CN110791751A - PCB board copper plating equipment - Google Patents

PCB board copper plating equipment Download PDF

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Publication number
CN110791751A
CN110791751A CN201911185577.3A CN201911185577A CN110791751A CN 110791751 A CN110791751 A CN 110791751A CN 201911185577 A CN201911185577 A CN 201911185577A CN 110791751 A CN110791751 A CN 110791751A
Authority
CN
China
Prior art keywords
motor
copper
copper plating
lid
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911185577.3A
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Chinese (zh)
Inventor
龙佳志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hengyang Jinhong Fine Chemical Co Ltd
Original Assignee
Hengyang Jinhong Fine Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hengyang Jinhong Fine Chemical Co Ltd filed Critical Hengyang Jinhong Fine Chemical Co Ltd
Priority to CN201911185577.3A priority Critical patent/CN110791751A/en
Publication of CN110791751A publication Critical patent/CN110791751A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1628Specific elements or parts of the apparatus
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1632Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a PCB copper plating device, which comprises a device main body and a device main body, wherein a copper deposition cylinder is arranged at the top end of the output end of a first motor, two oppositely-opened covers are arranged at the top end of the copper deposition cylinder, a third motor for controlling the opening and closing of the covers is arranged at a rotating shaft, a filtering device is arranged on the right side wall of the device main body, a fan is arranged on the left side of the filtering device main body, an electric heating wire is arranged at an air outlet of the fan, a placing box fixed on the side wall of the device main body is arranged on the left side of the electric heating wire, a flow-out hole is arranged at the bottom of the placing box, a connecting pipe is arranged on the flow-out hole, the other end of the connecting pipe is connected with the side wall of the copper deposition cylinder, a telescopic rod is arranged above the copper deposition cylinder, a hook is arranged at the bottom of the, the bottom of the telescopic rod is provided with the copper deposition cylinder, so that the copper plating speed is increased, and the quality is also improved.

Description

PCB board copper plating equipment
Technical Field
The invention relates to the technical field of copper plating, in particular to a PCB copper plating device.
Background
PCB boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has been over 100 years old, its design is mainly territory design, and the main advantages of adopting circuit board are that the errors of wiring and assembling can be greatly reduced, and the automation level and production labour rate can be raised. The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board. Since the printed circuit board is not a general end product, it is somewhat confusing in the definition of the name.
Electroless copper plating is a process in circuit board manufacturing, and is also commonly referred to as copper deposition or voiding as an autocatalytic redox reaction. The first treatment with activator to make the surface of insulating base material adsorb an active layer of particles is usually metal palladium particles (palladium is a very expensive metal, the price is high and is always rising, and there is practical colloidal copper technology in operation at present abroad to reduce the cost), copper ions are firstly reduced on the active metal palladium particles, and the reduced metal copper crystal nucleus itself becomes the catalytic layer of copper ions, so that the reduction reaction of copper is continuously carried out on the surface of the new copper crystal nucleus. The existing copper plating device has the defects of easy bubble generation, influence on the quality of a PCB, complex structure and incomplete copper plating, so that the development of the PCB copper plating device which is not easy to generate bubbles, does not influence the quality of the PCB, has a simple structure and can completely plate copper is urgently needed.
Application number in the prior art: CN201620485028.3 discloses a copper facing device, especially relates to a PCB board copper facing device. The invention aims to solve the technical problem of providing a PCB copper plating device which is not easy to generate bubbles, does not influence the quality of a PCB, has a simple structure and can fully plate copper. In order to solve the technical problem, the invention provides a PCB copper plating device which comprises a bottom plate, a copper deposition cylinder, a filter screen, a support rod, a left side plate, a top plate, a left bearing seat, a nut, a screw rod, a right bearing seat, a motor II, a cylinder, a hook, a motor III, a rotating shaft, a cover, an electromagnet III, an iron box, a steel ball, a connecting rod, an electromagnet I, an electromagnet II, a spring and a motor I, wherein the left side plate, the copper deposition cylinder and the support rod are sequentially arranged on the bottom plate from left to right, and the top plate is connected above the left side plate. The invention achieves the effects of difficult bubble generation, no influence on the quality of the PCB, simple structure and capability of plating copper comprehensively. Above technical scheme has very big defect, and first heavy copper hanging basket is stood in heavy copper box for copper facing speed is slow, and the second hair-dryer is polluted by the dust in the outside air easily when air-drying the copper-plated PCB board with higher speed, makes its copper facing quality greatly reduced, and the third sinks the copper jar when copper facing and belongs to open state, needs a large amount of heats to maintain the temperature of sinking copper jar solution, extravagant energy very much.
Disclosure of Invention
The invention aims to provide a PCB copper plating device to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a PCB board copper plating device comprises a device main body, wherein the device main body is provided with a first motor with an upward output end at the bottom end inside the device main body, a copper deposition cylinder is arranged at the top end of the output end of the first motor, two oppositely-opened covers are arranged at the top end of the copper deposition cylinder, the two covers are rotatably connected with the copper deposition cylinder through a rotating shaft, a third motor for controlling a cover switch is arranged at the rotating shaft, a filtering device is arranged on the right side wall of the device main body, a fan is arranged on the left side of the filtering device main body, a heating wire is arranged at the air outlet of the fan, a placing box fixed on the side wall of the device main body is arranged on the left side of the heating wire, an outlet hole is formed in the bottom of the placing box, a connecting pipe is arranged on the outlet hole, the other end of the connecting pipe is connected with the side wall of the copper deposition cylinder, the device is characterized in that a second motor is arranged at the upper left corner of the top end in the main body, a lead screw is arranged at the output end of the second motor, a lead screw nut is sleeved on the lead screw, the bottom of the lead screw nut is connected with the top end of the telescopic rod, and a copper deposition cylinder is arranged at the bottom of the telescopic rod.
Further, filter equipment strains the lid including pipeline, first lid and second of straining, the pipeline with establish the air intake department at the fan, the pipeline with first strain lid threaded connection, first strain lid and second strain lid threaded connection, first strain and cover with first straining and all be equipped with the filter screen, first strain and cover and second strain and be equipped with the cavity between the lid, be equipped with active carbon in the cavity.
Further, the periphery of first motor is equipped with fixed frame, it is fixed through the bearing frame between fixed frame and the motor main shaft, the top of first motor is passed through the mounting panel with the bottom of heavy copper cylinder and is connected, the bottom of second motor is equipped with the motor fixed plate, the inside wall fixed connection of fixed plate and device main part, pass through bolt fixed connection between motor fixed plate and the second motor.
Further, the center of the hinge joint of the two covers is provided with a through hole.
Further, the both ends of lead screw all are equipped with the fixed plate, two the top fixed connection of fixed block and device main part, two all be equipped with the bearing frame in the fixed plate, the both ends of lead screw are established in the bearing frame.
Further, the screw rod nut is fixedly connected with the top end of the telescopic rod through a bolt, and the hook is fixedly connected with the output end of the bottom of the telescopic rod through a bolt.
Furthermore, the copper deposition cylinder is communicated with the placing box through a connecting pipe.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the motor is arranged at the bottom of the copper deposition cylinder, so that the motor rotates slowly when the PCB is plated with copper, and the copper plating time is greatly accelerated;
2. the air inlet of the fan is provided with the filtering device, and the filtering device is internally provided with the activated carbon, so that impurities in the air are filtered, and the copper plating quality is greatly improved;
3. the top of the copper deposition cylinder is provided with a cover, the cover is covered during copper plating, and the hook is avoided through the hole, so that the solution in the copper deposition cylinder is cooled for a long time.
Drawings
FIG. 1 is a schematic view of an internal structure of a PCB copper plating apparatus according to the present invention;
FIG. 2 is a top view of a copper deposition cylinder of the PCB copper plating apparatus of the present invention;
fig. 3 is a disassembled perspective view of a filtering device of the copper plating device for the PCB.
The reference numerals are explained below:
in the figure: 1. a device main body; 2. a cover; 3. a rotating shaft; 4. a copper deposition cylinder; 5. a first motor; 6. a fixing frame; 7. a connecting pipe; 8. an outflow hole; 9. an electric heating wire; 10. a filtration device; 11. a fan; 12. placing a box; 13. hooking; 14. a telescopic rod; 15. a fixing plate; 16. a screw rod; 17. a feed screw nut; 18. a second motor; 19. a motor fixing plate; 20. a third motor; 21. through the hole; 22. a pipeline; 23. a first filter cover; 24. a cavity; 25. a second filter cover; 26. and (5) filtering by using a filter screen.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-3, the present invention provides a technical solution:
a PCB board copper plating device comprises a device main body 1, the device main body 1 is provided, a first motor 5 with an upward output end is arranged at the bottom end inside the device main body 1, a copper deposition cylinder 4 is arranged at the top end of the output end of the first motor 5, two oppositely-opened covers 2 are arranged at the top end of the copper deposition cylinder 4, the two covers 2 are rotatably connected with the copper deposition cylinder 4 through a rotating shaft 2, a third motor 20 for controlling the opening and closing of the covers 2 is arranged at the position of the rotating shaft 2, a filtering device 10 is arranged on the right side wall of the device main body 1, a fan 11 is arranged on the left side of the main body 1 of the filtering device 10, a heating wire 9 is arranged at an air outlet of the fan 11, a placing box 12 fixed on the side wall of the device main body 1 is arranged on the left side of the heating wire 9, an outflow hole 8 is arranged at the bottom of the placing box 12, a connecting pipe 7 is, the top of heavy copper jar 4 is equipped with telescopic link 14, the bottom of telescopic link 14 is equipped with couple 13, the inside top upper left corner of device main part 1 is equipped with second motor 18, the output of second motor 18 is equipped with lead screw 16, the cover is equipped with screw-nut 17 on the lead screw 16, screw-nut 17's bottom with telescopic link 14 top is connected, the bottom of telescopic link 14 is equipped with heavy copper jar 4.
In order to further improve a PCB board copper facing device's service function, filter equipment 10 includes that pipeline 22, first filter lid 23 and second filter lid 25, pipeline 22 with establish the air intake department at fan 11, pipeline 22 with first filter lid 23 threaded connection, first filter lid 23 and second filter lid 25 threaded connection, all be equipped with filter screen 26 on first filter lid 23 and the first filter lid 23, be equipped with cavity 24 between first filter lid 23 and the second filter lid 25, be equipped with active carbon in the cavity 24.
In order to further improve a PCB board copper facing device's service function, the periphery of first motor 5 is equipped with fixed frame 6, it is fixed through the bearing frame between fixed frame 6 and the motor main shaft, the top of first motor 5 is passed through the mounting panel with the bottom of heavy copper cylinder 4 and is connected, the bottom of second motor 18 is equipped with motor fixed plate 19, the inside wall fixed connection of fixed plate 1519 and device main part 1, pass through bolt fixed connection between motor fixed plate 19 and the second motor 18.
In order to further improve the use function of the PCB copper plating device, the center of the hinged part of the two covers 2 is provided with a through hole 21.
In order to further improve the service function of the PCB copper plating device, the two ends of the screw rod 16 are respectively provided with a fixing plate 15, two fixing blocks are fixedly connected with the top end of the device main body 1, two bearing seats are respectively arranged in the fixing plates 15, and the two ends of the screw rod 16 are arranged in the bearing seats.
In order to further improve the use function of the PCB copper plating device, the lead screw nut 17 is fixedly connected with the top end of the telescopic rod 14 through a bolt, and the hook 13 is fixedly connected with the output end at the bottom of the telescopic rod 14 through a bolt.
In order to further improve the use function of the PCB copper plating device, the copper deposition cylinder 4 is communicated with the placing box 12 through a connecting pipe 7.
The working principle is as follows: when the copper plating device is used, the second motor 18 is started firstly, then the lead screw 16 is driven to rotate, the lead screw 16 drives the lead screw nut 17 to move rightwards, the lead screw nut 17 drives the telescopic rod 14 to move rightwards, when the lead screw moves to the rightmost end, the copper plating hanging basket is placed on the hook 13, then the steps are operated in the reverse direction, the copper plating hanging basket is moved to the top end of the copper plating cylinder 4, then the telescopic rod 14 is started to extend, the copper plating hanging basket falls into the copper plating cylinder, the first motor 5 is started to drive the copper plating cylinder 4 to rotate, after copper plating is completed, the telescopic rod 14 is contracted, the second motor 18 is started to move the copper plating hanging basket into the placing box 12, the fan 11 and the electric heating wire 9 are started to dry the copper plating PCB in an accelerated mode, and redundant solution flows into the.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (7)

1. The utility model provides a PCB board copper plating equipment, includes device main part (1), its characterized in that: the device comprises a device body (1), wherein a first motor (5) with an upward output end is arranged at the bottom end inside the device body (1), a copper deposition cylinder (4) is arranged at the top end of the output end of the first motor (5), two covers (2) which are split are arranged at the top end of the copper deposition cylinder (4), the two covers (2) are rotatably connected with the copper deposition cylinder (4) through a rotating shaft (2), a third motor (20) for controlling the opening and closing of the covers (2) is arranged at the rotating shaft (2), a filtering device (10) is arranged on the right side wall of the device body (1), a fan (11) is arranged on the left side of the main body (1) of the filtering device (10), an electric heating wire (9) is arranged at an air outlet of the fan (11), a placing box (12) fixed on the side wall of the device body (1) is arranged on the left side of the electric heating wire (9), and an outflow hole (8), be equipped with connecting pipe (7) on outlet (8), the other end of connecting pipe (7) is connected with heavy copper jar (4) lateral wall, the top of heavy copper jar (4) is equipped with telescopic link (14), the bottom of telescopic link (14) is equipped with couple (13), the inside top upper left corner of device main part (1) is equipped with second motor (18), the output of second motor (18) is equipped with lead screw (16), the cover is equipped with screw-nut (17) on lead screw (16), the bottom of screw-nut (17) with telescopic link (14) top is connected, the bottom of telescopic link (14) is equipped with heavy copper jar (4).
2. The PCB copper plating device of claim 1, wherein: filter equipment (10) strains lid (25) including pipeline (22), first strain lid (23) and second, pipeline (22) and the air intake department of establishing fan (11), pipeline (22) with first strain lid (23) threaded connection, first strain lid (23) and second strain lid (25) threaded connection, first strain all be equipped with filter screen (26) on lid (23) and the first lid (23) of straining, first strain and be equipped with cavity (24) between lid (25) of straining (23) and second, be equipped with activated carbon in cavity (24).
3. The PCB copper plating device of claim 1, wherein: the periphery of first motor (5) is equipped with fixed frame (6), it is fixed through the bearing frame between fixed frame (6) and the motor main shaft, the top of first motor (5) is passed through the mounting panel with the bottom of heavy copper jar (4) and is connected, the bottom of second motor (18) is equipped with motor fixed plate (19), the inside wall fixed connection of fixed plate (15) (19) and device main part (1), through bolt fixed connection between motor fixed plate (19) and second motor (18).
4. The PCB copper plating device of claim 1, wherein: the center of the hinge joint of the two covers (2) is provided with a through hole (21).
5. The PCB copper plating device of claim 1, wherein: the two ends of the screw rod (16) are provided with fixing plates (15), the fixing blocks are fixedly connected with the top end of the device main body (1), bearing seats are arranged in the fixing plates (15), and the two ends of the screw rod (16) are arranged in the bearing seats.
6. The PCB copper plating device of claim 1, wherein: the screw rod nut (17) is fixedly connected with the top end of the telescopic rod (14) through a bolt, and the hook (13) is fixedly connected with the output end of the bottom of the telescopic rod (14) through a bolt.
7. The PCB copper plating device of claim 1, wherein: the copper deposition cylinder (4) is communicated with the placing box (12) through a connecting pipe (7).
CN201911185577.3A 2019-11-27 2019-11-27 PCB board copper plating equipment Pending CN110791751A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911185577.3A CN110791751A (en) 2019-11-27 2019-11-27 PCB board copper plating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911185577.3A CN110791751A (en) 2019-11-27 2019-11-27 PCB board copper plating equipment

Publications (1)

Publication Number Publication Date
CN110791751A true CN110791751A (en) 2020-02-14

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ID=69446444

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911185577.3A Pending CN110791751A (en) 2019-11-27 2019-11-27 PCB board copper plating equipment

Country Status (1)

Country Link
CN (1) CN110791751A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040097071A1 (en) * 2002-11-19 2004-05-20 Igor Ivanov Method of electoless deposition of thin metal and dielectric films with temperature controlled on stages of film growth
CN201261805Y (en) * 2008-08-14 2009-06-24 惠州中京电子科技有限公司 Copper precipitation unit of printed circuit board
CN204069515U (en) * 2014-09-22 2014-12-31 国茂(浙江)科技有限公司 A kind of pcb board sinks copper equipment
CN205688011U (en) * 2016-05-25 2016-11-16 信丰福昌发电子有限公司 A kind of pcb board is with sinking copper frame
CN205741210U (en) * 2016-05-25 2016-11-30 信丰福昌发电子有限公司 A kind of pcb board copper plating device
CN208201123U (en) * 2018-04-13 2018-12-07 梅州华达电路板有限公司 A kind of pcb board electroless copper cylinder overflowing liquid recyclable device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040097071A1 (en) * 2002-11-19 2004-05-20 Igor Ivanov Method of electoless deposition of thin metal and dielectric films with temperature controlled on stages of film growth
CN201261805Y (en) * 2008-08-14 2009-06-24 惠州中京电子科技有限公司 Copper precipitation unit of printed circuit board
CN204069515U (en) * 2014-09-22 2014-12-31 国茂(浙江)科技有限公司 A kind of pcb board sinks copper equipment
CN205688011U (en) * 2016-05-25 2016-11-16 信丰福昌发电子有限公司 A kind of pcb board is with sinking copper frame
CN205741210U (en) * 2016-05-25 2016-11-30 信丰福昌发电子有限公司 A kind of pcb board copper plating device
CN208201123U (en) * 2018-04-13 2018-12-07 梅州华达电路板有限公司 A kind of pcb board electroless copper cylinder overflowing liquid recyclable device

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