CN110828073A - Polyimide film laminated insulator and manufacturing method thereof - Google Patents
Polyimide film laminated insulator and manufacturing method thereof Download PDFInfo
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- CN110828073A CN110828073A CN201911131559.7A CN201911131559A CN110828073A CN 110828073 A CN110828073 A CN 110828073A CN 201911131559 A CN201911131559 A CN 201911131559A CN 110828073 A CN110828073 A CN 110828073A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/14—Supporting insulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
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Abstract
The invention relates to a polyimide film laminated insulator which is formed by bonding a plurality of layers of single-sided adhesive polyimide films 1, wherein the single-sided adhesive polyimide films 1 comprise polyimide films 2 and adhesive layers 3, and the insulator has a cylindrical structure and a conical structure. The invention also relates to a method for manufacturing the insulator, which comprises the steps of firstly processing the multilayer polyimide film 1 with the single-side adhesive into a specific shape, placing the specific shape in a mold, then placing the mold in a high-temperature container, integrally heating the mold to the temperature at which the adhesive layer 3 is melted and the polyimide film 2 is not melted, so that the adhesive layer 3 is melted and is bonded with the adjacent polyimide film 2 of the polyimide film 1 with the single-side adhesive into a whole. After the temperature is returned to the room temperature, the multilayer polyimide film 1 with the single-sided adhesive becomes a whole. The insulator has special effects of body insulation and edge insulation, has excellent processing performance, and the method for manufacturing the insulator is simple and practical.
Description
Technical Field
The invention belongs to the technical field of insulating media, and particularly relates to a polyimide film laminated insulator and a manufacturing method thereof.
Background
Insulation is one of the key factors that restrict the miniaturization of pulse power devices. The field intensity of the edge surface of the existing insulating medium is greatly influenced by the application environment. In the general design process, the field intensity of the medium surface rarely exceeds 100kV/cm for ensuring the reliability, and the medium surface is in some corrosive environments, such as SF6And its decomposition products, the in-plane withstand field strength is further reduced. Therefore, the research on developing a novel insulating material and researching a method for improving the flashover field intensity along the surface of a medium is an important research direction for the miniaturization of the pulse power device.
The national patent of a film-wrapped high-voltage pulse coaxial cable (patent acceptance number 201718002457.0) and the national patent of an axial leading-out bipolar plate winding pulse forming line (patent application number 201710408007.0) adopt a mode of laminating insulating films, so that the long-term local withstand voltage field intensity of the insulating material reaches the MV/cm order. In the paper (Improvement of surface flash performance in vacuum of A-B-A insulator by adapting ZnOvacuator as layer A [ J ], Li Shengtao, Zhang Tuo, Huangqifeng, et al, IEEE Transactions on Plasma Science,2010,38(7): 1656-. The glass fiber cloth epoxy board fully exerts the high insulating property of epoxy, and simultaneously improves the mechanical property of the glass fiber cloth epoxy board by utilizing the bonding and fixing effect of the glass fiber cloth, thereby obtaining higher insulating and mechanical properties in the direction vertical to the glass fiber cloth.
Polyimide is one of the organic polymer materials with the best combination property. For the structure of the pyromellitic polyimide molecule, the molecule contains a conjugated system consisting of an imine bond and a benzene ring. The phenyl group is a typical anti-irradiation group [ Schclaim, KAPTON film Electron irradiation Damage Effect Harbin: Harbin Industrial university, 2007 ]. Because the benzene ring is composed of conjugated pi bonds, the energy absorbed by benzene molecules is enough to break single bonds, but the energy is quickly redistributed on the whole molecular chain and is not concentrated on a certain bond, and meanwhile, the efficiency of the collision induced attenuation process is improved due to the conjugation formed by 6 pi electrons, so that the polyimide has higher electron bombardment resistance and corona resistance. Meanwhile, the polyimide material has excellent temperature resistance (the long-term use temperature is-200-300 ℃), has low outgassing rate in a vacuum environment, and is suitable for being used in a high-vacuum environment.
Disclosure of Invention
The invention provides a polyimide film laminated insulator which has high body insulation and pressure resistance strength, strong surface insulation capability and excellent processing performance, and the method for manufacturing the insulator is simple and practical.
The specific scheme of the invention is as follows:
the invention provides a polyimide film laminated insulator which is formed by bonding a plurality of layers of single-sided adhesive-carrying polyimide films 1, wherein each single-sided adhesive-carrying polyimide film 1 comprises a polyimide film 2 and an adhesive layer 3, and the polyimide film 2 of each layer of single-sided adhesive-carrying polyimide film 1 is bonded with the adhesive layer 3 of the adjacent single-sided adhesive-carrying polyimide film 1.
Further, the insulator is cylindrical, wherein each layer of single-sided adhesive polyimide film 1 is a plane and is perpendicular to the axis of the cylinder.
Further, the insulator is conical, wherein a plurality of layers of polyimide films 1 with single-sided adhesive are wound around the axis of the conical shape.
The invention also provides a method for manufacturing the polyimide film laminated insulator, which comprises the following steps:
the multilayer single-sided adhesive-carrying polyimide film 1 is processed into a specific shape and placed in a mold 4, 7, the mold is placed in a high-temperature container, the whole is heated to the temperature that the adhesive layer 3 is molten and the polyimide film 2 is not molten, the adhesive layer 3 is molten and is bonded with the polyimide film 2 of the adjacent single-sided adhesive-carrying polyimide film 1 into a whole, and after the temperature is restored to the room temperature, the multilayer single-sided adhesive-carrying polyimide film 1 becomes a whole.
Further, the mold is a cylindrical mold 4, and the interior of the cylindrical mold 4 is in a cylindrical shape; processing each layer of single-sided adhesive polyimide film 1 into a circular sheet, stacking the circular sheet in the cylindrical die 4 layer by layer, covering a high-pressure plate 5 above the circular sheet, and applying pressure to the high-pressure plate 5 during high-temperature processing.
Further, the mould is a conical mould 7, and the conical mould 7 is provided with an inner core 8; the mold 7 is provided with an inner core 8, the multilayer single-sided adhesive polyimide film 1 is processed into a long strip shape and wound on the inner core 8 of the mold 7 to form a cylindrical shape, wherein the adhesive layer 3 of the innermost single-sided adhesive polyimide film 1 is in contact with the inner core 8; side baffles 9 are respectively arranged at two plane ends of the cylindrical shape formed by winding; and (3) heating at high temperature, then recovering to room temperature, and processing the cylindrical multi-layer polyimide film 1 with the single-sided adhesive into a conical insulator.
The invention has the following beneficial effects:
1. the polyimide film has the ultrahigh voltage-resistant characteristic of the polyimide film, and the long-term insulation voltage-resistant strength can reach MV/cm magnitude.
2. The thicknesses of the polyimide film 2 and the glue layer 3 are optional, and the insulating capacity of the insulating medium along the surface can exceed 100 kV/cm.
3. The polyimide film laminated insulator has excellent mechanical processing performance and can be processed into a specific shape.
Drawings
FIG. 1 is a schematic view of a structure of a single-sided adhesive polyimide film;
fig. 2 is a schematic view of a specific mold for molding a cylindrical insulator;
fig. 3 is a schematic view of a specific mold for molding a cone insulator.
1-single-sided adhesive-carrying polyimide film, 2-insulating film, 3-adhesive layer, 4-cylindrical die, 5-high pressure plate, 6-special die cylinder, 7-conical die, 8-inner core and 9-side baffle.
Detailed Description
The following describes an implementation process of the present invention with reference to the embodiments and the accompanying drawings.
The polyimide film laminated insulator is formed by hot-pressing a plurality of layers of polyimide films 1 with single-sided adhesive.
The multilayer polyimide film 1 with the single-sided adhesive is processed into a specific shape. The single-sided adhesive-carrying polyimide film 1 comprises a polyimide film 2 and an adhesive layer 3, as shown in fig. 1. The polyimide film 2 of each layer is bonded with the adhesive layer 3 of the adjacent polyimide film 1 with the adhesive on the single surface.
As shown in fig. 2, for a cylindrical insulator, each layer of single-sided adhesive polyimide film 1 is first processed into round pieces with the same size, and the round pieces are stacked in a cylindrical mold 4 layer by layer, the polyimide film 2 of the single-sided adhesive polyimide film 1 is in contact with the adhesive layer 3 of the adjacent single-sided adhesive polyimide film 1, and a high-pressure plate 5 is placed at one end of the multiple layers of single-sided adhesive polyimide films 1.
The cylindrical mold 4 is placed in a high-temperature container, the whole is heated to the temperature at which the adhesive layer 3 melts and the polyimide film 2 does not melt, and high pressure is applied to the high-pressure plate 5 of the specific mold 4. Under the action of high temperature and high pressure, after a period of time, the glue layer 3 is melted and is bonded with the adjacent polyimide film 2 with the glue polyimide film 1 on the single surface into a whole. After the temperature is returned to the room temperature, the multilayer polyimide film 1 with the single-sided adhesive becomes a whole, and the processability of the insulating material and the ultrahigh voltage resistance of the polyimide film 2 are both achieved.
Finally, the insulating material recovered to room temperature is processed to a specific shape and used as an insulating medium.
For the conical insulator, as shown in fig. 3, first, a plurality of single-sided adhesive polyimide films 1 are processed into a long shape having a certain width. The single-sided adhesive-carrying polyimide film 1 comprises a polyimide film 2 and an adhesive layer 3.
Secondly, winding a plurality of layers of polyimide films 1 with single-sided adhesive on the inner core 8 of the conical die 7 layer by layer, wherein the adhesive layers 3 of the polyimide films 1 with single-sided adhesive are in contact with the inner core 8. After winding is completed, the side guards 9 are installed.
And thirdly, placing the conical die 7 in a high-temperature container, integrally heating to the temperature at which the glue layer 3 is melted and the polyimide film 2 is not melted, and applying pressure by utilizing the thermal shrinkage property of the polyimide film. Under the action of high temperature and high pressure, after a period of time, the glue layer 3 is melted and bonded with the adjacent polyimide film 2 with the glue polyimide film 1 on the single surface into a whole. After the temperature is returned to the room temperature, the multilayer polyimide film 1 with the single-sided adhesive becomes a whole, and the processability of the insulating material and the ultrahigh voltage resistance of the polyimide film 2 are both achieved.
And finally, processing the insulating material recovered to the room temperature into a conical insulator with a specific shape to be used as an insulating medium.
Example 1
The insulating medium with the diameter of 90mm and the thickness of 20mm is required for SF6And the decomposition product gas environment withstands 270 kV/mu s pulse voltage, and gives consideration to the characteristics of body insulation and surface insulation, and the specific design is as follows:
the polyimide film 1 with the glue on the single surface has a polyimide layer 2 with the thickness of 25 mu m, and a glue layer 3 made of Fluorinated Ethylene Propylene (FEP) with the thickness of 15 mu m.
First, the polyimide film 1 with a single-sided tape was cut into a circular sheet having a diameter of 110 mm.
Secondly, 1000 layers of single-side adhesive-carrying polyimide films 1 are stacked in a specific mold 4, and a polyimide film 2 of the single-side adhesive-carrying polyimide film 1 is in contact with an adhesive layer 3 of an adjacent single-side adhesive-carrying polyimide film 1. The special die cylinder 6 is made of stainless steel, the thickness of the cylinder is 10mm, the inner diameter of the cylinder is 111mm, and the height of the cylinder is 100 mm. The high-pressure plate 5 is made of stainless steel, and has an outer diameter of 111mm and a thickness of 10 mm.
And thirdly, placing the mould in a high-temperature oven, heating to 300 ℃ (higher than the FEP melting temperature of the glue layer 3 and lower than the melting temperature of the polyimide film 2), applying 100N pressure on the high-pressure plate 5, and cooling to room temperature for 24 hours according to a specific temperature curve.
Finally, the insulation will be restored to room temperatureThe material is processed into a cylindrical shape with the outer diameter of 90mm and the thickness of 20mm, the surface of a cylindrical surface is made into a structure for 6atm SF6And under the action of 270kV microsecond pulse, the electric field in the insulating medium is 135kV/cm, the average electric field along the surface is 135kV/cm, the highest field intensity is 210kV/cm, and the system runs stably.
Claims (6)
1. The laminated insulator is characterized by being formed by bonding a plurality of layers of single-sided adhesive polyimide films (1), wherein each single-sided adhesive polyimide film (1) comprises a polyimide film (2) and an adhesive layer (3), and the polyimide film (2) of each layer of single-sided adhesive polyimide film (1) is bonded with the adhesive layer (3) of the adjacent single-sided adhesive polyimide film (1).
2. The polyimide film laminated insulator according to claim 1, wherein said insulator is cylindrical, and wherein each of said single-sided adhesive polyimide films (1) is planar and perpendicular to the axis of said cylindrical shape.
3. The polyimide film laminated insulator according to claim 1, wherein the insulator has a conical shape, and wherein a plurality of layers of the polyimide film (1) with the adhesive on one side are wound around the axis of the conical shape.
4. A method for producing the polyimide film laminated insulator according to claim 1, comprising the steps of:
processing the multilayer single-sided adhesive-carrying polyimide film (1) into a specific shape, placing the specific shape in a mold, placing the mold in a high-temperature container, integrally heating the mold to the temperature at which the adhesive layer (3) melts and the polyimide film (2) does not melt, so that the adhesive layer (3) melts and is bonded with the polyimide film (2) of the adjacent single-sided adhesive-carrying polyimide film (1) into a whole, and after the temperature is restored to room temperature, the multilayer single-sided adhesive-carrying polyimide film (1) becomes a whole.
5. The method for manufacturing a polyimide film laminated insulator according to claim 4, wherein the mold is a cylindrical mold (4), and the inside of the cylindrical mold (4) has a cylindrical shape; processing each layer of single-sided adhesive polyimide film (1) into a circular sheet, stacking the circular sheet in a cylindrical die (4) layer by layer, covering a high-pressure plate (5) at the upper part, and applying pressure on the high-pressure plate (5) during high-temperature processing.
The method for manufacturing a polyimide film laminated insulator according to claim 4, wherein the mold is a cylindrical mold (4), and the inside of the cylindrical mold (4) has a cylindrical shape; processing each layer of single-sided adhesive polyimide film (1) into a long strip shape, winding the long strip shape on a cylindrical die (4) layer by layer, then covering a high-pressure plate (5) at the upper part, and applying pressure on the high-pressure plate (5) during high-temperature processing.
6. The method for manufacturing a polyimide film laminated insulator according to claim 4, wherein the mold is a conical mold (7), the conical mold (7) having an inner core (8); processing a plurality of layers of single-sided adhesive polyimide films (1) into long strips, winding the long strips on an inner core (8) of a conical die (7) to form a cylindrical shape, wherein an adhesive layer (3) of the innermost single-sided adhesive polyimide film (1) is in contact with the inner core (8); side baffles (9) are respectively arranged at two plane ends of the cylindrical shape formed by winding; and (3) heating at high temperature, then recovering to room temperature, and processing the cylindrical multi-layer polyimide film (1) with the single-sided adhesive into a conical insulator.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911131559.7A CN110828073A (en) | 2019-11-19 | 2019-11-19 | Polyimide film laminated insulator and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911131559.7A CN110828073A (en) | 2019-11-19 | 2019-11-19 | Polyimide film laminated insulator and manufacturing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050013998A1 (en) * | 2003-07-14 | 2005-01-20 | Lacourt Philip Roland | Dielectric substrates comprising a polymide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto |
| CN102522167A (en) * | 2011-12-30 | 2012-06-27 | 天津市华之阳特种线缆有限公司 | Polyimide coiled sleeve and processing method thereof |
| CN102514344A (en) * | 2011-12-02 | 2012-06-27 | 西北工业大学 | Preparation method of self-lubricating polyimide/poly(perfluoro ethylene-propylene) laminated composite material |
| CN107248854A (en) * | 2017-06-02 | 2017-10-13 | 西北核技术研究所 | A kind of axial lead bipolar plates wind pulse-forming line |
| CN109228586A (en) * | 2018-08-31 | 2019-01-18 | 株洲时代新材料科技股份有限公司 | A kind of low dielectric polyimide composite film and preparation method thereof |
-
2019
- 2019-11-19 CN CN201911131559.7A patent/CN110828073A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050013998A1 (en) * | 2003-07-14 | 2005-01-20 | Lacourt Philip Roland | Dielectric substrates comprising a polymide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto |
| CN102514344A (en) * | 2011-12-02 | 2012-06-27 | 西北工业大学 | Preparation method of self-lubricating polyimide/poly(perfluoro ethylene-propylene) laminated composite material |
| CN102522167A (en) * | 2011-12-30 | 2012-06-27 | 天津市华之阳特种线缆有限公司 | Polyimide coiled sleeve and processing method thereof |
| CN107248854A (en) * | 2017-06-02 | 2017-10-13 | 西北核技术研究所 | A kind of axial lead bipolar plates wind pulse-forming line |
| CN109228586A (en) * | 2018-08-31 | 2019-01-18 | 株洲时代新材料科技股份有限公司 | A kind of low dielectric polyimide composite film and preparation method thereof |
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Application publication date: 20200221 |