CN110859618B

CN110859618B - Electroencephalogram electrode patch, preparation method thereof and electroencephalogram sensor

Info

Publication number: CN110859618B
Application number: CN201911308744.9A
Authority: CN
Inventors: 孔令海
Original assignee: Shenzhen Pride Membrane Switch Technology Co ltd
Current assignee: Shenzhen Pride Membrane Switch Technology Co ltd
Priority date: 2019-12-18
Filing date: 2019-12-18
Publication date: 2023-07-07
Anticipated expiration: 2039-12-18
Also published as: CN110859618A

Abstract

The patch comprises an insulating film, a plurality of lead wires printed on the inner surface of the film, a plurality of contact electrodes printed on the outer surface of the film and an anti-interference film attached to the inner surface, wherein the insulating film is provided with a via hole, a second contact area of the insulating film is far away from an extraction area relative to a first contact area, the inner electrodes of the lead wires are scattered and positioned in the first contact area and the second contact area, the extraction electrodes of the lead wires are concentrated in the extraction area, the contact electrodes are positioned in the first contact area and the second contact area and electrically connected with the corresponding inner electrodes through the via hole, and a signal shielding structure is arranged on the anti-interference film to cover a line section of the lead wires. The invention has the effects of multiple anti-interference and size narrowing.

Description

Electroencephalogram electrode patch, preparation method thereof and electroencephalogram sensor

Technical Field

The invention relates to the technical field of electroencephalogram sensors, in particular to an electroencephalogram electrode patch, a preparation method thereof and an electroencephalogram sensor.

Background

In the past, hospitals lack effective electroencephalogram signal acquisition and analysis equipment in operation during large-scale operation, the dosage of anesthetic in operation is generally based on experience of anesthesiologists and clinically observed patient conditions, and has the advantages of lack of effective scientific data reference, high anesthesia accident mortality rate and increased clinical electroencephalogram detection equipment required by national health authorities. The existing disposable electroencephalogram sensors in the market all adopt a single-layer structure, and in a multi-equipment scene of an operating room, the problems of signal acquisition failure, unstable acquisition, data disorder and the like are caused due to signal interference, so that the disposable electroencephalogram sensors cannot be used in accordance with reality.

The brain electrical sensor device is used for collecting brain electrical signals of a human body, the medical brain electrical electrode patch used correspondingly is a disposable consumable attached to the brain of the human body, the brain electrical energy signals of the human body need to be accurately collected, the brain electrical sensor device is based on the more complex shape of the brain of the human body, and the used component of the brain electrical sensor device is the soft and bendable brain electrical electrode patch, so that single-chip multipoint measurement is realized. There are of course also mechanical assembly designs of single point multiple electrode measuring heads, but this is too costly for disposable consumables. However, the electroencephalogram electrode patch commonly adopted in the market at present uses single-layer PET or PI as a base material, conductive paste and silver chloride paste are only printed on a single surface based on cost consideration, and are respectively used as a lead wire and a contact electrode of the patch, so that the electroencephalogram electrode patch is easy to be interfered by external signals when being used in a responsible environment where clinical multi-monitoring equipment operates simultaneously, and the human electroencephalogram signals received by the electroencephalogram sensor are easy to be distorted as medical equipment is placed closer. Therefore, how to resist signal interference is a problem that the medical electroencephalogram market is increasingly required to overcome.

Chinese patent application publication No. CN104224167a discloses a disposable brain state monitoring flexible patch electrode, which comprises a wire, an electrode interface box, an IC card identification circuit, an IC card contact, an electroencephalogram acquisition processing circuit, an Ag conductive layer contact, an electrode insert, an IC card control chip, a photosensitive flexible substrate film, a nano Ag circuit layer, an Ag/AgCl ion conductive coating, an insulating PE coating, a collodion pad, a puncture pad and a sponge. The electrode main body structure is sequentially divided into four layers, namely a photosensitive flexible substrate film; firstly, an Ag circuit layer formed by printing nano Ag paste; firstly, an Ag/AgCl ion conductive coating prepared from Ag/AgCl slurry; one is an insulating PE coating. The flexible patch electrode is obtained by printing an Ag circuit layer and an Ag/AgCl ion conductive coating on the same surface of a photosensitive flexible substrate film.

The Chinese patent publication No. CN209033538U discloses an electrode patch which is connected with a detection host, wherein the detection host comprises a plurality of connectors, the electrode patch comprises a patch substrate, a first electrode, a ground electrode and a second electrode which are respectively and electrically connected with the connectors are arranged on the front surface of the patch substrate, and the ground electrode is positioned between the first electrode and the second electrode. The first electrode is an active electrode, and the second electrode is a reference electrode placed at a position of the body relative to the zero potential point.

Disclosure of Invention

The invention provides an electroencephalogram electrode patch, which is used for solving the problem that the electroencephalogram electrode patch is easy to be interfered by external signals and realizing the functions of size narrowing and multiple anti-interference of a disposable electroencephalogram electrode patch. The brain electrical sensor is particularly applied to a sensor of an operation clinical brain electrical monitoring device, an brain electrical sensor combined with brain electrical electrode patches belongs to disposable consumables, each operation table is required to be provided with one brain electrical sensor, the market quantity is huge, and the brain electrical sensor is beneficial to society for a long time. Still other objects of the present invention are to provide an electroencephalogram sensor including the electroencephalogram electrode patch.

The invention provides a preparation method of an electroencephalogram electrode patch, which is used for realizing efficient manufacturing of the narrow-size anti-interference electroencephalogram electrode patch with multiple anti-interference functions.

The main purpose of the invention is realized by the following technical scheme:

an electroencephalogram electrode patch is proposed, comprising:

the insulation film is provided with an outer surface, an inner surface and a plurality of penetrating through holes, the insulation film is divided into a first contact area, a second contact area and a lead-out area according to the shape area, the through holes are formed in the first contact area and the second contact area, and the second contact area is far away from the lead-out area relative to the first contact area;

A plurality of lead lines printed on the inner surface of the insulating film, one ends of the lead lines integrally formed as an inner electrode, the other ends of the lead lines integrally formed as an outer electrode, the inner electrodes being scattered in the first contact region and the second contact region, each inner electrode covering one or more of the via holes, the outer electrodes being concentrated in the outer region;

a plurality of contact electrodes printed on the outer surface of the insulating film, the contact electrodes being located in the first contact region and the second contact region and corresponding to the inner electrodes, each contact electrode covering one or more of the vias through which the corresponding inner electrode is electrically connected, and

the anti-interference film is attached to the inner surface of the insulating film, and a signal shielding structure is arranged on the anti-interference film and covers the line section of the lead line.

According to the first basic technical scheme, the lead wire and the contact electrode are respectively formed on the inner surface and the outer surface of the insulating film, the through holes are conducted, the anti-interference film is attached to the inner surface of the insulating film, the insulating film isolates interference of human bioelectric energy on the lead wire when the brain electrode patch is used, the thickness of the insulating film ensures the minimum isolation distance between the lead wire and a contact human body under random bending of the brain electrode patch when the brain electrode patch is used, the isolation thickness is more consistent relative to a surface insulating coating, a signal shielding structure arranged on the anti-interference film covers a wire section of the lead wire, interference of external signals running simultaneously by multiple monitoring devices on the wire section of the lead wire is isolated, the inner electrode is distributed, mutual interference of the contact electrode is isolated, and therefore a multiple anti-interference effect is obtained, and the size of the disposable brain electrode patch can be further reduced.

The present invention may be further configured in a preferred example to: the patch further comprises a limit coating which is printed on the inner surface of the insulating film and is isolated between the line sections of the adjacent lead wires, or when the first contact area is a plurality of and is connected in series between the lead-out area and the second contact area, the gap between the line sections of the adjacent lead wires on the section between the first contact area and the lead-out area is larger than the thickness of the insulating film, preferably, the gap between the line sections of the adjacent lead wires is larger than or equal to 0.015mm; preferably, the shape of the second contact area is a two-dimensional drop shape.

By adopting the preferable technical scheme, the spacing coating is utilized to be isolated between the line sections of the adjacent lead wires, the function of limiting the lower limit value of the gap between the line sections of the adjacent lead wires can be exerted in the use occasion of bending the electroencephalogram electrode patch, and particularly, the gap can be limited to be more than or equal to 0.015mm so as to avoid the mutual signal interference between the line sections of the adjacent lead wires excessively close to the leading-out line sections when bending the electroencephalogram electrode patch, or the gap between the first contact area and the section closest to the leading-out area is utilized to be larger than the thickness of the insulating film, so that the degree of mutual signal interference between the line sections of the adjacent lead wires can be reduced or/and the gap filling of the spacing coating is facilitated; preferably, the two-dimensional drop-shaped second contact region is utilized, so that the line section part of the second contact region and the first contact region is not easily torn off when the contact electrode relatively far from the lead-out region is bent.

The present invention may be further configured in a preferred example to: the patch also comprises an insulating ink layer which is printed on the inner surface of the anti-interference film, and the printing thickness of the insulating ink layer is preferably 15-25 mu m.

By adopting the preferable technical scheme, the signal shielding structure and the lead wire are electrically isolated by utilizing the formation of the insulating ink layer, so that the signal wire and the signal shielding structure are prevented from being electrically short-circuited.

The present invention may be further configured in a preferred example to: the contact electrode includes a lead pad layer on the outer surface of the insulating film and a contact layer on the lead pad layer; preferably, the signal shielding structure also covers the inner electrode.

By adopting the preferable technical scheme, the multi-layer structure of the contact electrode and the lead cushion layer positioned at the bottom are utilized to realize the through hole conduction between the contact electrode and the lead wire, and the contact layer of the contact electrode is prevented from being diffused and polluted to the inner surface of the insulating film; preferably, the signal shielding structure also covers the inner electrode, and the inner electrode has better shielding and limiting supporting effects on the inner surface so as to avoid sliding or loosening of the inner electrode.

The present invention may be further configured in a preferred example to: the signal shielding structure is printed on the inner surface of the anti-interference film.

By adopting the above preferred technical scheme, the signal shielding structure is formed on the inner surface of the film of the anti-interference film by printing, so that the signal shielding structure is closer to the line section of the lead line, a better anti-interference effect is achieved, and the outer surface of the film of the anti-interference film can provide an exposed surface of a flat printable identification pattern.

The present invention may be further configured in a preferred example to: the outline shape of the signal shielding structure corresponds to the line section of the lead wire and the inner electrode, and the width of the signal shielding structure is larger than the width of the line section of the lead wire; preferably, the signal shielding structure comprises shielding lines, shielding points or a combination thereof.

By adopting the preferable technical scheme, the special contour outline and the width limit of the signal shielding structure are utilized to effectively shield the line section of the lead line and the inner electrode.

The present invention may be further configured in a preferred example to: the via hole comprises a central hole and a plurality of peripheral holes surrounding the central hole, wherein the distance from the peripheral holes to the central hole is smaller than the radius of the inner electrode, specifically, the diameter of the via hole is 0.015-0.15 mm, and preferably, the diameter of the via hole is 0.015-0.05 mm.

By adopting the preferable technical scheme, the inner electrode can substantially and completely cover the via hole by limiting the hole configuration of the via hole and the distance from the peripheral hole to the central hole, the peripheral hole can be used as a buffer hole of the central hole, the electric connection of the central hole is not affected even if the electric connection of the peripheral hole breaks, and the through hole conduction of the contact electrode and the inner electrode can be realized by specifically utilizing the specific diameter size range of the via hole, and the printing coating can not excessively diffuse and overflow on the other surface of the film.

The present invention may be further configured in a preferred example to: the thickness of the polyester film of the insulating film is 0.025-0.1 mm, the thickness of the silver paste coating of the lead wire is 4-12 mu m, and the line width of the line section of the lead wire is 0.2-1.2 mm.

By adopting the above preferred technical scheme, the electroencephalogram electrode patch has a sufficiently narrow and small line section and sufficiently thin layers of thicknesses by utilizing the specific polyester film thickness range, the silver paste coating thickness range and the line width range of the line section of the lead line, so that the slender thin film type soft electroencephalogram sensor can be assembled.

the preparation method of the brain electrode patch comprises the following steps:

providing an insulating film, wherein the insulating film is provided with an outer surface, an inner surface and a plurality of penetrating through holes, the insulating film is divided into a first contact area, a second contact area and a lead-out area, the through holes are formed in the first contact area and the second contact area, and the second contact area is far away from the lead-out area relative to the first contact area;

forming a plurality of lead wires on the inner surface of the insulating film by first printing, wherein one end of each lead wire is formed into an inner electrode, the other end of each lead wire is formed into an extraction electrode, the inner electrodes are scattered in the first contact area and the second contact area, each inner electrode covers one or more through holes, and the extraction electrodes are concentrated in the extraction area;

forming a plurality of contact electrodes on the outer surface of the insulating film by a second printing, wherein the contact electrodes are positioned in the first contact area and the second contact area and correspond to the inner electrodes, each contact electrode covers one or more through holes and electrically connected with the corresponding inner electrodes through the through holes, and

And an anti-interference film is attached to the inner surface of the insulating film, and a signal shielding structure is arranged on the inner surface of the anti-interference film and covers the line section of the lead line.

Through adopting the basic technical scheme II, the lead wire and the contact electrode are respectively formed by double-sided twice printing and are conducted through the through hole of the insulating film, the anti-interference film is attached, the lead wire is clamped between the insulating film and the anti-interference film, the insulating film isolates the interference of human bioelectricity to the lead wire, and the signal shielding structure of the anti-interference film isolates the interference of an external signal to the line section of the lead wire, so that the electroencephalogram electrode patch with multiple anti-interference effects is obtained.

The present invention may be further configured in a preferred example to: the via hole comprises a central hole and a plurality of peripheral holes surrounding the central hole, wherein the distance from the peripheral holes to the central hole is smaller than the radius of the inner electrode, specifically, the diameter of the via hole is 0.015-0.15 mm, preferably 0.015-0.05-mm, the polyester film thickness of the insulating film is 0.025-0.1-mm, the silver paste coating thickness of the lead wire is 4-12 mu m, and the line width of the line section of the lead wire is 0.2-1.2-mm.

In summary, the present invention includes at least one of the following beneficial technical effects:

1. the size of the disposable electroencephalogram electrode patch is narrowed, the multiple anti-interference functions are realized, and the narrow thin soft film electroencephalogram electrode patch is designed; specifically, the brain electrode patch can be self anti-interference, can prevent interference to a human body attached to the application and can prevent interference to external environment equipment, and the three-prevention design effectively achieves the anti-interference effect.

2. The disposable electroencephalogram electrode patch can be assembled into an electroencephalogram sensor in a narrow thinned and thinned form;

3. the preparation process of the brain electrode patch needs to use printing equipment and laminating equipment, and besides film surface treatment equipment, no additional mechanical device installation equipment is needed except for the junction of device terminals, so that the treatment process is relatively simple and the brain electrode patch with multiple anti-interference functions can be manufactured.

Drawings

FIG. 1 is a schematic view of explosion of each membrane layer and a partial enlarged view of a signal shielding structure of an EEG electrode patch according to a first embodiment of the present invention;

FIG. 2 is a schematic perspective view of an EEG electrode patch according to a first embodiment of the present invention;

FIG. 3A is a schematic view of a first embodiment of the present invention with a partial cross-section at a second contact area;

FIG. 3B is a schematic view of a portion of the upper surface of the first contact region according to the first embodiment of the present invention;

FIG. 4 is a schematic diagram showing a circuit configuration of the lead wire according to the first preferred embodiment of the present invention;

FIG. 5 is a schematic diagram showing the outer layer pattern of the anti-interference film according to the first preferred embodiment of the present invention;

FIG. 6 is a flowchart showing a process for manufacturing an EEG electrode patch according to a second preferred embodiment of the present invention;

fig. 7A to 7D are schematic views of a partial cross-section of a first contact region of a thin film in each main step in a process for manufacturing an electroencephalogram electrode patch according to a second preferred embodiment of the present invention;

FIG. 8 is an exploded view of a third embodiment of an electroencephalogram sensor according to the present invention;

fig. 9 is a schematic perspective view of an electroencephalogram according to a third preferred embodiment of the present invention.

The reference numerals are 10, an insulating film, 11, a first contact area, 12, a second contact area, 13, a lead-out area, 20, a lead wire, 21, an inner electrode, 22, a lead-out electrode, 30, a contact electrode, 31, a lead cushion layer, 32, a contact layer, 40, an anti-interference film, 41, a signal shielding structure, 42, an insulating film, 50, a via hole, 51, a central hole, 52, a peripheral hole, 60, a limiting coating, 70, an insulating ink layer, 80, a lead elastomer, 81, a limiting ring, 90, an isolation elastic patch, 91, a security chip connector, 92, a connecting end positioning patch, 93 and a far end patch.

Detailed Description

The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only examples for understanding a part of the inventive concept of the present invention, and are not representative of all embodiments, nor are they to be construed as the only embodiments. All other embodiments, based on the embodiments of the present invention, which are obtained by those of ordinary skill in the art under the understanding of the inventive concept of the present invention, are within the scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In order to facilitate understanding of the technical scheme of the invention, the electroencephalogram electrode patch, the preparation method thereof and the electroencephalogram sensor are further described and explained in detail below, but are not used as the protection scope defined by the invention.

The electroencephalogram electrode patch, the preparation method thereof and the electroencephalogram sensor of the invention are described in further detail below, but the scope of protection of the invention should not be limited.

Fig. 1 is a schematic view of explosion of each membrane layer of an electroencephalogram electrode patch and a partial enlarged view of a signal shielding structure, and fig. 2 is a schematic view of an electroencephalogram electrode patch; referring to fig. 1 and 2, a first embodiment of the present invention proposes an electroencephalogram electrode patch including an insulating film 10, a plurality of lead wires 20, a plurality of contact electrodes 30, and an anti-interference film 40. FIG. 3A is a schematic view of a partial cross-section of the lead wire 20 at the second contact region; fig. 3B is a schematic view of a portion of the upper surface of the lead wire 20 at the second contact region, and fig. 4 is a schematic view of the circuit configuration of the lead wire 20; fig. 5 is a schematic diagram of the outer film pattern of the anti-interference film 40.

The insulating film 10 has an outer surface, an inner surface and a plurality of through vias 50, the insulating film 10 is divided into a first contact area 11, a second contact area 12 and a lead-out area 13 according to the shape, the vias 50 are arranged in the first contact area 11 and the second contact area 12, the second contact area 12 is far away from the lead-out area 13 relative to the first contact area 11, the insulating film 10 can be a PET polyester film, the color of the insulating film can be transparent, white or black, more specifically a transparent insulating film, and the insulating film is used for observing whether the position of the lead wire 20 is printed well. In this embodiment, the first contact area 11 is plural and is connected in series between the lead-out area 13 and the second contact area 12. One specific, but non-limiting, shape of the first contact region 112 may be a two-dimensional calabash shape.

The lead wires 20 are printed on the inner surface of the insulating film 10, one end of the lead wires 20 is integrally formed into an inner electrode 21, the other end of the lead wires 20 is integrally formed into an outer electrode 22, the inner electrodes 21 are scattered in the first contact region 11 and the second contact region 12, and each inner electrode 21 covers one or more via holes 50, preferably one inner electrode covers a plurality of via holes, the outer electrode 22 is concentrated in the outer region 13, the outer electrode 22 is particularly located on one side of the insulating film 10, the other side of the insulating film 10 is particularly located on the second contact region 12, so that the space between the inner electrodes 21 is larger than that between the outer electrodes 22, the lead wires 20 are particularly printed conductive lines, such as silver paste, carbon paste, biochar paste, nano silver paste, graphene, carbon nanotube and the like, are printed with a conductive paste, particularly cured silver paste, and then formed into a conductive paste, and the conductive wire has better fracture resistance than that formed by curing. In the present embodiment, the wire section of the lead wire 20 to which the inner electrode 21 of the second contact area 12 located relatively far is correspondingly connected is arc-shaped in winding shape while passing through the first contact area 11, and the same gap as the inner electrode 21 of the first contact area 11 is maintained to avoid signal interference between the wire section and the inner electrode. In this embodiment, the second contact area 12 may have a two-dimensional drop shape.

Referring to fig. 3A, the contact electrodes 30 are printed on the outer surface of the insulating film 10, the contact electrodes 30 are located in the first contact region 11 and the second contact region 12 and correspond to the inner electrodes 21, each contact electrode 30 covers one or more of the vias 50, and the corresponding inner electrode 21 is electrically connected through the via 50. The contact electrode 30 is used for contacting the surface of the human body at the brain sensing point. In addition, the anti-interference film 40 is attached to the inner surface of the insulating film 10, and a signal shielding structure 41 is disposed on the anti-interference film 40 to cover the wire section of the lead wire 20.

The implementation principle of the embodiment is as follows: the lead wire 20 and the contact electrode 30 are respectively formed on the inner surface and the outer surface of the insulating film 10 and are conducted through the through hole 50, the anti-interference film 40 is attached to the inner surface of the insulating film 10 and the contact electrode 30 are distributed, when the brain-electric patch is used, the insulating film 10 isolates interference of human body bioelectricity on the lead wire 20, the thickness of the insulating film 10 ensures the minimum isolation distance between the lead wire 20 and the contact human body under any bending of the brain-electric patch when the brain-electric patch is used, the signal shielding structure 41 arranged on the anti-interference film 40 covers the wire section of the lead wire 20, the interference of external signals which are operated simultaneously by a plurality of monitoring devices on the wire section of the lead wire 20 is isolated, the distance between the inner electrodes 21 is larger than the distance between the lead electrodes 22, the interference of the external signals between the inner electrodes 21 is isolated, multiple anti-interference effects are obtained, and the brain-electric patch can be realized once by extending the brain-electric patch without plug terminals and the plug terminals positioned on the same side. In a specific application, the electroencephalogram electrode patch can be even arranged on the joint surface of the electroencephalogram sensor after the size is reduced, and the electroencephalogram sensing position is adjusted in a mode that hands of an operator do not need to directly contact with the electroencephalogram electrode patch.

Regarding one possible structure for increasing the limit effect on the lead wire 20, in a preferred example, the electroencephalogram electrode patch further includes a limit coating 60 printed on the inner surface of the insulating film 10, the limit coating 60 being isolated between the line sections adjacent to the lead wire 20, or when the first contact region 11 is plural and connected in series between the lead-out region 13 and the second contact region 12, a gap of the line sections adjacent to the lead wire 20 at a section between the first contact region 11 and the lead-out region 13 is greater than a thickness of the insulating film 10, preferably, a gap of the line sections adjacent to the lead wire 20 is greater than or equal to 0.015mm. Therefore, the spacing coating 60 is used to isolate the wire sections adjacent to the lead wires 20, so that the function of limiting the lower limit value of the gap between the wire sections adjacent to the lead wires 20 can be exerted in the use occasion of bending the electroencephalogram electrode patch, and particularly, the gap can be limited to be more than or equal to 0.015mm so as to avoid the mutual signal interference between the wire sections adjacent to the lead wires 20 when bending the electroencephalogram electrode patch, or the gap between the first contact area 11 and the section nearest to the lead-out area 13 is used to be larger than the thickness of the insulating film 10, so that the degree of mutual signal interference between the wire sections adjacent to the lead wires 20 can be reduced or/and the gap filling of the spacing coating 60 is facilitated. In this embodiment, the limiting coating 60 has an opening exposing the extraction electrode 22.

Regarding an implementation shape of the insulating film 10, in a preferred example, the shape of the second contact region 12 is a two-dimensional drop shape, and the connection strength of the second contact region 12 and the narrow and refined connection point adjacent to the first contact region 11 is increased by using the two-dimensional drop shape of the second contact region 12, when the contact electrode 30 relatively far from the lead-out region 13 is in a meandering position, the line section portion of the second contact region 12 and the first contact region 11 is not easily broken due to excessive bending.

Regarding an implementation of the surface insulation coating of the signal shielding structure 41, in a preferred example, the electroencephalogram electrode patch further includes an insulation ink layer 70 printed on the inner surface of the anti-interference film 40, and preferably, the printing thickness of the insulation ink layer 70 is 15-25 μm. Therefore, by forming the insulating ink layer 70, the signal shielding structure 41 and the lead wire 20 are electrically isolated, and electrical short circuit between the signal wire and the signal shielding structure 41 is avoided.

Regarding one possible position of the signal shielding structure 41, in a preferred example, the signal shielding structure 41 is printed on the inner face of an insulating film 42 such as a PET film in the anti-interference film 40. Therefore, the signal shielding structure 41 is formed on the inner surface of the anti-interference film 40 by printing, so that the signal shielding structure 41 is closer to the line section of the lead line 20, a better anti-interference effect is achieved, and an exposed surface of the flat printable identification pattern can be provided on the outer surface of the insulating film 42 of the anti-interference film 40. The insulating film 42 may be transparent, white or black in color, more specifically, a white insulating film, and a logo pattern or other graphics may be printed on the outer surface of the insulating film 42. A printed pattern printed on the outer surface of the insulating film 42 can be referred to as fig. 5, and the position of the contact electrode 30 can be identified and given a number. Preferably, the signal shielding structure 41 also covers the inner electrode 21, and the inner electrode 21 has better shielding and limiting supporting effects on the inner surface, so as to avoid sliding or loosening of the inner electrode 21.

Regarding one possible aspect of the signal shielding structure 41, in a preferred example, the contour outline of the signal shielding structure 41 corresponds to the line section of the lead line 20 and the internal electrode 21 and the width of the signal shielding structure 41 is greater than the width of the line section of the lead line 20; preferably, the signal shielding structure 41 comprises shielding lines, shielding points or a combination thereof. Therefore, the specific contour profile and width of the signal shielding structure 41 are used to effectively shield the wire section of the lead wire 20 and the inner electrode 21.

With respect to one embodiment of the contact electrode 30, in a preferred example, referring to fig. 3A, the contact electrode 30 includes a lead pad layer 31 and a contact layer 32, the lead pad layer 31 is located on the outer surface of the insulating film 10, and the contact layer 32 is located on the lead pad layer 31. Therefore, with the multilayer structure of the contact electrode 30 and the lead pad layer 31 at the bottom, the through-hole conduction between the contact electrode 30 and the lead wire 20 is achieved, and diffusion contamination of the contact layer 32 of the contact electrode 30 to the inner surface of the insulating film 10 is prevented. Preferably, the anti-interference film 40 does not cover the inner electrode 21, so that the contact electrode 30 has better flexibility to be closely attached to the brain induction point of the human body. In this embodiment, the lead pad layer 31 is a conductive pattern formed by silver paste printing, and the contact layer 32 is a conductive pattern formed by silver chloride paste printing, and the patterns may be identical.

Regarding one possible configuration and size range of the via hole 50, in a preferred example, referring to fig. 3A and 3B, the via hole 50 includes a central hole 51 and a plurality of peripheral holes 52 surrounding the central hole 51, and a distance from the peripheral holes 52 to the central hole 51 is smaller than a radius of the inner electrode 21, specifically, a diameter of the via hole 50 is 0.015-0.15 mm, preferably 0.015-0.05 mm. Therefore, the via hole 50 is defined by the hole arrangement and the distance from the peripheral hole 52 to the central hole 51, so that the internal electrode 21 can substantially and completely cover the via hole 50, the peripheral hole 52 can be used as a buffer hole for the central hole 51, the electrical connection of the central hole 51 is not affected even if the electrical connection of the peripheral hole 52 breaks, and the contact electrode 30 and the through hole of the internal electrode 21 can be conducted by the specific diameter size range of the via hole 50 without excessively diffusing and overflowing on the other surface of the film.

With respect to one practical size range of each main member, in a preferred example, the polyester film thickness of the insulation film 10 is 0.025 to 0.1. 0.1 mm, the silver paste coating thickness of the lead wire 20 is 4 to 12 μm, and the wire width of the wire section of the lead wire 20 is 0.2 to 1.2 mm. Therefore, the specific polyester film thickness range, the silver paste coating thickness range and the line width range of the line section of the lead line 20 are utilized, so that the electroencephalogram electrode patch has a sufficiently miniaturized line section and sufficiently thinned layers of thickness for being combined on the joint surface of the electroencephalogram sensor.

Regarding an overall shape and size of the electroencephalogram electrode patch, basically in this embodiment, the shape of the electroencephalogram electrode patch may be a strip shape with a width variation, the portion of the line section located on the lead line 20 is the narrowest, the first side lead-out area 12 and the second side lead-out areas 13,14 are the second widest, the contact area 11 is the widest, the positions of the areas are rapidly confirmed by the width variation in use, and furthermore, the overall length of the electroencephalogram electrode patch may be controlled to be 12-30 cm, and the overall film thickness may be controlled to be 0.06-0.3 mm.

In addition, the second embodiment of the present invention further provides a preparation method of an electroencephalogram electrode patch, which is used for preparing the electroencephalogram electrode patch of the first embodiment or an electroencephalogram electrode patch with similar functions, and fig. 6 shows a flowchart of the preparation process; FIGS. 7A to 7D are schematic views showing a partial cross-section of the first contact region 11 of the thin film at main steps in the manufacturing process; the preparation method comprises the following main steps S1 to S4.

Referring to fig. 7A, the insulating film 10 is divided into a first contact region 11, a second contact region 12 and a lead-out region 13 by the insulating film 10 having an outer surface, an inner surface and a plurality of through vias 50, wherein the through vias 50 are opened in the first contact region 11 and the second contact region 12, and the second contact region 12 is separated from the lead-out region 13 with respect to the first contact region 11;

Referring to fig. 7B, a plurality of lead wires 20 are first printed on the inner surface of the insulating film 10, one end of the lead wires 20 is formed into an inner electrode 21, the other end of the lead wires 20 is formed into an outer electrode 22, the inner electrodes 21 are scattered in the first contact region 11 and the second contact region 12, each inner electrode 21 covers one or more through holes 50, the outer electrode 22 is concentrated in the outer region 13, and the shape of the inner electrode 22 is finger-shaped, so that the interval between the inner electrodes 21 is larger than that between the outer electrodes 22;

referring to fig. 7C, a plurality of contact electrodes 30 are formed on the outer surface of the insulating film 10 by a second printing process, wherein the contact electrodes 30 are located in the first contact region 11 and the second contact region 12 and correspond to the inner electrodes 21, each contact electrode 30 covers one or more of the via holes 50, and the corresponding inner electrode 21 is electrically connected through the via holes 50;

in step S4, an anti-interference film 40 is attached to the inner surface of the film, referring to fig. 7D, an anti-interference film 40 is attached to the inner surface of the insulating film 10, and a signal shielding structure 41 is provided on the inner surface of the anti-interference film 40 to cover the line section of the lead line 20.

Specifically, the main steps S1 to S4 are all implemented on a film master, a plurality of unit areas corresponding to the film shape of the product are integrated together, and the required monomer shape is cut after the printing and attaching process is completed.

The implementation principle of the embodiment is as follows: the two-sided printing forms the lead wire 20 and the contact electrode 30 respectively and is conducted by the via hole 50 of the insulating film 10, then the anti-interference film 40 is attached, the lead wire 20 is clamped between the insulating film 10 and the anti-interference film 40, the insulating film 10 isolates the interference of human bioelectricity to the lead wire 20, the signal shielding structure 41 of the anti-interference film 40 isolates the interference of external signals to the line section of the lead wire 20, and thus the electroencephalogram electrode patch with multiple anti-interference effects is obtained.

Regarding a possible size range of the via hole 50 and other main members, in a preferred example, the via hole 50 includes a central hole 51 and a plurality of peripheral holes 52 surrounding the central hole 51 corresponding to each of the inner electrodes 21, a distance from the peripheral holes 52 to the central hole 51 is smaller than a radius of the inner electrodes 21, specifically, a diameter of the via hole 50 is 0.015 to 0.15mm, preferably 0.015 to 0.05 mm, a polyester film thickness of the insulating film 10 is 0.025 to 0.1 mm, a silver paste coating thickness of the lead wire 20 is 4 to 12 μm, and a line width of a line section of the lead wire 20 is 0.2 to 1.2 mm.

A third embodiment of the present invention proposes an electroencephalogram sensor, including an electroencephalogram electrode patch of any one of the examples described above, and fig. 8 is a schematic diagram illustrating an explosion of a component of the electroencephalogram sensor; fig. 9 is a schematic perspective view of the electroencephalogram sensor, and fig. 2 is a schematic perspective view of an electroencephalogram electrode patch. Referring to fig. 8 and 9, the electroencephalogram electrode patch further comprises a lead elastic body 80 aligned on the contact electrode 30 and an isolation elastic patch 90 arranged on the first contact area 11, wherein the lead elastic body 80 is accommodated in an opening of the isolation elastic patch 90, and preferably, a limit ring 81 is arranged on the periphery of the lead elastic body 80. More specifically, the isolation elastic patch 90 further includes a distal patch 93 disposed on the second contact area 12, and more preferably, the isolation elastic patch 90 further includes a connection end positioning patch 92 aligned with the lead-out area 13, so that the electroencephalogram sensor can be relatively firmly attached to the brain of the user to prevent loosening and falling. More specifically, the electroencephalogram sensor may further include: a secure chip connector 91 may be provided at the extraction region 13 to conduct the extraction electrode 22. The secure chip connector 91 may be used for signal communication with an electrical lead of a clinical brain electrical detection device for surgery.

In summary, the invention proposes a disposable anti-interference brain electrode slice and brain electrical sensor comprising the brain electrode slice by using one or more embodiments, for clinical monitoring of disposable anti-interference surgery, through many innovative researches and tests, in the best embodiment, the lead wire of the printed brain electrode slice adopting the compound multilayer printing technology and the compound technology is preferably but not limited to be used as a base signal acquisition transmission layer and is clamped between an insulating film and an anti-interference film, the patch adopts a polyester film independently innovatively developed as a printing base layer to print nano silver paste, a compound double-sided conduction technology is formed through a via hole, one side of the film is printed with a nano silver paste lead wire, the other side of the film is printed with a nano silver prize via hole lead point, and a layer of silver chloride paste is printed on the base as a contact electrode of the electrode signal acquisition layer; the surface of the nano silver paste lead wire layer is adhered with a polyester film for protecting and shielding the nano silver paste lead wire formed by printing by adopting a composite process, and the nano silver paste lead wire layer is used as an anti-interference film. The preparation method of the invention innovatively realizes the separation of the electrode signal acquisition layer and the lead wire layer, the design can avoid mutual interference of own signals, and in addition, as the nano silver paste lead layer is arranged on the other surface of the contact electrode, the signal interference generated by the local contact of the lead wire and the skin surface is avoided; the surface of the nano silver paste lead wire layer is adhered with a polyester film by adopting a composite technology for protecting and printing a nano silver paste shielding layer, and the shielding layer can effectively isolate external signal interference and ionizing radiation. The electrode plate has the advantages that multiple anti-interference effects are effectively achieved through the three-prevention designs of self anti-interference, user anti-interference, external environment anti-interference and the like. The brain electrode sheet is adopted as a signal acquisition and transmission layer, foam rubber is used as an isolation elastic patch, nylon hooks are used as limiting rings, sponge and hydrogel are used as lead elastic bodies, and the combination of the material structural layers is adopted, so that the obtained disposable anti-interference operation clinical monitoring brain electrode sheet achieves the effect of full-environment use through testing.

The embodiments of the present invention are all preferred embodiments for easy understanding or implementation of the technical solution of the present invention, and are not limited in scope by the present invention, and all equivalent changes according to the structure, shape and principle of the present invention should be covered in the scope of the claimed invention.

Claims

1. An electroencephalogram electrode patch, comprising:

an insulating film (10) having an outer surface, an inner surface and a plurality of through vias (50), wherein the insulating film (10) is divided into a first contact region (11), a second contact region (12) and a lead-out region (13) according to a shape region, the through vias (50) are arranged in the first contact region (11) and the second contact region (12), and the second contact region (12) is far away from the lead-out region (13) relative to the first contact region (11);

a plurality of lead wires (20) printed on the inner surface of the insulating film (10), one end of the lead wires (20) integrally forming an inner electrode (21), the other end of the lead wires (20) integrally forming an extraction electrode (22), the inner electrodes (21) being scattered in the first contact region (11) and the second contact region (12), each inner electrode (21) covering one or more of the via holes (50), the extraction electrode (22) being concentrated in the extraction region (13);

A plurality of contact electrodes (30) printed on the outer surface of the insulating film (10), the contact electrodes (30) being located in the first contact region (11) and the second contact region (12) and corresponding to the inner electrodes (21), each contact electrode (30) covering one or more of the vias (50), the corresponding inner electrode (21) being electrically connected through the via (50); a kind of electronic device with high-pressure air-conditioning system

The anti-interference film (40) is attached to the inner surface of the insulating film (10), and a signal shielding structure (41) is arranged on the anti-interference film (40) and covers the line section of the lead wire (20).

2. The electroencephalogram electrode patch according to claim 1, further comprising: and a limit coating (60) printed on the inner surface of the insulating film (10), the limit coating (60) being isolated between the line sections adjacent to the lead lines (20).

3. The electroencephalogram electrode patch according to claim 1, wherein when the first contact region (11) is plural and connected in series between the lead-out region (13) and the second contact region (12), a gap of a line section adjacent to the lead-out line (20) on a section between the first contact region (11) and the lead-out region (13) is larger than a thickness of the insulating film (10).

4. An electroencephalogram electrode patch according to claim 3, characterized in that a gap of a line section adjacent to the lead line (20) is 0.015mm or more.

5. An electroencephalogram electrode patch according to claim 3, characterized in that the shape of the second contact region (12) is a two-dimensional drop-shape.

6. The electroencephalogram electrode patch according to claim 1, further comprising: and an insulating ink layer (70) printed on the inner surface of the anti-interference film (40).

7. The electroencephalogram electrode patch according to claim 6, characterized in that the printed thickness of the insulating ink layer (70) is between 15 and 25 μm.

8. The electroencephalogram electrode patch according to claim 1, characterized in that the contact electrode (30) includes a lead pad layer (31) and a contact layer (32), the lead pad layer (31) being located on the outer surface of the insulating film (10), the contact layer (32) being located on the lead pad layer (31), the signal shielding structure (41) also covering the inner electrode (21).

9. The electroencephalogram electrode patch according to claim 1, wherein the signal shielding structure (41) is printed on a film inner face of the anti-interference film (40).

10. The electroencephalogram electrode patch according to claim 9, characterized in that the contour outline of the signal shielding structure (41) corresponds to the line section of the lead line (20) and the inner electrode (21) and the width of the signal shielding structure (41) is larger than the width of the line section of the lead line (20).

11. The electroencephalogram electrode patch according to claim 9, wherein the signal shielding structure (41) comprises shielding lines, shielding points, or a combination thereof.

12. The electroencephalogram electrode patch according to any one of claims 1-11, wherein the via (50) comprises a central hole (51) and a plurality of peripheral holes (52) surrounding the central hole (51) for each inner electrode (21), the distance of the peripheral holes (52) to the central hole (51) being smaller than the radius of the inner electrode (21).

13. The electroencephalogram electrode patch according to claim 12, characterized in that the diameter of the via (50) is between 0.015 and 0.15mm.

14. The electroencephalogram electrode patch according to claim 13, wherein the diameter of the via (50) is between 0.015 and 0.05 mm.

15. The electroencephalogram electrode patch according to claim 12, wherein the insulating film (10) is a polyester film having a thickness of 0.025 to 0.1 mm; the silver paste coating thickness of the lead wire (20) is 4-12 mu m; the line width of the line section of the lead line (20) is between 0.2 and 1.2 and mm.

16. The preparation method of the brain electrode patch is characterized by comprising the following steps of:

providing an insulating film (10), wherein the insulating film (10) is provided with an outer surface, an inner surface and a plurality of penetrating through holes (50), the insulating film (10) is divided into a first contact area (11), a second contact area (12) and a lead-out area (13), the through holes (50) are arranged in the first contact area (11) and the second contact area (12), and the second contact area (12) is far away from the lead-out area (13) relative to the first contact area (11);

-forming a plurality of lead lines (20) on the inner surface of the insulating film (10) by first printing, wherein one end of the lead lines (20) is formed into an inner electrode (21), the other end of the lead lines (20) is formed into an extraction electrode (22), the inner electrodes (21) are scattered in the first contact region (11) and the second contact region (12), each inner electrode (21) covers one or more of the via holes (50), and the extraction electrodes (22) are concentrated in the extraction region (13);

-forming a plurality of contact electrodes (30) on the outer surface of the insulating film (10) by a second printing, the contact electrodes (30) being located within the first contact region (11) and the second contact region (12) and corresponding to the inner electrodes (21), each contact electrode (30) covering one or more of the vias (50), electrically connecting the corresponding inner electrode (21) through the via (50); a kind of electronic device with high-pressure air-conditioning system

And an anti-interference film (40) is attached to the inner surface of the insulating film (10), and a signal shielding structure (41) is arranged on the inner surface of the anti-interference film (40) to cover the line section of the lead wire (20).

17. The method of manufacturing an electroencephalogram electrode patch according to claim 16, wherein the via hole (50) includes a central hole (51) and a plurality of peripheral holes (52) surrounding the central hole (51) corresponding to each internal electrode (21), and a distance from the peripheral hole (52) to the central hole (51) is smaller than a radius of the internal electrode (21).

18. The method for preparing an electroencephalogram electrode patch according to claim 17, wherein the diameter of the via hole (50) is 0.015-0.15 mm.

19. The method of manufacturing an electroencephalogram electrode patch according to claim 18, wherein the diameter of the via hole (50) is between 0.015 and 0.05 and mm.

20. The method for preparing an electroencephalogram electrode patch according to claim 16, wherein the insulating film (10) is a polyester film having a thickness of 0.025 to 0.1 and mm; the silver paste coating thickness of the lead wire (20) is 4-12 mu m; the line width of the line section of the lead line (20) is between 0.2 and 1.2 and mm.

21. An electroencephalogram sensor, comprising: an electroencephalogram electrode patch according to any one of claims 1 to 15, a lead elastomer (80) disposed in alignment on the contact electrode (30), and an isolating elastic patch (90) disposed on the first contact region (11) and the second contact region (12), the lead elastomer (80) being received within an aperture of the isolating elastic patch (90).

22. The electroencephalogram sensor according to claim 21, characterized in that a stopper ring (81) is provided at the periphery of the lead elastic body (80).

23. The electroencephalogram sensor according to claim 21, wherein the isolating elastic patch (90) further comprises a distal end patch (93) disposed on the second contact region (12).

24. The electroencephalogram sensor according to claim 23, wherein the isolation elastic patch (90) further comprises a connection end positioning patch (92) provided in alignment with the lead-out area (13).

25. The electroencephalogram sensor according to claim 21, further comprising: a secure chip connector (91) is mountable to the extraction region (13) for electrically connecting the extraction electrode (22).