CN110809386A - Semiconductor switch control device - Google Patents
Semiconductor switch control device Download PDFInfo
- Publication number
- CN110809386A CN110809386A CN201911065937.6A CN201911065937A CN110809386A CN 110809386 A CN110809386 A CN 110809386A CN 201911065937 A CN201911065937 A CN 201911065937A CN 110809386 A CN110809386 A CN 110809386A
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- fixedly connected
- groove
- semiconductor switch
- switch control
- control device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of semiconductors and discloses a semiconductor switch control device which comprises a machine body, wherein a heat dissipation groove is formed in the right side of the machine body, sliding grooves are formed in the front side and the rear side of the heat dissipation groove, a placing cavity is formed in the inner wall of each sliding groove, a rack is fixedly connected to the inner wall of each placing cavity, a heat dissipation device is connected to the inner portion of each sliding groove in a sliding mode and meshed with the corresponding rack, a fixing device is fixedly connected to the top of each heat dissipation device, and a fixing hole is formed in the outer side of the machine body. This semiconductor switch controlling means, through setting up heat abstractor, and then when organism electronic component is overheated, heat abstractor will carry out all-round radiating processing to the electronic component in the organism in the in-process that reciprocates in the outside of organism to can make the electronic component in the organism obtain all-round and rapid cooling and handle, the potential safety hazard that from this reduces has increased electronic component's life.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a semiconductor switch control device.
Background
At present, a semiconductor switch control device mostly adopts a box type, but as is known, after an electronic element is electrified to operate, heat energy is generated, if the electronic element is not subjected to heat dissipation treatment, a great potential safety hazard is generated, and the service life of the electronic element is influenced.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a semiconductor switch control device which has the advantages of omnibearing and quick heat dissipation of electronic elements in a box and the like, and solves the problem that the box type semiconductor switch control device cannot effectively dissipate heat of the electronic elements in the box.
(II) technical scheme
In order to realize the purpose of comprehensively and quickly radiating electronic elements in the box, the invention provides the following technical scheme: the utility model provides a semiconductor switch controlling means, includes the organism, the radiating groove has been seted up on the right side of organism to the spout has all been seted up to both sides around the radiating groove, and has been seted up at the inner wall of spout and has placed the chamber, and at the inner wall fixedly connected with rack of placing the chamber, and the inside sliding connection of spout has heat abstractor, and heat abstractor and rack toothing, at heat abstractor's top fixedly connected with fixing device, has seted up the fixed orifices in the outside of organism.
Preferably, the heat abstractor is including the movable block, pass through support column and first motor fixed connection in the inside of movable block, and the output fixedly connected with fan of first motor, equal fixedly connected with spliced pole in both sides around the movable block, and place the post at the left side fixedly connected with of spliced pole, and place the left end fixedly connected with fixed plate of post, and seted up the recess in the inside of placing the post, inner wall fixedly connected with second motor at the recess, and the output of second motor wear out the fixed plate and with gear fixed connection, and gear and rack toothing, at the left side fixedly connected with balancing column of gear, and the left end of balancing column is worn out the spout and is extended to the organism and pass through bearing and fly leaf fixed connection, and the top fixedly connected with fixing device of the fixed plate that is located the front side and fly leaf.
Preferably, fixing device is including the fixed block, at the bottom fixedly connected with supporting shoe of fixed block, and the bottom and the heat abstractor fixed connection of supporting shoe, the dead slot has been seted up in the inside of fixed block, and the activity groove has been seted up in the bottom of dead slot, and at the inner wall fixedly connected with rotating electrical machines of dead slot, and the output fixedly connected with threaded rod of rotating electrical machines, the movable tube is equipped with to the outside spiral shell at the threaded rod, and the bottom fixedly connected with quarter butt of movable tube, and the bottom sliding connection of quarter butt is at the activity inslot, at the front end fixedly connected with kicking rod of movable tube.
Preferably, the ejector rod is a hollow ejector rod, and the diameter of the hollow inside of the ejector rod is larger than that of the threaded rod and smaller than that of the movable tube.
Preferably, the bottom of the supporting block is provided with a gear groove, and the width of the gear groove is larger than the thickness of the gear.
Preferably, the diameter of the fixing holes is larger than that of the top stick, and the number of the fixing holes is three.
Preferably, the movable tube is internally provided with a threaded hole matched with the thread on the outer side of the threaded rod.
(III) advantageous effects
Compared with the prior art, the invention provides a semiconductor switch control device, which has the following beneficial effects:
1. this semiconductor switch controlling means, through setting up heat abstractor, and then when organism electronic component is overheated, heat abstractor will carry out all-round radiating processing to the electronic component in the organism in the in-process that reciprocates in the outside of organism to can make the electronic component in the organism obtain all-round and rapid cooling and handle, the potential safety hazard that from this reduces has increased electronic component's life.
2. This semiconductor switch controlling means, through the cooperation between fixing device and the fixed orifices, and then fixing device can fix heat abstractor in a certain position, can reach the effect of carrying out unilateral rapid cooling to the higher position of electronic component heat from this to the radiating efficiency and the application range of device have been promoted.
3. This semiconductor switch controlling means, through the cooperation between first motor and the fan, and then when opening first motor, the output of first motor drives the fan and blows off the air current in to the organism, reduces the inside temperature of organism from this, through the cooperation between rotating electrical machines and the threaded rod, and then when opening rotating electrical machines, the rotation of threaded rod makes the top rod get into the fixed orifices, makes fixing device fix heat abstractor at present position from this.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor switch control device according to the present invention;
fig. 2 is a schematic structural diagram of a heat dissipation device of a semiconductor switch control device according to the present invention;
fig. 3 is a sectional view of a fixing device of a semiconductor switch control device according to the present invention;
fig. 4 is a cross-sectional view of a semiconductor switch control device placement column structure according to the present invention.
In the figure: 1. a body; 2. a chute; 3. a rack; 4. a placement chamber; 5. a heat sink; 501. a moving block; 502. a first motor; 503. a second motor; 504. placing the column; 505. connecting columns; 506. a fixing plate; 507. a gear; 508. a movable plate; 509. a fan; 510. a support pillar; 511. a balancing column; 512. a groove; 6. a fixing device; 601. a fixed block; 602. an empty groove; 603. a rotating electric machine; 604. a movable tube; 605. a short bar; 606. a movable groove; 607. a top stick; 608. a support block; 609. a threaded rod; 7. and (7) fixing holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, a semiconductor switch control device comprises a body 1, a heat sink is disposed on the right side of the body 1, the heat sink is an initial heat dissipation manner of the device, sliding grooves 2 are disposed on the front and rear sides of the heat sink, a placing cavity 4 is disposed on the inner wall of the sliding groove 2, a rack 3 is fixedly connected to the inner wall of the placing cavity 4, a heat dissipation device 5 is slidably connected to the inside of the sliding groove 2, the heat dissipation device 5 is engaged with the rack 3, and when an electronic component of the body 1 is overheated, the heat dissipation device 5 performs an omnidirectional heat dissipation process on the electronic component in the body 1 during the up and down movement process on the outer side of the body 1, so that the electronic component in the body 1 can be subjected to an omnidirectional and rapid cooling process, thereby reducing the potential safety hazard and prolonging the service life of the electronic component, at heat abstractor 5's top fixedly connected with fixing device 6, through the cooperation between fixing device 6 and the fixed orifices 7, and then fixing device 6 can fix heat abstractor 5 in a certain position, can reach the effect of carrying out unilateral rapid cooling to the higher position of electronic component heat from this to promoted the device's radiating efficiency and application range, seted up fixed orifices 7 in the outside of organism 1.
Specifically, the heat dissipation device 5 includes a moving block 501, the moving block 501 is a hollow moving block, the inside of the moving block 501 is fixedly connected to a first motor 502 through two sets of supporting columns 510, an output end of the first motor 502 is fixedly connected to a fan 509, through cooperation between the first motor 502 and the fan 509, when the first motor 502 is turned on, the output end of the first motor 502 drives the fan 509 to blow air flow into the machine body 1, so as to reduce the temperature inside the machine body 1, the fan 509 is located on the right side of the heat dissipation groove, connecting columns 505 are fixedly connected to the front and rear sides of the moving block 501, the connecting columns 505 are used for connecting the moving block 501 and the placing columns 504, and placing columns 504 are fixedly connected to the left side of the connecting columns 505, fixing plates 506 are fixedly connected to the left ends of the placing columns 504, the fixing plates 506 are located outside the sliding grooves 2, and grooves 512 are formed in the placing columns, the inner wall of the groove 512 is fixedly connected with a second motor 503, the output end of the second motor 503 penetrates through the fixing plate 506 and is fixedly connected with a gear 507, the gear 507 is meshed with the rack 3, the left side of the gear 507 is fixedly connected with a balance column 511, the left end of the balance column 511 penetrates through the sliding chute 2 and extends to the machine body 1 and is fixedly connected with a movable plate 508 through a bearing, when the first motor 502 and the second motor 503 are started, the output end of the first motor 502 drives the fan 509 to blow heat dissipation airflow into the machine body 1 through the heat dissipation groove, the output end of the second motor 503 drives the gear 507 and the rack 3 to form dislocation of teeth so as to generate reverse motion, thereby the heat dissipation device 5 can move up and down on the outer side of the machine body 1, and the top of the fixing plate 506 and the movable plate 508 which are positioned on the front side are fixedly connected with a fixing device 6.
Specifically, the fixing device 6 includes a fixing block 601, the length of the fixing block 601 does not affect the movement of the rack 3 and the gear 507, the fixing block 601 does not touch the machine body 1, a supporting block 608 is fixedly connected to the bottom of the fixing block 601, the bottom of the supporting block 608 is fixedly connected to the heat sink 5, a hollow groove 602 is formed in the fixing block 601, a movable groove 606 is formed in the bottom of the hollow groove 602, a rotating motor 603 is fixedly connected to the inner wall of the hollow groove 602, a threaded rod 609 is fixedly connected to the output end of the rotating motor 603, a movable tube 604 is screwed on the outer side of the threaded rod 609, a short rod 605 is fixedly connected to the bottom of the movable tube 604, the bottom end of the short rod 605 is slidably connected to the movable groove 606, the sliding of the short rod 605 in the movable groove 606 keeps the balance of the movable tube 604, and if the threaded rod 609 does not slide in the movable groove 606 during, the movable tube 604 will rotate with the threaded rod 609 instead of moving, and a top stick 607 is fixedly connected to the front end of the movable tube 604.
Specifically, the top rod 607 is a hollow top rod, and the diameter of the hollow inside of the top rod 607 is larger than the diameter of the threaded rod 609 and smaller than the diameter of the movable tube 604, so that the movement of the top rod 607 does not affect the threaded rod 609 and the movable tube 604.
Specifically, a gear groove is formed in the bottom of the supporting block 608, and the width of the gear groove is larger than the thickness of the gear 507, so that the gear 507 is not clamped by the supporting block 608 when rotating.
Specifically, the diameter of the fixing holes 7 is larger than that of the top rod 607, and the number of the fixing holes 7 is three, thereby dividing the machine body 1 into three parts, and the three parts correspond to the three groups of fixing holes 7 respectively.
Specifically, the movable tube 604 is internally provided with a threaded hole matched with the thread on the outer side of the threaded rod 609, so that when the threaded rod 609 rotates, the movable tube 604 moves on the outer side of the threaded rod 609, and through the matching between the rotating motor 603 and the threaded rod 609, when the rotating motor 603 is started, the top rod 607 enters the fixing hole 7 through the rotation of the threaded rod 609, and the fixing device 6 fixes the heat dissipation device 5 at the current position.
The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.
When the heat dissipation device 5 is moved outside the machine body 1, the large amount of generated airflow can carry out omnibearing and rapid heat dissipation treatment on the electronic components of the machine body 1, and if the heat of the electronic components at a certain position is too high, the heat dissipation device 5 only needs to be moved to the position with too high heat, and the top stick 607 is aligned with the fixing hole 7 closest to the current position, then, the rotating motor 603 is started, so that the output end of the rotating motor 603 drives the threaded rod 609 to rotate, the threaded rod 609 rotates to drive the top rod 607 to enter the fixing hole 7 through the movable tube 604, the top rod 607 fixes the heat dissipation device 5 at the current position, and the heat dissipation device 5 can independently and rapidly perform heat dissipation treatment on the electronic element in the current position.
In summary, in the semiconductor switch control device, the heat dissipation device 5 is disposed, and when the electronic components of the body 1 are overheated, the heat dissipation device 5 performs the all-around heat dissipation treatment on the electronic components in the body 1 in the process of moving up and down outside the body 1, so as to cool the electronic components in the body 1 all around and rapidly, thereby reducing the potential safety hazard and prolonging the service life of the electronic components.
Through the cooperation between fixing device 6 and the fixed orifices 7, and then fixing device 6 can fix heat abstractor 5 in a certain position, can reach the effect of carrying out unilateral rapid cooling to the higher position of electronic component heat from this to the radiating efficiency and the application range of the device have been promoted.
Through the cooperation between the first motor 502 and the fan 509, when the first motor 502 is turned on, the output end of the first motor 502 drives the fan 509 to blow air flow into the machine body 1, so as to reduce the temperature inside the machine body 1, and through the cooperation between the rotating motor 603 and the threaded rod 609, when the rotating motor 603 is turned on, the top rod 607 enters the fixing hole 7 through the rotation of the threaded rod 609, so that the fixing device 6 fixes the heat dissipation device 5 at the current position.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A semiconductor switch control device comprises a machine body (1), and is characterized in that: the radiating groove has been seted up on the right side of organism (1), and spout (2) have all been seted up to both sides around the radiating groove, and seted up at the inner wall of spout (2) and placed chamber (4), and inner wall fixedly connected with rack (3) placing chamber (4), and the inside sliding connection of spout (2) has heat abstractor (5), and heat abstractor (5) and rack (3) meshing, at top fixedly connected with fixing device (6) of heat abstractor (5), fixed orifices (7) have been seted up in the outside of organism (1).
2. The semiconductor switch control device according to claim 1, characterized in that: the heat dissipation device (5) comprises a moving block (501), the inside of the moving block (501) is fixedly connected with a first motor (502) through a supporting column (510), an output end of the first motor (502) is fixedly connected with a fan (509), connecting columns (505) are fixedly connected to the front side and the rear side of the moving block (501), the left side of each connecting column (505) is fixedly connected with a placing column (504), a left end of each placing column (504) is fixedly connected with a fixing plate (506), a groove (512) is formed in each placing column (504), a second motor (503) is fixedly connected to the inner wall of each groove (512), the output end of each second motor (503) penetrates out of the fixing plate (506) and is fixedly connected with a gear (507), the gear (507) is meshed with a rack (3), a balance column (511) is fixedly connected to the left side of the gear (507), the left end of the balance column (511) penetrates out of a sliding groove (2) and extends to a machine body (1) through a bearing and the moving plate (508) Fixedly connected, and the top of the fixed plate (506) and the movable plate (508) positioned at the front side are fixedly connected with a fixing device (6).
3. The semiconductor switch control device according to claim 1, characterized in that: fixing device (6) are including fixed block (601), bottom fixedly connected with supporting shoe (608) at fixed block (601), and the bottom and heat abstractor (5) fixed connection of supporting shoe (608), dead slot (602) have been seted up in the inside of fixed block (601), and movable groove (606) have been seted up in the bottom of dead slot (602), and inner wall fixedly connected with rotating electrical machines (603) at dead slot (602), and the output fixedly connected with threaded rod (609) of rotating electrical machines (603), movable tube (604) are equipped with to the outside spiral shell at threaded rod (609), and the bottom fixedly connected with quarter butt (605) of movable tube (604), and the bottom sliding connection of quarter butt (605) is in movable groove (606), at the front end fixedly connected with top rod (607) of movable tube (604).
4. The semiconductor switch control device according to claim 3, characterized in that: the top rod (607) is a hollow top rod, and the diameter of the hollow part in the top rod (607) is larger than that of the threaded rod (609) and smaller than that of the movable tube (604).
5. A semiconductor switch control device according to claim 2 or 3, characterized in that: the bottom of the supporting block (608) is provided with a gear groove, and the width of the gear groove is larger than the thickness of the gear (507).
6. The semiconductor switch control device according to claim 1 or 3, characterized in that: the diameter of the fixing holes (7) is larger than that of the top rods (607), and the number of the fixing holes (7) is three.
7. The semiconductor switch control device according to claim 1, characterized in that: the movable tube (604) is internally provided with a threaded hole matched with the thread on the outer side of the threaded rod (609).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911065937.6A CN110809386A (en) | 2019-11-04 | 2019-11-04 | Semiconductor switch control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911065937.6A CN110809386A (en) | 2019-11-04 | 2019-11-04 | Semiconductor switch control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110809386A true CN110809386A (en) | 2020-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911065937.6A Pending CN110809386A (en) | 2019-11-04 | 2019-11-04 | Semiconductor switch control device |
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| Country | Link |
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| CN (1) | CN110809386A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225953A (en) * | 2021-05-07 | 2021-08-06 | 江西雕视信息技术股份有限公司 | Device and method capable of supporting high-resolution point-to-point display coding and decoding |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206226914U (en) * | 2016-11-18 | 2017-06-06 | 浙江亿邦通信科技股份有限公司 | A kind of equipment with heat abstractor |
| CN206849988U (en) * | 2017-06-28 | 2018-01-05 | 福建德驰新能源科技有限公司 | A kind of heat abstractor for new energy car battery |
| CN107732680A (en) * | 2017-10-24 | 2018-02-23 | 佛山杰致信息科技有限公司 | A kind of Multifunctional power distribution cabinet heat abstractor |
| CN208078871U (en) * | 2018-04-02 | 2018-11-09 | 东莞立德电子有限公司 | Has the Switching Power Supply of new radiator |
-
2019
- 2019-11-04 CN CN201911065937.6A patent/CN110809386A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206226914U (en) * | 2016-11-18 | 2017-06-06 | 浙江亿邦通信科技股份有限公司 | A kind of equipment with heat abstractor |
| CN206849988U (en) * | 2017-06-28 | 2018-01-05 | 福建德驰新能源科技有限公司 | A kind of heat abstractor for new energy car battery |
| CN107732680A (en) * | 2017-10-24 | 2018-02-23 | 佛山杰致信息科技有限公司 | A kind of Multifunctional power distribution cabinet heat abstractor |
| CN208078871U (en) * | 2018-04-02 | 2018-11-09 | 东莞立德电子有限公司 | Has the Switching Power Supply of new radiator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225953A (en) * | 2021-05-07 | 2021-08-06 | 江西雕视信息技术股份有限公司 | Device and method capable of supporting high-resolution point-to-point display coding and decoding |
| CN113225953B (en) * | 2021-05-07 | 2022-12-13 | 江西雕视信息技术股份有限公司 | Device and method capable of supporting high-resolution point-to-point display coding and decoding |
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Address after: 221600 Science and Technology Park A5, Peixian Economic Development Zone, Xuzhou City, Jiangsu Province Applicant after: Hans semiconductor (Jiangsu) Co.,Ltd. Address before: 221600 Science and Technology Park A5, Peixian Economic Development Zone, Xuzhou City, Jiangsu Province Applicant before: Hans Automation Technology (Jiangsu) Co.,Ltd. |
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Application publication date: 20200218 |