CN110824737A - Hard-to-hard vacuum full-lamination process - Google Patents

Hard-to-hard vacuum full-lamination process Download PDF

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Publication number
CN110824737A
CN110824737A CN201910923321.1A CN201910923321A CN110824737A CN 110824737 A CN110824737 A CN 110824737A CN 201910923321 A CN201910923321 A CN 201910923321A CN 110824737 A CN110824737 A CN 110824737A
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raw material
sheet
auxiliary substrate
hard
jig
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CN110824737B (en
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富玥麟
李书印
胡城生
熊建勇
李洪林
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Sichuan Changjiang Huayun Electronic Technology Co Ltd
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Sichuan Changjiang Huayun Electronic Technology Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs

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  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)

Abstract

A hard-to-hard vacuum full lamination process comprises the following steps: the upper piece of the raw material is fixed on an auxiliary substrate in a detachable way, and the auxiliary substrate does not shield the upper piece of the raw material; installing an extensible member outside a raw material placing area of the jig, placing a raw material lower sheet in the raw material placing area, supporting an auxiliary substrate fixed with a raw material upper sheet on the extensible member, and setting the height of the extensible member to keep the raw material upper sheet and the raw material lower sheet separated; pressing the upper sheet and the lower sheet of the raw material fixed on the auxiliary substrate in vacuum; separating the finished product from the auxiliary substrate; the auxiliary substrate is arranged in a rectangular frame shape, and the original material is provided with a sheet frame inside the auxiliary substrate and is adhered and fixed through the easy-tearing glue. By adopting the process method, the raw materials are subjected to vacuum lamination to generate less bubbles, and the product can be completely bubble-free after defoaming; and the product precision is higher.

Description

Hard-to-hard vacuum full-lamination process
Technical Field
The invention relates to the technical field of liquid crystal display modules, in particular to a hard-to-hard vacuum full-lamination process.
Background
The Liquid Crystal Module (LCM) is a liquid crystal screen capable of displaying information independently, if no equipment for outputting video signals is connected through a video line, the liquid crystal screen cannot display the video information, and the liquid crystal module is equipment for assembling the signal output equipment, the video line and the liquid crystal screen together. The liquid crystal display module is a complete display assembly which is formed by assembling a liquid crystal display device, a connecting piece, an integrated circuit, a control drive circuit, a PCB circuit board, a backlight source and a structural part together and can be designed according to the requirements of users.
The invention is applicable to the technical field of full lamination, and particularly aims at 1:1 optical clear adhesive OCA, hot melt optical clear adhesive SCA and other transparent solid adhesive hard-to-hard full-laminating project fields. To the current industry for 1: the optical raw material with the size of 1 mainly comprises two hard-to-hard full-laminating processes: placing the raw material into a jig in a normal environment, and attaching the two products in a vacuum environment after the two products are contacted; and (3) adopting soft-to-hard film coating equipment to directly laminate hard to hard in a normal environment. The two attaching processes have some defects: (1) by combining the characteristics of the OCA material, the OCA is used for laminating under a normal environment or is directly contacted and pressed under a vacuum environment, so that a large amount of bubbles are generated in the product, and the finished product still cannot be completely bubble-free through a subsequent defoaming process. (2) The deviation of the alignment precision of the upper sheet and the lower sheet of the raw material is large, and the risk of product breakage is high when the soft-to-hard equipment is used for hard-to-hard fitting.
Disclosure of Invention
In order to solve the problems, the invention provides a hard-to-hard vacuum full-lamination process, which has less bubbles in vacuum lamination of raw materials and can realize that a product is completely bubble-free after defoaming.
In order to solve the technical problem, the invention adopts the following scheme:
a hard-to-hard vacuum full lamination process comprises the following steps:
s1: the upper piece of the raw material is fixed on an auxiliary substrate in a detachable way, and the auxiliary substrate does not shield the upper piece of the raw material;
s2: installing an extensible member outside a raw material placing area of the jig, placing a raw material lower sheet in the raw material placing area, supporting an auxiliary substrate fixed with a raw material upper sheet on the extensible member, and setting the height of the extensible member to keep the raw material upper sheet and the raw material lower sheet separated;
s3: pressing the upper sheet and the lower sheet of the raw material fixed on the auxiliary substrate in vacuum;
s4: and separating the finished product from the auxiliary substrate.
Further, a specific auxiliary substrate and a disassembly and assembly mode thereof are provided, wherein the auxiliary substrate is set to be in a rectangular frame shape, and the raw material is provided with a sheet frame inside; the extensible member adopts the spring thimble, and it is a plurality of to follow the regional edge installation of placing of tool.
Further, the specific hard-to-hard vacuum full lamination process comprises the following steps:
s11: the auxiliary substrate is subjected to easy-tear glue lamination treatment;
s12: placing the raw material upper sheet in a raw material placing area of the jig, and confirming the position of the raw material upper sheet through a CCD camera;
s13: placing the auxiliary substrate on a spring thimble of the jig, and adjusting the position through a micrometer positioning block of the jig;
s14: pressing the upper sheet of the raw material and the auxiliary substrate;
s21: carrying out OCA (optical clear adhesive) attaching on the lower sheet of the raw material;
s22: taking out the attached auxiliary substrate and the original upper sheet;
s23: placing the lower piece of the raw material with the adhered OCA into a raw material placing area of a jig, and carrying out position confirmation by using a CCD camera;
s31: removing the protective film and the OCA release film on the raw material;
s32: the attached auxiliary substrate and the upper raw material sheet are arranged on a spring thimble of the jig, the height between the upper raw material sheet and the lower raw material sheet is adjusted through the spring thimble, and the upper raw material sheet and the lower raw material sheet are kept to be separated;
s33: fine adjustment is carried out by using a micrometer positioning block on the jig, and the upper Mark point and the lower Mark point are superposed and aligned through a CCD camera on the jig;
s34: carrying out vacuum lamination on the upper sheet and the lower sheet of the raw material;
s4: after the pressing is finished, quickly taking out the finished product attached to the auxiliary substrate; removing the easy-tearing glue on the auxiliary substrate, and separating the finished product from the auxiliary substrate;
s5: functional test and quadratic element test.
As a preferable option, we optimize the parameters of the hard-to-hard vacuum full lamination process, specifically, the size of the easy-to-tear adhesive in step S11 is 40mm long and 20mm wide.
Further, step S21 is performed with OCA attachment using soft-to-hard attachment equipment.
Further, step S14 is to perform vacuum lamination of the auxiliary substrate and the upper sheet of the raw material under a normal environment, and adjust the pressure of the vacuum lamination equipment to 0.10 Mpa-0.15 Mpa.
Further, in step S32, the distance between the upper sheet and the lower sheet of the raw material is not less than 8mm, and the top surface of the auxiliary substrate is lower than or flush with the top surface of the jig.
Further, the coincidence accuracy of the Mark point 30 on the upper plate and the Mark point 40 on the lower plate is ≦ 0.2mm in step S33.
Further, the process parameters of step S34 are: the pressure is 0.1-0.2 Mpa, the vacuum degree is-98 PSI-100 PSI, and the pressing time is 15-20 s.
Further, in step S4, the finished product is taken out within 5S to 10S, and then the easy-tear glue on the auxiliary substrate is removed.
The invention has the following beneficial effects:
1. the upper sheet of the raw material is adhered to an auxiliary base plate through easy-tearing glue, a spring thimble is additionally arranged on the jig, and the upper sheet of the raw material is supported on the spring thimble through the auxiliary base plate, so that a gap is reserved after the upper sheet of the raw material and the lower sheet of the raw material are placed; then, the pressing is carried out in the vacuum pressing equipment, so that the bubbles between the two raw materials can be effectively reduced, and the finished product can be ensured to be completely bubble-free through subsequent defoaming treatment.
2. Through using CCD equipment, the micrometer locating piece on the tool, when the micrometer locating piece fine setting position, the CCD camera is counterpointed, and piece and former material accuracy align down on the former material when the Mark point coincidence of two former materials reaches the high accuracy laminating, and control accuracy has avoided the problem of laminating off normal within 0.2 mm.
3. The vacuum laminating is carried out in a separating state, so that bubbles can be effectively prevented from being generated, and the subsequent bubbles of a finished product can be rebounded; the CCD and the micrometer are combined, so that the upper raw material and the lower raw material can be accurately aligned, the requirements of customers are greatly met, the precision control is within the range less than or equal to 0.2mm, and the precision control is stable.
Drawings
FIG. 1 is a schematic diagram of the operation of an embodiment of the present invention.
Reference numerals: 1-a jig, 10-a micrometer positioning block, 2-a spring thimble, 3-a raw material upper sheet, 30-an upper sheet Mark point, 4-a raw material lower sheet, 40-a lower sheet Mark point, 5-an auxiliary substrate, 50-easy-tear glue and 6-a CCD camera.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the present invention is not limited to these examples.
Example 1
The embodiment provides a hard-to-hard vacuum full lamination process, which comprises the following steps:
s1: the raw material upper piece 3 is fixed on an auxiliary substrate 5 in an easy-to-detach manner, and the auxiliary substrate 5 does not shield the raw material upper piece 3;
s2: installing an extensible member outside a raw material placing area of the jig 1, placing a raw material lower sheet 4 in the raw material placing area, supporting an auxiliary substrate 5 fixed with a raw material upper sheet 3 on the extensible member, and setting the height of the extensible member to keep the raw material upper sheet 3 and the raw material lower sheet 4 separated;
s3: pressing the upper sheet 3 and the lower sheet 4 fixed on the auxiliary substrate 5 in vacuum;
s4: the finished product is separated from the auxiliary substrate 5.
The upper raw material sheet 3 is firstly fixed on an auxiliary substrate 5, the jig 1 is additionally provided with an expansion piece, the upper raw material sheet 3 is supported on the expansion piece through the auxiliary substrate 5, and a gap is reserved after the upper raw material sheet 3 and the lower raw material sheet 4 are placed; then the two raw materials are sent into vacuum pressing equipment, the telescopic piece can compress to enable the two raw materials to be attached during pressing, air flow between the two raw materials is less under the vacuum environment, bubbles between the two raw materials after vacuum pressing can be effectively reduced, and the finished product can be guaranteed to be completely bubble-free through subsequent defoaming treatment.
Example 2
On the basis of embodiment 1, a specific auxiliary substrate 5 and a mounting and dismounting manner thereof are provided, the auxiliary substrate 5 is configured in a rectangular frame shape, and the raw material upper sheet 3 is framed inside thereof and is attached and fixed by the easy-tear tape 50.
Furthermore, the telescopic part adopts a spring thimble 2, and a plurality of telescopic parts are arranged along the edge of the placement area of the jig 1.
Through easily tearing pulling glue 50 with former material upper segment 3 fixed with auxiliary substrate 5's frame, tear after the pressfitting is accomplished and easily tear pulling glue 50 and can dismantle auxiliary substrate 5, the dismouting is convenient. The frame of the auxiliary substrate 5 is arranged on the spring thimble 2 to stably support the raw material upper sheet 3, and the frame-shaped auxiliary substrate 5 can not shield the raw material upper sheet 3 and can be prevented from being clamped between two raw materials during pressing; the spring thimble 2 needs to provide enough compressive resistance to push the auxiliary substrate 5 against the lower sheet 4 of the raw material so as not to contact with the auxiliary substrate, and needs to be compressed to the bottom during pressing so as to completely attach the upper sheet 3 of the raw material to the lower sheet 4 of the raw material.
Example 3
With reference to the method described in embodiment 1 and the improved fixture described in embodiment 2, as shown in fig. 1, a specific hard-to-hard vacuum full-lamination process includes the following steps:
s11: the auxiliary substrate 5 is subjected to easy-tear glue attaching treatment; will easily tear and draw gluey 50 intervals to paste on auxiliary substrate 5 frames, one end stretches into and is convenient for paste fixed former material upper segment 3 in the frame, and another end stretches out the outer 10mm of frame so that follow-up tearing remove, easily tear the size of drawing gluey for length 40mm, wide 20 mm.
S12: the raw material upper sheet 3 is placed in a raw material placing area of the jig 1, and position confirmation is carried out through a CCD camera 6 of the jig 1;
s13: placing the auxiliary substrate 5 on the spring thimble 2 of the jig 1, and adjusting the position through the micrometer positioning block 10 of the jig 1; the upper sheet 3 of the raw material and the auxiliary substrate 5 are aligned, so that the upper sheet 3 of the raw material falls into the frame of the auxiliary substrate 5, and the auxiliary substrate 5 is prevented from shielding the upper sheet 3 of the raw material.
S14: pressing the upper sheet 3 of the raw material and the auxiliary substrate 5; under natural environment, the original material upper sheet 3 is bonded to the easy-tearing glue 50 by adopting pressing equipment, so that the original material upper sheet and the auxiliary substrate 5 are connected into a whole.
S21: OCA attaching is carried out on the lower sheet 4 of the raw material;
s22: taking out the attached auxiliary substrate 5 and the upper sheet 3 of the raw material;
s23: the OCA-pasted lower raw material sheet 4 is placed in the raw material placement area of the jig 1, and the position is confirmed by using the CCD camera 6.
S31: removing the protective film and the OCA release film of the upper sheet 3 of the raw material;
s32: the attached auxiliary substrate 5 and the upper raw material sheet 3 are placed on a spring ejector pin 2 of the jig 1, the height between the upper raw material sheet 3 and the lower raw material sheet 4 is adjusted through the spring ejector pin 2, and the upper raw material sheet 3 and the lower raw material sheet 4 are kept to be separated; the raw material upper sheet 3 is supported on the spring thimble 2 through the frame of the auxiliary substrate 5, and the spring thimble 2 can be set to be height-adjustable or fixed according to the weight of the adhered raw material upper sheet 3 and the auxiliary substrate 5. After the placement, the upper raw material sheet 3 and the lower raw material sheet 4 cannot be contacted, and the top surface of the auxiliary substrate 5 cannot exceed the jig 1, so that the micrometer positioning block 10 on the jig 1 is utilized to adjust the position of the upper raw material sheet 3.
S33: the upper Mark point 30 and the lower Mark point 40 are superposed and aligned through a CCD camera 6 on the jig, and a micrometer positioning block 10 on the jig 1 is used for fine adjustment; when micrometer locating piece 10 finely tunes the position, CCD camera 6 counterpoints, and the log 3 of going up aligns with log 4 accuracy when the Mark point coincidence of two logs.
S34: carrying out vacuum lamination on the upper sheet 3 and the lower sheet 4 of the raw material; the two raw materials are not in contact when placed, and then are pressed in a vacuum environment, so that bubbles between the upper raw material and the lower raw material can be effectively reduced, the subsequent defoaming treatment difficulty is reduced, and finally the product can be completely bubble-free.
S4: after the pressing is finished, quickly taking out the finished product attached to the auxiliary substrate 5; the quick taking-out is considered based on two reasons, firstly, after the finished product is pressed, the lower raw material sheet 4 is attached to the upper raw material sheet 3, the two raw materials are attached to the auxiliary substrate 5, and in order to reduce the gravity borne by the easy-tear glue 50 and avoid the separation of the easy-tear glue 50 and the OCA film of the upper raw material sheet 3, the product is prevented from falling and being damaged, and therefore the product needs to be separated as soon as possible; secondly, after the finished product is pressed, the finished product is taken out quickly, so that the easy-to-tear glue 50 is convenient to tear off, and the finished product and the auxiliary substrate 5 are separated.
S5: functional test and quadratic element test.
Example 4
On the basis of the embodiment 3, parameters of the hard-to-hard vacuum full lamination process are optimized, and specifically, the size of the easy-to-tear glue in the step S11 is 40mm in length and 20mm in width.
Further, step S21 is performed with OCA attachment using soft-to-hard attachment equipment.
Further, step S14, adjusting the pressure of the vacuum pressing equipment to 0.10-0.15 MPa; and carrying out vacuum lamination of the auxiliary substrate and the upper sheet of the raw material under a normal environment.
Further, in step S32, the distance between the upper sheet and the lower sheet of the raw material is not less than 8mm, and the top surface of the auxiliary substrate is lower than or flush with the top surface of the jig. According to the height of tool 1, can not let auxiliary substrate 5 exceed the top surface of tool 1, if surpass, auxiliary substrate 5 can not utilize micrometer locating piece 10 to finely tune. The predetermined distance is not less than 8mm because the gap is too small, the upper raw material sheet 3 and the auxiliary substrate 5 support on the pogo pins 2 and then have gravity, and cannot contact the lower raw material sheet 4 even after being pressed down.
Further, the coincidence accuracy of the Mark point 30 on the upper plate and the Mark point 40 on the lower plate is ≦ 0.2mm in step S33.
Further, the process parameters of step S34 are: the pressure is 0.1-0.2 Mpa, the vacuum degree is-98 PSI-100 PSI, and the pressing time is 15-20 s.
Further, in step S4, the finished product is taken out within 3S-5S.
Example 5
And finally, testing the prepared product, wherein compared with the original product, the product prepared by the method has the advantages that the product precision is obviously improved, and the finally prepared finished product has no bubbles.
(1) Product accuracy detection
Randomly extracting 15 products, and performing precision test by using a quadratic element tester, wherein as shown in table 1, the bonding precision of the upper sheet and the lower sheet of the raw material of the finished product obtained by the method is greatly improved, the bonding deviation of the original method is large, the precision is unstable, and the deviation is even more than 0.35 mm; the product obtained by the invention has the precision controlled within 0.2mm, the average precision of about 0.1mm, small precision fluctuation and the total standard deviation of only about 0.06 mm.
Table 1 product accuracy testing data table
Figure DEST_PATH_IMAGE001
(2) Product bubble detection
In the existing 1:1 vacuum laminating process, the raw materials are laminated with more bubbles, the subsequent defoaming treatment is difficult, and the prepared finished product still contains a small amount of bubbles. By adopting the process steps described in the embodiment, the upper and lower raw materials are subjected to vacuum lamination to generate few bubbles, and the finished product prepared by defoaming treatment is completely free of bubbles. 88 finished products are randomly extracted for bubble detection, 87 of the finished products have no bubbles, only 1 product has bubbles with the size of 0.8mm, the rejection rate of the product is greatly reduced, and the quality of the product is obviously improved.
The foregoing is only a preferred embodiment of the present invention, and the present invention is not limited thereto in any way, and any simple modification, equivalent replacement and improvement made to the above embodiment within the spirit and principle of the present invention still fall within the protection scope of the present invention.

Claims (10)

1. A hard-to-hard vacuum full lamination process is characterized by comprising the following steps:
s1: the upper piece of the raw material is fixed on an auxiliary substrate in a detachable way, and the auxiliary substrate does not shield the upper piece of the raw material;
s2: installing an extensible member outside a raw material placing area of the jig, placing a raw material lower sheet in the raw material placing area, supporting an auxiliary substrate fixed with a raw material upper sheet on the extensible member, and setting the height of the extensible member to keep the raw material upper sheet and the raw material lower sheet separated;
s3: pressing the upper sheet and the lower sheet of the raw material fixed on the auxiliary substrate in vacuum;
s4: and separating the finished product from the auxiliary substrate.
2. The hard-to-hard vacuum full lamination process according to claim 1, wherein the auxiliary substrate is configured in a rectangular frame shape, and the upper sheet of the raw material is detachably fixed inside the auxiliary substrate; the extensible member adopts the spring thimble, and it is a plurality of to follow the regional edge installation of placing of tool.
3. The hard-to-hard vacuum full lamination process according to claim 2, wherein the step S1 comprises the steps of:
s11: the auxiliary substrate is subjected to easy-tear glue lamination treatment;
s12: placing the raw material upper sheet in a raw material placing area of the jig, and confirming the position of the raw material upper sheet through a CCD camera;
s13: and arranging the auxiliary substrate on a spring thimble of the jig, and adjusting the position through a micrometer positioning block of the jig.
S14: and pressing the upper sheet of the raw material and the auxiliary substrate.
4. The hard-to-hard vacuum full lamination process according to claim 2, wherein the step S2 comprises the steps of:
s21: carrying out OCA (optical clear adhesive) attaching on the lower sheet of the raw material;
s22: taking out the attached auxiliary substrate and the original upper sheet;
s23: the raw material placing area of the jig is placed in the raw material lower piece with the OCA attached, and the CCD camera is used for confirming the position.
5. The hard-to-hard vacuum full lamination process according to claim 2, wherein the step S3 comprises the steps of:
s31: removing the protective film and the OCA release film on the raw material;
s32: the attached auxiliary substrate and the upper raw material sheet are arranged on a spring thimble of the jig, the height between the upper raw material sheet and the lower raw material sheet is adjusted through the spring thimble, and the upper raw material sheet and the lower raw material sheet are kept to be separated;
s33: fine adjustment is carried out by using a micrometer positioning block on the jig, and the upper Mark point and the lower Mark point are superposed and aligned through a CCD camera on the jig;
s34: and carrying out vacuum pressing on the upper sheet and the lower sheet of the raw material.
6. The hard-to-hard vacuum full-lamination process according to claim 2, wherein in step S4, the finished product is taken out within 5S to 10S, and then the easy-to-tear glue on the auxiliary substrate is removed.
7. The hard-to-hard vacuum full lamination process according to claim 3, wherein the step S14 is performed under a normal environment to perform vacuum lamination of the auxiliary substrate and the upper sheet of the raw material, and the pressure is 0.10 MPa to 0.15 MPa.
8. The hard-to-hard vacuum full-lamination process according to claim 5, wherein the distance between the upper sheet and the lower sheet of the raw material in step S32 is not less than 8mm, and the top surface of the auxiliary substrate is lower than or flush with the top surface of the jig.
9. The hard-to-hard vacuum full lamination process according to claim 5, wherein the coincidence accuracy of the Mark points of the upper plate and the Mark points of the lower plate in the step S33 is less than or equal to 0.2 mm.
10. The hard-to-hard vacuum full lamination process according to claim 5, wherein the process parameters of step S34 are: 0.1 Mpa-0.2 Mpa, vacuum degree: -98 PSI ~ -100 PSI, press fit time: 15s to 20 s.
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