CN110841975B - Control method and device for PCB ultrasonic backwashing device - Google Patents
Control method and device for PCB ultrasonic backwashing device Download PDFInfo
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- CN110841975B CN110841975B CN201911150108.8A CN201911150108A CN110841975B CN 110841975 B CN110841975 B CN 110841975B CN 201911150108 A CN201911150108 A CN 201911150108A CN 110841975 B CN110841975 B CN 110841975B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W10/00—Technologies for wastewater treatment
- Y02W10/10—Biological treatment of water, waste water, or sewage
Abstract
The invention relates to the technical field of PCB production, and particularly discloses a control method and a control device for a PCB ultrasonic backwashing device. A control method of a PCB ultrasonic backwashing device is applied to the ultrasonic backwashing device, a plurality of ultrasonic vibrating plates are arranged in an ultrasonic cylinder of the PCB ultrasonic backwashing device, and the method comprises the following steps: the ultrasonic vibration plates are grouped to form a plurality of ultrasonic vibration plate groups, the plurality of ultrasonic vibration plate groups work according to a set time sequence, and the time for the plurality of ultrasonic vibration plate groups to work simultaneously does not exceed the preset time. The control method of the PCB ultrasonic backwashing device provided by the invention controls the ultrasonic vibration plates to work simultaneously for no more than the preset time, reduces the resonance area of ultrasonic waves generated by a plurality of ultrasonic vibration plates, and prevents the ultrasonic vibration plates from impacting one place of the PCB all the time, thereby avoiding the problem that the panel or the hole ring edge of the PCB is damaged due to mutual impact or resonance impact of the ultrasonic waves generated by the ultrasonic vibration plates, and preventing the panel and the hole ring edge of the PCB from being corroded.
Description
Technical Field
The invention relates to the technical field of PCB production, in particular to a control method and a control device of a PCB ultrasonic backwashing device.
Background
In the technical field of PCB production, the ultrasonic backwashing technology is widely applied. However, when the ultrasonic backwashing device is used for cleaning the surface attachments of the PCB, the problem that the copper surface of the plate surface or the hole ring edge is corroded exists, and the ultrasonic backwashing device is particularly obvious on the plate with the high thickness-diameter ratio. In the prior art, a certain number of ultrasonic vibration plates are usually installed on the edge of an ultrasonic cylinder body, and all the ultrasonic vibration plates are opened simultaneously for cleaning according to set power and cleaning time, so that the ultrasonic vibration plates are impacted or generate resonance impact. Therefore, it is desirable to provide a control method of a PCB ultrasonic backwashing device to solve the above problems.
Disclosure of Invention
The invention aims to provide a control method and a control device of a PCB ultrasonic backwashing device, which reduce the resonance area of ultrasonic waves generated by a plurality of ultrasonic vibration plates, prevent the ultrasonic waves from always impacting one place of the PCB and solve the problem of etching of a panel or a copper surface at the edge of a hole ring of the PCB.
In order to achieve the purpose, the invention adopts the following technical scheme:
a control method of a PCB ultrasonic backwashing device is applied to the ultrasonic backwashing device, a plurality of ultrasonic vibrating plates are arranged in an ultrasonic cylinder of the PCB ultrasonic backwashing device, and the method comprises the following steps:
grouping the ultrasonic vibration plates to form a plurality of ultrasonic vibration plate groups;
the ultrasonic vibration plate groups work according to a set time sequence, and the time for the ultrasonic vibration plate groups to work simultaneously does not exceed the preset time.
Preferably, the cross section of the ultrasonic cylinder is rectangular, the ultrasonic vibration plates are arranged on three side walls of the ultrasonic cylinder, and the grouping of the plurality of ultrasonic vibration plates to form a plurality of ultrasonic vibration plate groups specifically includes:
the ultrasonic vibration plates on the two opposite side walls are set as a first ultrasonic vibration plate group and a second ultrasonic vibration plate group, the ultrasonic vibration plate adjacent to the first ultrasonic vibration plate group on the third side wall is set as a third ultrasonic vibration plate group, the ultrasonic vibration plate adjacent to the second ultrasonic vibration plate group is set as a fourth ultrasonic vibration plate group, and a fifth ultrasonic vibration plate group is arranged between the third ultrasonic vibration plate group and the fourth ultrasonic vibration plate group.
Preferably, the operation of the plurality of ultrasonic wave vibration plate groups according to a set time sequence specifically includes:
when the first ultrasonic vibration plate group and the fourth ultrasonic vibration plate group work, the second ultrasonic vibration plate group and the third ultrasonic vibration plate group wait, and the fifth ultrasonic vibration plate group always works.
Preferably, the second and third ultrasonic horn groups begin to operate without the first and fourth ultrasonic horn groups ending operating.
Preferably, the first ultrasonic vibrator plate group and the fourth ultrasonic vibrator plate group operate according to a first timing, and the first timing includes a first operating time T1, a second operating time T2, and a first waiting time T3, which are sequentially arranged at intervals.
Preferably, the second ultrasonic transducer group and the third ultrasonic transducer group operate according to a second time sequence, the second time sequence includes a second waiting time T4, a third operating time T5 and a fourth operating time T6, which are sequentially arranged at intervals, the second waiting time T4 is arranged corresponding to the first operating time T1, the third operating time T5 is arranged corresponding to the second operating time T2, and the fourth operating time T6 is arranged corresponding to the first waiting time T3.
Preferably, the first operating time T1 and the second waiting time T4 are set to 45-65s, the second operating time T2 and the third operating time T5 are set to 8-12s, and the first waiting time T3 and the fourth operating time T6 are set to 45-65 s.
Preferably, the ultrasonic vibration plates are grouped by inputting information through a human-computer interface.
Preferably, the information input through the human-computer interface further includes, after grouping the ultrasonic vibration plates:
and inputting information through a human-computer interface, and setting working time sequence for each group of ultrasonic vibration plates.
A PCB ultrasonic backwashing device adopts the control method of the PCB ultrasonic backwashing device.
The invention has the beneficial effects that:
the control method of the PCB ultrasonic backwashing device provided by the invention controls the time for the ultrasonic vibration plates to work simultaneously not to exceed the preset time, reduces the resonance area of ultrasonic waves generated by a plurality of ultrasonic vibration plates, and can not impact towards one place of the PCB all the time, thereby avoiding the problem that the panel or the hole ring edge of the PCB is damaged due to mutual impact or resonance impact of the ultrasonic waves generated by the ultrasonic vibration plates, and the panel and the hole ring edge of the PCB can not be corroded.
The PCB ultrasonic backwashing device provided by the invention has a good PCB cleaning effect, and the panel and the annular edge of the hole of the PCB cannot be corroded.
Drawings
FIG. 1 is a distribution diagram of an ultrasonic vibrating plate of an ultrasonic back washing device for PCB provided by an embodiment of the invention;
FIG. 2 is a flowchart illustrating the main steps of a control method for an ultrasonic back washing apparatus of a PCB according to an embodiment of the present invention;
FIG. 3 is a flowchart illustrating the detailed steps of a control method for an ultrasonic PCB backwashing device according to an embodiment of the present invention;
FIG. 4 is a timing diagram illustrating operation of an ultrasonic vibrating plate according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating operation of an ultrasonic vibrating plate according to an embodiment of the present invention at a first operating time T1;
FIG. 6 is a schematic diagram illustrating operation of an ultrasonic vibration plate according to an embodiment of the present invention during a second operation time T2;
fig. 7 is a schematic diagram illustrating the operation of the ultrasonic vibrating plate in the third operation time T3 according to the embodiment of the present invention.
In the figure:
1. an ultrasonic wave cylinder; 2. a first ultrasonic vibration plate group; 3. a second ultrasonic vibration plate group; 4. a third ultrasonic vibration plate group; 5. a fourth ultrasonic vibration plate group; 6. and a fifth ultrasonic vibration plate group.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The embodiment provides a PCB ultrasonic wave backwashing device, including ultrasonic wave jar 1, be equipped with a plurality of ultrasonic waves in the ultrasonic wave jar 1 and shake the board. Specifically, as shown in fig. 1, the cross section of the ultrasonic wave cylinder 1 is rectangular, and ultrasonic wave vibration plates are disposed on three side walls of the ultrasonic wave cylinder 1, and are mounted on the side walls of the ultrasonic wave cylinder 1.
In this embodiment, two ultrasonic vibration plates are respectively installed on two opposite side walls of the ultrasonic cylinder 1, and three ultrasonic vibration plates are installed on the third side wall of the ultrasonic cylinder 1. The number of the ultrasonic vibration plates depends on the size of the ultrasonic cylinder 1, so that the surface of the PCB can be sufficiently cleaned, and the equipment cost can be reduced. Therefore, the number of the ultrasonic diaphragms is not limited herein.
In this embodiment, the ultrasonic vibration plates on the two opposite side walls are set as the first ultrasonic vibration plate group 2 and the second ultrasonic vibration plate group 3, the ultrasonic vibration plate adjacent to the first ultrasonic vibration plate group 2 on the third side wall is set as the third ultrasonic vibration plate group 4, the ultrasonic vibration plate adjacent to the second ultrasonic vibration plate group 3 is set as the fourth ultrasonic vibration plate group 5, and the fifth ultrasonic vibration plate group 6 is provided between the third ultrasonic vibration plate group 4 and the fourth ultrasonic vibration plate group 5.
The embodiment also provides a control method of the PCB ultrasonic backwashing device, which is applied to the PCB ultrasonic backwashing device, so that the PCB ultrasonic backwashing device has a good PCB cleaning effect, and a panel and a hole ring edge of the PCB cannot be corroded.
As shown in fig. 2, the control method of the ultrasonic back washing device for PCBs mainly comprises: the ultrasonic vibration plates are grouped to form a plurality of ultrasonic vibration plate groups, the ultrasonic vibration plate groups work according to a set time sequence, and the time for the ultrasonic vibration plate groups to work simultaneously does not exceed the preset time. The control method controls the time of the ultrasonic vibration plates working simultaneously not to exceed the preset time, reduces the resonance area of ultrasonic waves generated by the ultrasonic vibration plates, and can not impact towards one place of the PCB all the time, further avoids the problem that the panel or the hole ring edge of the PCB is damaged due to mutual impact or resonance impact of the ultrasonic vibration plates, and the panel and the hole ring edge of the PCB can not be corroded.
Fig. 3 is a flowchart illustrating detailed steps of a control method of the PCB ultrasonic backwashing device, and the control method of the PCB ultrasonic backwashing device according to this embodiment will be described in detail with reference to fig. 3.
The control method mainly comprises the following steps:
step one, grouping a plurality of ultrasonic vibration plates.
Specifically, information is input through a human-computer interface, and a plurality of ultrasonic vibration plates are grouped. In the present embodiment, seven ultrasonic vibration plates are provided, and each ultrasonic vibration plate is numbered. The seven ultrasonic vibration plates are required to be divided into five groups, five grouping input interfaces are arranged on the human-computer interface, each input interface is provided with seven numbers, operators can select and group the ultrasonic vibration plates, the operation is convenient, the operation flexibility is high, and the ultrasonic vibration plates can be grouped according to requirements.
In this embodiment, the ultrasonic vibration plates on the two opposite side walls are set as the first ultrasonic vibration plate group 2 and the second ultrasonic vibration plate group 3, the ultrasonic vibration plate adjacent to the first ultrasonic vibration plate group 2 on the third side wall is set as the third ultrasonic vibration plate group 4, the ultrasonic vibration plate adjacent to the second ultrasonic vibration plate group 3 is set as the fourth ultrasonic vibration plate group 5, and the fifth ultrasonic vibration plate group 6 is provided between the third ultrasonic vibration plate group 4 and the fourth ultrasonic vibration plate group 5.
And step two, setting working time sequences for each group of ultrasonic vibration plates.
Specifically, information is input through a human-computer interface, and a working time sequence is set for each group of ultrasonic vibration plates. In this embodiment, the ultrasonic vibration plates are divided into five groups, and then five working timing setting interfaces are provided on the human-computer interface, and each working timing setting interface corresponds to one group of ultrasonic vibration plates.
In the present embodiment, the first ultrasonic transducer plate group 2 and the fourth ultrasonic transducer plate group 5 operate simultaneously, and therefore the timing of operation of the first ultrasonic transducer plate group 2 is the same as the timing of operation of the fourth ultrasonic transducer plate group 5. The second ultrasonic vibration plate group 3 and the third ultrasonic vibration plate group 4 operate simultaneously, so the operation time sequence of the second ultrasonic vibration plate group 3 and the third ultrasonic vibration plate group 4 is the same, and when the first ultrasonic vibration plate group 2 and the fourth ultrasonic vibration plate group 5 operate, the second ultrasonic vibration plate group 3 and the third ultrasonic vibration plate group 4 wait. The fifth ultrasonic horn group 6 is always in operation during operation of the device. This ultrasonic wave shakes the setting of board group and working order, has effectively avoided ultrasonic wave to shake mutual striking or resonance impact damage of board to PCB's panel or the problem of hole ring limit.
Further, in a cleaning period, when the first ultrasonic vibration plate group 2 and the fourth ultrasonic vibration plate group 5 do not work, the second ultrasonic vibration plate group 3 and the third ultrasonic vibration plate group 4 start to work, and after the second ultrasonic vibration plate group 3 and the third ultrasonic vibration plate group 4 work for a preset time, a cleaning period is completed, so that uninterrupted cleaning in each period is realized, and the cleaning efficiency is improved.
Specifically, as shown in fig. 4, the first ultrasonic horn group 2 and the fourth ultrasonic horn group 5 operate in a first sequence including a first operating time T1, a second operating time T2, and a first waiting time T3, which are sequentially arranged at intervals, and each cleaning cycle includes a first operating time T1, a second operating time T2, and a first waiting time T3. The second ultrasonic vibration plate group 3 and the third ultrasonic vibration plate group 4 work according to a second time sequence, the second time sequence comprises a second waiting time T4, a third working time T5 and a fourth working time T6 which are arranged at intervals in sequence, and each cleaning cycle comprises a second waiting time T4, a third working time T5 and a fourth working time T6. The second waiting time T4 is set corresponding to the first working time T1, the third working time T5 is set corresponding to the second working time T2, and the fourth working time T6 is set corresponding to the first waiting time T3, so that the ultrasonic vibration plates work in batches, and the ultrasonic vibration plates are prevented from colliding with each other during working.
In the present embodiment, the first operating time T1 and the second waiting time T4 are set to 45-65s, preferably 55s, the second operating time T2 and the third operating time T5 are set to 8-12s, preferably 10s, the first waiting time T3 and the fourth operating time T6 are set to 45-65s, preferably 55s, and a reasonable operating time is set to improve the cleaning efficiency. When the cleaning strength needs to be increased, the time for simultaneously working a plurality of ultrasonic vibration plate groups can be prolonged.
And step three, starting the PCB ultrasonic backwashing device, wherein each group of ultrasonic vibration plates work according to a set working time sequence.
In the present embodiment, fig. 5 is a schematic diagram illustrating the operation of the ultrasonic horn during the first operation time T1, fig. 6 is a schematic diagram illustrating the operation of the ultrasonic horn during the second operation time T2, and fig. 7 is a schematic diagram illustrating the operation of the ultrasonic horn during the third operation time T3.
With reference to fig. 4, 5, 6, and 7, after the first ultrasonic vibration plate group 2 and the fourth ultrasonic vibration plate group 5 operate for the first operating time T1, the first ultrasonic vibration plate group 2 and the fourth ultrasonic vibration plate group 5 continue to operate for the second operating time T2, after the first ultrasonic vibration plate group 2 and the fourth ultrasonic vibration plate group 5 operate for the first operating time T1, the second ultrasonic vibration plate group 3 and the third ultrasonic vibration plate group 4 start to operate for the third operating time T5 and the fourth operating time T6, and after the second ultrasonic vibration plate group 3 and the third ultrasonic vibration plate group 4 operate for the third operating time T5, the first ultrasonic vibration plate group 2 and the fourth ultrasonic vibration plate group 5 stop operating until the second ultrasonic vibration plate group 3 and the third ultrasonic vibration plate group 4 stop operating and then start. While the fifth ultrasonic horn group 6 is in an active state throughout the operation of the device.
In other embodiments, the ultrasonic vibration plates can be grouped in other forms, and are not limited to the grouping mode in the step one, and the number of the ultrasonic vibration plates and the positions of the ultrasonic vibration plates are not limited to the mode in the step one. The working time sequence of the ultrasonic vibration plate groups is not limited to work according to the time sequence set in the step two, the step two is only an optimal embodiment described, the time for the ultrasonic vibration plate groups to vibrate simultaneously can be effectively limited, and the cleaning effect on the PCB can be effectively ensured.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (7)
1. The utility model provides a control method of PCB ultrasonic wave backwashing device, is applied to the ultrasonic wave and backflushs the device, is equipped with a plurality of ultrasonic waves in its ultrasonic wave jar and shakes the board, the cross-section of ultrasonic wave jar is the rectangle, the three lateral wall of ultrasonic wave jar all sets up the ultrasonic wave shakes the board, its characterized in that, the method includes:
grouping the plurality of ultrasonic vibration plates to form a plurality of ultrasonic vibration plate groups, wherein grouping the plurality of ultrasonic vibration plates to form the plurality of ultrasonic vibration plate groups specifically comprises: setting the ultrasonic vibration plates on the two opposite side walls as a first ultrasonic vibration plate group and a second ultrasonic vibration plate group, setting the ultrasonic vibration plate adjacent to the first ultrasonic vibration plate group on a third side wall as a third ultrasonic vibration plate group, setting the ultrasonic vibration plate adjacent to the second ultrasonic vibration plate group as a fourth ultrasonic vibration plate group, and arranging a fifth ultrasonic vibration plate group between the third ultrasonic vibration plate group and the fourth ultrasonic vibration plate group;
the plurality of ultrasonic vibration plate groups work according to a set time sequence, and the time for the plurality of ultrasonic vibration plate groups to work simultaneously does not exceed a preset time, and the working of the plurality of ultrasonic vibration plate groups according to the set time sequence specifically comprises the following steps:
when the first ultrasonic vibration plate group and the fourth ultrasonic vibration plate group work, the second ultrasonic vibration plate group and the third ultrasonic vibration plate group wait, and the fifth ultrasonic vibration plate group always works;
and when the first ultrasonic vibration plate group and the fourth ultrasonic vibration plate group do not work, the second ultrasonic vibration plate group and the third ultrasonic vibration plate group start to work.
2. The method for controlling the ultrasonic back washing device of the PCB of claim 1, wherein the first ultrasonic vibrator plate group and the fourth ultrasonic vibrator plate group are operated according to a first timing sequence, and the first timing sequence comprises a first operating time T1, a second operating time T2 and a first waiting time T3 which are arranged at intervals in sequence.
3. The method for controlling the ultrasonic PCB backwashing device of claim 2, wherein the second ultrasonic vibrator panel group and the third ultrasonic vibrator panel group operate according to a second time sequence, the second time sequence comprises a second waiting time T4, a third working time T5 and a fourth working time T6 which are sequentially arranged at intervals, the second waiting time T4 is arranged corresponding to the first working time T1, the third working time T5 is arranged corresponding to the second working time T2, and the fourth working time T6 is arranged corresponding to the first waiting time T3.
4. The method for controlling the ultrasonic PCB backwashing device of claim 3, wherein the first operating time T1 and the second waiting time T4 are set to 45-65s, the second operating time T2 and the third operating time T5 are set to 8-12s, and the first waiting time T3 and the fourth operating time T6 are set to 45-65 s.
5. The control method of the ultrasonic PCB backflushing device according to claim 4, wherein the ultrasonic vibration plates are grouped by inputting information through a human-computer interface.
6. The method for controlling the ultrasonic back washing device of the PCB of claim 5, wherein the step of inputting information through the human-machine interface, after grouping the ultrasonic vibration plates, further comprises the steps of:
and inputting information through a human-computer interface, and setting working time sequence for each group of ultrasonic vibration plates.
7. An ultrasonic back washing device for a PCB, characterized in that the control method of the ultrasonic back washing device for the PCB according to any one of claims 1 to 6 is adopted.
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