CN110868509A - Method and equipment for adjusting photosensitive chip board - Google Patents
Method and equipment for adjusting photosensitive chip board Download PDFInfo
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- CN110868509A CN110868509A CN201810986579.1A CN201810986579A CN110868509A CN 110868509 A CN110868509 A CN 110868509A CN 201810986579 A CN201810986579 A CN 201810986579A CN 110868509 A CN110868509 A CN 110868509A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N17/00—Diagnosis, testing or measuring for television systems or their details
- H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
Abstract
The invention discloses a method and equipment for adjusting a photosensitive chip plate, which are used for solving the problems of long operation time and low efficiency when the photosensitive chip plate is adjusted by a manual method in the prior art. The invention determines two symmetry axes on the photosensitive chip plate; wherein the two symmetry axes are perpendicular to each other, the intersection point of the two symmetry axes is the center point of the photosensitive chip board, and one of the two symmetry axes is parallel to the intersection line of the mounting plane and the photosensitive chip board; it is right the position of sensitization chip board is adjusted, so that the definition that lies in a symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same, and the definition that lies in another symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same. According to the invention, the photosensitive chip board is adjusted according to the definition of the image in the symmetrical areas at two sides of the symmetry axis, so that the time is saved and the working efficiency is improved.
Description
Technical Field
The invention relates to the technical field of images, in particular to a method and equipment for adjusting a photosensitive chip board.
Background
The monitoring camera is widely applied to the fields of schools, companies, banks, traffic and the like, and is mainly used for a series of security activities such as security inspection, real-time control, investigation and evidence obtaining. Therefore, the monitoring camera has a high requirement on the definition of the acquired image.
The photosensitive chip board is a main component element in a monitoring camera and is mainly used for mapping and converting received light rays to generate an electronic image. Meanwhile, the installation of the photosensitive chip plate is closely related to clear imaging, if the installation of the photosensitive chip plate is unbalanced, the definition of one side of the displayed picture is very high, and the other side of the displayed picture is blurred. Therefore, when the monitoring camera is manufactured, the position of the photosensitive chip board in the monitoring camera needs to be adjusted, so that the acquired light can be imaged clearly.
In the prior art, the photosensitive chip plate is mainly fixed in the monitoring camera by a screw and a spring, so that when the photosensitive chip plate is adjusted, the flatness of the photosensitive chip plate is adjusted by manually adjusting a fixing screw, and the flatness test tool is adopted to monitor the adjustment result after adjustment.
In summary, in the prior art, the photosensitive chip board is adjusted mainly by a manual method, which results in long operation time and low efficiency.
Disclosure of Invention
The invention provides a method and equipment for adjusting a photosensitive chip plate, which are used for solving the problems of long operation time and low efficiency when the photosensitive chip plate is adjusted by a manual method in the prior art.
In a first aspect, a method for adjusting a photosensitive chip board provided in an embodiment of the present invention includes:
determining two symmetry axes on the photosensitive chip plate; wherein the two symmetry axes are perpendicular to each other, the intersection point of the two symmetry axes is the center point of the photosensitive chip board, and one of the two symmetry axes is parallel to the intersection line of the mounting plane and the photosensitive chip board;
it is right the position of sensitization chip board is adjusted, so that the definition that lies in a symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same, and the definition that lies in another symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same.
Firstly, determining two mutually perpendicular symmetry axes on a photosensitive chip plate, wherein the intersection point of the two symmetry axes is the central point of the photosensitive chip plate, and one of the two symmetry axes is parallel to a mounting plane; and then, adjusting the position of the photosensitive chip plate to ensure that the image definition in the symmetrical areas on two sides of one of the two symmetrical axes on the photosensitive chip plate is the same, and then continuously adjusting the position of the photosensitive chip plate to ensure that the image definition in the symmetrical areas on two sides of the other of the two symmetrical axes on the photosensitive chip plate is the same. According to the invention, when the photosensitive chip plate is adjusted, the position of the photosensitive chip plate is adjusted according to the definition of the image in the symmetrical areas on the two sides of the set symmetrical axis, and when the image definitions in the symmetrical areas on the two sides of the set symmetrical axis are the same, the adjustment is stopped, the photosensitive chip plate is in a balanced state, and the adjustment result is detected by a test tool without manually adjusting a screw, so that the time is saved, and the working efficiency is improved.
In a possible implementation manner, when the position of the photosensitive chip plate is adjusted, a first included angle between the photosensitive chip plate and the mounting plane is adjusted first, so that the definition of images in mutually symmetrical areas on two sides of a symmetrical axis, which is parallel to the intersection line of the mounting plane and the photosensitive chip plate, on the photosensitive chip plate is the same;
taking the position of the photosensitive chip plate with the first included angle adjusted as a reference plane;
and then adjusting a second included angle between the photosensitive chip plate and the reference plane so as to enable the definition of images in mutually symmetrical areas on two sides of the other symmetrical axis in the two symmetrical axes on the photosensitive chip plate to be the same.
According to the method, the photosensitive chip plate is adjusted firstly, so that the image definition of symmetrical areas on two sides of a symmetrical axis parallel to an intersection line of a mounting plane and the photosensitive chip plate is the same, after the image definition of symmetrical areas on two sides of the symmetrical axis parallel to the intersection line is determined to be consistent, the plane where the adjusted photosensitive chip plate is located is set as a reference plane, the photosensitive chip plate is continuously adjusted to enable the image definition of symmetrical areas on two sides of the other symmetrical axis to be consistent, at the moment, the definition of symmetrical areas on two sides of the two symmetrical axes is guaranteed to be consistent, the photosensitive chip plate is in a balanced state, in the adjusting process, adjustment is carried out only according to the two symmetrical axes and the two included angles, the step of balancing the photosensitive chip plate by using a manual adjusting screw does not exist, time is saved, and working efficiency is improved.
In a possible implementation, it is right sensitization chip board with after second contained angle between the reference plane is adjusted, if lie in two symmetry axes on the sensitization chip board with the mounting surface with the definition of image is different among the mutual symmetric region of symmetry axis both sides that the intersecting line of sensitization chip board is parallel, then right sensitization chip board with first contained angle between the mounting surface is adjusted once more, so that lie in on the sensitization chip board in two symmetry axes with the mounting surface with the definition of image is the same in the mutual symmetric region of symmetry axis both sides that the intersecting line of sensitization chip board is parallel.
According to the method, after the second included angle is adjusted, whether the image definition of symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the mounting plane and the photosensitive chip board is consistent or not is determined, if the image definition of symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the mounting plane and the photosensitive chip board is inconsistent, the first included angle is adjusted to enable the image definition of symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the mounting plane and the photosensitive chip board to be consistent, detection and adjustment are carried out again, and the position of the adjusted photosensitive chip board is guaranteed to be more.
In a possible implementation manner, when the position of the photosensitive chip plate is adjusted, the current position of the photosensitive chip plate is taken as a reference plane; adjusting a second included angle between the photosensitive chip plate and the reference plane so that the definition of images in mutually symmetrical areas on two sides of a symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate in the two symmetrical axes is the same;
then, the photosensitive chip plate and a first included angle between the mounting planes are adjusted, so that the definition of images in the areas which are positioned on two sides of the other symmetrical axis in the two symmetrical axes and are symmetrical to each other on the photosensitive chip plate is the same.
The method comprises adjusting a photosensitive chip plate to make the image clarity of symmetrical regions at two sides of a symmetrical axis which is not parallel to the intersection line of a mounting plane and the photosensitive chip plate consistent, judging whether the image clarity of symmetrical regions at two sides of another symmetrical axis on the adjusted photosensitive chip plate is consistent after determining that the image clarity of symmetrical regions at two sides of the symmetrical axis which is not parallel to the intersection line is consistent, adjusting a first included angle between the mounting plane and the adjusted photosensitive chip plate after determining that the image clarity of symmetrical regions at two sides of the other symmetrical axis is consistent, ensuring that the clarity of symmetrical regions at two sides of the two symmetrical axes is consistent at the moment, indicating that the photosensitive chip plate is in a balanced state, adjusting according to the two symmetrical axes and the two included angles in the adjusting process, and avoiding the step of balancing the photosensitive chip plate by using a manual adjusting screw, time is saved, and working efficiency is improved.
In a possible implementation, it is right sensitization chip board with after first contained angle between the mounting surface was adjusted, if lie in two symmetry axes on the sensitization chip board with the mounting surface with the definition of image is inequality among the mutual symmetric region of the symmetry axis both sides that the intersecting line of sensitization chip board is not parallel, then right sensitization chip board with second contained angle between the reference plane is adjusted once more, so that lie in on the sensitization chip board in two symmetry axes with the mounting surface with the definition of image is the same in the mutual symmetric region of the symmetry axis both sides that the intersecting line of sensitization chip board is not parallel.
According to the method, after the first included angle is adjusted, whether the image definition of symmetrical areas on two sides of a symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip board is consistent or not is determined, if the image definition of symmetrical areas on two sides of the symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip board is inconsistent, the second included angle is adjusted, the image definition of symmetrical areas on two sides of the symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip board is consistent, detection and adjustment are carried out again, and the position of the adjusted photosensitive.
In a second aspect, an embodiment of the present invention further provides an apparatus for adjusting a photosensitive chip board, where the apparatus includes: at least one processing unit and at least one memory unit, wherein the memory unit stores program code that, when executed by the processing unit, causes the processing unit to perform the following:
determining two symmetry axes on the photosensitive chip plate; wherein the two symmetry axes are perpendicular to each other, the intersection point of the two symmetry axes is the center point of the photosensitive chip board, and one of the two symmetry axes is parallel to the intersection line of the mounting plane and the photosensitive chip board;
it is right the position of sensitization chip board is adjusted, so that the definition that lies in a symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same, and the definition that lies in another symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same.
In a third aspect, an embodiment of the present invention further provides an apparatus for adjusting a photosensitive chip board, where the apparatus includes: the determining module and the adjusting module:
a determination module: determining two symmetry axes on the photosensitive chip plate; wherein the two symmetry axes are perpendicular to each other, the intersection point of the two symmetry axes is the center point of the photosensitive chip board, and one of the two symmetry axes is parallel to the intersection line of the mounting plane and the photosensitive chip board;
an adjusting module: it is right to be used for the position of sensitization chip board is adjusted, so that the definition that lies in a symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same, and the definition that lies in another symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same.
In a fourth aspect, the present application also provides a computer storage medium having a computer program stored thereon, which when executed by a processor, performs the steps of the method of the first aspect.
In addition, for technical effects brought by any one implementation manner of the second aspect to the fourth aspect, reference may be made to technical effects brought by different implementation manners of the first aspect, and details are not described here.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a flowchart of a method for adjusting a photo sensor chip according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of two symmetrical axes divided on a photosensitive chip board according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating adjustment of a first included angle between a photosensitive chip board and a mounting plane according to an embodiment of the invention;
FIG. 4 is a schematic diagram illustrating adjustment of a second included angle between a photosensitive chip board and a reference plane according to an embodiment of the invention;
FIG. 5 is a schematic view of an apparatus for integrally adjusting a photosensitive chip plate according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of selecting a symmetrical region image according to an embodiment of the present invention;
FIG. 7 is a flowchart of an overall method for adjusting a photo-sensing chip board according to an embodiment of the present invention;
FIG. 8 is a structural diagram of an apparatus for adjusting a photosensitive chip board according to an embodiment of the present invention;
FIG. 9 is a block diagram of another apparatus for adjusting a photosensitive chip board according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The photosensitive chip board is an important component element in the monitoring camera, the mounting process of the photosensitive chip board has great influence on the definition of an image, when the photosensitive chip board is mounted in an unbalanced manner, the definition of an electronic image generated by final conversion is inconsistent, therefore, before the monitoring camera leaves a factory, the definition of an electronic image generated by mapping the photosensitive chip board is consistent, the flatness of the photosensitive chip board is adjusted, when the flatness of the photosensitive chip board is adjusted, the flatness of the photosensitive chip board is adjusted by manually adjusting a fixing screw, a flatness test tool is adopted to monitor an adjustment result, and after the flatness meets requirements, the position of the photosensitive chip board is fixed by glue.
The existing monitoring cameras are used in the fields of schools, companies, banks, traffic and the like, a large number of monitoring cameras are needed, and if the photosensitive chip board is adjusted by adopting the scheme, the time is wasted, and the efficiency is low. Therefore, the embodiment of the invention provides a scheme for judging whether the flatness of the photosensitive chip meets the condition by using an algorithm, two symmetrical axes which pass through the central point of the photosensitive chip plate and are perpendicular to each other are arranged, the position of the photosensitive chip plate is automatically adjusted, finally, the definitions of mutually symmetrical areas on two sides of the two symmetrical axes are the same, the flatness of the photosensitive chip plate meets the condition, manual adjustment is not needed, the human capital is reduced, and the working efficiency is improved.
The embodiments of the present invention will be described in further detail with reference to the drawings attached hereto.
The method for adjusting the photosensitive chip board provided by the embodiment of the invention, as shown in fig. 1, specifically comprises the following steps:
The embodiment of the invention firstly determines two mutually vertical symmetry axes on the photosensitive chip plate, the intersection point of the two symmetry axes is the central point of the photosensitive chip plate, and one of the two symmetry axes is parallel to the mounting plane; and then, adjusting the position of the photosensitive chip plate to ensure that the image definition in the symmetrical areas on two sides of one of the two symmetrical axes on the photosensitive chip plate is the same, and then continuously adjusting the position of the photosensitive chip plate to ensure that the image definition in the symmetrical areas on two sides of the other of the two symmetrical axes on the photosensitive chip plate is the same. According to the invention, when the photosensitive chip plate is adjusted, the position of the photosensitive chip plate is adjusted according to the definition of the image in the symmetrical areas on the two sides of the set symmetrical axis, and when the image definitions in the symmetrical areas on the two sides of the set symmetrical axis are the same, the adjustment is stopped, the photosensitive chip plate is in a balanced state, and the adjustment result is detected by a test tool without manually adjusting a screw, so that the time is saved, and the working efficiency is improved.
Specifically, as shown in fig. 2, which is a schematic diagram of the photosensitive chip board according to the embodiment of the present invention, it can be seen from fig. 2 that the point O is a central point of the photosensitive chip board, the two symmetry axes are an X axis and a Y axis, respectively, the X axis and the Y axis are perpendicular to each other and pass through the point O.
Optionally, when the photosensitive chip board is adjusted, the position of the photosensitive chip board can be periodically adjusted, then whether the image definitions in the symmetrical areas on the two sides of the symmetry axis are consistent or not is judged, and if so, the adjustment is stopped; the position of the photosensitive chip plate can be adjusted in real time, whether the definition of the images in the symmetrical areas on the two sides of the symmetry axis is consistent or not can be judged, and when the definition of the images in the symmetrical areas on the two sides of the symmetry axis is consistent, the adjustment is stopped.
When the photosensitive chip plate is adjusted in the embodiment of the invention, the image definition of symmetrical areas at two sides of a symmetry axis parallel to the intersection line of the mounting plane and the photosensitive chip plate can be ensured to be the same, and then the photosensitive chip plate is adjusted to ensure that the image definition at two sides of the other symmetry axis is the same; when the photosensitive chip plate is adjusted, the image definition of symmetrical areas on two sides of a symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate is ensured to be the same, and then the photosensitive chip plate is adjusted, so that the image definition of symmetrical areas on two sides of the symmetrical axis which is parallel to the intersection line of the mounting plane and the photosensitive chip plate is the same. The two schemes are briefly described by the following embodiments.
The first embodiment is as follows: and adjusting the photosensitive chip plate, and firstly enabling the image definition of symmetrical areas on two sides of a symmetrical axis parallel to the intersection line of the mounting plane and the photosensitive chip plate to be the same.
Optionally, when the position of the photosensitive chip plate is adjusted, a first included angle between the photosensitive chip plate and the mounting plane is adjusted, so that the definition of images in mutually symmetrical areas on two sides of a symmetry axis, which is parallel to the intersection line of the mounting plane and the photosensitive chip plate, on the photosensitive chip plate is the same;
taking the position of the photosensitive chip plate with the first included angle adjusted as a reference plane;
and adjusting a second included angle between the photosensitive chip plate and the reference plane so that the definition of images in mutually symmetrical areas on two sides of another symmetrical shaft in the two symmetrical shafts on the photosensitive chip plate is the same.
Specifically, two symmetry axes are divided on the photosensitive chip board, and as shown in fig. 2, an X axis and a Y axis are two symmetry axes on the photosensitive chip board; the position of the photosensitive chip plate at the initial moment is a preset position of the photosensitive chip plate, and whether the image definition of symmetrical areas on two sides of a symmetrical axis parallel to the intersection line of the mounting plane and the photosensitive chip plate is the same or not is judged at the preset position of the photosensitive chip plate; if the preset positions of the photosensitive chip plates are the same as the preset positions of the photosensitive chip plates, taking the plane where the preset positions of the photosensitive chip plates are located as a reference plane, and otherwise, adjusting a first included angle between the photosensitive chip plates and the installation plane.
Fig. 3 is a schematic diagram illustrating adjustment of a first included angle between a photosensitive chip board and the mounting plane according to an embodiment of the present invention. As can be seen from fig. 3, an intersection line L exists between the mounting plane and the photosensitive chip board, and a symmetry axis parallel to the intersection line L is a Y axis, so that it is determined at an initial time whether image definitions at symmetrical positions on both sides of the Y axis are consistent, and after determining that the image definitions are inconsistent, a first included angle is adjusted, as shown in fig. 3, where the first included angle is an included angle between the mounting plane and the photosensitive chip board; and if the two angles are consistent, adjusting the second included angle by taking the preset position plane of the photosensitive chip plate as a reference plane.
Specifically, an implementation of determining whether the image definitions of the symmetrical regions on both sides of the Y axis are consistent will be explained in the following manner.
The first method is as follows: determining that the image definitions of symmetrical areas on two sides of the Y axis are consistent;
after the image definitions of the symmetrical areas on the two sides of the Y axis are determined to be consistent, taking the plane where the preset position of the photosensitive chip plate is located as a reference plane, adjusting a second included angle, judging whether the image definitions of the symmetrical areas on the two sides of the X axis are consistent or not before adjusting the second included angle, if so, not adjusting the photosensitive chip plate, and indicating that the preset position of the photosensitive chip plate is the balance position of the photosensitive chip plate; if the two symmetrical areas are not consistent, the second included angle needs to be adjusted so as to enable the image definition of the symmetrical areas on the two sides of the X axis to be consistent.
Fig. 4 is a schematic diagram illustrating adjustment of a second included angle between the photosensitive chip board and the reference plane according to the embodiment of the invention; as can be seen from fig. 4, a second included angle exists between the reference plane and the photosensitive chip board, and when adjusting, the reference plane is used as the reference plane and the position is not changed, and the second included angle is adjusted only by adjusting the position of the photosensitive chip board. Meanwhile, after the second included angle is adjusted, whether the second included angle meets the requirement is determined according to whether the image definitions of the symmetrical areas on the two sides of the X axis are consistent, if the image definitions of the symmetrical areas on the two sides of the X axis are consistent, the second included angle is proved to meet the requirement, and the position of the photosensitive chip plate corresponding to the adjusted second included angle can be set as a balance position; and if the image definitions of the symmetrical areas on the two sides of the X axis are not consistent, continuously adjusting the second included angle to enable the image definitions of the symmetrical areas on the two sides of the X axis to be consistent.
The second method comprises the following steps: determining that the image definition of symmetrical areas at two sides of the Y axis is inconsistent;
after the image definition of symmetrical areas on two sides of the Y axis is determined to be inconsistent, a first included angle needs to be adjusted, as shown in FIG. 3, a first included angle exists between the installation plane and the photosensitive chip board, when the first included angle is adjusted, the installation plane is used as a reference plane, the position is unchanged, and the first included angle is adjusted by changing the position of the photosensitive chip board; after the first included angle is adjusted, whether the first included angle meets the requirement is determined according to whether the definition of the images of the symmetrical areas on the two sides of the Y axis is consistent, and if the definition of the images of the symmetrical areas on the two sides of the Y axis is inconsistent, the first included angle is continuously adjusted until the definition of the images of the symmetrical areas on the two sides of the Y axis is consistent; and if the image definition of symmetrical areas on two sides of the Y axis is consistent, the first included angle is proved to meet the requirement, and the adjustment of the first included angle is stopped.
After the adjustment of the first included angle is stopped, the position of the photosensitive chip plate with the adjusted first included angle is used as a reference plane to adjust a second included angle, whether the image definitions of symmetrical areas on two sides of the X axis are consistent or not is judged before the second included angle is adjusted, if yes, the photosensitive chip plate does not need to be adjusted, and the position of the corresponding photosensitive chip plate with the adjusted first included angle is the balance position of the photosensitive chip plate; if the two symmetrical areas are not consistent, the second included angle needs to be adjusted so as to enable the image definition of the symmetrical areas on the two sides of the X axis to be consistent.
Specifically, as shown in fig. 5, which is a schematic view of an apparatus for integrally adjusting a photosensitive chip board according to an embodiment of the present invention, it can be seen from fig. 5 that a first included angle and a second included angle exist; when adjusting, the first included angle is adjusted first, the second included angle is adjusted after the first included angle meets the condition, and the adjusting process is finished after the second included angle meets the condition.
In the implementation, firstly, the photosensitive chip plate is adjusted to enable the definition of images of symmetrical areas on two sides of a symmetrical axis parallel to an intersection line of a mounting plane and the photosensitive chip plate to be the same, after the definition of the images of the symmetrical areas on two sides of the symmetrical axis parallel to the intersection line is determined to be the same, the plane where the adjusted photosensitive chip plate is located is set as a reference plane, the photosensitive chip plate is continuously adjusted to enable the definition of the images of the symmetrical areas on two sides of the other symmetrical axis to be the same, at the moment, the definition of the symmetrical areas on two sides of the two symmetrical axes is ensured to be the same, the photosensitive chip plate is in a balanced state, in the adjusting process, the adjustment is only needed to be carried out according to the two symmetrical axes and the two included angles, the step of balancing the photosensitive chip plate by using a manual adjusting screw does not exist, the time is saved, and the working efficiency.
It should be noted that when selecting images of symmetric regions on both sides of the symmetry axis, it is preferable that the images are located close to the edge of the photosensitive chip board, specifically as shown in fig. 6, which is a schematic diagram of selecting images of symmetric regions according to an embodiment of the present invention, as can be seen from fig. 6, when determining whether the image definitions of symmetric regions on both sides of the Y axis are consistent, the two selected symmetric images are X1 and X2, respectively; when determining whether the image definitions of the symmetrical regions on both sides of the X axis are consistent, the two symmetrical images selected are Y1 and Y2, respectively.
Optionally, it is right sensitization chip board with after second contained angle between the reference plane is adjusted, if lie in two symmetry axes on the sensitization chip board with mounting plane with the definition of image is different in the mutual symmetric region of symmetry axis both sides that the intersecting line of sensitization chip board is parallel, then right sensitization chip board with first contained angle between the mounting plane is adjusted once more, so that lie in two symmetry axes on the sensitization chip board with mounting plane with the definition of image is the same in the mutual symmetric region of symmetry axis both sides that the intersecting line of sensitization chip board is parallel.
Based on the above contents, after the second included angle is adjusted to make the definition of the images in the X-axis bilateral symmetry regions consistent, whether the definition of the images in the Y-axis bilateral symmetry regions is consistent needs to be detected, and when it is determined that the definition of the images in the Y-axis bilateral symmetry regions is inconsistent, the first included angle is continuously adjusted to make the definition of the images in the Y-axis bilateral symmetry regions identical.
In implementation, after the second included angle is adjusted, whether the image definitions of symmetrical areas on two sides of a symmetrical axis parallel to the intersection line of the mounting plane and the photosensitive chip plate are consistent or not is determined, if the image definitions of symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the mounting plane and the photosensitive chip plate are inconsistent, the first included angle is adjusted to enable the image definitions of symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the mounting plane and the photosensitive chip plate to be consistent, detection and adjustment are conducted again, and the position of the adjusted photosensitive chip plate is guaranteed to be more accurate.
Example two: and adjusting the photosensitive chip plate, and firstly enabling the image definition of symmetrical areas on two sides of a symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate to be the same.
Optionally, the position of the photosensitive chip plate is adjusted, and the current position of the photosensitive chip plate is used as a reference plane;
adjusting a second included angle between the photosensitive chip plate and the reference plane so that the definition of images in mutually symmetrical areas on two sides of a symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate in the two symmetrical axes is the same;
it is right sensitization chip board with first contained angle between the mounting surface is adjusted, so that the definition that lies in another symmetry axis both sides and the regional image of mutual symmetry is the same in two symmetry axes on the sensitization chip board.
Specifically, two symmetry axes are divided on the photosensitive chip board, and as shown in fig. 2, an X axis and a Y axis are two symmetry axes on the photosensitive chip board; the position of the photosensitive chip plate at the initial moment is a preset position of the photosensitive chip plate, and whether the image definition of symmetrical areas on two sides of a symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate is the same or not is judged at the preset position of the photosensitive chip plate;
if not, taking the plane of the preset position of the photosensitive chip plate as a reference plane, adjusting a second included angle between the photosensitive chip plate and the reference plane, after the second included angle is adjusted to ensure that the image definition of symmetrical areas at two sides of a symmetrical axis which is not parallel to the intersecting line of the mounting plane and the photosensitive chip plate is the same, the adjusted position of the photosensitive chip plate is determined, judging whether the image definition of symmetrical areas at two sides of another symmetrical axis on the photosensitive chip plate is consistent or not according to the adjusted photosensitive chip plate, if so, determining that the adjusted photosensitive chip plate is in a balance position, otherwise, determining a first included angle according to the adjusted included angle between the photosensitive chip plate and the mounting plane, adjusting the first included angle until the definition of the images in the mutually symmetrical areas at the two sides of the other symmetry axis is consistent, stopping adjusting the first included angle, and determining that the position of the photosensitive chip plate is in a balance position;
if the two symmetrical areas are the same, the position of the photosensitive chip plate is unchanged, whether the image definitions of the symmetrical areas on the two sides of the other symmetrical axis are consistent or not is continuously judged, if yes, the preset position of the photosensitive chip plate is determined to be a balance position, otherwise, a first included angle between the photosensitive chip plate and the mounting plane is adjusted until the image definitions of the mutually symmetrical areas on the two sides of the other symmetrical axis are consistent, the adjustment of the first included angle is stopped, and the position of the photosensitive chip plate is determined to be in the balance position.
In the implementation, firstly, the photosensitive chip plate is adjusted to ensure that the image definitions of symmetrical areas at two sides of a symmetrical shaft which is not parallel to the intersection line of a mounting plane and the photosensitive chip plate are consistent, after the image definitions of the symmetrical areas at two sides of the symmetrical shaft which is not parallel to the intersection line are determined to be consistent, whether the image definitions of symmetrical areas at two sides of another symmetrical shaft on the adjusted photosensitive chip plate are consistent or not is judged, after the image definitions are determined to be inconsistent, a first included angle between the mounting plane and the adjusted photosensitive chip plate is adjusted to ensure that the image definitions of symmetrical areas at two sides of another symmetrical shaft are consistent, at the moment, the definition of symmetrical areas at two sides of the two symmetrical shafts is ensured to be consistent, the photosensitive chip plate is in a balanced state, in the adjusting process, the photosensitive chip plate can be adjusted according to the two symmetrical shafts and the two included angles, and the step of balancing the photosensitive plate by using a manual adjusting screw does not exist, time is saved, and working efficiency is improved.
Optionally, it is right sensitization chip board with after first contained angle between the mounting surface is adjusted, if lie in two symmetry axes on the sensitization chip board with the mounting surface with the definition of image is inequality among the mutual symmetric region of symmetry axis both sides that the intersecting line of sensitization chip board is not parallel, then right sensitization chip board with second contained angle between the reference plane is adjusted once more, so that lie in two symmetry axes on the sensitization chip board with the mounting surface with the definition of image is the same in the mutual symmetric region of symmetry axis both sides that the intersecting line of sensitization chip board is not parallel.
Based on the above contents, after the first included angle is adjusted to make the definition of the images in the bilateral symmetry areas of the Y axis consistent, whether the definition of the images in the bilateral symmetry areas of the X axis is consistent needs to be detected, and when the definition of the bilateral symmetry areas of the X axis is determined to be inconsistent, the second included angle is continuously adjusted to make the definition of the images in the mutual symmetry areas of the two sides of the X axis identical.
In implementation, after the first included angle is adjusted, whether the image definitions of symmetrical areas on two sides of a symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate are consistent or not is determined, if the image definitions of symmetrical areas on two sides of the symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate are not consistent, the second included angle is adjusted, the image definitions of symmetrical areas on two sides of the symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate are consistent, detection and adjustment are carried out again, and the position of the adjusted photosensitive chip plate.
The two embodiments provided by the embodiment of the invention adopt an algorithm mode to adjust the photosensitive chip plate, and the difference is that the adjustment sequence is different, the embodiment firstly adjusts a first included angle to ensure that the image definition of mutually symmetrical areas at two sides of a symmetrical axis parallel to the intersection line of the mounting plane and the photosensitive chip plate is the same, and adjusts a second included angle to ensure that the image definition of mutually symmetrical areas at two sides of a symmetrical axis not parallel to the intersection line of the mounting plane and the photosensitive chip plate is the same; the second embodiment is to adjust the second included angle first and then adjust the first included angle.
It should be noted that, in the above embodiments, adjusting the photosensitive chip board is automatically performed under the control of a camera program, that is, the position of the photosensitive chip board is adjusted by an algorithm, whether the image definitions of symmetric regions on two sides of a symmetric axis are consistent is judged by the algorithm, the position of the photosensitive chip board is automatically locked after the conditions are determined to be met, when the photosensitive chip is adjusted, the photosensitive chip board is adjusted only according to two fixed points on an X axis and a Y axis, manual screw adjustment is not needed, and after the adjustment, the photosensitive chip board can be automatically fixed without dispensing, so that the embodiment of the present invention is convenient to maintain while saving time and improving efficiency.
The method for adjusting the photosensitive chip plate provided by the embodiment of the invention also supports manual remote adjustment, focusing debugging and the like, and is also suitable for remotely and independently setting the photosensitive chip plate to be a special angle.
As shown in fig. 7, taking the first angle adjustment as an example, the overall method flowchart for adjusting the photosensitive chip board provided in the embodiment of the present invention specifically includes the following steps:
in step 710, the flatness adjustment of the photo chip board is completed.
Based on the same inventive concept, the embodiment of the invention also provides equipment for adjusting the photosensitive chip plate, and as the method corresponding to the equipment is the method for adjusting the photosensitive chip plate in the embodiment of the invention, and the principle of solving the problem of the equipment is similar to the method, the implementation of the equipment can refer to the implementation of the method, and repeated parts are not repeated.
As shown in fig. 8, an embodiment of the present invention provides an apparatus for adjusting a photosensitive chip board, including: at least one processing unit 800, and at least one memory unit 801, wherein the memory unit 801 stores program code that, when executed by the processing unit 800, causes the processing unit 800 to perform the following:
determining two symmetry axes on the photosensitive chip plate; wherein the two symmetry axes are perpendicular to each other, the intersection point of the two symmetry axes is the center point of the photosensitive chip board, and one of the two symmetry axes is parallel to the intersection line of the mounting plane and the photosensitive chip board;
it is right the position of sensitization chip board is adjusted, so that the definition that lies in a symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same, and the definition that lies in another symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same.
Optionally, the processing unit 800 is specifically configured to:
adjusting a first included angle between the photosensitive chip plate and the mounting plane so that the definition of images in mutually symmetrical areas on two sides of a symmetrical axis which is parallel to the intersection line of the mounting plane and the photosensitive chip plate and is positioned on the photosensitive chip plate is the same;
taking the position of the photosensitive chip plate with the first included angle adjusted as a reference plane;
and adjusting a second included angle between the photosensitive chip plate and the reference plane so that the definition of images in mutually symmetrical areas on two sides of another symmetrical shaft in the two symmetrical shafts on the photosensitive chip plate is the same.
Optionally, the processing unit 800 is further configured to:
if the definition of the image in the symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the photosensitive chip board and the mounting plane on the photosensitive chip board is different, the first included angle between the photosensitive chip board and the mounting plane is adjusted again, so that the definition of the image in the symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the photosensitive chip board and the mounting plane on the photosensitive chip board is the same.
Optionally, the processing unit 800 is specifically configured to:
taking the current position of the photosensitive chip plate as a reference plane;
adjusting a second included angle between the photosensitive chip plate and the reference plane so that the definition of images in mutually symmetrical areas on two sides of a symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate in the two symmetrical axes is the same;
it is right sensitization chip board with first contained angle between the mounting surface is adjusted, so that the definition that lies in another symmetry axis both sides and the regional image of mutual symmetry is the same in two symmetry axes on the sensitization chip board.
Optionally, the processing unit 800 is further configured to:
if the definition of the image in the symmetrical areas on two sides of the symmetrical axis, which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate, on the photosensitive chip plate is different, the second included angle between the photosensitive chip plate and the reference plane is adjusted again, so that the definition of the image in the symmetrical areas on two sides of the symmetrical axis, which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate, on the photosensitive chip plate is the same.
Based on the same inventive concept, the embodiment of the invention also provides equipment for adjusting the photosensitive chip plate, and as the method corresponding to the equipment is the method for adjusting the photosensitive chip plate in the embodiment of the invention, and the principle of solving the problem of the equipment is similar to the method, the implementation of the equipment can refer to the implementation of the method, and repeated parts are not repeated.
As shown in fig. 9, an embodiment of the present invention provides an apparatus for adjusting a photosensitive chip board, including a determining module 900, an adjusting module 901:
the determination module 900: determining two symmetry axes on the photosensitive chip plate; wherein the two symmetry axes are perpendicular to each other, the intersection point of the two symmetry axes is the center point of the photosensitive chip board, and one of the two symmetry axes is parallel to the intersection line of the mounting plane and the photosensitive chip board;
the adjusting module 901: it is right to be used for the position of sensitization chip board is adjusted, so that the definition that lies in a symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same, and the definition that lies in another symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same.
Optionally, the adjusting module 901 is specifically configured to:
adjusting a first included angle between the photosensitive chip plate and the mounting plane so that the definition of images in mutually symmetrical areas on two sides of a symmetrical axis which is parallel to the intersection line of the mounting plane and the photosensitive chip plate and is positioned on the photosensitive chip plate is the same;
taking the position of the photosensitive chip plate with the first included angle adjusted as a reference plane;
and adjusting a second included angle between the photosensitive chip plate and the reference plane so that the definition of images in mutually symmetrical areas on two sides of another symmetrical shaft in the two symmetrical shafts on the photosensitive chip plate is the same.
Optionally, the adjusting module 901 is further configured to:
if the definition of the image in the symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the photosensitive chip board and the mounting plane on the photosensitive chip board is different, the first included angle between the photosensitive chip board and the mounting plane is adjusted again, so that the definition of the image in the symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the photosensitive chip board and the mounting plane on the photosensitive chip board is the same.
Optionally, the adjusting module 901 is specifically configured to:
taking the current position of the photosensitive chip plate as a reference plane;
adjusting a second included angle between the photosensitive chip plate and the reference plane so that the definition of images in mutually symmetrical areas on two sides of a symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate in the two symmetrical axes is the same;
it is right sensitization chip board with first contained angle between the mounting surface is adjusted, so that the definition that lies in another symmetry axis both sides and the regional image of mutual symmetry is the same in two symmetry axes on the sensitization chip board.
Optionally, the adjusting module 901 is further configured to:
if the definition of the image in the symmetrical areas on two sides of the symmetrical axis, which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate, on the photosensitive chip plate is different, the second included angle between the photosensitive chip plate and the reference plane is adjusted again, so that the definition of the image in the symmetrical areas on two sides of the symmetrical axis, which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate, on the photosensitive chip plate is the same.
An embodiment of the present invention further provides a readable storage medium for adjusting a photosensitive chip board for synchronization, which includes program code for causing a computing device to execute the steps of the method for adjusting a photosensitive chip board when the program code runs on the computing device.
The present application is described above with reference to block diagrams and/or flowchart illustrations of methods, apparatus (systems) and/or computer program products according to embodiments of the application. It will be understood that one block of the block diagrams and/or flowchart illustrations, and combinations of blocks in the block diagrams and/or flowchart illustrations, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, and/or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer and/or other programmable data processing apparatus, create means for implementing the functions/acts specified in the block diagrams and/or flowchart block or blocks.
Accordingly, the subject application may also be embodied in hardware and/or in software (including firmware, resident software, micro-code, etc.). Furthermore, the present application may take the form of a computer program product on a computer-usable or computer-readable storage medium having computer-usable or computer-readable program code embodied in the medium for use by or in connection with an instruction execution system. In the context of this application, a computer-usable or computer-readable medium may be any medium that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A method of conditioning a photosensitive chip board, the method comprising:
determining two symmetry axes on the photosensitive chip plate; wherein the two symmetry axes are perpendicular to each other, the intersection point of the two symmetry axes is the center point of the photosensitive chip board, and one of the two symmetry axes is parallel to the intersection line of the mounting plane and the photosensitive chip board;
it is right the position of sensitization chip board is adjusted, so that the definition that lies in a symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same, and the definition that lies in another symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same.
2. The method of claim 1, wherein said adjusting the position of said photosensitive chip plate comprises:
adjusting a first included angle between the photosensitive chip plate and the mounting plane so that the definition of images in mutually symmetrical areas on two sides of a symmetrical axis which is parallel to the intersection line of the mounting plane and the photosensitive chip plate and is positioned on the photosensitive chip plate is the same;
taking the position of the photosensitive chip plate with the first included angle adjusted as a reference plane;
and adjusting a second included angle between the photosensitive chip plate and the reference plane so that the definition of images in mutually symmetrical areas on two sides of another symmetrical shaft in the two symmetrical shafts on the photosensitive chip plate is the same.
3. The method of claim 2, wherein after adjusting the second angle between the photosensitive chip plate and the reference plane, further comprising:
if the definition of the image in the symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the photosensitive chip board and the mounting plane on the photosensitive chip board is different, the first included angle between the photosensitive chip board and the mounting plane is adjusted again, so that the definition of the image in the symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the photosensitive chip board and the mounting plane on the photosensitive chip board is the same.
4. The method of claim 1, wherein said adjusting the position of said photosensitive chip plate comprises:
taking the current position of the photosensitive chip plate as a reference plane;
adjusting a second included angle between the photosensitive chip plate and the reference plane so that the definition of images in mutually symmetrical areas on two sides of a symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate in the two symmetrical axes is the same;
it is right sensitization chip board with first contained angle between the mounting surface is adjusted, so that the definition that lies in another symmetry axis both sides and the regional image of mutual symmetry is the same in two symmetry axes on the sensitization chip board.
5. The method of claim 4, wherein after adjusting the first angle between the photosensitive chip board and the mounting plane, further comprising:
if the definition of the image in the symmetrical areas on two sides of the symmetrical axis, which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate, on the photosensitive chip plate is different, the second included angle between the photosensitive chip plate and the reference plane is adjusted again, so that the definition of the image in the symmetrical areas on two sides of the symmetrical axis, which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate, on the photosensitive chip plate is the same.
6. An apparatus for conditioning a photosensitive chip plate, comprising: at least one processing unit and at least one memory unit, wherein the memory unit stores program code that, when executed by the processing unit, causes the processing unit to perform the following:
determining two symmetry axes on the photosensitive chip plate; wherein the two symmetry axes are perpendicular to each other, the intersection point of the two symmetry axes is the center point of the photosensitive chip board, and one of the two symmetry axes is parallel to the intersection line of the mounting plane and the photosensitive chip board;
it is right the position of sensitization chip board is adjusted, so that the definition that lies in a symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same, and the definition that lies in another symmetry axis both sides in two symmetry axes and the region of mutual symmetry on the sensitization chip board is the same.
7. The device of claim 6, wherein the processing unit is specifically configured to:
adjusting a first included angle between the photosensitive chip plate and the mounting plane so that the definition of images in mutually symmetrical areas on two sides of a symmetrical axis which is parallel to the intersection line of the mounting plane and the photosensitive chip plate and is positioned on the photosensitive chip plate is the same;
taking the position of the photosensitive chip plate with the first included angle adjusted as a reference plane;
and adjusting a second included angle between the photosensitive chip plate and the reference plane so that the definition of images in mutually symmetrical areas on two sides of another symmetrical shaft in the two symmetrical shafts on the photosensitive chip plate is the same.
8. The device of claim 7, wherein the processing unit is further to:
if the definition of the image in the symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the photosensitive chip board and the mounting plane on the photosensitive chip board is different, the first included angle between the photosensitive chip board and the mounting plane is adjusted again, so that the definition of the image in the symmetrical areas on two sides of the symmetrical axis parallel to the intersection line of the photosensitive chip board and the mounting plane on the photosensitive chip board is the same.
9. The device of claim 6, wherein the processing unit is specifically configured to:
taking the current position of the photosensitive chip plate as a reference plane;
adjusting a second included angle between the photosensitive chip plate and the reference plane so that the definition of images in mutually symmetrical areas on two sides of a symmetrical axis which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate in the two symmetrical axes is the same;
it is right sensitization chip board with first contained angle between the mounting surface is adjusted, so that the definition that lies in another symmetry axis both sides and the regional image of mutual symmetry is the same in two symmetry axes on the sensitization chip board.
10. The device of claim 9, wherein the processing unit is further to:
if the definition of the image in the symmetrical areas on two sides of the symmetrical axis, which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate, on the photosensitive chip plate is different, the second included angle between the photosensitive chip plate and the reference plane is adjusted again, so that the definition of the image in the symmetrical areas on two sides of the symmetrical axis, which is not parallel to the intersection line of the mounting plane and the photosensitive chip plate, on the photosensitive chip plate is the same.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810986579.1A CN110868509B (en) | 2018-08-28 | 2018-08-28 | Method and equipment for adjusting photosensitive chip board |
| PCT/CN2019/102955 WO2020043116A1 (en) | 2018-08-28 | 2019-08-28 | Systems and methods for adjusting position of photosensitive chip of image acquisition device |
| EP19854574.1A EP3827580B1 (en) | 2018-08-28 | 2019-08-28 | Systems and methods for adjusting position of photosensitive chip of image acquisition device |
| US17/185,881 US11425289B2 (en) | 2018-08-28 | 2021-02-25 | Systems and methods for adjusting position of photosensitive chip of image acquisition device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810986579.1A CN110868509B (en) | 2018-08-28 | 2018-08-28 | Method and equipment for adjusting photosensitive chip board |
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| CN110868509A true CN110868509A (en) | 2020-03-06 |
| CN110868509B CN110868509B (en) | 2022-02-18 |
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