CN110862513B - Hot-melt epoxy resin and preparation method and application of prepreg - Google Patents
Hot-melt epoxy resin and preparation method and application of prepreg Download PDFInfo
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- CN110862513B CN110862513B CN201911192688.7A CN201911192688A CN110862513B CN 110862513 B CN110862513 B CN 110862513B CN 201911192688 A CN201911192688 A CN 201911192688A CN 110862513 B CN110862513 B CN 110862513B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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Abstract
The invention discloses a hot-melt epoxy resin which is prepared by firstly adding a curing agent for heating, heat-preserving and pre-curing treatment, adjusting the viscosity of a polymer, then cooling and adding the curing agent for molding; the invention also discloses a preparation method of the prepreg, which takes the hot-melt epoxy resin as a raw material and adopts a film adhesive calendering method in the hot-melt method to prepare the prepreg; the invention also discloses application of the prepreg, wherein the prepreg is molded by a mould pressing method after being paved and attached, and a prepreg laminated board is obtained after cooling. The hot-melt epoxy resin has good film forming property and impregnating property, avoids adverse effects of uneven multi-component ingredients and mixed materials on product performance, and is beneficial to industrial automatic production; the preparation method of the prepreg improves the uniformity of the content of the gel in the prepreg, and the prepared prepreg has good cohesiveness at room temperature and is convenient to operate; the prepreg has the advantages of simple application process, mild preparation conditions and easy realization, and further expands the application range of the prepreg.
Description
Technical Field
The invention belongs to the technical field of prepreg preparation, and particularly relates to hot-melt epoxy resin, and a preparation method and application of prepreg.
Background
The resin-based composite material has the characteristics of strong manufacturability, good mechanical property, excellent thermophysical and physical properties and the like. The epoxy resin is a resin matrix which is most widely applied to resin-based composite materials, and has excellent manufacturability, heat resistance, chemical resistance, mechanical property and electrical property, so that the epoxy resin is widely applied to the fields of aerospace and the like. The epoxy resin is a polymer containing more than two epoxy groups in the molecule, is cured and crosslinked by adopting a curing agent to generate a network structure, and belongs to thermosetting resin. Along with the application of the resin in the aerospace field, higher requirements are put on the heat resistance of the resin, and the glass transition temperature of the aerospace-grade resin is required to be more than 150 ℃.
The prepreg is a composition of a resin matrix and a reinforcement prepared by impregnating a resin matrix with continuous fibers or fabrics under strictly controlled conditions, is an intermediate for manufacturing advanced composite materials, has a structural unit with certain mechanical properties, can be subjected to structural design, and is directly transplanted into a composite material product with certain properties. The prepreg can be produced by a solution method (wet method) and a hot-melt method (dry method). The solution method is the first method for manufacturing the prepreg, that is, the resin is dissolved in a solvent (such as ethanol and acetone) with low boiling point to form the prepreg, which has the defects of uneven gel content, environmental pollution and the like; the hot melting method is to melt resin at high temperature, and then carbon fibers or fabrics are impregnated in different modes to prepare prepreg, the prepared prepreg has uniform and easily-controlled content, no solvent, low volatile matter content, no environmental pollution, good appearance quality of finished products and increasingly wide and deep application, so the research on the hot melting method has been a hotspot. According to the process steps, the hot melting method can be divided into a direct hot melting method and a film adhesive calendering method, wherein the fiber is directly immersed into the molten resin; the latter is to make resin into glue film, compound on the surface of fiber, then heat and pressurize to melt the resin, and immerse into fiber. The film adhesive calendering method is the most widely applied method at the present stage, and requires that the resin has good film forming property in a room temperature environment and has good wettability and adhesiveness to fibers at a certain temperature.
In general, a method for synthesizing a hot-melt epoxy resin for a prepreg includes mixing a liquid resin and a solid resin to adjust the viscosity and specific properties of the resin, and adding a curing agent and an accelerator. In general, in a hot-melt resin formula, liquid epoxy resin is taken as a matrix (such as E51), and then cured epoxy resin is added to adjust viscosity (increase viscosity), so that the resin is in a semi-solid state at normal temperature and is not sticky, and the prepared prepreg is easy to operate; on the other hand, the resin viscosity is required to be semisolid at normal temperature, and when the fiber or fabric is impregnated after hot melting, the viscosity in the process window is required to be good for the impregnation of the fiber or fabric (the film formation is required to be good in the film-forming method) and the applicable viscosity of the existing equipment is required to be 7 pas to 70 pas. The patent application No. 201510023408.5 discloses a method for preparing colorless transparent epoxy resin for prepreg and composite material, which comprises using liquid epoxy resin, solid epoxy resin, curing agent and accelerator as components, and adjusting the ratio of the liquid epoxy resin and the solid epoxy resin to adjust the viscosity of the colorless transparent epoxy resin, wherein the glass transition temperature of the obtained prepreg is 145-150 ℃, and the heat resistance is general. The patent with the application number of 201610365714.1 discloses a high-temperature-resistant cured epoxy resin carbon fiber prepreg, and a preparation method and application thereof, wherein the viscosity is adjusted by adjusting the proportion of liquid epoxy resin and solid epoxy resin, and the prepared prepreg has good heat resistance, but is realized by adding high-temperature-resistant epoxy resin.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a hot-melt epoxy resin, which is used for overcoming the defects of the prior art. The hot-melt epoxy resin is prepared by firstly adding the curing agent to carry out heating and heat-preservation pre-curing treatment, adjusting the viscosity of a polymer, then cooling and adding the curing agent to carry out forming, so that the material loss caused by the batching times is reduced, the adverse effects of errors and uneven material mixing in the calculation process of multi-component batching on the performance of products are avoided, the industrial automatic production is facilitated, the hot-melt epoxy resin is in a semi-solid state at room temperature and is not sticky, the film-forming property after heating is better, and the impregnation property on continuous fibers/fabrics is better.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the hot-melt epoxy resin is characterized by being prepared from the following raw materials in parts by mass: 100 parts of liquid epoxy resin, 3.5-4.0 parts of aromatic amine curing agent A and 26.7-27.3 parts of aromatic amine curing agent B; the heat distortion temperature of the aromatic amine curing agent A and the aromatic amine curing agent B reaches 150 ℃, the heat distortion temperature of the aromatic amine curing agent B is higher than that of the aromatic amine curing agent A, and the latency of the aromatic amine curing agent B in the epoxy resin is better than that of the aromatic amine curing agent A in the epoxy resin; the hot-melt epoxy resin is prepared by the following steps:
step one, heating and insulating liquid epoxy resin;
step two, adding an aromatic amine curing agent A into the liquid epoxy resin heated and insulated in the step one, uniformly stirring, heating to 150-160 ℃, and insulating for 100-120 min to perform pre-curing treatment to obtain a polymer;
and step three, cooling the polymer obtained in the step two to 90-100 ℃, then adding the aromatic amine curing agent B in batches, uniformly stirring, and cooling to room temperature to obtain the hot-melt epoxy resin.
The method comprises the steps of heating and insulating liquid epoxy resin to enhance stirring performance, adding the aromatic amine curing agent A, heating and insulating to perform pre-curing adjustment to increase viscosity to obtain a polymer, cooling, and adding the aromatic amine curing agent B to avoid an implosion phenomenon caused by an exothermic reaction between the liquid epoxy resin and the aromatic amine curing agent A, so that the hot-melt epoxy resin with excellent heat resistance is obtained, is semi-solid at room temperature and is not sticky, and has good film forming performance after heating and good impregnation performance on continuous fibers/fabrics.
The above hot-melt epoxy resin is characterized in that the liquid epoxy resin is E51 epoxy resin. The liquid epoxy resin is a general liquid epoxy resin, has good performances of adhesion, corrosion resistance, insulation and high strength, is low in price and is easy to obtain.
The hot-melt epoxy resin is characterized in that the aromatic amine curing agent A is a DDM curing agent. The DDM curing agent has good heat resistance and is easy to obtain.
The hot-melt epoxy resin is characterized in that the aromatic amine curing agent B is a DDS curing agent. The DDS curing agent has better heat resistance and the heat resistance is better than that of the common DDM curing agent.
The hot-melt epoxy resin is characterized in that the heating temperature in the step one is 50-60 ℃, and the heat preservation time is 20-30 min. The optimized heating parameters improve the fluidity of the liquid epoxy resin after heating and heat preservation, and are beneficial to mutual solubility of the subsequent liquid epoxy resin and the curing agent.
The hot-melt epoxy resin is characterized in that the adding times in the step three are 3 times. As the reaction of the liquid epoxy resin after the aromatic amine curing agent A and the aromatic amine curing agent B are added is an exothermic reaction, the aromatic amine curing agent B is added by times, particularly by 3 times, so that the cooled polymer and the aromatic amine curing agent B are fully stirred and uniformly dispersed, and the phenomenon of implosion caused by excessive heat aggregation is avoided, and the preparation of the hot-melt epoxy resin is prevented from being influenced.
In addition, the invention also discloses a method for preparing the prepreg by adopting the hot-melt epoxy resin, which is characterized in that the prepreg is prepared by adopting a film adhesive calendering method in the hot-melt method, and the specific process is as follows: the molten hot-melt epoxy resin is uniformly coated on the gumming paper on a coating machine to prepare a film, then the fiber/fabric is clamped between two rolls of films on a dipping machine to form a sandwich structure, and the films are dipped into the fiber/fabric through a hot roller to obtain the prepreg.
The prepreg is prepared by adopting a film adhesive calendering method in a hot melting method, and the fiber/fabric is clamped between two rolls of films made of hot-melt epoxy resin to form a sandwich structure, so that the uniformity of the content of the adhesive in the prepreg is improved, and the prepared prepreg has good cohesiveness at room temperature and is convenient to operate.
The method is characterized in that the temperature of the rubber roller of the coating machine is 60-65 ℃, and the whole linear speed is 3-5 m/min; the temperature of the hot roller of the impregnation machine is 65-70 ℃, and the linear speed is 3-5 m/min. The optimized technological parameters in the preparation process are beneficial to uniformly coating the molten hot-melt epoxy resin on the impregnated paper to prepare a film with uniform thickness, ensure that the film is fully immersed into the fiber/fabric, and further improve the uniformity of the content of the glue in the prepreg.
The invention also provides application of the prepreg, which is characterized in that the prepreg is molded by adopting a mould pressing method after being laid and pasted, and a prepreg laminated board is obtained after cooling; the specific process of molding by the die pressing method comprises the following steps: firstly heating to 90-100 ℃ and preserving heat for 20-30 min at the pressure of 0.1-0.3 MPa, then heating to 190-200 ℃ and preserving heat for 120-150 min at the pressure of 0.3-0.5 MPa.
The invention adopts a mould pressing method to prepare the prepreg into the prepreg laminated board, has simple process, mild preparation conditions and easy realization, and further enlarges the application range of the prepreg.
The application is characterized in that the prepreg is a glass fiber prepreg. The preparation method can be applied to common glass fiber prepreg, and the glass fiber prepreg laminated board is prepared by taking the common glass fiber prepreg as a raw material, so that the practical performance and the application value of the invention are enlarged.
Compared with the prior art, the invention has the following advantages:
1. compared with the prior art that the viscosity is adjusted by adjusting the proportion of liquid resin and solid resin in the preparation components, the invention obtains the hot-melt epoxy resin with excellent heat resistance by adding the curing agent for heating, heat-preserving and pre-curing treatment, adjusting the viscosity of the polymer, then cooling and adding the curing agent for molding, reduces the material loss caused by the batching times, avoids the bad influence on the product performance caused by errors and uneven mixing in the multi-component batching calculation process, and is beneficial to industrial automatic production.
2. According to the invention, through the selection of the proportion of the resin and the curing agent, the prepared hot-melt epoxy resin is semisolid at room temperature and is not sticky, the film-forming property after heating is better, and the impregnation property on continuous fibers/fabrics is better.
3. The prepreg is prepared by adopting a film adhesive calendering method in a hot melting method, and the fiber/fabric is clamped between two rolls of films made of hot-melt epoxy resin to form a sandwich structure, so that the uniformity of the content of the adhesive in the prepreg is improved, and the prepared prepreg has good cohesiveness at room temperature and is convenient to operate.
4. The invention firstly prepares the glass fiber prepreg, and then prepares the glass fiber prepreg into the glass fiber laminated board by adopting a mould pressing method, the glass transition temperature of the glass fiber laminated board can reach more than 180 ℃, the heat resistance is good, and the use requirement in high temperature environment is greatly met.
5. The glass fiber board laminated board prepared by the invention has no adverse phenomena of layering, pores, rich grease, poor glue, debonding, deformation and the like, and the finally prepared product meets the standard requirement.
The technical solution of the present invention is further described in detail by examples below.
Detailed Description
Example 1
The hot-melt epoxy resin of the embodiment is prepared from the following raw materials in parts by weight: 100 parts of E51 epoxy resin, 4.0 parts of DDM curing agent and 26.7 parts of DDS curing agent; the hot-melt epoxy resin is prepared by the following steps:
step one, heating 100 parts of E51 epoxy resin to 50 ℃, and preserving heat for 30 min;
step two, adding 4.0 parts of DDM curing agent into the E51 epoxy resin heated and insulated in the step one, uniformly stirring, heating to 150 ℃, and insulating for 120min for pre-curing treatment to obtain a polymer;
and step three, cooling the polymer obtained in the step two to 90 ℃, then adding 26.7 parts of DDS curing agent by 3 times, uniformly stirring, and cooling to room temperature to obtain the hot-melt epoxy resin.
The hot-melt epoxy resin of the embodiment is semisolid and not sticky at room temperature, and the result shows that the film forming property is good when the hot-melt epoxy resin is coated on release paper; the viscosity of the hot-melt epoxy resin at 60 ℃ is measured by adopting a Brookf IELD Bolifei DV-II viscometer of America, and the viscosity at 65 ℃ is measured to be between 27 and 28 Pa.s and between 15 and 17 Pa.s; the gel time of the resin is measured by referring to GJB1059.4-1990 'test method for testing phenolic resin for ablative material gel time test', at a constant temperature of 150 ℃, the hot-melt epoxy resin which is dissolved in absolute ethyl alcohol and has 40 percent of solid content is placed in a horizontal shallow round groove with a surface of a specified heating plate, the stirring is carried out according to a specified mode, the time of the hot-melt epoxy resin which is heated from the beginning to the gel is recorded to be 175s, and the viscosity requirement of a hot-melt adhesive film calendering method is met.
The specific process for preparing the prepreg by using the hot-melt epoxy resin in the embodiment comprises the following steps: uniformly coating the molten hot-melt epoxy resin on gumming paper on a coating machine to prepare a film, then clamping glass fibers between two rolls of films on a dipping machine to form a sandwich structure, and soaking the films into the glass fibers through a hot roller to obtain glass fiber prepreg; the temperature of the rubber roller of the coating machine is 60 ℃, and the whole linear speed is 3 m/min; the temperature of the hot roller of the impregnating machine is 65 ℃, and the linear speed is 3 m/min.
The application process of the prepreg in the embodiment is as follows: laying 17 layers of glass fiber prepreg, then placing the glass fiber prepreg into a mould to be molded by adopting a mould pressing method, and cooling to obtain a glass fiber laminated board; the specific process of molding by the die pressing method comprises the following steps: heating to 90 deg.C, maintaining at 0.3MPa for 30min, heating to 190 deg.C, and maintaining at 0.5MPa for 150 min.
The glass transition temperature of the glass fiber laminated board of the embodiment is 186 ℃ measured by a DMA 242C type dynamic mechanical analyzer of German Nachi company, the heat resistance is good, and the use requirement in high temperature environment can be met.
Example 2
The hot-melt epoxy resin of the embodiment is prepared from the following raw materials in parts by weight: 100 parts of E51 epoxy resin, 3.8 parts of DDM curing agent and 27.0 parts of DDS curing agent; the hot-melt epoxy resin is prepared by the following steps:
step one, heating 100 parts of E51 epoxy resin to 55 ℃, and keeping the temperature for 25 min;
step two, adding 3.8 parts of DDM curing agent into the E51 epoxy resin heated and insulated in the step one, uniformly stirring, heating to 155 ℃, and insulating for 110min for pre-curing treatment to obtain a polymer;
and step three, cooling the polymer obtained in the step two to 95 ℃, then adding 27.0 parts of DDS curing agent by 3 times, uniformly stirring, and cooling to room temperature to obtain the hot-melt epoxy resin.
The hot-melt epoxy resin of the embodiment is semisolid and not sticky at room temperature, and the result shows that the film forming property is good when the hot-melt epoxy resin is coated on release paper; the viscosity of the hot-melt epoxy resin at 60 ℃ is measured by adopting a Brookf IELD Bolifei DV-II viscometer of America, and the viscosity at 65 ℃ is measured to be between 23 and 24 Pa.s and between 12 and 13 Pa.s; the gel time of the resin is measured by referring to GJB1059.4-1990 'test method for testing phenolic resin for ablative material gel time test', at a constant temperature of 150 ℃, the hot-melt epoxy resin which is dissolved in absolute ethyl alcohol and has 40 percent of solid content is placed in a horizontal shallow round groove with a surface of a specified heating plate, the stirring is carried out according to a specified mode, the time of the hot-melt epoxy resin which is heated from the beginning to the gel is recorded as 182s, and the viscosity requirement of a hot-melt adhesive film calendering method is met.
The specific process for preparing the prepreg by using the hot-melt epoxy resin in the embodiment comprises the following steps: uniformly coating the molten hot-melt epoxy resin on gumming paper on a coating machine to prepare a film, then clamping glass fibers between two rolls of films on a dipping machine to form a sandwich structure, and soaking the films into the glass fibers through a hot roller to obtain glass fiber prepreg; the temperature of the rubber roller of the coating machine is 62 ℃, and the whole linear speed is 4 m/min; the temperature of the hot roller of the impregnation machine is 68 ℃, and the linear speed is 4 m/min.
The application process of the prepreg in the embodiment is as follows: laying 17 layers of glass fiber prepreg, placing the glass fiber prepreg into a mould, forming by adopting a mould pressing method, and cooling to obtain a glass fiber laminated board; the specific process of molding by the die pressing method comprises the following steps: the temperature is raised to 95 ℃ and the temperature is kept for 25min under the pressure of 0.2MPa, and then the temperature is raised to 195 ℃ and the temperature is kept for 130min under the pressure of 0.4 MPa.
The glass transition temperature of the glass fiber laminated board of the embodiment is 193 ℃ measured by a DMA 242C type dynamic mechanical analyzer of German Nachi company, the heat resistance is good, and the use requirement in high temperature environment can be met.
Example 3
The hot-melt epoxy resin of the embodiment is prepared from the following raw materials in parts by weight: 100 parts of E51 epoxy resin, 3.5 parts of DDM curing agent and 27.3 parts of DDS curing agent; the hot-melt epoxy resin is prepared by the following steps:
step one, heating 100 parts of E51 epoxy resin to 60 ℃, and preserving heat for 20 min;
step two, adding 3.5 parts of DDM curing agent into the E51 epoxy resin heated and insulated in the step one, uniformly stirring, heating to 160 ℃, and insulating for 100min for pre-curing treatment to obtain a polymer;
and step three, cooling the polymer obtained in the step two to 100 ℃, then adding 27.3 parts of DDS curing agent by 3 times, uniformly stirring, and cooling to room temperature to obtain the hot-melt epoxy resin.
The hot-melt epoxy resin of the embodiment is semisolid and not sticky at room temperature, and the result shows that the film forming property is good when the hot-melt epoxy resin is coated on release paper; the viscosity of the hot-melt epoxy resin at 60 ℃ is measured to be 21 pas and the viscosity at 65 ℃ is measured to be 10 pas-11 pas by adopting a Brookf IELD Bolifei DV-II viscometer; the gel time of the resin is measured by referring to GJB1059.4-1990 'test method for testing phenolic resin for ablative material gel time test', at a constant temperature of 150 ℃, the hot-melt epoxy resin which is dissolved in absolute ethyl alcohol and has 40 percent of solid content is placed in a horizontal shallow round groove with a surface of a specified heating plate, the stirring is carried out according to a specified mode, the time of the hot-melt epoxy resin which is heated from the beginning to the gel is recorded as 188s, and the viscosity requirement of a hot-melt adhesive film calendering method is met.
The specific process for preparing the prepreg by using the hot-melt epoxy resin in the embodiment comprises the following steps: uniformly coating the molten hot-melt epoxy resin on gumming paper on a coating machine to prepare a film, then clamping glass fibers between two rolls of films on a dipping machine to form a sandwich structure, and soaking the films into the glass fibers through a hot roller to obtain glass fiber prepreg; the temperature of the rubber roller of the coating machine is 65 ℃, and the whole linear speed is 5 m/min; the temperature of the hot roller of the impregnation machine is 70 ℃, and the linear speed is 5 m/min.
The application process of the prepreg in the embodiment is as follows: preparing glass fiber prepreg by taking glass fiber as a fiber/fabric raw material, then paving 17 layers of the glass fiber prepreg, placing the glass fiber prepreg into a mold, molding by adopting a mold pressing method, and cooling to obtain a glass fiber laminated board; the specific process of molding by the die pressing method comprises the following steps: heating to 100 deg.C and maintaining at 0.1MPa for 20min, heating to 200 deg.C and maintaining at 0.3MPa for 120 min.
The glass transition temperature of the glass fiber laminated board of the embodiment is 201 ℃ measured by a DMA 242C type dynamic mechanical analyzer of German Nachi company, the heat resistance is good, and the use requirement in high temperature environment can be met.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Any simple modifications, alterations and equivalent changes of the above embodiments according to the technical essence of the invention are still within the protection scope of the technical solution of the invention.
Claims (7)
1. The hot-melt epoxy resin is characterized by being prepared from the following raw materials in parts by mass: 100 parts of liquid epoxy resin, 3.5-4.0 parts of aromatic amine curing agent A and 26.7-27.3 parts of aromatic amine curing agent B; the thermal deformation temperatures of the aromatic amine curing agent A and the aromatic amine curing agent B reach 150 ℃, the thermal deformation temperature of the aromatic amine curing agent B is higher than that of the aromatic amine curing agent A, and the latency of the aromatic amine curing agent B in the epoxy resin is superior to that of the aromatic amine curing agent A in the epoxy resin; the hot-melt epoxy resin is prepared by the following steps:
step one, heating and insulating liquid epoxy resin; the liquid epoxy resin is E51 epoxy resin;
step two, adding an aromatic amine curing agent A into the liquid epoxy resin heated and insulated in the step one, uniformly stirring, heating to 150-160 ℃, and keeping the temperature for 100-120 min to perform pre-curing treatment to obtain a polymer; the aromatic amine curing agent A is a DDM curing agent;
step three, cooling the polymer obtained in the step two to 90-100 ℃, then adding the aromatic amine curing agent B in batches, stirring uniformly, and cooling to room temperature to obtain hot-melt epoxy resin; the aromatic amine curing agent B is a DDS curing agent.
2. The hot-melt epoxy resin as claimed in claim 1, wherein the heating temperature in the first step is 50-60 ℃ and the holding time is 20-30 min.
3. A hot-melt epoxy resin according to claim 1, wherein the number of said additions in step three is 3.
4. A method for preparing a prepreg by using the hot-melt epoxy resin as claimed in any one of claims 1 to 3, which is characterized in that the prepreg is prepared by using a film adhesive calendering method in a hot-melt method, and the specific process comprises the following steps: the molten hot-melt epoxy resin is uniformly coated on the gumming paper on a coating machine to prepare a film, then the fiber/fabric is clamped between two rolls of films on a dipping machine to form a sandwich structure, and the films are dipped into the fiber/fabric through a hot roller to obtain the prepreg.
5. The method as claimed in claim 4, wherein the temperature of the rubber roller of the coating machine is 60-65 ℃, and the whole linear speed is 3-5 m/min; the temperature of the hot roller of the impregnation machine is 65-70 ℃, and the linear speed is 3-5 m/min.
6. The use of a prepreg according to claim 4 wherein the prepreg is applied and formed by compression moulding and cooled to provide a prepreg laminate; the specific process of molding by the die pressing method comprises the following steps: firstly heating to 90-100 ℃ and preserving heat for 20-30 min at the pressure of 0.1-0.3 MPa, then heating to 190-200 ℃ and preserving heat for 120-150 min at the pressure of 0.3-0.5 MPa.
7. Use according to claim 6, wherein the prepreg is a glass fibre prepreg.
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