CN110867138A - Display panel, manufacturing method and display device - Google Patents
Display panel, manufacturing method and display device Download PDFInfo
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- CN110867138A CN110867138A CN201911191143.4A CN201911191143A CN110867138A CN 110867138 A CN110867138 A CN 110867138A CN 201911191143 A CN201911191143 A CN 201911191143A CN 110867138 A CN110867138 A CN 110867138A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000004020 conductor Substances 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 30
- 238000005187 foaming Methods 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 15
- 229920001940 conductive polymer Polymers 0.000 claims description 14
- 239000006260 foam Substances 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 5
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229920001197 polyacetylene Polymers 0.000 claims description 4
- -1 polypropylene Polymers 0.000 claims description 4
- 229920000128 polypyrrole Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000002041 carbon nanotube Substances 0.000 claims description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 2
- 239000006261 foam material Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 239000000872 buffer Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 230000003068 static effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a display panel, a manufacturing method and a display device, wherein the display panel comprises: the display device comprises a first substrate and a second substrate, wherein through holes are formed in display areas of the first substrate and the second substrate, a bubble-shaped conductive object is arranged in a non-display area at the edge of the through hole, and the bubble-shaped conductive object is in contact with at least part of the edge of the through hole. For improving the reliability of the display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method and a display device.
Background
At present, a display device such as a mobile phone and a tablet computer often needs to reserve a space for electronic devices such as a commonly used front camera, a mechanical key and a fingerprint module. These devices are for example arranged in a top position on the front side of the display device.
In the prior art, in order to increase the screen occupation ratio, a transparent non-display area may be formed in the display area of the display panel to accommodate the electronic device, that is, a certain installation space is reserved in the display area for the electronic device.
However, in practical applications, external electrostatic charges easily enter the inside of the display screen from the installation space, thereby affecting the display effect of the display device. In addition, during use, the electronic device is easily collided with the display screen, thereby affecting the reliability of the display device.
Disclosure of Invention
The invention provides a display panel, a manufacturing method and a display device, which are used for improving the reliability of the display panel.
In a first aspect, an embodiment of the present invention provides a display panel, including:
the display device comprises a first substrate and a second substrate, wherein through holes are formed in display areas of the first substrate and the second substrate, a bubble-shaped conductive object is arranged in a non-display area at the edge of the through hole, and the bubble-shaped conductive object is in contact with at least part of the edge of the through hole.
In a second aspect, an embodiment of the present invention provides a display device, including the display panel described above.
In a third aspect, an embodiment of the present invention provides a method for manufacturing a display panel, including:
forming the through holes in the display areas of the first substrate and the second substrate;
at normal temperature, the bubble-like conductor in contact with at least a portion of the edge of the via hole is formed in the non-display region of the edge of the via hole.
The invention has the following beneficial effects:
in the technical scheme of the embodiment of the invention, the through holes are formed in the display areas of the first substrate and the second substrate, and the bubble-shaped conductive object which is in contact with at least part of the edge of the through hole is arranged in the non-display area at the edge of the through hole. On one hand, the bubble-shaped conductive object releases external static charges, so that the static protection function of the display panel is improved, and the display effect of the display panel is further improved. On the other hand, the bubble-like conductor effectively buffers the collision between the electronic device disposed in the through hole and the display panel, and improves the reliability of the display panel.
Drawings
Fig. 1 is a top view of a display panel according to an embodiment of the invention;
FIG. 2 is a cross-sectional view of the display panel shown in FIG. 1 along direction CC';
FIG. 3 shows an arrangement of bubble conductors in a display panel according to an embodiment of the present invention;
FIG. 4 is a diagram illustrating an alternative arrangement of bubble conductors in a display panel according to an embodiment of the present invention;
FIG. 5 is a diagram illustrating an alternative arrangement of bubble conductors in a display panel according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a display device according to an embodiment of the invention;
fig. 8 is a schematic structural diagram of another display device according to an embodiment of the invention;
fig. 9 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention;
fig. 10 is a flowchart of a method of implementing the first implementation manner of step S102 in the method for manufacturing a display panel according to the embodiment of the present invention;
fig. 11 is a flowchart of a method of implementing the second implementation manner of step S102 in the method for manufacturing a display panel according to the embodiment of the present invention.
Detailed Description
The terms "first," "second," and the like in the description and claims of the present invention and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "comprises" and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The term "and/or" herein is merely an association describing an associated object, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" in this document generally indicates that the preceding and following related objects are in an "or" relationship unless otherwise specified.
It should be understood that the preferred embodiments described below are only for illustrating and explaining the present invention and are not to be used for limiting the present invention. And the embodiments and features of the embodiments in the present application may be combined with each other without conflict. Also, the shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the present invention.
In order to better understand the technical solutions of the present invention, the technical solutions of the present invention are described in detail below with reference to the drawings and the specific embodiments, and it should be understood that the specific features in the embodiments and the embodiments of the present invention are detailed descriptions of the technical solutions of the present invention, and are not limitations of the technical solutions of the present invention, and the technical features in the embodiments and the embodiments of the present invention may be combined with each other without conflict.
Referring to fig. 1 and fig. 2, fig. 1 is a top view of a display panel according to an embodiment of the present invention, and fig. 2 is a cross-sectional view of the display panel shown in fig. 1 along a direction CC'. In an embodiment of the present invention, the display panel includes:
the display device comprises a first substrate 10 and a second substrate 20, wherein a through hole 30 is formed in a display area A of the first substrate 10 and the second substrate 20, a bubble-shaped conductor 40 is arranged in a non-display area B at the edge of the through hole 30, and the bubble-shaped conductor 40 is in contact with at least part of the edge of the through hole 30. The bubble-like conductor 40 may be in contact with the edge of the through hole 30 entirely or in contact with the edge of the through hole 30 partially. Fig. 1 shows a schematic view of the bubble conductor 40 in full contact with the edge of the via 30.
In the solution of the embodiment of the present invention, the through hole 30 is opened in the display area a of the first substrate 10 and the second substrate 20, and the bubble-like conductor 40 contacting at least a portion of the edge of the through hole 30 is disposed in the non-display area B at the edge of the through hole 30. On the other hand, the bubble-like conductive object 40 releases the external electrostatic charges, thereby improving the electrostatic protection function of the display panel and further improving the display effect of the display panel. On the other hand, the bubble-like conductor 40 effectively buffers the collision between the electronic device disposed in the through hole 30 and the display panel, improving the reliability of the display panel.
In the embodiment of the present invention, the through hole 30 is mainly used for placing devices such as a camera and a photosensor, and electrostatic charges easily enter the display panel through the through hole 30, so as to interfere with circuits inside the display panel and affect normal display of the display panel. In practice, these electrostatic charges can be conducted away by the bubble conductor 40 and do not accumulate in the via 30. Since the bubble-like conductor 40 is in contact with at least a portion of the edge of the through-hole 30 and is disposed in the non-display region B at the edge of the through-hole 30, electrostatic charges can be effectively prevented from entering the inside of the display panel, ensuring normal display of the display panel.
In the embodiment of the present invention, the bubble-shaped conductive object 40 is disposed in the non-display region B at the edge of the through hole 30, so that the collision damage between the electronic device disposed in the through hole 30 and the display panel can be alleviated, thereby improving the reliability of the display panel.
In the embodiment of the present invention, the bubble-shaped conductive object 40 is a conductive foam formed by doping a foaming material with conductive particles, or the bubble-shaped conductive object 40 is a bubble-shaped structure formed by foaming a conductive polymer. In this way, the bubble-shaped conductive object 40 not only conducts the electrostatic charges, but also provides a buffer protection for the components in contact with the bubble-shaped conductive object. Of course, those skilled in the art may select different materials to form the bubble-shaped conductive object 40 according to the actual application scenario, and details are not repeated herein.
In the specific implementation process, the conductive foam can be directly foamed and grown at the edge of the through hole 30 at a low temperature, the contact between the conductive foam and the edge of the through hole 30 is firmer, and the formed structure is more stable. Moreover, the electronic device arranged in the through hole 30 has better fixing performance and better reliability due to larger foaming volume growth of the conductive foam. In addition, the bubble-like conductor 40 can be formed at a low temperature, thereby reducing the production cost of the display panel.
In the specific implementation process, the light and thin design of the display panel is ensured due to the fact that the conductive foam is very light. The conductive foam has good flame retardance, low surface resistivity, good wear resistance, no dependence on environmental humidity and good corrosion resistance and oxidation resistance, so that the display panel made of the foam conductive material 40 formed by the conductive foam has better service performance.
In the embodiment of the present invention, the bubble-shaped conductive object 40 may be a conductive foam formed by doping a foaming material with conductive particles, wherein the foaming material may be at least one of polypropylene PP, polyurethane PU, polyethylene PE, and polyvinyl chloride PVC, and in practical applications, the foaming material of different materials may be specifically selected according to application scene requirements, so as to manufacture the conductive foam. In addition, the foam material is low in material cost and good in stability, so that the manufactured conductive foam and the display panel are low in cost. In a specific implementation, the material of the conductive particles includes at least one of nickel copper, gold, carbon, tin, aluminum, and copper. Because the electric conductivity of the conductive particles is good, the electrostatic charges can be well conducted, and therefore the electrostatic protection capability of the display panel is improved and the display effect of the display panel is ensured through the conductive foam formed by foaming the conductive particles. Of course, conductive particles made of other materials with better conductivity can be selected, and are not described herein again.
In the embodiment of the present invention, the bubble-like conductor 40 may also be a bubble-like structure formed by foaming a conductive polymer. Wherein the conductive polymer comprises at least one of polyacetylene, polypyrrole and polyethylene oxide. In the specific implementation process, the conductive polymer can be directly foamed and grown at the edge of the through hole 30 at a low temperature, so that a bubble structure is formed. The structure formed by the method is more stable because the whole process is directly subjected to foaming growth. Moreover, the larger the foamed volume of the conductive polymer, the better the fixing performance and reliability of the electronic device arranged in the through hole 30. In addition, the conductive polymer can be foamed at low temperature, thereby reducing the production cost of the display panel.
In the embodiment of the present invention, as shown in fig. 3, one of the arrangements of the bubble-like conductor 40, specifically, the bubble-like conductor 40 is arranged around the through hole 30, so that the force from all directions can be effectively relieved, and the electronic device arranged in the through hole 30 can be effectively protected.
In the embodiment of the present invention, as shown in fig. 4, another arrangement of the bubble-like conductor 40 is shown, specifically, the bubble-like conductor 40 includes a first bubble-like conductor 401 and a second bubble-like conductor 402, and the first bubble-like conductor 401 and the second bubble-like conductor 402 are symmetrically arranged around the through hole 30. In a specific implementation, the first bubble conductor 401 and the second bubble conductor 402 may be symmetrically disposed at the corresponding edges of the via 30 according to a direction in which the frequency of collision of the electronic device disposed in the via 30 with the via 30 is the highest. For example, to the position that sets up the camera structure adjustment bubble conducting object 40 in through-hole 30, for example, can be to a plurality of cameras carry out the setting of corresponding easy position of colliding with to carry out effectual buffering to the easy position of colliding with, thereby when improving display panel reliability, reduced display panel's cost design. As shown in fig. 4, the first bubble conductor 401 and the second bubble conductor 402 are arranged along the first direction x. For example, the first direction x is a direction extending along the gate line, and the second direction y is a direction perpendicular to the first direction x. For example, the second direction y is a direction along which the data line extends. As shown in fig. 5, another arrangement of the bubble-like conductor 40, specifically, a first bubble-like conductor 401 and a second bubble-like conductor 402 may be symmetrically arranged in a second direction y perpendicular to the first direction x. Of course, in practical applications, the bubble-shaped conductive object 40 may be disposed according to specific needs, and will not be described herein.
In a specific implementation process, the bubble-shaped conductive object 40 with a corresponding thickness and the bubble-shaped conductive object 40 with a corresponding volume can be arranged according to the volume of the electronic device arranged in the through hole 30 and the area size of the through hole 30, so that different conduction characteristics of the display panel to electrostatic charges are realized, and diversified designs of the display panel are realized.
In the embodiment of the present invention, the display panel is an organic light emitting diode display panel, and the bubble-like conductor 40 is electrically connected to a ground line of the organic light emitting diode display panel, specifically, the first substrate 10 may be a cover plate, and the second substrate 20 may be an LTPS substrate in which the ground line is disposed. The bubble-shaped conductive object 40 is electrically connected to the ground line of the LTPS substrate, so that the bubble-shaped conductive object 40 at least partially contacting the edge of the through hole 30 can conduct the electrostatic charges to the outside of the oled display panel through the ground line of the oled display panel, thereby protecting the oled display panel and improving the display effect of the oled.
In the embodiment of the present invention, as shown in fig. 6, another structural diagram of the display panel is shown, and specifically, the display panel further includes a conductive layer 50 disposed around an edge of the through hole 30. In a specific implementation process, the electrostatic charges inside the through holes 30 can be fully conducted to the outside of the display panel through the conductive layer 50, so that electrostatic protection of the display panel is realized, and a display effect of the display panel is improved.
In a specific implementation, the conductive layer 50 includes a black matrix and conductive particles doped in the black matrix. The conductive particles are made of at least one of polyacetylene, polypyrrole, polyethylene oxide, graphene and carbon nanotubes. The conductive particles have good conductivity, so that static charges from the outside can be quickly conducted to the outside of the display panel, and the display effect of the display panel is improved. Of course, other conductive particles with better conductivity can also be used, and are not described herein again. In the specific implementation process, the conductive layer 50 includes a black matrix, so that interference of external light to the display panel can be effectively prevented, and the display effect of the display panel is further improved.
Based on the same inventive concept, an embodiment of the present invention also provides a display device, as shown in fig. 7, including the display panel 100 described above. In a specific implementation process, as shown in fig. 8, another structure of the display device is shown, specifically, the display panel 100 is a liquid crystal display panel, the first substrate 10 may be a color film substrate, the second substrate 20 may be an array substrate, the display panel 100 further includes an iron frame 60, and the foamed conductive object 40 is in direct contact with the iron frame 60. In this way, the electrostatic charges from the outside are conducted to the outside through the foamed conductive object 40 and the bezel 60, thereby achieving electrostatic protection of the display device and improving the display effect of the display device.
Still in combination with the liquid crystal display panel shown in fig. 8, the first substrate 10 and the second substrate 20 are attached together by the sealant 70, so that a box-shaped space is formed between the first substrate 10 and the second substrate 20, a liquid crystal layer 80 can be disposed in the box-shaped space, and liquid crystal molecules in the liquid crystal layer 80 can be limited in the box-shaped space by the sealant 70 and cannot overflow.
In the embodiment of the present invention, since the principle of the display device for solving the problem is similar to that of the display panel, the implementation of the display device can refer to the implementation of the display panel, and repeated descriptions are omitted.
In a specific implementation process, the display device provided in the embodiment of the present invention may be a mobile phone shown in fig. 7, and certainly, the display device provided in the embodiment of the present invention may also be any product or component having a display function, such as a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator. Other essential components of the display device are understood by those skilled in the art, and are not described herein nor should they be construed as limiting the present invention.
In the display panel and the display device provided by the embodiment of the invention, the through hole 30 is formed in the display area a of the first substrate 10 and the second substrate 20, and the bubble-shaped conductive object 40 contacting at least part of the edge of the through hole 30 is arranged in the non-display area B at the edge of the through hole 30. On the other hand, the bubble-like conductive object 40 releases the external electrostatic charges, thereby improving the electrostatic protection function of the display panel and further improving the display effect of the display panel. On the other hand, the bubble-like conductor 40 effectively buffers the collision between the electronic device disposed in the through hole 30 and the display panel, improving the reliability of the display panel.
Based on the same inventive concept, referring to fig. 9, an embodiment of the present invention further provides a method for manufacturing a display panel, including:
s101: forming the through holes in the display areas of the first substrate and the second substrate;
s102: at normal temperature, the bubble-like conductor in contact with at least a portion of the edge of the via hole is formed in the non-display region of the edge of the via hole.
In the specific implementation process, the specific implementation process from step S101 to step S102 is as follows:
firstly, forming through holes in display areas of a first substrate and a second substrate; then, at normal temperature, in the non-display region at the edge of the via hole, a bubble-like conductive object is formed in contact with at least part of the edge of the via hole. Because the bubble-shaped conductive object can be formed at low temperature, the contact between the bubble-shaped conductive object and the edge of the through hole is firmer, the reliability of the display panel is improved, and the design cost of the display panel is reduced.
In the embodiment of the present invention, step S102 can be implemented by, but is not limited to, the following two implementations. Referring to fig. 10, in a first implementation manner, step S102: forming the bubble-like conductor in contact with at least a portion of the edge of the via hole in the non-display region at the edge of the via hole at normal temperature, including:
s201: doping the foaming material and the conductive particles to form a mixture;
s202: disposing the mixture in the non-display area at the edge of the through-hole and in contact with at least a portion of the edge of the through-hole;
s203: and foaming the mixture to form the bubble-shaped conductive object.
In the specific implementation process, the specific implementation process of step S201 to step S203 is as follows:
firstly, doping a foaming material and conductive particles to form a mixture; specifically, doping may be performed according to a corresponding ratio according to a conductive requirement. The doped mixture is then disposed in the non-display area at the edge of the via and in contact with at least a portion of the edge of the via. Specifically, the doped mixture can be disposed at the corresponding position of the edge of the through hole according to actual needs. Then, the mixture is foamed to form a foamed conductive material. That is, the doped mixture is directly disposed at a corresponding position of the edge of the via hole, and the mixture is directly foamed, thereby forming a bubble-like conductor. In addition, the mixture can be directly foamed at normal temperature to form a foamed conductive object, so that the manufacturing process of the display panel is simplified.
Referring to fig. 11, step S102: forming the bubble-like conductor in contact with at least a portion of the edge of the via hole in the non-display region at the edge of the via hole at normal temperature, including:
s301: arranging a conductive polymer in the non-display area at the edge of the through hole and contacting at least part of the edge of the through hole;
s302: and foaming the conductive polymer to form the bubble-shaped conductive object.
In the specific implementation process, the specific implementation process from step S301 to step S302 is as follows:
firstly, arranging a conductive polymer in a non-display area at the edge of a through hole, and contacting at least part of the edge of the through hole; then, the conductive polymer is foamed to form a foamed conductive material. The whole foaming process can be directly realized at normal temperature, so that the manufacturing process of the display panel is relatively simplified.
In the embodiment of the present invention, since the principle of the manufacturing method of the display panel to solve the problem is similar to that of the display panel, the specific structure of the display panel can refer to the structure of the display panel, and repeated descriptions are omitted.
In the manufacturing method of the display panel provided by the embodiment of the invention, the through holes are formed in the display areas of the first substrate and the second substrate; then, at normal temperature, a bubble-like conductor in contact with at least part of the edge of the via hole is formed in the non-display region at the edge of the via hole. On the other hand, the bubble-like conductive object 40 releases the external electrostatic charges, thereby improving the electrostatic protection function of the display panel and further improving the display effect of the display panel. On the other hand, the bubble-like conductor 40 effectively buffers the collision between the electronic device disposed in the through hole 30 and the display panel, improving the reliability of the display panel. In addition, at normal temperature, the bubble-shaped conductive object can be formed at the edge of the through hole, so that the whole manufacturing process is simple, and the manufacturing cost of the display panel is reduced.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (17)
1. A display panel, comprising:
the display device comprises a first substrate and a second substrate, wherein through holes are formed in display areas of the first substrate and the second substrate, a bubble-shaped conductive object is arranged in a non-display area at the edge of the through hole, and the bubble-shaped conductive object is in contact with at least part of the edge of the through hole.
2. The display panel according to claim 1, wherein the bubble-like conductor is a conductive foam formed by doping a foam material with conductive particles, or is a bubble-like structure formed by foaming a conductive polymer.
3. The display panel of claim 2, wherein the foamed material comprises at least one of polypropylene (PP), Polyurethane (PU), Polyethylene (PE), and polyvinyl chloride (PVC).
4. The display panel of claim 2, wherein the material of the conductive particles comprises at least one of nickel copper, gold, carbon, tin, aluminum, and copper.
5. The display panel of claim 2, wherein the conductive polymer comprises at least one of polyacetylene, polypyrrole, and polyethylene oxide.
6. The display panel of claim 1, wherein the bubble conductor is disposed around the via.
7. The display panel of claim 1, wherein the bubble conductors are spaced around the via.
8. The display panel of claim 7, wherein the bubble-like conductor comprises a first bubble-like conductor and a second bubble-like conductor, the first bubble-like conductor and the second bubble-like conductor being symmetrically disposed about the via.
9. The display panel according to claim 1, wherein the display panel is an organic light emitting diode display panel, and the bubble-like conductor is electrically connected to a ground line of the organic light emitting diode display panel.
10. The display panel according to any one of claims 1 to 9, further comprising a conductive layer disposed around an edge of the through hole.
11. The display panel according to claim 10, wherein the conductive layer comprises a black matrix and conductive particles doped in the black matrix.
12. The display panel of claim 11, wherein a material of the conductive particles comprises at least one of polyacetylene, polypyrrole, polyethylene oxide, graphene, and carbon nanotubes.
13. A display device characterized by comprising the display panel according to any one of claims 1 to 12.
14. The display device according to claim 13, wherein the display panel is a liquid crystal display panel, the display panel further comprising an iron frame, and the bubble-like conductor is in direct contact with the iron frame.
15. A method of manufacturing a display panel according to any one of claims 1 to 12, comprising:
forming the through holes in the display areas of the first substrate and the second substrate;
at normal temperature, the bubble-like conductor in contact with at least a portion of the edge of the via hole is formed in the non-display region of the edge of the via hole.
16. The method of claim 15, wherein the forming the bubble-like conductor in contact with at least a portion of the via edge in the non-display region at the via edge comprises:
doping the foaming material and the conductive particles to form a mixture;
disposing the mixture in the non-display area at the edge of the through-hole and in contact with at least a portion of the edge of the through-hole;
and foaming the mixture to form the bubble-shaped conductive object.
17. The method of claim 15, wherein the forming of the bubble-like conductor in contact with at least a portion of the via edge in the non-display region at the via edge comprises:
arranging a conductive polymer in the non-display area at the edge of the through hole and contacting at least part of the edge of the through hole;
and foaming the conductive polymer to form the bubble-shaped conductive object.
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| Application Number | Priority Date | Filing Date | Title |
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| CN115731813A (en) * | 2021-08-31 | 2023-03-03 | 乐金显示有限公司 | Display device and display apparatus |
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