner groove wall of the main board installation groove body (12) are provided with draft angles;
the outer groove wall of the host installation groove body (11) is parallel to the groove depth direction of the host installation groove body (11), and the outer groove wall of the main board installation groove body (12) is parallel to the groove depth direction of the main board installation groove body (12).
2. The adaptor cartridge of claim 1, wherein the wall thickness of the bottom end of the slot wall of the host mounting slot (11) is 3.4-3.6 mm, preferably 3.5 mm; the wall thickness of the top end of the groove wall of the host installation groove body (11) is 3.0-3.2 mm, preferably 3.1 mm.
3. The adaptor cartridge of claim 1 wherein the wall thickness of the top end of the slot wall of the main plate mounting slot (12) is 2.2-2.5 mm, preferably 2.3 mm; the wall thickness of the bottom end of the groove wall of the main board installation groove body (12) is 2.6-2.9 mm, and preferably 2.7 mm.
4. The adaptor clip according to any one of claims 1 to 3, wherein a back stop (13) extending along the depth direction of the main board mounting groove (12) is provided on the inner groove wall of the main board mounting groove (12), and the back stop (13) extends to the bottom of the main board mounting groove (12).
5. An electric power failure recognition device, characterized by comprising a failure recognition host and the switching card holder of any one of claims 1 to 4, wherein the failure recognition host is installed in the host installation slot body (11).
6. An injection mold for injection molding of the adapter card holder housing (10) according to any one of claims 1 to 4, comprising a stationary mold, a movable mold and at least two outer molds (20), the outer molds (20) each having a molding surface;
the molding surface is used for molding the outer groove wall of the host installation groove body (11) of the shell (10) and the outer groove wall of the main board installation groove body (12) of the shell (10), and the outer dies (20) can move towards the directions deviating from each other to be demolded;
the fixed die is used for molding the inner groove wall and the groove bottom of the host installation groove body (11), the movable die is used for molding the inner groove wall and the groove bottom of the main board installation groove body (12), and the movable die can move towards the direction departing from the fixed die for demolding;
the molding surface on each outer mold (20) is parallel to the moving direction of the fixed mold.
7. The injection mold according to claim 6, wherein the movable mold is provided with an injection molding groove for molding a back stop (13) on the main plate installation groove body (12), and the injection molding groove extends to one end of the movable mold forming a groove bottom of the main plate installation groove body (12).
8. An injection mould according to claim 7, characterized in that the draft of the stationary mould is 0.1-0.2 degrees, preferably 0.2 degrees;
and/or the drawing degree of the movable mold is 0.1-0.2 degrees, preferably 0.2 degrees.
9. A method of demolding, characterized in that it is applied to the injection mold of any one of claims 6 to 8, comprising the steps of:
the outer dies (20) move towards the directions which are deviated from each other respectively, and when the clearance between the outer dies (20) and the shell (10) reaches the size required by the demoulding of the shell (10), the outer dies (20) are in place;
when the outer molds (20) are in place, the movable mold moves in the direction departing from the fixed mold; when the distance between the movable mold and the fixed mold reaches the size required by demolding of the shell (10), the movable mold stops moving;
when the movable mold stops moving, the movable mold acts, and the shell (10) is separated from the movable mold.
10. The demolding method as claimed in claim 9, wherein the step of moving the mold specifically includes the steps of: the ejector rod connected to the movable die ejects the shell (10).
CN201911239751.8A 2019-12-05 2019-12-05 Switching card seat, power failure recognition device, injection mold and demolding method Pending CN110871549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911239751.8A CN110871549A (en) 2019-12-05 2019-12-05 Switching card seat, power failure recognition device, injection mold and demolding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911239751.8A CN110871549A (en) 2019-12-05 2019-12-05 Switching card seat, power failure recognition device, injection mold and demolding method

Publications (1)

Publication Number Publication Date
CN110871549A true CN110871549A (en) 2020-03-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911239751.8A Pending CN110871549A (en) 2019-12-05 2019-12-05 Switching card seat, power failure recognition device, injection mold and demolding method

Country Status (1)

Country Link
CN (1) CN110871549A (en)

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