CN110828382A - Metal glass packaging shell - Google Patents
Metal glass packaging shell Download PDFInfo
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- CN110828382A CN110828382A CN201911127445.5A CN201911127445A CN110828382A CN 110828382 A CN110828382 A CN 110828382A CN 201911127445 A CN201911127445 A CN 201911127445A CN 110828382 A CN110828382 A CN 110828382A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a metal glass packaging shell, and belongs to the technical field of packaging shells. The metal glass packaging shell comprises a first metal glass shell, a second metal glass shell, a first accommodating space, a first heat dissipation piece, a third metal glass shell, a second accommodating space and a second heat dissipation piece. When the temperature in the second accommodating space is higher than the first preset temperature, one end of the shape alloy plate extends to the first position from the initial position, meanwhile, the annular current conducting plate connected to the shape alloy plate is driven to enable one end of the annular current conducting plate to be connected to the second conducting structure, the other end of the annular current conducting plate to be connected to the third conducting structure, when the temperature is lower than the first preset temperature, the shape alloy plate is shortened to the initial position, one end of the shape alloy plate faces away from the second conducting structure and the third conducting structure, and two ends of the annular current conducting plate are respectively separated from the third conducting structure and the second conducting structure, so that accurate heat dissipation of a packaging shell is achieved, and energy is saved.
Description
Technical Field
The invention belongs to the technical field of packaging shells, and relates to a metal glass packaging shell.
Background
At present, along with the increase of hybrid integrated circuit power density, the heat of whole encapsulation metal components can increase rapidly, if can not in time dispel the heat, can cause the damage to the hybrid integrated circuit in the packaging shell, present encapsulation metal components only rely on the thermal conductivity of packaging shell metal to dispel the heat, nevertheless along with the increase of components and parts heat dissipation, its self has been difficult to satisfy radiating requirement, can lead to the fact the damage to the hybrid integrated circuit in the packaging shell in difficult to avoid like this in long-term working process. Metallic glass, also known as amorphous alloy, has both the advantages of metal and glass and overcomes their respective disadvantages. Such as glass, is brittle and has no ductility. The strength of the metal glass is higher than that of steel, the hardness of the metal glass exceeds that of high-hardness tool steel, and the metal glass has certain toughness and rigidity, and the packaging shell made of the metal glass also needs to be cooled so as to avoid the situation that the hybrid integrated circuit in the packaging shell is damaged in a long-term working process.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a metal glass packaging shell, and the technical problems to be solved by the invention are as follows: how to provide a metallic glass package housing.
The purpose of the invention can be realized by the following technical scheme:
a metal glass packaging shell comprises a first metal glass shell arranged at the bottom end, a second metal glass shell arranged at the top end of the first metal glass shell, a first containing space formed by the inner side walls of the first metal glass shell and the second metal glass shell, a first heat radiating piece arranged in the first containing space, a second heat radiating piece arranged at the top end of the first metal glass shell, the periphery of the first metal glass shell, a third metal glass shell connected to the second end of the first metal glass shell, a second containing space formed by the inner side walls of the first metal glass shell, the outer side wall of the second metal glass shell and the inner side wall of the third metal glass shell and a second heat radiating piece arranged in the second containing space, wherein the second heat radiating piece comprises a first through hole arranged at one end of the third metal glass shell, a first sealing plate used for sealing the first through hole, a heat radiating structure used for radiating heat for the second containing space when the metal glass shell is electrified, and a second heat radiating piece arranged in the second containing space, The power supply, one end is connected to one end of the power supply, the other end is connected to the first conductive structure at one end of the heat dissipation structure, one end is connected to the second conductive structure at the other end of the heat dissipation structure, the annular conductive plate, the shape alloy plate which is used for extending the heated end of the second accommodating space from the initial position to the first position to drive the annular conductive plate to one end of the annular conductive plate to be connected to the second conductive structure when the temperature in the second accommodating space is higher than the first preset temperature, the other end of the annular conductive plate is connected to the third conductive structure, and one end of the annular conductive plate is shortened to the initial position to drive the two ends of the annular conductive plate to move towards the direction far away from the second conductive structure and the third conductive structure respectively when the temperature in the.
Preferably, the outer side wall of the second metal glass shell is coated with a layer of waterproof and breathable film.
Preferably, the heat sink further comprises a metal glass partition plate, one end of the metal glass partition plate is connected to the second metal glass shell, the other end of the metal glass partition plate is connected to the third metal glass shell, the metal glass partition plate is used for partitioning the second accommodating space into a first partition space located at the upper part of the second accommodating space and a second partition space located at the lower part of the second accommodating space, the second heat sink is arranged in the first partition space, the first through hole is arranged in the first partition space, and the first sealing plate is arranged in the first partition space.
Preferably, the second heat dissipation element further comprises a support rod, one end of the support rod is connected to the other end of the shape alloy plate, the other end of the support rod is connected to the second metal glass shell, the other end of the shape alloy plate abuts against the third metal glass shell, and the heat dissipation structure comprises a fan and an installation frame used for installing the fan on the metal glass partition plate.
Preferably, the shape alloy plate limiting device further comprises a limiting net barrel used for limiting the shape alloy plate, a plurality of meshes are arranged on the limiting net barrel, and one end of the limiting net barrel is fixed on the third metal glass shell.
Preferably, the first heat dissipation element comprises a graphene film attached to the inner side wall of the second metal glass shell.
Preferably, the heat dissipation structure further comprises a stop plate arranged in the second separation space, wherein a second through hole and a third through hole are symmetrically formed in the second separation space and located on two sides of the stop plate respectively, the heat dissipation structure further comprises a second sealing plate for sealing the second through hole, a third sealing plate for sealing the third through hole, and a third heat dissipation member for dissipating heat for the second separation space.
Preferably, the third heat dissipating member includes a cold water tank for storing cold water or ice water, and a first delivery pipe for delivering the cold water in the cold water tank to the second partitioned space.
Preferably, the hot water recycling device further comprises a hot water recycling tank and a second conveying pipe, wherein one end of the second conveying pipe is sleeved on the third through hole, and the other end of the second conveying pipe is connected to the hot water recycling tank.
Preferably, be equipped with temperature sensor, bluetooth communication module and the controller that is used for detecting the temperature in the first accommodation space, controller control temperature sensor detects the temperature and acquires to detect temperature, bluetooth communication module and matches on external communication module control bluetooth communication module will detect the temperature and send to external communication module.
According to the invention, a first accommodating space is defined by the inner side walls of a first metal glass shell and a second metal glass shell, components can be arranged in the first accommodating space, a first heat radiating piece is arranged in the first accommodating space, the first heat radiating piece transmits heat to the outside of the first accommodating space, a third metal glass shell is arranged at the periphery of the second metal glass shell, a second accommodating space is defined by the outer side walls of the first metal glass shell, the second metal glass shell and the inner side wall of the third metal glass shell, a second heat radiating piece for radiating a packaging shell is arranged in the second accommodating space, when the heat in the first accommodating space is transmitted to the second accommodating space, a first sealing plate is opened, when the temperature in the second accommodating space is higher than a first preset temperature, one end of a shape alloy plate extends from an initial position to a first position, and simultaneously, an annular current conducting plate connected to the shape alloy plate is driven, so that one annular end of the annular current conducting plate, The annular current conducting plate other end is connected in third conductive structure, the power like this, first conductive structure, heat radiation structure, third conductive structure, annular current conducting plate, second conductive structure intercommunication, the power can give heat radiation structure power supply like this, heat radiation structure dispels the heat for the second accommodation space, second accommodation space temperature descends, when the temperature is less than first predetermined temperature, shape alloy plate shortens to initial position, shape alloy plate one end is towards keeping away from second conductive structure and third conductive structure, annular current conducting plate both ends are third conductive structure and the separation of second conductive structure respectively, realize dispelling the heat for the encapsulation shell accurately, the energy can be saved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is a side view of a shape alloy plate in the present invention;
FIG. 4 is a schematic structural diagram of the annular conductive plate of the present invention when it is not connected to the second conductive structure and the third conductive structure;
fig. 5 is a schematic structural diagram of the annular conductive plate in the invention when connected with the second conductive structure and the third conductive structure;
fig. 6 is a schematic structural view of a third heat dissipation element in the present invention;
fig. 7 is a schematic diagram showing a configuration in which the controller controls the temperature sensor according to the present invention.
In the figure: 1-a first metal glass shell, 11-a first accommodating space, 2-a second metal glass shell, 3-a third metal glass shell, 31-a second separation space, 32-a first separation space, 321-a stop plate, 4-a metal glass separation plate, 51-a first sealing plate, 52-a second sealing plate, 53-a third sealing plate, 54-a second through hole, 55-a third through hole, 6-a second heat dissipation member, 61-a shape alloy plate, 611-a limiting mesh cylinder, 62-an annular conductive plate, 63-a second conductive structure, 64-a third conductive structure, 65-a first conductive structure, 66-a power supply, 67-a fan, 7-a first heat dissipation member, 8-a third heat dissipation member, 81-a cold water tank, 82-a first delivery pipe, 83-hot water recovery box, 84-second delivery pipe, 91-controller, 92-temperature sensor, 93-Bluetooth communication module.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
Referring to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, and fig. 7, the metal glass package housing in the present embodiment includes a first metal glass housing 1 disposed at a bottom end, a second metal glass housing 2 disposed at a top end of the first metal glass housing 1 and connected to a first end of the first metal glass housing 1, a first accommodating space 11 enclosed by inner side walls of the first metal glass housing 1 and the second metal glass housing 2, a first heat sink 7 disposed in the first accommodating space 11, a second accommodating space disposed at a top end of the first metal glass housing 1 and disposed at an outer periphery of the first metal glass housing 1 and connected to a second end of the first metal glass housing 1, a second heat sink 6 enclosed by the first metal glass housing 1, an outer side wall of the second metal glass housing 2 and an inner side wall of the third metal glass housing 3, the second heat sink 6 includes a first through hole disposed at one end of the third metallic glass shell 3, a first sealing plate 51 for sealing the first through hole, a heat dissipation structure for dissipating heat from the second accommodating space when the second accommodating space is powered on, a power supply 66, a first conductive structure 65 having one end connected to one end of the power supply 66 and the other end connected to one end of the heat dissipation structure, a second conductive structure 63 having one end connected to the other end of the power supply 66, a third conductive structure 64 having one end connected to the other end of the heat dissipation structure, an annular conductive plate 62, a first end of the second accommodating space heated when the temperature is higher than a first preset temperature extends from an initial position to a first position to drive the annular conductive plate 62 to a second conductive structure 63, the other end of the annular conductive plate 62 is connected to the third conductive structure 64, and a second end of the second accommodating space shortened to the initial position to drive two ends of the annular conductive plate 62 to respectively move away from the second conductive structure 63 when the temperature And a shape alloy plate 61 moving in the direction of the third conductive structure 64.
This time, a first accommodating space 11 is enclosed by the inner side walls of the first metal glass shell 1 and the second metal glass shell 2, the component can be installed in the first accommodating space 11, the first heat dissipation member 7 is arranged in the first accommodating space 11, the first heat dissipation member 7 transfers heat to the outside of the first accommodating space 11, the third metal glass shell 3 is arranged at the periphery of the second metal glass shell 2, the first metal glass shell 1, the outer side wall of the second metal glass shell 2 and the inner side wall of the third metal glass shell 3 enclose a second accommodating space, a second heat dissipation member 6 for dissipating heat of the packaging shell is arranged in the second accommodating space, when the heat in the first accommodating space 11 is transferred to the second accommodating space, the first sealing plate 51 is opened, when the temperature in the second accommodating space is higher than a first preset temperature, one end of the annular conductive plate 61 is extended from the initial position to the first position, and simultaneously, the annular conductive plate 62 connected to the annular conductive plate 61 is driven so that one end of the annular conductive plate 62 is connected to the Construct 63, the annular current conducting plate 62 other end is connected in third conducting structure 64, power 66 like this, first conducting structure 65, heat radiation structure, third conducting structure 64, annular current conducting plate 62, second conducting structure 63 intercommunication, power 66 can give heat radiation structure power supply like this, heat radiation structure dispels the heat for the second accommodation space, the temperature of second accommodation space descends, when the temperature is less than first predetermined temperature, shape alloy plate 61 shortens to the initial position, shape alloy plate 61 one end is towards keeping away from second conducting structure 63 and third conducting structure 64, annular current conducting plate 62 both ends are third conducting structure 64 and the separation of second conducting structure 63 respectively, realize dispelling the heat for the encapsulation shell is accurate, energy saving. The first conductive structure 65 is a first wire, the second conductive structure 63 includes a second wire having one end connected to the other end of the power supply 66 and a first conductive contact located at the other end of the wire, the third conductive structure 64 includes a third wire having one end connected to the other end of the heat dissipation structure and a third conductive contact located at the other end of the wire, the distance between the first conductive contact and the second conductive contact is smaller than the diameter of the outer ring of the annular conductive plate 62 and larger than the diameter of the inner ring of the annular conductive plate 62, and the annular conductive plate 62 is parallel to the two conductive contacts.
The outer side wall of the second metal glass shell 2 can be coated with a layer of waterproof breathable film, so that water can be prevented from entering the first accommodating space 11, and normal use of components in the first accommodating space 11 is prevented from being influenced.
The metal glass package housing in this embodiment may further include a metal glass partition plate 4 having one end connected to the second metal glass shell 2 and the other end connected to the third metal glass shell 3, and configured to partition the second accommodating space into a first partition space 32 located at an upper portion of the second accommodating space and a second partition space 31 located at a lower portion of the second accommodating space, the second heat dissipating member 6 is disposed in the first partition space 32, the first through hole is disposed in the first partition space 32, and the first sealing plate 51 is disposed in the first partition space 32. The first metal glass shell 1 is a rectangular metal glass shell, the second metal glass shell 2 is a rectangular glass shell, the first accommodating space 11 is a rectangular accommodating space, the third metal glass shell 3 is a rectangular metal glass shell, the second accommodating space is a rectangular accommodating space with a center coinciding with the center of the first accommodating space 11, the metal glass partition plate 4 is a rectangular partition plate, two ends of the metal partition plate are respectively and vertically welded to the third metal glass shell 3 and the second metal glass shell 2, the second metal glass shell 2 can be welded to the first metal glass shell 1, two ends of the third metal glass shell 3 can be respectively welded to the first metal glass shell 1 and the second metal glass shell 2, and the first partition space 32 and the second partition space 31 are rectangular spaces. And a plurality of pins with one end sequentially passing through the second metallic glass shell 2 in the first separated space 32 and the third metallic glass shell 3 in the first separated space 32 and extending out can also be included.
The second heat dissipating member 6 may further include a support rod having one end connected to the other end of the shape alloy plate 61 and the other end connected to the second metallic glass shell 2, the other end of the shape alloy plate 61 abuts against the third metallic glass shell 3, and the heat dissipating structure may include a fan 67 and a mounting bracket for mounting the fan 67 on the metallic glass partition plate 4.
The metal glass package housing in this embodiment may further include a limiting mesh cylinder 611 for limiting the shape alloy plate 61, the limiting mesh cylinder 611 is provided with a plurality of meshes, one end of the limiting mesh cylinder 611 is fixed to the third metal glass shell 3, and one end of the limiting mesh cylinder 611 is flush with the non-telescopic end of the shape alloy plate 61.
The first heat dissipation element 7 includes a graphene film adhered to the inner sidewall of the second metal glass shell 2, so that heat in the first accommodating space 11 is uniformly dissipated. The first heat dissipation element 7 may further include a plurality of heat dissipation fins disposed on the inner sidewall of the second metal glass shell 2 for heat dissipation, and the graphene film is adhered to the surfaces of the heat dissipation fins.
The metal glass package housing in this embodiment may further include a stop plate 321 disposed in the second separation space 31, wherein the second separation space 31 is symmetrically provided with a second through hole 54 and a third through hole 55 at two sides of the stop plate 321, and further includes a second sealing plate 52 for sealing the second through hole 54, a third sealing plate 53 for sealing the third through hole 55, and a third heat sink 8 for dissipating heat from the second separation space 31. The first through hole, the second through hole 54, and the third through hole 55 may be circular through holes, the peripheries of the first sealing plate 51, the second sealing plate 52, and the third sealing plate 53 are all provided with external threads, the first sealing plate 51 may be screwed to the first through hole, the second sealing plate 52 may be screwed to the second through hole 54, and the third sealing plate 53 may be screwed to the third through hole 55.
The third heat sink 8 includes a cold water tank 81 for storing cold water or ice water, and a first delivery pipe 82 for delivering the cold water in the cold water tank 81 to the second partitioned space 31. A water pump may be further included, which is provided on the first transfer pipe 82, to pump the cold water or the ice water.
The metallic glass sealing case in this embodiment may further include a hot water recovery tank 83, and a second delivery pipe 84 having one end thereof fitted to the third through hole 55 and the other end thereof connected to the hot water recovery tank 83. In this way, the second sealing plate 52 can be opened, cold water or ice water can be transported into the second partitioned space 31 through the first transport pipe 82, hot water is formed in the second partitioned space 31 after a lapse of time, the second sealing plate 52 is closed, the third sealing plate 53 is opened, and the hot water is transported into the hot water recovery tank 83 through the second transport pipe 84, thereby improving the water resource utilization rate.
Can be equipped with temperature sensor 92, bluetooth communication module 93 and the controller 91 that is used for detecting the temperature in the first accommodation space 11, controller 91 control temperature sensor 92 detects the temperature and acquires to detect temperature, bluetooth communication module 93 matches external communication module after control bluetooth communication module 93 will detect the temperature and send to external communication module on. Like this the user can match bluetooth communication module 93 through the cell-phone, controller 91 can be STM32 singlechip, controller 91 control temperature sensor 92 detects the temperature and will detect temperature data transmission to the cell-phone through bluetooth communication module 93 after acquireing the detection temperature on, the user can observe the temperature in the first accommodation space 11 in real time, can in time open first closing plate 51, make things convenient for the 6 machines of second radiating element to dispel the heat, improve the radiating efficiency of second radiating element 6, and when the high temperature, open third radiating element 8 in order to dispel the heat to the encapsulation shell, further improve radiating efficiency.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (10)
1. A kind of metal glass encapsulates the outer cover, characterized by: comprises a first metal glass shell (1) arranged at the bottom end, a second metal glass shell (2) arranged at the top end of the first metal glass shell (1), a first containing space (11) enclosed by the inner side walls of the first metal glass shell (1) and the second metal glass shell (2), a first heat radiating piece (7) arranged in the first containing space (11), a second containing space arranged at the top end of the first metal glass shell (1), arranged at the periphery of the first metal glass shell (1), a third metal glass shell (3) connected at the second end of the first metal glass shell (1), a second heat radiating piece (6) enclosed by the outer side wall of the first metal glass shell (2) and the inner side wall of the third metal glass shell (3) and arranged in the second containing space, wherein the second heat radiating piece (6) comprises a first through hole arranged at one end of the third metal glass shell (3), A first sealing plate (51) for sealing the first through hole, a heat dissipation structure for dissipating heat of the second accommodating space when the power is on, a power supply (66), a first conductive structure (65) with one end connected to one end of the power supply (66) and the other end connected to one end of the heat dissipation structure, a second conductive structure (63) with one end connected to the other end of the power supply (66), a third conductive structure (64) with one end connected to the other end of the heat dissipation structure, an annular conductive plate (62), a first end of the second accommodating space heated when the temperature is higher than a first preset temperature extends from an initial position to the first position to drive the annular conductive plate (62) to a second conductive structure (63) with one end connected to the third conductive structure (64), and a second end of the annular conductive plate (62) shortens to the initial position to drive the two ends of the annular conductive plate (62) to respectively move away from the second conductive structure when the temperature is lower than the first preset temperature (63) And a shape alloy plate (61) moving in the direction of the third conductive structure (64).
2. The metallic glass package of claim 1, wherein: the outer side wall of the second metal glass shell (2) is coated with a layer of waterproof breathable film.
3. A metallic glass package as in claim 1 or 2, wherein: the metal glass partition plate is characterized by further comprising a metal glass partition plate (4) with one end connected to the second metal glass shell (2) and the other end connected to the third metal glass shell (3) and used for partitioning the second accommodating space into a first partition space (32) located at the upper portion of the second accommodating space and a second partition space (31) located at the lower portion of the second accommodating space, the second heat dissipation piece (6) is arranged in the first partition space (32), the first through hole is formed in the first partition space (32), and the first sealing plate (51) is arranged on the first partition space (32).
4. A metallic glass package as in claim 3, wherein: the second heat dissipation piece (6) further comprises a support rod, one end of the support rod is connected to the other end of the shape alloy plate (61), the other end of the support rod is connected to the second metal glass shell (2), the other end of the shape alloy plate (61) is abutted to the third metal glass shell (3), and the heat dissipation structure comprises a fan (67) and an installation frame used for installing the fan (67) on the metal glass partition plate (4).
5. The metallic glass package of claim 4, wherein: the metal glass plate limiting device is characterized by further comprising a limiting net barrel (611) used for limiting the shape alloy plate (61), a plurality of meshes are arranged on the limiting net barrel (611), and one end of the limiting net barrel (611) is fixed to the third metal glass shell (3).
6. The metallic glass package of claim 5, wherein: the first heat dissipation piece (7) comprises a graphene film attached to the inner side wall of the second metal glass shell (2).
7. A metallic glass package as in claim 3, wherein: the heat dissipation structure is characterized by further comprising a stop plate (321) arranged in the second separation space (31), wherein a second through hole (54) and a third through hole (55) are symmetrically formed in the second separation space (31) and located on two sides of the stop plate (321) respectively, a second sealing plate (52) used for sealing the second through hole (54), a third sealing plate (53) used for sealing the third through hole (55), and a third heat dissipation element (8) used for dissipating heat for the second separation space (31).
8. The metallic glass package of claim 7, wherein: the third heat dissipation element (8) comprises a cold water tank (81) for storing cold water or ice water and a first conveying pipe (82) for conveying the cold water in the cold water tank (81) to the second separated space (31).
9. The metallic glass package of claim 8, wherein: the hot water recycling device also comprises a hot water recycling tank (83), a second conveying pipe (84) with one end sleeved on the third through hole (55) and the other end connected with the hot water recycling tank (83).
10. A metallic glass package as in claim 1 or 2, wherein: be equipped with in first accommodation space (11) and be used for detecting temperature sensor (92), bluetooth communication module (93) and controller (91), controller (91) control temperature sensor (92) detect the temperature and acquire and detect temperature, bluetooth communication module (93) match external communication module after control bluetooth communication module (93) will detect the temperature and send to external communication module on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911127445.5A CN110828382B (en) | 2019-11-18 | 2019-11-18 | Metal glass packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911127445.5A CN110828382B (en) | 2019-11-18 | 2019-11-18 | Metal glass packaging shell |
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| Publication Number | Publication Date |
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| CN110828382A true CN110828382A (en) | 2020-02-21 |
| CN110828382B CN110828382B (en) | 2021-07-02 |
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| CN201911127445.5A Expired - Fee Related CN110828382B (en) | 2019-11-18 | 2019-11-18 | Metal glass packaging shell |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981462A (en) * | 2016-01-19 | 2017-07-25 | 讯凯国际股份有限公司 | Liquid-cooling heat radiator |
| EP3196561A1 (en) * | 2016-01-20 | 2017-07-26 | Mitsubishi Heavy Industries Thermal Systems, Ltd. | Air conditioner controller and air conditioner including the same |
| CN207381385U (en) * | 2017-10-30 | 2018-05-18 | 镇江佳鑫精工设备有限公司 | A kind of semiconductor device of the operation is stable |
| CN109192450A (en) * | 2018-10-24 | 2019-01-11 | 浙江长兴瑞和电子科技有限公司 | A kind of high frequency transformer with dust reduction capability |
| CN109300859A (en) * | 2018-09-18 | 2019-02-01 | 陈广焕 | A kind of protectiveness chip package frame |
-
2019
- 2019-11-18 CN CN201911127445.5A patent/CN110828382B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106981462A (en) * | 2016-01-19 | 2017-07-25 | 讯凯国际股份有限公司 | Liquid-cooling heat radiator |
| EP3196561A1 (en) * | 2016-01-20 | 2017-07-26 | Mitsubishi Heavy Industries Thermal Systems, Ltd. | Air conditioner controller and air conditioner including the same |
| CN207381385U (en) * | 2017-10-30 | 2018-05-18 | 镇江佳鑫精工设备有限公司 | A kind of semiconductor device of the operation is stable |
| CN109300859A (en) * | 2018-09-18 | 2019-02-01 | 陈广焕 | A kind of protectiveness chip package frame |
| CN109192450A (en) * | 2018-10-24 | 2019-01-11 | 浙江长兴瑞和电子科技有限公司 | A kind of high frequency transformer with dust reduction capability |
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| CN110828382B (en) | 2021-07-02 |
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