CN110837285A

CN110837285A - Heat abstractor and data processing equipment

Info

Publication number: CN110837285A
Application number: CN201911069174.2A
Authority: CN
Inventors: 边柳坤; 折包军; 纪锦标
Original assignee: Xian Yep Telecommunication Technology Co Ltd
Current assignee: Xian Yep Telecommunication Technology Co Ltd
Priority date: 2019-11-05
Filing date: 2019-11-05
Publication date: 2020-02-25

Abstract

The invention provides a heat dissipation device and data processing equipment. Wherein the heat sink comprises a mounting member; the mounting piece is fixed with a fan set; the mounting piece is provided with a sliding part and a locking part, and the sliding part can be arranged on the case in a sliding manner along a first direction so as to drive the fan set to move to a preset position relative to the case; the locking part is used for fixing the mounting piece at a preset position of the case. According to the heat dissipation device and the data processing equipment provided by the invention, when the mainboard is replaced or the position of the mainboard is moved, the position of the mounting part can be moved through the sliding part, so that the fan set is closer to the mainboard, the heat dissipation effect of the mainboard is better, the heat dissipation device can adapt to various mainboards, the universality is high, meanwhile, the design of the air guide cover in the prior art can be cancelled or simplified, and the cost of the data processing equipment is reduced.

Description

Heat abstractor and data processing equipment

Technical Field

The invention relates to the technical field of heat dissipation of data processing equipment, in particular to a heat dissipation device and data processing equipment.

Background

A plurality of power devices are usually arranged in data processing devices such as servers or switches, the power devices emit a large amount of heat when performing data processing and operation, and the power devices need to be cooled in order to ensure that the power devices can continuously and efficiently operate.

At present, common server includes the box and fixes the fan group in the box, is provided with the mainboard in the space of fan group one side, and the fan group can blow out the wind current, and the wind current can blow to the mainboard to take away the hot-air around the mainboard, for the mainboard heat dissipation, make the mainboard can last high-efficient operation.

For different models, the installation position or the size of the mainboard are different, and in order to ensure that the mainboard can still keep a good heat dissipation effect, an air guide cover needs to be arranged between the fan set and the mainboard so as to guide the blown air flow to the mainboard.

Disclosure of Invention

The embodiment of the invention provides a heat dissipation device and data processing equipment, and aims to solve the problems that in the prior art, an air guide cover in a server is complex in structure, poor in universality and high in server cost.

An embodiment of the present invention provides a heat dissipation apparatus, including: a mounting member; a fan set is fixed on the mounting piece; the mounting piece is provided with a sliding part and a locking part, and the sliding part can be arranged on the case in a sliding manner along a first direction so as to drive the fan set to move to a preset position relative to the case; the locking part is used for fixing the mounting piece at a preset position of the case.

The heat dissipation device comprises a mounting piece, a fan group and a fan assembly, wherein the mounting piece comprises a first plate body extending along the first direction, and the first plate body is provided with a vent hole facing an air outlet surface of the fan group; the sliding part and the locking part are respectively arranged at two ends of the first plate body along a second direction, and the second direction is perpendicular to the first direction.

The heat dissipation device as described above, wherein the first plate body is connected to a first bending portion and a second bending portion connected to the first bending portion along one end of the second direction, the first bending portion, the second bending portion and the first plate body are enclosed to form a sliding slot, and the sliding slot is formed in the sliding portion.

The heat dissipation device as described above, wherein the locking portion includes at least one locking hole extending along the first direction, and a bolt for screwing with the chassis is disposed through each locking hole.

The heat dissipation device comprises a first plate body, a second plate body and a locking hole, wherein the first plate body is provided with a sliding part, the sliding part is arranged on the first plate body, the sliding part is arranged on the second plate body, the first plate body is provided with a sliding hole, and the sliding part is provided with a sliding hole.

The heat dissipating device as set forth above, wherein the second plate body has a protruding region protruding in the second direction toward the sliding portion, and the locking hole is provided on the protruding region.

The heat dissipation device comprises a first plate body, a second plate body and a fan set, wherein the first plate body is provided with a first bent part, the second plate body is provided with a second bent part, the first bent part is provided with a first bent part, and the second bent part is provided with a second bent part.

The heat dissipation device as described above, wherein two ends of the first plate body along the first direction extend out of two sides of the fan set.

The heat dissipation device further comprises a fan wall fixed in the chassis, a through hole is formed in the fan wall, the first plate is attached to the surface of the fan wall, and the sliding portion can slide along the edge of the fan wall.

The embodiment of the invention provides data processing equipment which comprises a case and a heat dissipation device, wherein the heat dissipation device is arranged in the case.

According to the heat dissipation device and the data processing equipment provided by the embodiment of the invention, the installation part is arranged; the mounting piece is fixed with a fan set; the mounting piece is provided with a sliding part and a locking part, and the sliding part can be arranged on the case in a sliding manner along a first direction so as to drive the fan set to move to a preset position relative to the case; the locking part is used for fixing the mounting piece at a preset position of the case. When changing the mainboard or removing the mainboard position, can remove the position of installed part through the sliding part for the fan assembly is closer from the mainboard, and the radiating effect of mainboard is better, and can adapt to multiple mainboard, and the commonality is high, still can cancel the wind scooper among the prior art simultaneously or simplify the design of wind scooper, has reduced data processing equipment's cost.

Drawings

The following detailed description of the present invention is provided in conjunction with the accompanying drawings, and it is to be understood that the detailed description set forth herein is merely illustrative and explanatory of the present invention and is not restrictive of the invention as claimed below.

FIG. 1 is a schematic diagram of an internal structure of a data processing apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of the heat dissipation device in FIG. 1;

FIG. 3 is a schematic view of the mounting member and the fan assembly of FIG. 2;

fig. 4 is a schematic view of the mounting member of fig. 2.

Description of reference numerals:

100: a heat sink;

110: a mounting member;

111: a sliding part;

112: a lock section;

1121: a locking hole;

1122: a bolt;

113: a first plate body;

1131: a vent hole;

1132: a blocking region;

114: a first bending portion;

115: a second bending portion;

116: a second plate body;

1161: a raised region;

117: a third bend portion;

120: a fan set;

130: a fan wall;

200: a chassis;

300: a first mainboard mounting area;

400: a second mainboard mounting area;

500: and a hard disk installation area.

Detailed Description

FIG. 1 is a schematic diagram of an internal structure of a data processing apparatus according to an embodiment of the present invention; FIG. 2 is a schematic structural diagram of the heat dissipation device in FIG. 1; FIG. 3 is a schematic view of the mounting member and the fan assembly of FIG. 2; fig. 4 is a schematic view of the mounting member of fig. 2.

Referring to fig. 1 to 4, the present embodiment provides a heat dissipation apparatus 100, including: a mounting member 110; a fan set 120 is fixed on the mounting member 110; the mounting member 110 is provided with a sliding portion 111 and a locking portion 112, the sliding portion 111 can be slidably disposed on the chassis 200 along a first direction to drive the fan set 120 to move to a preset position relative to the chassis 200; the locking portion 112 is used to fix the mounting member 110 at a predetermined position of the cabinet 200.

In particular, the heat dissipation device 100 may be used in an electronic device such as a data processing device that requires heat dissipation. The data processing device may be a server or a switch. For convenience of explanation, the server is explained below.

The server may include a case 200, and the heat sink 100 may be installed in the case 200, and referring to fig. 1, the heat sink 100 may substantially divide a space inside the case 200 into a left part and a right part, and the left side may be a hard disk installation area 500 in which a hard disk may be installed. The right side may be a motherboard mounting area in which a motherboard may be mounted. It is understood that the board body parallel to the hard disk mounting area 500 and the motherboard mounting area in fig. 1 may be the bottom board of the chassis 200, and the edge of the bottom board may be the side wall of the chassis 200. The top panel of the chassis 200 is hidden.

The heat dissipation device 100 may include a mounting member 110, and the mounting member 110 may be made of a material commonly known in the art, such as a metal material or a plastic material. The mounting member 110 may be a plate or block structure or the like.

The fan set 120 may be fixed on the mounting member 110, the fan set 120 may include at least one fan, the fan is fixed on the mounting member 110, and the fixing manner between the fan and the mounting member 110 may be various, for example, the fan may be screwed on the mounting member 110, or the fan may be fixed on the mounting member 110 by a flexible nail, which is convenient to detach and install. The fan set 120 may be used to form an air flow, for example, an air outlet surface of the fan set 120 may face the motherboard installation area, so as to form an air flow directed from the hard disk installation area 500 to the motherboard installation area. Of course, in other embodiments, the wind flow may also be directed from the motherboard area to the hard disk area 500.

The mounting member 110 is further provided with a sliding portion 111, and the sliding portion 111 can be slidably provided in the housing 200 along a first direction, which may be a vertical direction in fig. 1. The structure of the sliding part 111 may be set according to the structure of the housing 200, for example, the housing 200 is provided with a slide rail, and the sliding part 111 may be a slider sliding on the slide rail. Alternatively, the sliding part 111 may be a slide rail, and the housing 200 may be provided with a slider to realize relative sliding between the two.

The sliding portion 111 slides relative to the chassis 200, and can drive the fan set 120 to slide to a predetermined position. The preset position can be the position closest to the main board; that is, the center line of the fan group 120 in the left-right direction in fig. 1 may coincide with the center line of the motherboard mounting area, or the center line of the fan group 120 in the left-right direction in fig. 1 may be located closest to the center line of the motherboard mounting area.

The mounting member 110 is further provided with a locking portion 112, the locking portion 112 can fix the mounting member 110 after sliding at a preset position, the locking portion 112 can have various structures, for example, the locking portion 112 can be a slot, and the chassis 200 can be hinged with a claw, and after the heat dissipation device 100 moves to the preset position, the claw can be rotated to be engaged with the slot, so as to fix the mounting member 110 at the preset position.

Two motherboard mounting areas are shown in fig. 1, a first motherboard mounting area 300 in the solid line box and a second motherboard mounting area 400 in the dashed line box, and the heat sink 100 can be moved for different models of servers so that it is closest to the motherboard mounting areas. For example, in the first type of server, the motherboard is installed in the first motherboard installation area 300, the first motherboard installation area 300 is close to the side wall of the chassis 200, and the installation component 110 can be moved, so that the installation component 110 contacts with the side wall, at this time, the center line of the fan set 120 is closest to the center line of the first motherboard installation area 300, the airflow can be blown to the motherboard more intensively, and the heat dissipation effect of the motherboard is good.

In the second model of server, the motherboard is mounted in the second motherboard mounting area 400. At this time, if the mounting member 110 is still fixed at the position shown in fig. 1, only a portion of the airflow blown by the fan assembly 120 flows through the second motherboard mounting area 400, the heat dissipation effect of the motherboard is poor, and the airflow is wasted. At this time, the mounting member 110 may be moved downward from the position of fig. 1, so that the center line of the fan set 120 may coincide with or be closest to the center line of the second motherboard mounting area 400, thereby maximizing the heat dissipation effect of the motherboard in the second server model. Therefore, the case 200 and the heat dissipation device 100 can adapt to more motherboards in different installation positions, and the universality is high.

Of course, in this embodiment, the motherboards in different mounting positions are taken as an example for description, and for the change of the size of the motherboard, the mounting member 110 may still be moved so that the fan assembly 120 may move to the preset position closest to the motherboard mounting area, and the heat dissipation performance of the motherboard may also be improved.

In the existing server, because the position of the fan is fixed, in order to improve the universality of the chassis, a variable air guide cover needs to be designed, the structure is complex, the cost is high, and the structure of the air guide cover can be simplified or the air guide cover can be eliminated by arranging the movable heat dissipation device, so that the cost is low.

The heat dissipation device provided by the embodiment is provided with the mounting piece; the mounting piece is fixed with a fan set; the mounting piece is provided with a sliding part and a locking part, and the sliding part can be arranged on the case in a sliding manner along a first direction so as to drive the fan set to move to a preset position relative to the case; the locking part is used for fixing the mounting piece at a preset position of the case. When changing the mainboard or removing the mainboard position, can remove the position of installed part through the sliding part for the fan assembly is closer from the mainboard, and the radiating effect of mainboard is better, and can adapt to multiple mainboard, and the commonality is high, still can cancel the wind scooper among the prior art simultaneously or simplify the design of wind scooper, has reduced data processing equipment's cost.

In another embodiment, the mounting member 110 includes a first plate 113 extending along a first direction, and the first plate 113 is provided with a vent 1131 facing the air outlet surface of the fan set; the sliding portion 111 and the locking portion 112 are respectively disposed at both ends of the first plate 113 in a second direction perpendicular to the first direction.

Taking fig. 1 as an example, the second direction may be in a direction perpendicular to the paper. The fan group 120 may be mounted on the first plate 113. The plurality of fans in the fan group 120 may also be arranged in the first direction so that the wind flow may cover the surface of the main board.

In order to facilitate the blowing of the wind, the first plate 113 may be provided with a vent 1131, and the vent 1131 may be a circular hole or a fan-shaped hole, which may be one or more. Preferably, a plurality of ventilation holes 1131 may be formed at each fan corresponding position, so that the area of the opening surface of the first plate 113 may be reduced, and the strength of the mounting member 110 and the fixing effect of the fan may be improved.

The sliding portion 111 and the locking portion 112 may be respectively disposed at two ends of the first plate 113 along the second direction, for example, the sliding portion 111 may be slidably disposed on a top plate of the chassis 200, and the locking portion 112 may be fixed on a bottom plate of the chassis 200, so that the first plate 113 is fixed or connected along the upper and lower sides of the second direction, and the fixing effect of the fan set 120 is improved.

As an alternative of the sliding portion 111, a first bending portion 114 and a second bending portion 115 connected to the first bending portion 114 are connected to one end of the first plate 113 in the second direction, and the first bending portion 114, the second bending portion 115 and the first plate 113 are enclosed to form a sliding slot, and the sliding slot constitutes the sliding portion 111.

Specifically, the sliding portion 111 may be a sliding slot, a beam extending along the first direction or a mounting plate vertically disposed on the bottom plate may be disposed on the chassis 200, the sliding slot may be formed by bending the mounting member 110, the first bending portion 114 may be disposed at one end of the first plate 113, the first bending portion 114 may be disposed perpendicular to the first plate 113, and the second bending portion 114 may be disposed at one side of the first bending portion 114, so that the first bending portion 114, the second bending portion 115 and the first plate 113 enclose the sliding slot, and the sliding slot may be overlapped on the beam or the mounting plate, thereby achieving sliding.

It is understood that both the first and second

bent portions

114 and 115 may extend from one end to the other end of the first plate body 113 in the first direction. Alternatively, the first and second

bent portions

114 and 115 may include a plurality of segments extending in the first direction.

As an alternative to the locking portion 112, the locking portion 112 includes at least one locking hole 1121 extending along a first direction, and a bolt 1122 for screwing with the chassis 200 is inserted through each locking hole 1121.

Specifically, the locking hole 1121 may be a long hole, which may also extend in the first direction. A bolt 1122 may be inserted into the locking hole, a threaded hole may be formed in the bottom plate of the housing 200, and the bolt 1122 may be screwed into the threaded hole, so as to fix the mounting member 110 to the housing 200. When the fan set 120 needs to be moved, the bolt 1122 can be loosened to move the mounting member 110, and at this time, the bolt 1122 can move in the locking hole 1121 along the first direction relative to the locking hole 1121, so that the structure is simple and easy to implement. In addition, the locking hole 1121 may be plural, and the locking holes 1121 may be spaced apart in the first direction to increase the fastening degree of the heat sink.

Optionally, one end of the first plate 113 facing away from the sliding portion 111 is further provided with a second plate 116, the second plate 116 is perpendicular to the first plate 113, and two ends of the second plate 116 along the first direction are respectively provided with a locking hole 1121.

The second plate 116 may be parallel to the bottom plate of the chassis 200, and the first plate 113 may be integrally formed with the second plate 116, or may be connected by welding, screwing, or the like. Two locking holes 1121 may be formed in the second plate 116, and may be respectively located at two sides of the fan assembly 120, so as to improve the fixing effect.

Alternatively, the second plate body 116 has a protruding region 1161 protruding in the second direction toward the sliding portion 111, the locking hole 1121 is provided on the protruding region 1161, and the protruding region 1161 may be processed by punching or the like, so that the strength of the second plate body 116 may be improved.

In another embodiment, a third bending portion 117 is further disposed on a side of the second plate 116 facing away from the first plate 113, and the fan set 120 is fixed between the first plate 113 and the third bending portion 117. The second plate body 116, the first plate body 113 and the third bent portion 117 may enclose a receiving cavity for receiving the fan set 120.

The third bent portion 117 may have a small height in the second direction so as to block the air inlet holes of the fan group 120.

One side of the fan set 120 may be fixed to the first board 113, and the other side may be fixed to the third bending portion 117, so that both sides of the fan set 120 have a fixed connection, and the firmness of the fan set 120 is improved.

In another embodiment, two ends of the first board 113 along the first direction extend out of two sides of the fan assembly 120, so that an impermeable blocking area 1132 is formed on two sides of the fan assembly 120, respectively, and the blocking area 1132 may be used for blocking wind flow, preventing wind flow from flowing back, and improving heat dissipation effect.

Based on the above embodiments, the heat dissipation device 100 further includes a fan wall 130, the fan wall 130 is fixed in the chassis 200, a through hole is formed in the fan wall 130, the first board 113 is attached to a surface of the fan wall 130, and the sliding portion 111 can slide along an edge of the fan wall 130.

Specifically, the fan wall 130 may be fixed in the cabinet 200, extend in a first direction, and have both ends connected to the sidewalls of the cabinet 200. The fan wall 130 serves to partition the inside of the cabinet 200 to prevent the wind from flowing backward.

The fan wall 130 may be provided with a through hole, and the through hole may extend in the first direction, so that the air outlet surface of the entire fan set 120 may be exposed.

The sliding slot may overlap an end of the fan wall 130 in the second direction, for example, the first bending portion 114 is disposed between the top plate of the chassis 200 and the fan wall 130.

In order to ensure that the airflow of the fan assembly 120 can completely pass through the fan wall 130, the size of the fan assembly 120 along the first direction is smaller than the size of the through hole along the first direction, the blocking area 1132 can be used for blocking redundant partial through holes, the airflow blown into the motherboard installation area is prevented from flowing back to the hard disk installation area 500 through the through hole, and the heat dissipation effect is improved.

The present embodiment provides a data processing apparatus, which includes a chassis 200 and a heat dissipation device 100, wherein the heat dissipation device 100 is installed in the chassis 200.

Specifically, the data processing device may be an electronic device or the like that requires heat dissipation, such as a server or a switch. The chassis 200 may be a chassis structure commonly known in the art, and may have a rectangular structure, and the heat dissipation device 100 may be installed in the chassis 200.

The structure and function of the heat dissipation device 100 are the same as those of the above embodiments, and reference may be made to the above embodiments for details, which are not described herein again.

The data processing equipment provided by the embodiment is characterized in that a mounting part is arranged; the mounting piece is fixed with a fan set; the mounting piece is provided with a sliding part and a locking part, and the sliding part can be arranged on the case in a sliding manner along a first direction so as to drive the fan set to move to a preset position relative to the case; the locking part is used for fixing the mounting piece at a preset position of the case. When changing the mainboard or removing the mainboard position, can remove the position of installed part through the sliding part for the fan assembly is closer from the mainboard, and the radiating effect of mainboard is better, and can adapt to multiple mainboard, and the commonality is high, still can cancel the wind scooper among the prior art simultaneously or simplify the design of wind scooper, has reduced data processing equipment's cost.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipating device, comprising: a mounting member;

a fan set is fixed on the mounting piece; the mounting piece is provided with a sliding part and a locking part, and the sliding part can be arranged on the case in a sliding manner along a first direction so as to drive the fan set to move to a preset position relative to the case; the locking part is used for fixing the mounting piece at a preset position of the case.

2. The heat dissipation device of claim 1, wherein the mounting member comprises a first plate extending along the first direction, and the first plate is provided with a vent hole facing the air outlet surface of the fan set;

the sliding part and the locking part are respectively arranged at two ends of the first plate body along a second direction, and the second direction is perpendicular to the first direction.

3. The heat dissipating device of claim 2,

the first plate body is followed the one end of second direction be connected with first bending portion and with the second bending portion that first bending portion is connected, first bending portion with the second bending portion and first plate body encloses and establishes into the spout, the spout constitutes the sliding part.

4. The heat dissipating device of claim 2,

the locking part comprises at least one locking hole extending along the first direction, and a bolt used for being in threaded connection with the case penetrates through each locking hole.

5. The heat dissipating device of claim 4,

the first plate body deviates from the one end of sliding part still is provided with the second plate body, the second plate body with the first plate body sets up perpendicularly, just the second plate body is followed be provided with one respectively at first direction both ends the locking hole.

6. The heat dissipating device of claim 5, wherein the second plate has a protruding region protruding in the second direction toward a direction close to the sliding portion, and the locking hole is provided on the protruding region.

7. The heat dissipating device of claim 5, wherein a third bent portion is further disposed on a side of the second board body facing away from the first board body, and the fan assembly is fixed between the first board body and the third bent portion.

8. The heat dissipating device of any one of claims 2-7, wherein two ends of the first plate body along the first direction extend out of two sides of the fan set.

9. The heat dissipating device as claimed in any one of claims 2 to 7, further comprising a fan wall fixed in the chassis, wherein the fan wall has a through hole formed therein, the first plate is attached to a surface of the fan wall, and the sliding portion is capable of sliding along an edge of the fan wall.

10. A data processing apparatus comprising a chassis and the heat sink of any of claims 1-9, the heat sink being mounted within the chassis.