CN110843206A - Preparation method and application of three-dimensional electronic device - Google Patents
Preparation method and application of three-dimensional electronic device Download PDFInfo
- Publication number
- CN110843206A CN110843206A CN201810824130.5A CN201810824130A CN110843206A CN 110843206 A CN110843206 A CN 110843206A CN 201810824130 A CN201810824130 A CN 201810824130A CN 110843206 A CN110843206 A CN 110843206A
- Authority
- CN
- China
- Prior art keywords
- dimensional
- electronic device
- packaging
- conductive
- sacrificial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Abstract
The invention discloses a preparation method and application of a three-dimensional electronic device, and belongs to the field of three-dimensional forming and electronic devices. Specifically, the sacrificial slurry is used for constructing a required three-dimensional structure by using a three-dimensional die-free direct writing technology, the sacrificial slurry is removed after the packaging and the curing of another material, and finally, the formed three-dimensional pore channel is filled with a conductive material and is subjected to post-treatment to form a three-dimensional conductive network. The preparation method is simple to operate, has strong adaptability to the three-dimensional structure which is complicated in structure according to actual requirements, overcomes the defect that electronic devices prepared by the traditional method are difficult to miniaturize and integrate, can realize the manufacture of flexible and non-flexible electronic devices according to different packaging materials, and can be applied to the manufacture of electronic devices such as antennas, sensors, energy collectors and the like.
Description
Technical Field
The invention relates to the field of three-dimensional forming and electronic device manufacturing, in particular to a preparation method and application of a three-dimensional electronic device.
Background
With the progress of technology, the functional requirements of electronic products are higher and higher. To realize these functions, the electronic products have increasingly complex structures, increased number of components, and increased volume. Electronic products need to be kept small in size for convenient use, and therefore, high demands are made on integration and miniaturization of electronic devices. Communication products in the communication industry require multiple functions and cannot be too large in size, so that all parts need to be miniaturized, and particularly antennas with large sizes need to be used. The internet of things and ecological home are being developed vigorously, a large number of sensors are needed, so that high requirements are put on miniaturization of the sensors, and great convenience is brought if the sensors can be integrated on other electrical appliances or all the sensors can be integrated together. The rapid development of electronic computers puts higher demands on operation speed, power consumption and volume, and also requires a large number of miniaturized and highly integrated devices.
Traditional miniaturization approaches are mainly modular, using photolithographic techniques, but are limited to two-dimensional integrated circuits, and it is now difficult to further reduce device size. Designing electronic devices into three-dimensional structures is an effective means to further miniaturize electronic devices. Conventional three-dimensional structure processing methods (e.g., machining) are difficult to fabricate precise and complex devices. The three-dimensional lithography has the disadvantage of high scrap rate and high cost. Therefore, the novel three-dimensional forming technology is developed to realize the preparation of the three-dimensional electronic device, and the method has important scientific and economic significance.
The 3D printing technology without the mold direct writing can well construct a three-dimensional network structure, and the existing research shows that the three-dimensional hollow network with the complex pore channel structure can be prepared by combining the 3D printing technology without the mold direct writing and the composite material packaging technology. Researchers have developed research in this direction, and this idea is applied to the fields of reaction, separation, detection, etc. in the biochemical field, that is, the microfluidics technology. If the three-dimensional hollow network is filled with a suitable conductive material through the innovation of technical means, the design and the preparation of three-dimensional electronic devices with complicated and various three-dimensional structures can be realized. The realization of the target needs to combine the combination innovation of the technical means such as the modeless direct writing, the three-dimensional configuration of the electronic device, the design of the composite material and the like, is an important research direction in the interdisciplinary fields of materials science, mechanical manufacturing, electronics and the like, and has important scientific and industrial application significance.
Disclosure of Invention
The invention aims to provide a preparation method and application of a three-dimensional electronic device. Different electronic devices are obtained through the design of the microfluid structure, and the requirements of miniaturization and integration of the electronic devices at the present stage are met.
In order to achieve the purpose, the invention adopts the following scheme:
a method for manufacturing a three-dimensional electronic device comprises the steps of firstly, adopting a three-dimensional direct writing technology to construct a three-dimensional network structure required by the electronic device by using sacrificial slurry, then packaging the three-dimensional network structure, and removing the sacrificial slurry after packaging to form a three-dimensional pore channel; and filling the conductive material in the three-dimensional pore channel to obtain the electronic device with the three-dimensional conductive network. The method comprises the following steps:
(1) printing and constructing a required three-dimensional network structure on an electronic device substrate by a three-dimensional modeless direct writing technology; the three-dimensional network structure is composed of sacrificial slurry; the material of the electronic device substrate is the same as that of the packaging material.
(2) Pouring the three-dimensional network structure obtained in the step (1) by using a packaging material, covering the three-dimensional network structure with the packaging material, and curing the packaging material to obtain a packaging body; when the packaging material is a rigid material, obtaining a rigid three-dimensional electronic device; when the packaging material is a flexible material, a flexible three-dimensional electronic device is obtained.
(3) After packaging, the sacrificial material in the packaging body is liquefied to form liquid with good flowing performance to be discharged, and a three-dimensional pore channel (microfluidic channel) is formed in the packaging body;
(4) and filling a conductive material in the three-dimensional pore channel to form a three-dimensional conductive network.
In the step (2), the sacrificial material is a printable and phase-changeable material; printable refers to that the sacrificial material is suitable for three-dimensional die-free direct writing when in a solid state or a semi-solid state; phase-convertible means that the sacrificial material is capable of being converted to a liquid or gaseous state that is easily removed.
The sacrificial material is printable to satisfy loss modulus G '< storage modulus G' to ensure that the paste is able to retain shape after extrusion; the sacrificial material is capable of changing from a solid to a liquid under temperature or pH control for ease of removal.
In the step (4), after the conductive material is filled in the three-dimensional pore channel, the filled conductive material obtains the conductive capability or improves the conductive capability through post-treatment; the post-treatment is a drying treatment and/or a heat treatment.
The packaging material is PDMS, resin, photosensitive glue, engineering plastics or ceramic materials and the like.
The conductive material is conductive metallic paint, liquid metal or flowing liquid prepared by metal particles.
The three-dimensional electronic device is applied to the field of antennas, sensors or energy collectors as a three-dimensional conductive network.
The invention has the following advantages and beneficial effects:
the method for preparing the electronic device is simple, has strong adaptability to the structure, and can be used for manufacturing a three-dimensional electronic structure so as to miniaturize the electronic device and realize easy integration. The preparation of flexible and non-flexible electronic devices can be realized according to different packaging materials, and the packaging material can be used for manufacturing electronic devices such as antennas, sensors, energy collectors and the like.
Drawings
FIG. 1 is a flow chart of a method of fabricating a three-dimensional electronic device.
Fig. 2 is a schematic diagram of a three-dimensional microfluidic electronic device fabrication method.
FIG. 3 is a pictorial representation of an electronic device of the preparation of example 1.
Detailed Description
The invention is described in detail below with reference to the figures and examples.
The invention provides a preparation method of a three-dimensional electronic device, and the flow and the preparation schematic diagram of the preparation method are shown in figures 1-2. The process is as follows: constructing a three-dimensional model of the sacrificial material on the packaging material substrate through three-dimensional modeless direct writing printing; packaging and curing the obtained three-dimensional model formed by the sacrificial material; carrying out subsequent treatment on the obtained composite three-dimensional model formed by the sacrificial material and the packaging material to liquefy the sacrificial material, forming liquid with good flowing property and discharging the liquid to form a three-dimensional microfluidic channel; and filling the obtained three-dimensional micro-channel model formed by the packaging material with a conductive material to form a three-dimensional conductive network.
The phase transition conditions of the used sacrificial agent are easy to realize, and the sacrificial agent is Pluronic F-127 hydrogel in the following examples, and the preparation process is as follows: an amount of Pluronic F-127 was dissolved in deionized water and stirred to form a 32% strength by weight hydrogel. Used is sigma model P2443-250G F127. The 32 wt% temperature sensitive gel F-127 is semisolid at room temperature and liquid at about 0 ℃.
The used packaging material can be Dow Corning PDMS184, and at this time, a flexible electronic device can be manufactured; if epoxy resin is used as the packaging material, a non-flexible electronic device can be manufactured. In addition, packaging materials such as photosensitive adhesives, engineering plastics, ceramic materials and the like can also be used.
The conductive material may be a flowing liquid prepared by using conductive metallic paint, liquid alloy and metal particles.
Example 1:
as shown in fig. 3, from left to right are the microfluidic channel structures to be cast (the sacrificial agent is Pluronic F-127); the three-dimensional network structure of sacrificial agent F-127 has been removed; filling conductive silver paint and drying at 60 ℃ for 1 hour to obtain the three-dimensional electronic device. The preparation process of the electronic device is as follows:
(1) PDMS with a thickness of 2mm was pre-placed at the bottom of a square 22X 10 mm.
(2) Preparing F-127 gel with the mass fraction of 32%;
(3) using a three-dimensional die-free direct writing method, printing a fold line structure by using F-127 gel as slurry, wherein the total size is 15 multiplied by 10 multiplied by 0.42mm, and the distance between adjacent lines is 1.5 mm;
(5) PDMS was poured into the square groove, covering the upper surface of the microfluidic channel structure by about 3mm, and placed until curing.
(6) And (3) placing the completely cured sample at 4 ℃ for 1h, and drawing out the sample by using an injector after the gel is changed into liquid. Ethanol was then injected to flush out the residual F-127 and dried under vacuum at 60 ℃ for 1 hour.
(7) And filling conductive silver paint into the pore structure, and putting the pore structure in a vacuum box to dry the silver paint to obtain the three-dimensional electronic device formed by the conductive network.
Example 2:
in this embodiment, a three-dimensional network of a wood pile structure is prepared by using a three-dimensional electronic device preparation method, which comprises the following steps:
(1) preparing 32 mass percent of F-127 hydrogel and PDMS184 silica gel;
(2) printing a wood stack structure by using F-127 gel in a container with a layer of PDMS in advance, wherein the whole size of the wood stack structure is 30 multiplied by 5 mm;
(3) pouring PDMS into the container until the PDMS completely covers the wood pile structure, and standing for 12 hours at normal temperature until the PDMS is completely cured;
(4) placing the sample in an environment at 4 ℃ for 1 hour, extracting the solution by using an injector after the F-127 becomes the solution, continuously injecting ethanol into the channel to completely flush the F-127, and placing the F-127 into a drying oven to dry at 60 ℃ for 1 hour;
(7) and filling liquid metal to form a three-dimensional conductive network.
The above examples are merely incorporated by reference, and any method for fabricating three-dimensional electronic devices based on sacrificial slurry methods that is similar to or extends from the teachings of this patent is within the scope of this patent.
Claims (10)
1. A method for manufacturing a three-dimensional electronic device is characterized by comprising the following steps: the method comprises the steps of firstly, constructing a three-dimensional network structure required by an electronic device by using sacrificial slurry through a three-dimensional direct writing technology, then packaging the three-dimensional network structure, and removing the sacrificial slurry after packaging to form a three-dimensional pore channel; and filling the conductive material in the three-dimensional pore channel to obtain the electronic device with the three-dimensional conductive network.
2. The method of fabricating a three-dimensional electronic device according to claim 1, wherein: the method comprises the following steps:
(1) printing and constructing a required three-dimensional network structure on an electronic device substrate by a three-dimensional modeless direct writing technology; the three-dimensional network structure is composed of sacrificial slurry;
(2) pouring the three-dimensional network structure obtained in the step (1) by using a packaging material, covering the three-dimensional network structure with the packaging material, and curing the packaging material to obtain a packaging body;
(3) after packaging, liquefying the sacrificial material in the packaging body to form liquid with good flowing property for discharging, and forming a three-dimensional pore channel in the packaging body;
(4) and filling a conductive material in the three-dimensional pore channel to form a three-dimensional conductive network.
3. The method for producing a three-dimensional electronic device according to claim 2, characterized in that: when the packaging material is a rigid material, obtaining a rigid three-dimensional electronic device; when the packaging material is a flexible material, a flexible three-dimensional electronic device is obtained.
4. The method for producing a three-dimensional electronic device according to claim 2, characterized in that: the material of the electronic device substrate is the same as that of the packaging material.
5. The method for producing a three-dimensional electronic device according to claim 2, characterized in that: in the step (2), the sacrificial material is printable and phase-changeable material.
6. The method for producing a three-dimensional electronic device according to claim 5, characterized in that: the sacrificial material is printable to satisfy loss modulus G '< storage modulus G' to ensure that the paste is able to retain shape after extrusion; the sacrificial material is phase-changeable, i.e., capable of being transformed from a semi-solid state to a liquid state under temperature or pH control for ease of removal.
7. The method for producing a three-dimensional electronic device according to claim 5, characterized in that: in the step (4), after the conductive material is filled in the three-dimensional pore channel, the filled conductive material obtains the conductive capability or improves the conductive capability through post-treatment; the post-treatment is a drying treatment and/or a heat treatment.
8. The method for producing a three-dimensional electronic device according to claim 2, characterized in that: the packaging material is PDMS, resin, photosensitive glue, engineering plastics or ceramic materials and the like.
9. The method for producing a three-dimensional electronic device according to claim 2, characterized in that: the conductive material is conductive metallic paint, liquid metal or flowing slurry prepared from metal particles.
10. Use of the three-dimensional electronic device according to claim 1, characterized in that: the three-dimensional electronic device is applied to the field of antennas, sensors or energy collectors as a three-dimensional conductive network.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810824130.5A CN110843206A (en) | 2018-07-25 | 2018-07-25 | Preparation method and application of three-dimensional electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810824130.5A CN110843206A (en) | 2018-07-25 | 2018-07-25 | Preparation method and application of three-dimensional electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110843206A true CN110843206A (en) | 2020-02-28 |
Family
ID=69594366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810824130.5A Pending CN110843206A (en) | 2018-07-25 | 2018-07-25 | Preparation method and application of three-dimensional electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110843206A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112165766A (en) * | 2020-10-30 | 2021-01-01 | 哈尔滨工业大学（深圳） | Liquid metal flexible electron and preparation method and application thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103328189A (en) * | 2010-11-24 | 2013-09-25 | 应用科学研究Tno荷兰组织 | Interconnect structure and method for producing same |
| CN106211622A (en) * | 2016-08-05 | 2016-12-07 | 华中科技大学 | A kind of embedded circuit board is combined 3D Method of printing |
| CN107107492A (en) * | 2014-10-23 | 2017-08-29 | 脸谱公司 | Internal structure conductive trace and the making for the three-dimensional interconnection for manufacturing structure |
| CN107283859A (en) * | 2017-06-14 | 2017-10-24 | 上海大学 | A kind of method that fractal structure microchannel is prepared by 3D printing |
| CN107405826A (en) * | 2015-03-17 | 2017-11-28 | 飞利浦照明控股有限公司 | Make the 3D printing shape with interconnection and embedded components |
| US20180193922A1 (en) * | 2017-01-12 | 2018-07-12 | Voxel8. Inc. | Techniques for hybrid additive and substractive manufacturing |
-
2018
- 2018-07-25 CN CN201810824130.5A patent/CN110843206A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103328189A (en) * | 2010-11-24 | 2013-09-25 | 应用科学研究Tno荷兰组织 | Interconnect structure and method for producing same |
| CN107107492A (en) * | 2014-10-23 | 2017-08-29 | 脸谱公司 | Internal structure conductive trace and the making for the three-dimensional interconnection for manufacturing structure |
| CN107405826A (en) * | 2015-03-17 | 2017-11-28 | 飞利浦照明控股有限公司 | Make the 3D printing shape with interconnection and embedded components |
| CN106211622A (en) * | 2016-08-05 | 2016-12-07 | 华中科技大学 | A kind of embedded circuit board is combined 3D Method of printing |
| US20180193922A1 (en) * | 2017-01-12 | 2018-07-12 | Voxel8. Inc. | Techniques for hybrid additive and substractive manufacturing |
| CN107283859A (en) * | 2017-06-14 | 2017-10-24 | 上海大学 | A kind of method that fractal structure microchannel is prepared by 3D printing |
Non-Patent Citations (2)
| Title |
|---|
| VITTORIO SAGGIOMO: "Simple 3D Printed Scaffold-Removal Method for the Fabrication of Intricate Microfl uidic Devices", 《ADVANCE SCIENCE》 * |
| YONG-ZE YU: "3D printing for functional electronics by injection and package of liquid metals into channels of mechanical structures", 《MATERIALS AND DESIGN》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112165766A (en) * | 2020-10-30 | 2021-01-01 | 哈尔滨工业大学（深圳） | Liquid metal flexible electron and preparation method and application thereof |
| CN112165766B (en) * | 2020-10-30 | 2021-05-04 | 哈尔滨工业大学（深圳） | Liquid metal flexible electron and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108376839B (en) | Metamaterial based on liquid metal microfluidics and preparation method thereof | |
| CN104002474B (en) | There is the super-hydrophobic of micro-nano compound structure and adhere to preparation method and the application thereof on adjustable surface | |
| CN102012632B (en) | Method for preparing bionic adhesion arrays with different top end structures | |
| CN103826830B (en) | The layering manufacture of many materials micro element of free forming | |
| Wu et al. | Microfluidic stretchable radio-frequency devices | |
| CN107583696B (en) | A kind of particle capture and release device based on bulk acoustic wave excitation and moving bubble | |
| CN102962107B (en) | Manufacture method for three-dimensional micro-fluidic chip | |
| Novak et al. | Rapid fabrication of nickel molds for prototyping embossed plastic microfluidic devices | |
| CN103231518A (en) | Polydimethylsiloxane array micropore film preparation method | |
| Zhang et al. | Direct ink writing of moldable electrochemical energy storage devices: ongoing progress, challenges, and prospects | |
| CN105619572A (en) | 3D printing forming method of ceramic material | |
| CN102008927B (en) | Method for preparing multilayer amorphous alloy based microstructure | |
| CN107216153A (en) | A kind of 3D printing method of ceramic material | |
| CN110843206A (en) | Preparation method and application of three-dimensional electronic device | |
| Ni et al. | Recent Progress on the Development of Magnetically‐Responsive Micropillars: Actuation, Fabrication, and Applications | |
| CN104788102A (en) | Preparation method for nano-silicon nitride powder for laser sintering 3D printing technology | |
| Wang et al. | Selectively metalizable low-temperature cofired ceramic for three-dimensional electronics via hybrid additive manufacturing | |
| Tong | Advanced Materials for Printed Flexible Electronics | |
| CN102522494A (en) | Combined function device simultaneously having drive and sensing capabilities and preparation and application thereof | |
| CN102226446A (en) | Method for preparing megawatt fan blade shear web and auxiliary bonding angle thereof | |
| CN109351918B (en) | Multi-physical-field composite action micro-component liquid forming method | |
| CN106507732B (en) | Cavity structure ceramic component filling forming method and particular manufacturing craft | |
| CN110371919A (en) | A kind of self-assembly preparation method thereof of micro-nano multistage rod structure | |
| CN103413888B (en) | A kind of casting type thermoelectric device and preparation method thereof | |
| CN102279519B (en) | Three-dimensional micron/nano-structured fluid dielectrophoresis force scanning, embossing and forming method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200228 |
|
| RJ01 | Rejection of invention patent application after publication |