CN110845842A - Polytetramethylene adipamide resin composition - Google Patents

Polytetramethylene adipamide resin composition Download PDF

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Publication number
CN110845842A
CN110845842A CN201911087920.0A CN201911087920A CN110845842A CN 110845842 A CN110845842 A CN 110845842A CN 201911087920 A CN201911087920 A CN 201911087920A CN 110845842 A CN110845842 A CN 110845842A
Authority
CN
China
Prior art keywords
resin composition
polytetramethylene adipamide
adipamide resin
reinforcing agent
polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911087920.0A
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Chinese (zh)
Inventor
高建兵
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201911087920.0A priority Critical patent/CN110845842A/en
Publication of CN110845842A publication Critical patent/CN110845842A/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/10—Silicon-containing compounds
    • C08K7/12—Asbestos

Abstract

The invention discloses a polytetramethylene adipamide resin composition, which is characterized by comprising the following raw materials: the polyamide and the amino silane respectively comprise the following components in percentage by mass: 80% -95% of polyamide and 5% -20% of amino silane, so that the problem of poor heat resistance of polyamide resin in the prior art is solved.

Description

Polytetramethylene adipamide resin composition
Technical Field
The invention belongs to the technical field of epoxy resin amide curing agents, and relates to a polytetramethylene adipamide resin composition.
Background
Polyamide resin, abbreviated as polyamide resin, is widely used in paints, electrical and adhesive bonding because of its excellent properties as a curing and toughening agent for epoxy resins. It is a series of products, and is made up by using various unsaturated double-bond-containing oils and fats or modified oils and fats to make them into acid or monoester, and making them react with organic amine, and in the oils and fats the tung oil is easy to make into polymer because it contains more than 80% of conjugated double-bond tung oil, and its raw material source is sufficient, and its cost is low, so that it can be extensively used. In the prior art, tung oil is refined and then saponified, then is acidized, washed and dried to form eleostearic acid, the eleostearic acid is polymerized into polymerized eleostearic acid mainly by polymers at high temperature, and the polymerized eleostearic acid is amidated and condensed with organic amine; or the eleostearic acid and methanol are reacted to form methyl ester, and the methyl ester is polymerized at high temperature to form poly methyl eleostearate mainly comprising a polymer, and the poly methyl eleostearate and organic amine are amidated and condensed. The polyamide resin prepared by the method is a brownish red and brownish viscous fluid, but the application of the polyamide resin is greatly limited due to poor heat resistance and chemical resistance.
Disclosure of Invention
The invention aims to provide a polytetramethylene adipamide resin composition which solves the problem of poor heat resistance of polyamide resins in the prior art.
The technical scheme adopted by the invention is that the polytetramethylene adipamide resin composition comprises the following raw materials: polyamides and aminosilanes.
The invention is also characterized in that:
the composite material comprises the following components in percentage by mass: 80% -95% of polyamide and 5% -20% of amino silane.
The aminosilane may be replaced with any of an epoxysilane, a vinylsilane, a polyarylene sulfide, or a silicone oil.
The composition can be added with an enhancer.
The reinforcing agent is fibrous.
The reinforcing agent may be selected from one or more of glass fibers, asbestos fibers, carbon fibers, and graphite fibers.
The invention has the beneficial effects that: the polytetramethylene adipamide resin composition of the present invention can be used for manufacturing molded articles with excellent properties by injection molding, extrusion, blow molding, compression molding and other molding methods commonly used for producing thermoplastic resins, and solves the problem of poor heat resistance of polyamide resins in the prior art. They can be used for manufacturing various automobile parts, mechanical parts, electric and electronic parts, and various commercial products, etc.
Detailed Description
The present invention will be described in detail with reference to the following embodiments.
A polytetramethylene adipamide resin composition comprises the following raw materials: polyamides and aminosilanes. The composite material comprises the following components in percentage by mass: 80% -95% of polyamide and 5% -20% of amino silane. The aminosilane may be replaced with any of an epoxysilane, a vinylsilane, a polyarylene sulfide, or a silicone oil. The composition can be added with an enhancer. The reinforcing agent is fibrous. The reinforcing agent may be selected from one or more of glass fibers, asbestos fibers, carbon fibers, and graphite fibers.
Example 1
A polytetramethylene adipamide resin composition comprises the following raw materials: polyamides and aminosilanes. The composite material comprises the following components in percentage by mass: polyamide 80% and aminosilane 20%. The composition can be added with a reinforcing agent, wherein the reinforcing agent is fibrous, and the reinforcing agent can be selected from glass fibers.
Example 2
A polytetramethylene adipamide resin composition comprises the following raw materials: polyamides and aminosilanes. The composite material comprises the following components in percentage by mass: polyamide-95% and aminosilane 5%. The composition can be added with an enhancer. The reinforcing agent is fibrous. The reinforcing agent may be selected from asbestos fibers.
Example 3
A polytetramethylene adipamide resin composition comprises the following raw materials: polyamides and aminosilanes. The composite material comprises the following components in percentage by mass: polyamide 90% and aminosilane 10%. The aminosilane may be replaced with any of an epoxysilane, a vinylsilane, a polyarylene sulfide, or a silicone oil. The composition can be added with an enhancer. The reinforcing agent is fibrous. The reinforcing agent may be selected from carbon fibers.
Example 4
A polytetramethylene adipamide resin composition comprises the following raw materials: polyamides and aminosilanes. The composite material comprises the following components in percentage by mass: polyamide 87% and aminosilane 13%. The aminosilane may be replaced with any of an epoxysilane, a vinylsilane, a polyarylene sulfide, or a silicone oil. The composition can be added with an enhancer. The reinforcing agent is fibrous. The reinforcing agent may be selected from graphite fibers.
Example 5
A polytetramethylene adipamide resin composition comprises the following raw materials: polyamides and aminosilanes. The composite material comprises the following components in percentage by mass: 92% of polyamide and 8% of aminosilane. The aminosilane may be replaced with any of an epoxysilane, a vinylsilane, a polyarylene sulfide, or a silicone oil. The composition can be added with an enhancer. The reinforcing agent is fibrous. The reinforcing agent may be selected from one or more of glass fibers, asbestos fibers, carbon fibers, and graphite fibers.
The polytetramethylene adipamide resin composition of the present invention can be used for manufacturing molded articles with excellent properties by injection molding, extrusion, blow molding, compression molding and other molding methods commonly used for producing thermoplastic resins, and solves the problem of poor heat resistance of polyamide resins in the prior art. They can be used for manufacturing various automobile parts, mechanical parts, electric and electronic parts, and various commercial products, etc.

Claims (6)

1. A polytetramethylene adipamide resin composition, comprising the following raw materials: polyamides and aminosilanes.
2. The polytetramethylene adipamide resin composition according to claim 1, comprising the following components in percentage by mass: 80% -95% of polyamide and 5% -20% of amino silane.
3. The polytetramethylene adipamide resin composition according to claim 2, wherein the aminosilane may be replaced with any one of an epoxy silane, a vinyl silane, a polyarylene sulfide, or a silicone oil.
4. The polytetramethylene adipamide resin composition according to claim 1, wherein a reinforcing agent is added to the composition.
5. The polytetramethylene adipamide resin composition according to claim 4, wherein the reinforcing agent is in a fibrous form.
6. The polytetramethylene adipamide resin composition according to claim 4, wherein the reinforcing agent is selected from one or more of glass fiber, asbestos fiber, carbon fiber and graphite fiber.
CN201911087920.0A 2019-11-08 2019-11-08 Polytetramethylene adipamide resin composition Pending CN110845842A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911087920.0A CN110845842A (en) 2019-11-08 2019-11-08 Polytetramethylene adipamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911087920.0A CN110845842A (en) 2019-11-08 2019-11-08 Polytetramethylene adipamide resin composition

Publications (1)

Publication Number Publication Date
CN110845842A true CN110845842A (en) 2020-02-28

Family

ID=69599922

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911087920.0A Pending CN110845842A (en) 2019-11-08 2019-11-08 Polytetramethylene adipamide resin composition

Country Status (1)

Country Link
CN (1) CN110845842A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85109133A (en) * 1984-11-21 1986-09-03 斯塔米卡本公司(Dsm附属公司) Amilan polyamide resin composition
CN102942784A (en) * 2012-10-10 2013-02-27 惠州市华聚塑化科技有限公司 Moisture-proof lead-free soldering nylon 46 composite material and preparation method thereof
CN105462252A (en) * 2015-12-25 2016-04-06 广东威林工程塑料有限公司 Short-fiber-reinforced heat-conducting electric-insulating nylon 46 composite material and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85109133A (en) * 1984-11-21 1986-09-03 斯塔米卡本公司(Dsm附属公司) Amilan polyamide resin composition
CN102942784A (en) * 2012-10-10 2013-02-27 惠州市华聚塑化科技有限公司 Moisture-proof lead-free soldering nylon 46 composite material and preparation method thereof
CN105462252A (en) * 2015-12-25 2016-04-06 广东威林工程塑料有限公司 Short-fiber-reinforced heat-conducting electric-insulating nylon 46 composite material and preparation method thereof

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Application publication date: 20200228

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