CN110848949A

CN110848949A - Semiconductor heating and refrigerating air guide device

Info

Publication number: CN110848949A
Application number: CN201911059390.9A
Authority: CN
Inventors: 鲁亚萍; 邵旭平
Original assignee: Mengyue Comfort Technology (shanghai) Co Ltd
Current assignee: Mengyue Comfort Technology (shanghai) Co Ltd
Priority date: 2019-11-01
Filing date: 2019-11-01
Publication date: 2020-02-28

Abstract

The invention discloses a semiconductor heating and refrigerating air guide device which comprises an upper cover, radiating fins, a lower cover and semiconductor wafers, wherein the semiconductor wafers are arranged in the middle of the radiating fins, the radiating fins are arranged in a shell formed by the upper cover and the lower cover, an air inlet of the device is formed by an upper air inlet end of the upper cover and a lower air inlet end of the lower cover, an air outlet is formed in the upper end face of a downstream end of the upper cover in an upward extending mode, an air outlet is formed in the downstream end of the lower cover, the air inlet and the air outlet are coaxially arranged on two end sides of the radiating fins, and the air outlet is vertically arranged between the downstream of the radiating fins and the upstream of the air outlet. The device has the advantages of simple structure, flexible operation, convenient use, improved installation efficiency, reduced production cost, and the function of connecting the exhaust device and the multi-tube exhaust device simultaneously.

Description

Semiconductor heating and refrigerating air guide device

Technical Field

The invention relates to the technical field of temperature control air guide, in particular to a semiconductor heating and refrigerating air guide device.

Background

In 1834, the french scientist peltier found thermoelectric cooling and heating phenomena, namely the metallic thermoelectric reverse effect. A pair of thermocouples is formed by two different metals, and when direct current is input into the thermocouples, heat absorption and heat release phenomena are generated at the junctions of the thermocouples due to different directions of the direct current, which are called as the Peltier effect. The thermoelectric material is a semiconductor material, and after being electrified, one end of the thermoelectric material absorbs heat, and the other end releases heat, so that the thermoelectric material can play a role in refrigerating and heating by utilizing the characteristic. In recent years, thermoelectric refrigeration devices integrated by thermoelectric materials have been widely used in industries such as automobile air conditioning seats, environment-friendly refrigerators, and the like.

The thermoelectric semiconductor heating and refrigerating devices in the current market are not different from each other in air inlet and air outlet, for example, patent CN201820355044X, thermoelectric semiconductor module 3, and if the air outlet is in a closed space, the heat dissipation will be not smooth, which results in the performance reduction of the devices. The air outlet of the traditional thermoelectric semiconductor heating and cooling device is connected to the outside of the seat by using a plurality of connecting pieces or a through pipe, the method is single, and the installation is not flexible.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention aims to provide a semiconductor heating and cooling air guide device which can solve the problems.

The purpose of the invention is realized by adopting the following technical scheme:

the utility model provides a semiconductor heating refrigeration air ducting, includes upper cover, radiating fin, lower cover and semiconductor wafer, the semiconductor wafer sets up in the middle of the radiating fin, radiating fin sets up in the casing that comprises upper cover and lower cover, by the last inlet end of upper cover and the lower inlet end of lower cover constitute the air intake of device the up end of the low reaches end of upper cover upwards extends and sets up the air outlet the low reaches end of lower cover sets up the gas vent, the coaxial setting of air intake and gas vent is in radiating fin's both ends side, the air outlet vertically sets up radiating fin's low reaches with between the upper reaches of gas vent.

Preferably, an exhaust device is sleeved in the exhaust port.

Preferably, the heat dissipation fin comprises an upper fin group and a lower fin group which are arranged at intervals up and down, and the semiconductor fin is arranged in a spacing layer between the upper fin group and the lower fin group.

Preferably, a buckle is arranged at the downstream end of the upper cover, and a clamping groove corresponding to the buckle is formed at the upstream end of the exhaust port of the lower cover.

Preferably, the device also comprises a heat insulation sleeve for coating the peripheral wall of the radiating fin, and a flow guide notch is formed at the downstream end of the upper wall of the heat insulation sleeve and is positioned below the air outlet.

Preferably, an upper cover opening is formed on the upper cover, and a lower cover opening is formed on the lower cover, corresponding to the heat dissipation fins.

Preferably, the semiconductor wafer comprises an upper heating layer and a lower cooling layer, and a connecting lead is arranged from one end of the semiconductor wafer.

Preferably, the device further comprises an arc-shaped guide plate, a guide seat extends upwards from the tail end of the horizontal part of the butt joint part of the lower cover and the upper cover to form an air outlet, and the guide plate is mounted on the guide seat.

Preferably, the device further comprises two mounting lugs attached to the side end walls of the upper and/or lower covers.

Preferably, the air inlet, the air outlet and the air outlet are, but not limited to, kidney-round tube holes, and may also be rectangular, oval, circular, and the like.

Preferably, the exhaust device is a three-hole exhaust pipe sleeve body.

Preferably, the exhaust port is of a butt-joint structure and comprises an upper exhaust part and a lower exhaust part, three rows of through holes are formed in the butt-joint structure to serve as exhaust channels, and arc-shaped guide plates are integrally arranged at the gas inflow part of the upper exhaust part.

Preferably, the mounting lugs are integrally formed on both side end walls of the upper cover.

Compared with the prior art, the invention has the beneficial effects that: 1. the device has the advantages of simple structure, flexible operation and convenient use; 2. the device greatly improves the installation efficiency and reduces the production cost in the aspect of seat installation; 3. the exhaust port of the device has two functions; 4. the exhaust port can simultaneously realize the function of connecting one exhaust device and the multi-pipe exhaust device.

Drawings

Fig. 1 is a schematic structural view of a semiconductor heating and cooling air guide device according to the present invention;

fig. 2 is a schematic view of another view angle of the semiconductor heating and cooling air guiding device;

FIG. 3 is a schematic view of a baffle mounted to a lower cover;

fig. 4 is an exploded view of the semiconductor heating and cooling air guide device;

FIG. 5 is an exploded view of another embodiment of a vent in the lower cover.

In the figure: 1. an upper cover; 11. an upper cover opening; 12. buckling; 2. a heat dissipating fin; 21. an upper fin group; 22. a lower fin group; 3. a lower cover; 31. a lower cover opening; 32. a card slot; 33. a flow guide seat; 4. a semiconductor wafer; 41. an upper heat generating layer; 42. a lower refrigeration layer; 43. connecting a lead; 51. an upper air inlet end; 52. a lower air inlet end; 5. an air inlet; 6. an air outlet; 7. an exhaust port; 71. an upper exhaust part; 72. a lower exhaust part; 8. an exhaust device; 9. a thermal insulation sleeve; 91. a diversion gap; 10. mounting a lug; 100. a baffle.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

Referring to fig. 1 to 4, a semiconductor heating and cooling air guide device includes an upper cover 1, a heat dissipating fin 2, a lower cover 3 and semiconductor fins 4, where the semiconductor fins 4 are disposed in the middle of the heat dissipating fin 2, the heat dissipating fin 2 is disposed in a casing formed by the upper cover 1 and the lower cover 3, an air inlet 5 of the device is formed by an upper air inlet 51 of the upper cover 1 and a lower air inlet 52 of the lower cover 3, an air outlet 6 extends upward from an upper end of a downstream end of the upper cover 1, an air outlet 7 is disposed at a downstream end of the lower cover 3, the air inlet 5 and the air outlet 7 are coaxially disposed at two end sides of the heat dissipating fin 2, and the air outlet 6 is vertically disposed between a downstream of the heat dissipating fin 2 and an upstream of the air outlet 7.

The air inlet 5, the air outlet 6 and the air outlet 7 are kidney-shaped pipe holes.

Referring to fig. 4, an exhaust device 8 is sleeved in the exhaust port 7. The exhaust device 8 is a three-hole exhaust pipe sleeve body. The exhaust port 7 can simultaneously realize the dual-purpose function of connecting one exhaust device or a multi-pipe exhaust device; when used for connecting a single exhaust, the exhaust port 7 is connected in only one connection mode, and when used for connecting a multi-pipe exhaust, the exhaust port 7 can be selected from a three-hole exhaust pipe sleeve body or an exhaust device connected in series.

The heat dissipation fin 2 comprises an upper fin group 21 and a lower fin group 22 which are arranged at intervals up and down, and the semiconductor fin 4 is arranged in a spacing layer between the upper fin group 21 and the lower fin group 22.

A buckle 12 is arranged at the downstream end of the upper cover 1, and a clamping groove 32 corresponding to the buckle 12 is arranged at the upstream end of the exhaust port 7 of the lower cover 3.

The device also comprises a heat insulation sleeve 9 for coating the peripheral wall of the radiating fin 2, and a flow guide notch 91 is formed in the downstream end of the upper wall of the heat insulation sleeve 9, so that the flow guide notch 91 is positioned below the air outlet 6. The diversion notches 91 are used for guiding the airflow of the upper fin group 21 to the air outlet 6 more smoothly.

Corresponding to the heat dissipation fins 2, an upper cover opening 11 is formed in the upper cover 1, and a lower cover opening 31 is formed in the lower cover 3.

The semiconductor chip 4 includes an upper heat generating layer 41 and a lower cooling layer 42, and a connection lead 43 is provided from one end of the semiconductor chip 4.

The device also comprises an arc-shaped guide plate 100, a guide seat 33 which extends upwards from the tail end of the horizontal part of the butt joint part of the lower cover 3 and the upper cover 1 to form an air outlet 6, and the guide plate 100 is installed on the guide seat 33. The guide plate 100 is made of a heat insulation material, and has both a guide function and a heat insulation function.

The device further comprises two mounting lugs 10, said mounting lugs 10 being attached to the two side end walls of said upper and

lower covers

1, 3.

In another embodiment, the exhaust port 7 is a butt-joint structure, and includes an upper exhaust portion 71 and a lower exhaust portion 72, and the butt-joint structure 7 is provided with three rows of through holes as exhaust channels, and an arc-shaped baffle 100 is integrally disposed at a gas inflow portion of the upper exhaust portion 71. Therefore, the condition that the exhaust device 8 is arranged independently is eliminated, the structure is simpler, and the cost is lower.

The device may be used in a wide variety of applications, but is not limited to, ventilation systems or heating systems for car seats or refrigeration units.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a semiconductor heating refrigeration air ducting, includes upper cover (1), radiating fin (2), lower cover (3) and semiconductor wafer (4), its characterized in that: the semiconductor chip (4) is arranged in the middle of the radiating fin (2), the radiating fin (2) is arranged in a shell formed by an upper cover (1) and a lower cover (3), an upper air inlet end (51) of the upper cover (1) and a lower air inlet end (52) of the lower cover (3) form an air inlet (5) of the device, an upper end face of a downstream end of the upper cover (1) extends upwards to form an air outlet (6), an exhaust port (7) is arranged at the downstream end of the lower cover (3), the air inlet (5) and the exhaust port (7) are coaxially arranged at two end sides of the radiating fin (2), and the air outlet (6) is vertically arranged between the downstream of the radiating fin (2) and the upstream of the exhaust port (7).

2. The apparatus of claim 1, wherein: and an exhaust device (8) is sleeved in the exhaust port (7).

3. The apparatus of claim 1, wherein: the radiating fins (2) comprise upper fin groups (21) and lower fin groups (22) which are arranged at intervals up and down, and the semiconductor fins (4) are arranged in a spacing layer between the upper fin groups (21) and the lower fin groups (22).

4. The apparatus of claim 1, wherein: a buckle (12) is arranged at the downstream end of the upper cover (1), and a clamping groove (32) is formed at the upstream end of the exhaust port (7) of the lower cover (3) and corresponds to the buckle (12).

5. The apparatus of claim 1, wherein: the device also comprises a heat insulation sleeve (9) covering the outer peripheral wall of the heat dissipation fin (2), a flow guide notch (91) is formed in the downstream end of the upper wall of the heat insulation sleeve (9), and the flow guide notch (91) is located below the air outlet (6).

6. The apparatus of claim 1, wherein: an upper cover opening (11) is arranged on the upper cover (1) corresponding to the radiating fins (2), and a lower cover opening (31) is arranged on the lower cover (3).

7. The apparatus of claim 1, wherein: the semiconductor wafer (4) comprises an upper heating layer (41) and a lower cooling layer (42), and a connecting lead (43) is arranged at one end of the semiconductor wafer (4).

8. The apparatus of claim 1, wherein: the device also comprises an arc-shaped guide plate (100), a guide seat (33) of the air outlet (6) is formed by upwards extending the tail end of the horizontal part of the butt joint part of the lower cover (3) and the upper cover (1) in an arc shape, and the guide plate (100) is installed on the guide seat (33).

9. The apparatus of claim 5, wherein: the device further comprises two mounting lugs (10), said mounting lugs (10) being connected to the two side end walls of said upper and/or lower cover (1, 3).

10. The apparatus of claim 1, wherein: the exhaust port (7) is of a butt joint type structure and comprises an upper exhaust part (71) and a lower exhaust part (72), three rows of through holes are formed in the butt joint type structure (7) to serve as exhaust channels, and arc-shaped guide plates (100) are integrally arranged at the gas inflow part of the upper exhaust part (71).