CN110837723A - Component packaging adding method, device and equipment - Google Patents
Component packaging adding method, device and equipment Download PDFInfo
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- 238000010586 diagram Methods 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
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- 238000012545 processing Methods 0.000 description 2
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Abstract
The embodiment of the application discloses a component packaging adding method, which comprises the following steps: acquiring required packaging characteristic information of a first component, and generating a required packaging identification code of the first component according to the required packaging characteristic information of the first component; comparing the required packaging identification code with a packaging identification code in a component packaging library, wherein the component packaging library comprises a plurality of component packages and packaging identification codes corresponding to packaging characteristic information included by each component package; and when the target packaging identification code which is the same as the required packaging identification code is found in the component packaging library, adding the target component package corresponding to the target packaging identification code to the packaging position corresponding to the first component in the PCB layout. According to the embodiment of the application, the component package is searched through the required package identification code, and the component package is accurately added.
Description
Technical Field
The application relates to the field of electronic circuit hardware design, in particular to a component packaging adding method, device and equipment.
Background
With the development of science and technology, electronic circuits cannot be opened in our lives, and both the traditional television refrigerators and the current very popular intelligent robot field need to be realized by carrying a Printed Circuit Board (PCB), and the PCB is a link for connecting design and products.
In the prior art, the method for adding the packages to the components in the hardware design circuit is to manually input the package names of the components, the package names of the components are uncertain, the names of the components packaged in a package library are guessed mainly by experience and tacit between other designers, and then fuzzy search is carried out in the component package library according to the package names of the components, so that the packages of the components are added to the PCB, and the scheme for adding the components is not accurate enough.
Disclosure of Invention
Based on the problems, the application provides a component packaging adding method, device and equipment, the requirement packaging characteristic information of a component is generated into an identification code, the component packaging is added through comparison between the identification code of the requirement packaging characteristic information and the packaging identification code in a packaging library, the component packaging can be accurately added, the hardware research and development work efficiency is greatly improved, and the later maintenance of the component packaging library is facilitated.
In a first aspect, an embodiment of the present application provides a method for adding a component package, where the method includes:
acquiring required packaging characteristic information of a first component, and generating a required packaging identification code of the first component according to the required packaging characteristic information of the first component;
comparing the required packaging identification code with a packaging identification code in a component packaging library, wherein the component packaging library comprises a plurality of component packages and packaging identification codes corresponding to packaging characteristic information included by each component package;
and when the target packaging identification code which is the same as the required packaging identification code is found in the component packaging library, adding the target component package corresponding to the target packaging identification code to the packaging position corresponding to the first component in the PCB layout.
In a possible implementation manner, the component package library further includes a name of each component package corresponding to each package identification code;
adding the target component package corresponding to the target package identification code to the package position corresponding to the first component in the PCB layout comprises the following steps:
acquiring the name of a target component package corresponding to a target package identification code which is the same as the required package identification code in the component package library;
and searching the target component package in the component package library according to the component package name corresponding to the target package identification code, and adding the target component package to the package position corresponding to the first component in the Printed Circuit Board (PCB).
Optionally, the required package characteristic information includes any one or more of a package type, a number of pins included in the package, a pitch between the pins, a length of the pins, and a width of the pins.
In a possible embodiment, the obtaining the required package characteristic information of the first component includes:
and acquiring a package characteristic information description text of the first component, and extracting the required characteristic information of the first component from the package characteristic information description text according to a preset package characteristic format.
In a possible embodiment, the obtaining the required package characteristic information of the first component includes:
and acquiring a device picture of the first component, performing feature recognition on the device picture of the first component to obtain the device feature of the first component, and determining the required feature information of the first component according to the device feature of the first component.
Optionally, the method further includes:
when the target packaging identification code which is the same as the required packaging identification code cannot be searched in the component packaging library, generating the first component package according to the required packaging characteristic information of the first component;
and adding the requirement package identification code and the first component package associated with the requirement package identification code to the component package library.
In a possible embodiment, the obtaining the required package characteristic information of the first component comprises:
and generating packaging identification codes corresponding to the component packages in the component packaging library according to the packaging characteristic information contained in all the component packages in the component packaging library.
In a second aspect, an embodiment of the present application provides an adding apparatus for a component package, where the apparatus includes:
the acquisition module is used for acquiring the required packaging characteristic information of the first component;
the generating module is used for generating a required packaging identification code of the first component according to the required packaging characteristic information of the first component;
the comparison module is used for comparing the required packaging identification code generated by the generation module with the packaging identification code in a component packaging library, and the component packaging library comprises a plurality of component packages and packaging identification codes corresponding to the packaging characteristic information of each component package;
and the adding module is used for adding the target component package corresponding to the target package identification code to the package position corresponding to the first component in the Printed Circuit Board (PCB) when the target package identification code which is the same as the required package identification code is found in the component package library.
In a possible implementation manner, the component package library further includes a name of each component package corresponding to each package identification code;
the obtaining module is further configured to obtain a name of a target component package corresponding to a target package identification code in the component package library, the target package identification code being the same as the required package identification code;
the adding module is further used for searching the target component package in the component package library according to the name of the component package corresponding to the target package identification code, and adding the target component package to the package position corresponding to the first component in the Printed Circuit Board (PCB).
Optionally, the required package characteristic information includes any one or more of a package type, a number of pins included in the package, a pitch between the pins, a length of the pins, and a width of the pins.
In a possible embodiment, the obtaining module is further configured to obtain a package feature information description text of the first component, and extract the required feature information of the first component from the package feature information description text according to a preset package feature format.
In a possible embodiment, the obtaining module is further configured to obtain a device picture of the first component, perform feature recognition on the device picture of the first component to obtain a device feature of the first component, and determine the required feature information of the first component according to the device feature of the first component.
Optionally, the generating module is further configured to generate a first component package according to the required package feature information of the first component when the target package identification code that is the same as the required package identification code is not found in the component package library;
the adding module is further used for adding the required packaging identification code and the first component package associated with the required packaging identification code to the component packaging library.
In a possible embodiment, the generating module is further configured to generate package identification codes corresponding to the component packages in the component package library according to package characteristic information included in all the component packages in the component package library.
In a third aspect, an embodiment of the present application provides a device for adding a component package, where the device includes a transceiver, a processor, and a memory, where the processor is configured to execute a computer program stored in the memory, and implement the method in the foregoing aspects and any possible embodiment thereof.
In a fourth aspect, the present application provides a computer-readable storage medium having stored therein instructions, which, when executed on a computer, cause the computer to perform the method described in the above aspects and any possible embodiment thereof.
The application provides a component packaging adding method, a component packaging adding device and a component packaging adding device, wherein required packaging characteristic information of a first component is obtained, a required packaging identification code is generated according to the required packaging characteristic information of the first component, and when a target packaging identification code which is the same as the required packaging characteristic identification code is found in a component packaging library through comparison between the required packaging identification code and a packaging identification code in a packaging library, a target component package corresponding to the target packaging identification code is added to a packaging position corresponding to the first component in a PCB layout. By implementing the method and the device, the component package can be searched through the required package identification code, and the component package can be accurately added.
Drawings
Fig. 1 is a schematic diagram of a component object and a package provided in an embodiment of the present application;
fig. 2 is a schematic flow chart of an adding method of a component package according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram of human-computer interaction of an adding method for component packaging according to an embodiment of the present disclosure;
fig. 4 is a schematic view of an adding apparatus for a component package according to an embodiment of the present disclosure;
fig. 5 is a schematic diagram of an adding apparatus for a component package according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
For a better understanding of the present application, a component package is described in detail below with reference to the accompanying drawings. Referring to fig. 1, fig. 1 is a schematic diagram of a component entity and a package provided in an embodiment of the present application. As shown in fig. 1, the physical resistor placed on the PCB is shown as 1a, the representation on the PCB layout of the PCB is shown as 1b, the PCB is a circuit board processed according to the PCB layout, it can be understood that the PCB layout is a design document of a developer, the PCB is a product manufactured by a PCB manufacturer according to the PCB layout, the design trace and the component package of the PCB layout are printed on a board whose surface is entirely copper, the copper layer of the non-circuit and the non-component package part is etched away by chemical reaction, the copper wire is used to replace the connection wire in the PCB layout, the pad is used to replace the pin of the component, the pin connection wire is also copper, the pin connection wire is embodied by leading out the copper wire from the pad, the black filling parts of 1 and 2 in 1b respectively represent two pins of the resistor 1a, the resistor 1a is attached to the printed position of 1b in the PCB, the sticking mode is that the resistor 1a is fixed through soldering tin, the connection between the resistor pin and the PCB pad is realized through the soldering tin, and the connection between the pin of the resistor 1a and other components is realized. Therefore, the component packaging is an important representation way for placing components in the circuit diagram connecting line. As shown in fig. 1c, 1c is a real-object diagram of an integrated chip with 8 pins, the representation form of a PCB layout is shown as 1d, in the process of placing components on a PCB, 1c is placed at the position where the PCB represents 1d, the pins of the integrated chip 1c have a sequence, and the functions of each pin are different, so that the pins of the component package 1d also have a pin sequence and are consistent with the pin sequence of 1c, the integrated chip of 1c can have another component package form, that is, the same chip model can have different package forms, which component package is specifically determined by the specifically used chip material, as shown in fig. 1e, 1e is a chip of a plug-in, and the corresponding component package is 1 f. Therefore, the component packaging can be understood as a link for converting a circuit design into a product, the component packaging determines the position of the actual component placed on the PCB and realizes the connection between pins of the component, and therefore how to accurately add the component packaging is very important for the design and application of an electronic circuit.
In the prior art, the method for adding the package to each component in the hardware design circuit is to manually input the package name of the component, but the package name of the component is uncertain, and the name of the component packaged in the package library is guessed mainly by experience and tacit with other designers, and then fuzzy search is performed in the component package library according to the package name of the component, so that the package of the component is added to the PCB, and the scheme for searching for adding the package of the component is not accurate enough. Based on the not enough of prior art, this application utilizes the encapsulation characteristic information of demand encapsulation identification code record first component encapsulation, through in the components and parts encapsulation storehouse seek with the same target encapsulation identification code of demand encapsulation identification code will the target components and parts encapsulation that target encapsulation identification code corresponds adds to printed circuit board PCB territory in the encapsulation position that first component corresponds. The identification code of the embodiment of the present application includes, but is not limited to, a two-dimensional code, a barcode, and other forms of identification codes. In an optional embodiment, the adding device of the component package may communicate with a server, for example, the component package library is stored in the server, the adding device of the component package downloads the latest version of the component package library to the adding device of the component package through communicating with the server, and searches for a target package identification code identical to the required package identification code through the component package library in the adding device of the component package; for another example, the adding device of the component package uploads the required package identification code to the server through communication with the server, a component package library in the server searches for a target package identification code identical to the required package identification code, and a target component package corresponding to the target package identification code is downloaded to the adding device of the component package, so that the adding device of the component package adds the target component package corresponding to the target package identification code to a package position corresponding to the first component in a Printed Circuit Board (PCB) layout. In order to explain the technical solutions described in the present application, the following description is made by referring to the drawings and specific examples.
Referring to fig. 2, fig. 2 is a schematic flow chart of an adding method of a component package according to an embodiment of the present disclosure. As shown in fig. 2, the method includes:
s200, acquiring the required packaging characteristic information of the first component, and generating the required packaging identification code of the first component according to the required packaging characteristic information of the first component. Specifically, the required package characteristic information includes any one or more of a package type, a number of pins included in the package, a pitch between the pins, a length of the pins, and a width of the pins. Exemplary package types include SOP (small outline package), SSOP (shrink small outline package), SOT (small outline transistor), DIP (dual inline-pin package), and the like. And the component packaging adding device generates a required packaging identification code of the first component according to the required packaging characteristic information of the first component, and optionally, the required packaging identification code records the required characteristic information of the first component by 0 and 1 in a binary system.
In a possible embodiment, before acquiring the required package characteristic information of the first component in step S200, the method includes: and the adding device of the component package generates the package identification codes corresponding to the component packages in the component package library according to the package characteristic information contained in all the component packages in the component package library.
S201, the required packaging identification code is compared with a packaging identification code in a component packaging library, and the component packaging library comprises a plurality of component packages and packaging identification codes corresponding to packaging characteristic information included by each component package. Specifically, the requirement packaging identification code is acquired by step S200, the requirement packaging identification code contains the requirement packaging characteristic information of the first meta-device, the packaging identification code in the component packaging library contains the packaging characteristic information corresponding to each component, and the adding device for component packaging compares the requirement packaging identification code with all the packaging identification codes in the component packaging library, and searches the component packaging of the first meta-device in the component packaging library according to the requirement packaging characteristic information of the first meta-device. In a possible embodiment, the device for adding the component package may download the component package library of the latest version from a server in which the component package library is stored, and compare the required package identification code with all the package identification codes in the component package library. In another possible embodiment, the adding device of the component package uploads the required package identification code to the server through communication with the server, and a component package library in the server searches for a target package identification code identical to the required package identification code. It can be understood that a plurality of component packages included in the component package library can be placed in one file, and a package identification code corresponding to package characteristic information included in each component package can be placed in another file, so that file management of the package identification code and the component is facilitated.
S202, when the target packaging identification code which is the same as the required packaging identification code is found in the component packaging library, the target component packaging corresponding to the target packaging identification code is added to the packaging position corresponding to the first component in the PCB layout. Specifically, in step S201, the adding device of the component package searches for the component package of the first component in the component package library according to the required package feature information of the first component, determines that the component package library includes the target component package of the first component when the component package library finds the target package identification code identical to the required package identification code, and adds the target component package corresponding to the target package identification code to the package position corresponding to the first component in the PCB layout.
In a possible implementation manner, the component package library further includes a name of each component package corresponding to each package identification code; acquiring the name of a target component package corresponding to a target package identification code which is the same as the required package identification code in the component package library; and searching the target component package in the component package library according to the component package name corresponding to the target package identification code, and adding the target component package to the package position corresponding to the first component in the Printed Circuit Board (PCB). Specifically, the component package library includes a plurality of component packages, each of the plurality of component packages includes a respective name, the component package library further includes a package identification code corresponding to the package characteristic information of each component package, and the component package adding device further obtains the name of the target component package corresponding to the target package identification code when finding the target package identification code identical to the required package identification code in the component package library, so as to find the target component package in the component package library according to the name of the component package corresponding to the target package identification code, and add the target component package to the package position corresponding to the first component in the printed circuit board PCB, so that the embodiment is implemented, the accurate component package addition can be realized, and the implementation is simple and easy, the operation is convenient.
In a possible embodiment, when the target package identification code which is the same as the required package identification code is not found in the component package library, generating a first component package according to the required package characteristic information of the first component; and adding the requirement package identification code and the first component package associated with the requirement package identification code to the component package library. Specifically, when the adding device of the component package cannot find the target package identification code which is the same as the required package identification code in the component package library, it indicates that the component package of the first component does not exist in the existing component package library, therefore, the adding device of the component package can generate the first component package according to the requirement package characteristic information of the first component, add the requirement package identification code and the first component package associated with the requirement package identification code to the component package library, and further, the adding device for the component packaging can upload the completed component packaging library to a server to be used as a component packaging library of the latest version for storage and/or is convenient for other personnel in project development to download the component packaging library for use.
In the embodiment, the target packaging identification code which is the same as the required packaging identification code of the first component is searched in the packaging identification code of the component packaging library by comparing the packaging identification codes corresponding to the packaging characteristic information of the components, and the target component packaging corresponding to the target packaging identification code is added to the packaging position corresponding to the first component in the PCB layout, so that the accurate addition of the component packaging is realized.
In order to better understand the embodiments of the present application, the present application is further described below with reference to a human-computer interaction diagram.
Referring to fig. 3, fig. 3 is a schematic diagram of human-computer interaction of an adding method for a component package according to an embodiment of the present application. As shown in fig. 3, the method for adding the component package is specifically implemented as follows:
in step S200 of the embodiment described above with reference to fig. 2, the component packaging adding apparatus obtains the required packaging characteristic information of the first component, and there may be multiple possible implementation manners to obtain the required packaging characteristic information of the first component. In a possible implementation manner, as shown in fig. 3a, the component packaging adding apparatus obtains a packaging feature information description text of the first component, and extracts required feature information of the first component from the packaging feature information description text according to a preset packaging feature format, as shown in fig. 3 c. Illustratively, the package characteristic information description text provides "NE 555 (a chip model) with an SSOP ceramic micro-dip-molded package and 8 pins, the length and width is 1mm × 2mm, and the pin pitch is 0.65 mm", the preset package format is "_ pins, the package type is _, the pin length is _ mm, the width is _ mm, and the pin pitch is _ mm", the format of "NE 555 with an SSOP ceramic micro-dip-molded package and 8 pins, the length and width is 1mm × 2mm, and the pin pitch is 0.65 mm" is used for extracting package characteristic information, such as the pin number, the package type, the pin length, the pin width, and the pin pitch. Thus, the package characteristic information of the first component, namely 8 pins, is obtained, the package type is SSOP, the length of each pin is 1mm, the width of each pin is 2mm, and the pin interval is 0.65 mm. Optionally, the package feature information description text may be a data manual of the first component, the data manual is an instruction manual of the first component, the data manual includes functional features, an operation method, and a package instruction of the first component, the required feature information of the first component is extracted from the data manual of the first component according to a preset package feature format, the package feature information of the component may be acquired under the condition that time for reading the data manual is saved, and design efficiency of the electronic circuit is further improved.
In another possible implementation manner, as shown in fig. 3b, the adding apparatus for component packaging obtains a device picture of the first component, performs feature recognition on the device picture of the first component to obtain a device feature of the first component, and determines that the required feature information of the first component is shown in fig. 3c according to the device feature of the first component. Specifically, the adding device for component packaging obtains a device picture of the first component, the device picture of the component is a real object picture of the first component, and performs feature recognition on the device picture of the first component to obtain device features of the first component, the device features include packaging feature information of the first component, such as pin number, packaging type, pin length, pin width, and pin pitch, so that the adding device for component packaging can determine required feature information of the first component according to the device features of the first component. For example, if 3b is a real object diagram of an NE555 chip, the device package adding apparatus performs feature recognition on the device picture of the first component to obtain the device feature of the first component, where the device feature of the first component includes package feature information "8 pins" of the first component, the package type is SSOP, the length of each pin is 1mm, the width of each pin is 2mm, and the pin pitch is 0.65 mm. By implementing the embodiment, when the device picture with the first component is provided, the packaging characteristic information of the first component can be rapidly acquired.
And generating a required package identification code of the first component as shown in 3d according to the required package characteristic information of the first component as shown in 3 c.
In step S201 of the embodiment described above with reference to fig. 2, the required package identification code is compared with the package identification codes in the component package library, where the component package library includes a plurality of component packages and package identification codes corresponding to package characteristic information included in each component package. Specifically, the required packaging identification code is shown as 3d, the component packaging library is shown as 3e, the component packaging library 3e comprises packaging identification codes corresponding to the packaging characteristic information of the components and the packaging characteristic information of each component, and the required packaging identification code 3d searches for a target packaging identification code which is the same as the required packaging identification code 3d in the component packaging library 3 e. It can be understood that a plurality of component packages included in the component package library can be placed in one file, and a package identification code corresponding to package characteristic information included in each component package can be placed in another file, so that file management of the package identification code and the component is facilitated.
In step S202 of the embodiment described above with reference to fig. 2, when the target package identification code identical to the required package identification code is found in the component package library, the target component package corresponding to the target package identification code is added to the package position corresponding to the first component in the PCB layout. Specifically, when the component package adding device finds the target package identification code d identical to the required package identification code 3d in the component package library 3e, the target component package corresponding to the target package identification code d is added to the package position corresponding to the first component in the printed circuit board PCB layout, so that the effect shown in fig. 3f is achieved. If the target packaging identification code which is the same as the required packaging identification code cannot be searched in the component packaging library, generating the first component package according to the required packaging characteristic information of the first component; and adding the required packaging identification code and the first component package associated with the required packaging identification code into the component packaging library 3e to perfect the component packaging library.
According to the implementation of the embodiment, the required packaging characteristic information of the first component can be acquired through the packaging characteristic information description text of the first component or the component picture of the first component, the efficiency of electronic design is further improved, then the required packaging identification code is generated according to the required packaging characteristic information of the first component, through comparison between the required packaging identification code and the packaging identification code in the packaging library, the target packaging identification code which is the same as the required packaging characteristic identification code is searched in the component packaging library, the target component package corresponding to the target packaging identification code is added to the packaging position corresponding to the first component in the PCB layout, the component package is searched through the required packaging identification code, and accurate component package addition is achieved.
Referring to fig. 4, fig. 4 is a schematic view of an adding apparatus for a component package according to an embodiment of the present disclosure. As shown in fig. 4, the adding apparatus 40 for a component package includes:
an obtaining module 400, configured to obtain required package characteristic information of a first component;
a generating module 401, configured to generate a required package identification code of the first component according to the required package characteristic information of the first component;
a comparison module 402, configured to compare the required package identifier generated by the generation module 401 with package identifiers in a component package library, where the component package library includes a plurality of component packages and package identifiers corresponding to package feature information included in each component package;
an adding module 403, configured to add a target component package corresponding to the target package identification code to a package position corresponding to the first component in the printed circuit board PCB when the target package identification code identical to the required package identification code is found in the component package library.
In a possible implementation manner, the component package library further includes a name of each component package corresponding to each package identification code;
the obtaining module 400 is further configured to obtain a name of a target component package corresponding to a target package identification code in the component package library, where the target package identification code is the same as the required package identification code;
the adding module 403 is further configured to search the target component package in the component package library according to the name of the component package corresponding to the target package identification code, and add the target component package to the package position corresponding to the first component in the printed circuit board PCB.
Optionally, the required package characteristic information includes any one or more of a package type, a number of pins included in the package, a pitch between the pins, a length of the pins, and a width of the pins.
In a possible embodiment, the obtaining module 400 is further configured to obtain a package feature information description text of the first component, and extract the required feature information of the first component from the package feature information description text according to a preset package feature format.
In a possible embodiment, the obtaining module 400 is further configured to obtain a device picture of the first component, perform feature recognition on the device picture of the first component to obtain a device feature of the first component, and further determine the required feature information of the first component according to the device feature of the first component.
Optionally, the generating module 401 is further configured to generate the first component package according to the required package feature information of the first component when the target package identification code that is the same as the required package identification code is not found in the component package library;
the adding module 403 is further configured to add the required package identification code and the first component package associated with the required package identification code to the component package library.
In a possible embodiment, the generating module 401 is further configured to generate package identification codes corresponding to the component packages in the component package library according to package characteristic information included in all the component packages in the component package library.
In the embodiment, the target packaging identification code which is the same as the required packaging identification code of the first component is searched in the packaging identification code of the component packaging library by comparing the packaging identification codes corresponding to the packaging characteristic information of the components, and the target component packaging corresponding to the target packaging identification code is added to the packaging position corresponding to the first component in the PCB layout, so that the accurate addition of the component packaging is realized.
Referring to fig. 5, fig. 5 is a schematic diagram of an adding apparatus for a component package according to an embodiment of the present application. As shown in fig. 5, the component package adding apparatus 50 includes a transceiver 500, a processor 501, and a memory 502, wherein:
the transceiver 500 is configured to receive required package characteristic information of the first component, such as a package type, a number of pins included in a package, a pitch between the pins, a length of the pins, and a width of the pins, and optionally, the transceiver 500 further receives a package characteristic information description text of the first component or a device picture of the first component. Illustratively, the processor 501 may be a Central Processing Unit (CPU), and the processor may be other general-purpose processors, Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), field-programmable gate arrays (FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, and the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory 502 stores instructions, and it is understood that the memory 502 stores a plurality of component packages included in the component package library and package identification codes corresponding to package characteristic information included in each component package. Illustratively, the memory 502 may include both read-only memory and random-access memory, and provides instructions and data to the processor 501 and the transceiver 500. A portion of the memory 502 may also include non-volatile random access memory. For example, memory 502 may also store device type information
The processor 501 is configured to execute the computer program stored in the memory to implement any one of the possible embodiments described above.
In a specific implementation, the electronic device may execute, through each built-in functional module, the implementation manners provided in the steps in fig. 1 to fig. 4, which may be specifically referred to in the implementation manners provided in the steps in fig. 1 to fig. 4, and details are not repeated here again
In the embodiment, the target packaging identification code which is the same as the required packaging identification code of the first component is searched in the packaging identification code of the component packaging library by comparing the packaging identification codes corresponding to the packaging characteristic information of the components, and the target component packaging corresponding to the target packaging identification code is added to the packaging position corresponding to the first component in the PCB layout, so that the accurate addition of the component packaging is realized.
The present application provides a computer-readable storage medium having stored therein instructions, which when executed on a computer, cause the computer to perform any one of the possible embodiments described above.
It should be noted that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
According to the embodiment of the application, the demand packaging characteristic information of the first component is acquired, the demand packaging identification code is generated according to the demand packaging characteristic information of the first component, and when the target packaging identification code which is the same as the demand packaging characteristic identification code is found in the component packaging library through comparison between the demand packaging identification code and the packaging identification code in the packaging library, the target component packaging corresponding to the target packaging identification code is added to the packaging position corresponding to the first component in the PCB layout, so that accurate adding of component packaging is realized.
In the embodiments provided in the present application, it should be understood that the disclosed method, apparatus, and system may be implemented in other ways. The above-described embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, all the functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may be separately regarded as one unit, or two or more units may be integrated into one unit; the integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
Those of ordinary skill in the art will understand that: all or part of the steps for implementing the method embodiments may be implemented by hardware related to program instructions, and the program may be stored in a computer readable storage medium, and when executed, the program performs the steps including the method embodiments; and the aforementioned storage medium includes: a mobile storage device, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
Alternatively, the integrated unit of the present invention may be stored in a computer-readable storage medium if it is implemented in the form of a software functional module and sold or used as a separate product. Based on such understanding, the technical solutions of the embodiments of the present invention may be essentially implemented or a part contributing to the prior art may be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the methods described in the embodiments of the present invention. And the aforementioned storage medium includes: a removable storage device, a ROM, a RAM, a magnetic or optical disk, or various other media that can store program code.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. An adding method of a component package, the method comprising:
acquiring required packaging characteristic information of a first component, and generating a required packaging identification code of the first component according to the required packaging characteristic information of the first component;
comparing the required packaging identification code with a packaging identification code in a component packaging library, wherein the component packaging library comprises a plurality of component packages and packaging identification codes corresponding to packaging characteristic information included by each component package;
and when the target packaging identification code which is the same as the required packaging identification code is found in the component packaging library, adding the target component package corresponding to the target packaging identification code to the packaging position corresponding to the first component in the PCB layout.
2. The method according to claim 1, wherein the component package library further includes a name of each component package corresponding to each package identification code;
adding the target component package corresponding to the target package identification code to the package position corresponding to the first component in the PCB layout comprises the following steps:
acquiring the name of a target component package corresponding to a target package identification code which is the same as the required package identification code in the component package library;
and searching the target component package in the component package library according to the component package name corresponding to the target package identification code, and adding the target component package to the package position corresponding to the first component in the Printed Circuit Board (PCB).
3. The method according to claim 1, wherein the required package characteristic information comprises any one or more of a package type, a number of pins included in a package, a pitch between the pins, a length of the pins, and a width of the pins.
4. The method of claim 1, wherein obtaining the required package characteristics information of the first component comprises:
and acquiring a package characteristic information description text of the first component, and extracting the required characteristic information of the first component from the package characteristic information description text according to a preset package characteristic format.
5. The method of claim 1, wherein obtaining the required package characteristics information of the first component comprises:
and acquiring a device picture of the first component, performing feature recognition on the device picture of the first component to obtain the device feature of the first component, and determining the required feature information of the first component according to the device feature of the first component.
6. The method of claim 1, further comprising:
when the target packaging identification code which is the same as the required packaging identification code cannot be searched in the component packaging library, generating a first component package according to the required packaging characteristic information of the first component;
and adding the requirement package identification code and the first component package associated with the requirement package identification code to the component package library.
7. The method of claim 1, wherein obtaining the required package characteristics information of the first component comprises:
and generating packaging identification codes corresponding to the component packages in the component packaging library according to the packaging characteristic information contained in all the component packages in the component packaging library.
8. An adding device for a component package, the device comprising:
the acquisition module is used for acquiring the required packaging characteristic information of the first component;
the generating module is used for generating a required packaging identification code of the first component according to the required packaging characteristic information of the first component;
the comparison module is used for comparing the required packaging identification code generated by the generation module with the packaging identification code in a component packaging library, and the component packaging library comprises a plurality of component packages and packaging identification codes corresponding to the packaging characteristic information of each component package;
and the adding module is used for adding the target component package corresponding to the target package identification code to the package position corresponding to the first component in the Printed Circuit Board (PCB) when the target package identification code which is the same as the required package identification code is found in the component package library.
9. An adding device for a component package, the device comprising a transceiver, a processor and a memory, wherein the processor is configured to execute a computer program stored in the memory to implement the steps of the method according to any one of claims 1 to 7.
10. A computer-readable storage medium having stored therein instructions which, when run on a computer, cause the computer to perform the steps of the method according to any one of claims 1 to 7.
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| CN201911008052.2A CN110837723A (en) | 2019-10-22 | 2019-10-22 | Component packaging adding method, device and equipment |
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| CN201911008052.2A CN110837723A (en) | 2019-10-22 | 2019-10-22 | Component packaging adding method, device and equipment |
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| CN117473941A (en) * | 2023-12-28 | 2024-01-30 | 广东美创希科技有限公司 | Drawing processing method and device, electronic equipment and storage medium |
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Application publication date: 20200225 |