CN110785002B - Triggering expansion type self-protection structure circuit board - Google Patents

Triggering expansion type self-protection structure circuit board Download PDF

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Publication number
CN110785002B
CN110785002B CN201911050070.7A CN201911050070A CN110785002B CN 110785002 B CN110785002 B CN 110785002B CN 201911050070 A CN201911050070 A CN 201911050070A CN 110785002 B CN110785002 B CN 110785002B
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water
substrate
layer
pipeline
storage box
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CN201911050070.7A
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CN110785002A (en
Inventor
范希营
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Xuzhou Bochuang Construction Development Group Co ltd
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Su Normal University Semiconductor Materials and Equipment Research Institute Pizhou Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0275—Security details, e.g. tampering prevention or detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Security & Cryptography (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The invention relates to a triggering expansion type self-protection structure circuit board, which adopts a brand new circuit board structure design, a water-swelling layer (2) is added aiming at the position between a substrate (1) and a circuit printing layer (3), a water storage box (4) covering the upper part of each circuit component (10) and flow guide pipeline devices respectively butt-jointed with the water storage box (4) and the water-swelling layer (2) are applied, based on the design of a thin film (7) between an upper pipeline (5) and a lower pipeline (6) in each flow guide pipeline device, when the water storage box (4) is damaged, each upper pipeline (5) is triggered to vibrate and drives the thin film (7) to separate from the upper pipeline (5) and the lower pipeline (6), so that the water in the water storage box (4) flows to the water-swelling layer (2), namely, the water-swelling layer (2) is triggered to expand and deform and the circuit printing layer (3) is damaged, the circuit wiring is broken, the work of the circuit board is damaged, and the working stability of the self-protection structure of the circuit board is effectively improved.

Description

Triggering expansion type self-protection structure circuit board
Technical Field
The invention relates to a trigger expansion type self-protection structure circuit board, and belongs to the technical field of semiconductor circuit boards.
Background
The circuit board can be called as a printed circuit board or a printed circuit board, and the circuit board is divided into a single panel, a double-sided panel, and a multilayer circuit board, the circuit board is the most common device of electronic equipment, each electronic element on the circuit board respectively executes work to obtain the functions of electronic products, therefore, various specific data are transmitted and operated on the circuit board, which is often a way for lawless persons to steal data, therefore, how to protect the data in the circuit board from being stolen becomes an important aspect of circuit board protection, the prior art mostly adopts a self-destruction mode for protecting the circuit board, namely, when the circuit board is in an attacked state, the self-destruction program is triggered, but the existing self-destruction program has complex structure and high implementation cost, and secondary damage such as electric sparks, explosion and the like exists in the actual self-destruction process, and the danger coefficient is too high.
Disclosure of Invention
The invention aims to solve the technical problem of providing a trigger expansion type self-protection structure circuit board, which adopts a brand-new circuit board structure design, and uses a water-swelling material to timely destroy the circuit board at a critical moment, thereby effectively improving the working stability of the self-protection structure of the circuit board.
The invention adopts the following technical scheme for solving the technical problems: the invention designs a trigger expansion type self-protection structure circuit board which comprises a substrate, a water-swelling layer, a circuit printing layer, a water storage box, circuit components and flow guide pipeline devices, wherein the water-swelling layer is arranged on the substrate;
the surface size of the water-swelling layer is equal to the surface size of the substrate, the lower surface of the substrate is attached to the upper surface of the water-swelling layer, the surface size of the circuit printing layer is equal to the surface size of the water-swelling layer, circuit wiring on the circuit printing layer is arranged on the lower surface of the circuit printing layer, and the upper surface of the circuit printing layer is attached to the lower surface of the water-swelling layer;
the circuit components are respectively arranged at corresponding positions on the upper surface of the substrate, pins of the circuit components respectively penetrate through the substrate, the water swelling layer and the circuit printing layer in sequence, and are fixed with the circuit wiring on the lower surface of the circuit printing layer by using soldering tin, and the tops of the circuit components are coplanar and the coplanarity is parallel to the surface of the substrate;
arranging through holes penetrating through the upper surface and the lower surface of the substrate along the projection direction vertical to the surface of the substrate in the area of the substrate corresponding to the non-circuit wiring on the circuit printing layer; the number of the flow guide pipeline devices is equal to that of the through holes in the substrate, each flow guide pipeline device corresponds to each through hole in the substrate one by one, the structures of the flow guide pipeline devices are the same, each flow guide pipeline device comprises an upper pipeline and a lower pipeline, two ends of each pipeline are open and are communicated with each other, the lower pipelines in each flow guide pipeline device are arranged in the corresponding through holes in the substrate respectively, the end part of each lower pipeline, corresponding to one side of the upper surface of the substrate, protrudes out of the upper surface of the substrate, and the inner diameter of the port, corresponding to one side of the upper surface of the substrate, of each lower pipeline is matched with the outer diameter of the corresponding upper pipeline;
the water storage box is a flat plate and is internally provided with a cavity structure, the water storage box is made of opaque heat conduction materials, and water is stored in a cavity in the water storage box; the surface size of the water storage box is matched with the surface size of the substrate, the water storage box is arranged right above the upper surface of the substrate in a posture parallel to the surface of the substrate, and the projection of the substrate is positioned in the projection of the water storage box along the projection direction vertical to the surface of the substrate; the lower surface of the water storage box is contacted with the tops of all circuit components, the lower surface of the water storage box is provided with through holes penetrating through the inner space and the outer space of the water storage box respectively corresponding to the positions of all lower pipelines, the aperture of each through hole is matched with the aperture of each upper pipeline, namely, each flow guide pipeline device is in one-to-one correspondence with each through hole on the lower surface of the water storage box respectively, one end of each upper pipeline in each flow guide pipeline device is fixedly butted with the corresponding through hole on the lower surface of the water storage box respectively, and the end part of one side, facing to the substrate, of each; the end parts of the covering films on the upper pipelines are respectively arranged in the ports protruding out of the upper surface of the substrate on the corresponding lower pipelines, and the edge of the film on each upper pipeline is connected with the inner wall of the corresponding lower pipeline in a circle in a dispensing mode.
As a preferred technical scheme of the invention: the metal heat conduction layer is arranged between the substrate and the water-swelling layer, the substrate projection is positioned in the metal heat conduction layer projection along the projection direction vertical to the substrate surface, the lower surface of the substrate is attached to the upper surface of the metal heat conduction layer, and the lower surface of the metal heat conduction layer is attached to the upper surface of the water-swelling layer; the end part of the upper surface of the lower pipeline in each diversion pipeline device, which faces to the water-swelling layer, penetrates through the metal heat conduction layer and is butted with the upper surface of the water-swelling layer.
As a preferred technical scheme of the invention: the closed frame is integrally coplanar in structure, the shape and the size of the closed frame are the same as those of the edge of the water-swellable layer, the thickness of the closed frame is a preset thickness, the closed frame is arranged between the metal heat conduction layer and the water-swellable layer in a posture that the plane of the closed frame is parallel to the surface of the metal heat conduction layer, one circle of the edge of one side, facing the water-swellable layer, of the upper surface of the water-swellable layer on the closed frame is fixedly butted with one circle of the edge of the upper surface of the water-swellable layer, one circle of the edge of one side, facing the metal heat conduction layer, of the closed frame is fixedly butted with the lower surface of the metal heat conduction layer; the end parts of the upper surfaces of the lower pipelines in each flow guide pipeline device, which face the water-swellable layer, are respectively communicated with the inner cavity of the closed frame.
As a preferred technical scheme of the invention: the water-swellable layer is made of water-absorbent resin or water-swellable rubber.
Compared with the prior art, the triggering expansion type self-protection structure circuit board has the following technical effects:
(1) the invention designs a triggering expansion type self-protection structure circuit board, which adopts a brand new circuit board structure design, adds a water-swelling layer aiming at the position between a substrate and a circuit printing layer, applies water storage boxes covering the upper parts of circuit components and a flow guide pipeline device which is respectively butted with the water storage boxes on the water-swelling layer, and triggers the vibration of each upper pipeline and drives the separation of the film relative to the upper pipeline and the lower pipeline when the water storage boxes are damaged based on the film design between the upper pipeline and the lower pipeline in each flow guide pipeline device, thereby realizing the flowing of water in the water storage boxes to the water-swelling layer, namely triggering the expansion deformation of the water-swelling layer and the damage to the circuit printing layer, leading the circuit wiring to be broken, damaging the circuit board, and effectively improving the working stability of the self-protection structure of the circuit board; meanwhile, the water storage box is made of opaque heat conduction materials, and the water storage box is in contact with the top of each circuit component, so that effective heat dissipation can be realized for each circuit component;
(2) in the circuit board with the triggering expansion type self-protection structure, the metal heat conduction layer is further designed and added aiming at the position between the substrate and the water expansion layer, so that the high-efficiency self-protection of the circuit board and the heat dissipation of the top of each circuit component are achieved, meanwhile, the metal heat conduction layer is applied to issue and construct a heat dissipation structure aiming at each circuit component, and the working stability of the circuit components is ensured;
(3) in the circuit board with the triggering expansion type self-protection structure, a closed frame design is further introduced according to the position between the metal heat conduction layer and the water-swelling layer, a cavity structure is arranged in the closed frame, a gap area between the metal heat conduction layer and the water-swelling layer is constructed, and when a film between an upper pipeline and a lower pipeline in any flow guide pipeline device is separated, water flowing out from a water storage box through the lower pipeline can all spread over the whole water-swelling layer through the gap area, so that the fastest triggering of the water-swelling layer is realized, and the self-protection efficiency of the circuit board is further improved.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board of a triggering expansion type self-protection structure according to the invention.
The circuit comprises a substrate 1, a water-swelling layer 2, a circuit printing layer 3, a water storage box 4, an upper pipeline 5, a lower pipeline 6, a film 7, a metal heat conduction layer 8, a closed frame 9 and a circuit component 10.
Detailed Description
The following description will explain embodiments of the present invention in further detail with reference to the accompanying drawings.
The invention designs a triggering expansion type self-protection structure circuit board, which comprises a substrate 1, a water expansion layer 2, a circuit printing layer 3, a water storage box 4, circuit components 10 and flow guide pipeline devices, as shown in figure 1.
Wherein, meet water inflation layer 2 surface dimensions and 1 surface dimensions of base plate equal, 1 lower surface pastes and locates the upper surface that meets water inflation layer 2 on the base plate, and 3 surface dimensions of circuit printing layer equal with meet water inflation layer 2 surface dimensions, and the circuit wiring on circuit printing layer 3 sets up in its lower surface, and the lower surface that meets water inflation layer 2 is located in the upper surface subsides of circuit printing layer 3.
Each circuit component 10 is respectively arranged at the corresponding position of the upper surface of the substrate 1, the pins of each circuit component 10 respectively penetrate through the substrate 1, the water-swelling layer 2 and the circuit printing layer 3 in sequence, and the pins are fixed with the circuit wiring on the lower surface of the circuit printing layer 3 by applying soldering tin, and the tops of the circuit components 10 are coplanar and the coplanarity is parallel to the surface of the substrate 1.
Through holes penetrating through the upper surface and the lower surface of the substrate 1 along the projection direction are arranged on the substrate 1 corresponding to the non-circuit wiring area on the circuit printing layer 3 along the projection direction vertical to the surface of the substrate 1; the number of the guide pipeline devices is equal to the number of the through holes in the substrate 1, each guide pipeline device corresponds to each through hole in the substrate 1 one by one, the structures of the guide pipeline devices are the same, each guide pipeline device comprises an upper pipeline 5 and a lower pipeline 6, two ends of each pipeline are open and are communicated with each other, the lower pipelines 6 in each guide pipeline device are arranged in the corresponding through holes in the substrate 1 respectively, the end part, corresponding to one side of the upper surface of the substrate 1, on each lower pipeline 6 protrudes out of the upper surface of the substrate 1, and the inner diameter of the port, corresponding to one side of the upper surface of the substrate 1, on each lower pipeline 6 is matched with the outer diameter of the corresponding upper pipeline 5.
The water storage box 4 is a flat plate and is internally provided with a cavity structure, the water storage box 4 is made of opaque heat conduction materials, and water is stored in the cavity inside the water storage box 4; the surface size of the water storage box 4 is adapted to the surface size of the substrate 1, the water storage box 4 is arranged right above the upper surface of the substrate 1 in a posture parallel to the surface of the substrate 1, and the projection of the substrate 1 is positioned inside the projection of the water storage box 4 along the projection direction vertical to the surface of the substrate 1; the lower surface of the water storage box 4 is contacted with the top of each circuit component 10, the lower surface of the water storage box 4 is provided with through holes penetrating through the inner space and the outer space of the water storage box 4 corresponding to the positions of the lower pipelines 6 respectively, the caliber of each through hole is matched with the caliber of each upper pipeline 5, namely, each flow guide pipeline device is in one-to-one correspondence with each through hole on the lower surface of the water storage box 4 respectively, one end of each upper pipeline 5 in each flow guide pipeline device is fixedly butted with the corresponding through hole on the lower surface of the water storage box 4 respectively, and the end part of one side of the substrate 1 on each upper pipeline 5 is covered with; the end parts of the upper pipelines 5 covered with the films 7 are respectively arranged in the ports protruding out of the upper surface of the substrate 1 on the corresponding lower pipelines 6, and a circle of the edge of the film 7 on each upper pipeline 5 is connected with the inner wall of the corresponding lower pipeline 6 in a dispensing mode.
The triggering expansion type self-protection structure circuit board designed by the technical scheme adopts a brand-new circuit board structure design, a water-swelling layer 2 is added aiming at the position between a substrate 1 and a circuit printing layer 3, and the water storage boxes 4 covering the upper parts of the circuit components 10 and the diversion pipeline devices respectively butted with the water storage boxes 4 on the water-swelling layer 2 are applied, based on the design of the thin film 7 between the upper pipeline 5 and the lower pipeline 6 in each diversion pipeline device, when the water storage box 4 is damaged, the upper pipelines 5 are triggered to vibrate and the film 7 is driven to separate from the upper pipelines 5 and the lower pipelines 6, so that the water in the water storage box 4 flows to the water-swelling layer 2, the water-swelling layer 2 is triggered to swell and deform, and the circuit printing layer 3 is damaged, so that circuit wiring is broken, the work of the circuit board is damaged, and the working stability of the self-protection structure of the circuit board is effectively improved; meanwhile, the water storage box 4 is made of opaque heat conduction materials, and the water storage box 4 is in contact with the top of each circuit component 10, so that effective heat dissipation can be achieved for each circuit component 10.
Based on the technical scheme of the designed triggering expansion type self-protection structure circuit board, the invention further designs the following preferred technical scheme: aiming at the position between the substrate 1 and the water-swelling layer 2, a metal heat conduction layer 8 is further designed and added, the surface size of the metal heat conduction layer 8 is larger than the surface size of the substrate 1, the metal heat conduction layer 8 is arranged between the substrate 1 and the water-swelling layer 2, the projection of the substrate 1 is positioned in the projection of the metal heat conduction layer 8 along the projection direction vertical to the surface of the substrate 1, the lower surface of the substrate 1 is attached to the upper surface of the metal heat conduction layer 8, and the lower surface of the metal heat conduction layer 8 is attached to the upper surface of the water-swelling layer 2; the end parts of the lower pipelines 6 of the diversion pipeline devices facing the water-swellable layer 2 respectively penetrate through the metal heat conduction layer 8 and are butted with the upper surface of the water-swellable layer 2; thus, the high-efficiency self-protection of the circuit board and the heat dissipation of the top of each circuit component 10 are achieved, and meanwhile, a heat dissipation structure is constructed by applying the metal heat conduction layer 8 to each circuit component 10, so that the working stability of the circuit components 10 is ensured; moreover, a design of a closed frame 9 is further introduced according to the position between the metal heat conduction layer 8 and the water-swellable layer 2, the structure of the closed frame 9 is integrally coplanar, the shape and the size of the closed frame 9 are the same as those of the edge of the water-swellable layer 2, the thickness of the closed frame 9 is a preset thickness, the closed frame 9 is arranged between the metal heat conduction layer 8 and the water-swellable layer 2 in a posture that the plane of the closed frame 9 is parallel to the surface of the metal heat conduction layer 8, wherein one circle of the edge of the closed frame 9 facing one side of the water-swellable layer 2 is fixedly butted with one circle of the edge of the upper surface of the water-swellable layer 2, one circle of the edge of the closed frame 9 facing one side of the metal heat conduction layer 8 is fixedly butted with the lower surface of the metal heat conduction layer 8, and a; the tip that upwards meets water inflation layer 2 on the lower pipeline 6 among each water conservancy diversion pipe-line device communicates the inside cavity of closed frame 9 respectively, so through the built-in cavity structures of closed frame 9, it is regional with the clearance between meeting water inflation layer 2 to construct metal heat-conducting layer 8, when the separation takes place for film 7 between upper and lower pipeline 5 of arbitrary water conservancy diversion pipe-line device and lower pipeline 6, by water storage box 4 all can distribute whole meeting water inflation layer 2 through this clearance region through the water that pipeline 6 flows out down, realize meeting the fastest triggering of water inflation layer 2, further improve the high efficiency of circuit board self-protection.
In the practical application of the designed triggering expansion type self-protection structure circuit board, the water-swelling layer 2 can be specifically designed to be made of water-absorbent resin or water-swelling rubber; firstly, welding each circuit component 10 according to the structural design, then arranging the water storage box 4 on the top of each circuit component 10 according to the design, and realizing butt joint between the water storage box 4 and the inner cavity of the closed frame 9 through each flow guide pipeline device; in practical application, because the water storage box 4 is made of opaque heat conduction materials, and the water storage box 4 covers and is butt-jointed with the top of each circuit component 10, on one hand, the water storage box 4 can dissipate heat generated by the operation of each circuit component 10, and meanwhile, the layout of each circuit component 10 can be hidden, so that a lawbreaker must destroy the water storage box 4 firstly if wanting to steal data in the circuit component 10; meanwhile, the metal heat conduction layer 8 arranged below the substrate 1 can also dissipate heat generated by the operation of each circuit component 10.
When data theft action occurs in the circuit component 10, lawbreakers must pry the water storage box 4 according to the action of the water storage box 4, the action inevitably brings displacement of the water storage box 4, the separation of the membrane 7 between the upper pipeline 5 and the lower pipeline 6 in one or more diversion pipeline devices is driven, the water in the water storage box 4 flows to the built-in cavity area of the closed frame 9 and quickly spreads over the whole water-swellable layer 2, the water-swellable layer 2 expands and deforms after contacting with water, because the upper surface of the circuit printing layer 3 is attached to the lower surface of the water-swellable layer 2, the circuit printing layer 3 will break with the swelling deformation of the water-swellable layer 2, namely, the disconnection of the circuit wiring on the circuit printing layer 3 is directly caused, the work of the circuit board is damaged, and the working stability of the self-protection structure of the circuit board is effectively improved.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims (4)

1. The utility model provides a trigger inflation formula is from protective structure circuit board which characterized in that: the water-swellable printed circuit board comprises a substrate (1), a water-swellable layer (2), a circuit printing layer (3), a water storage box (4), circuit components (10) and flow guide pipeline devices;
the surface size of the water-swelling layer (2) is equal to that of the substrate (1), the lower surface of the substrate (1) is attached to the upper surface of the water-swelling layer (2), the surface size of the circuit printing layer (3) is equal to that of the water-swelling layer (2), circuit wiring on the circuit printing layer (3) is arranged on the lower surface of the circuit printing layer, and the upper surface of the circuit printing layer (3) is attached to the lower surface of the water-swelling layer (2);
the circuit components (10) are respectively arranged at corresponding positions on the upper surface of the substrate (1), pins of the circuit components (10) respectively penetrate through the substrate (1), the water swelling layer (2) and the circuit printing layer (3) in sequence, the pins are fixed with circuit wiring on the lower surface of the circuit printing layer (3) by soldering tin, and the tops of the circuit components (10) are coplanar and the coplanarity is parallel to the surface of the substrate (1);
arranging through holes which penetrate through the upper surface and the lower surface of the substrate (1) along the projection direction vertical to the surface of the substrate (1) in the projection direction, wherein the through holes correspond to the non-circuit wiring areas on the circuit printing layer (3); the number of the flow guide pipeline devices is equal to that of the through holes in the substrate (1), each flow guide pipeline device corresponds to each through hole in the substrate (1) one by one, the structures of the flow guide pipeline devices are the same, each flow guide pipeline device comprises an upper pipeline (5) and a lower pipeline (6), two ends of each pipeline are open and are communicated with each other, the lower pipelines (6) in each flow guide pipeline device are arranged in the corresponding through holes in the substrate (1), the end part of each lower pipeline (6), corresponding to one side of the upper surface of the substrate (1), protrudes out of the upper surface of the substrate (1), and the inner diameter of the port, corresponding to one side of the upper surface of the substrate (1), in each lower pipeline (6) is matched with the outer diameter of the corresponding upper pipeline (5);
the water storage box (4) is a flat plate and is internally provided with a cavity structure, the water storage box (4) is made of opaque heat conduction materials, and water is stored in the cavity inside the water storage box (4); the surface size of the water storage box (4) is adapted to the surface size of the substrate (1), the water storage box (4) is arranged right above the upper surface of the substrate (1) in a posture parallel to the surface of the substrate (1), and the projection of the substrate (1) is positioned inside the projection of the water storage box (4) along the projection direction vertical to the surface of the substrate (1); the lower surface of the water storage box (4) is contacted with the top of each circuit component (10), the lower surface of the water storage box (4) is provided with through holes which penetrate through the inner space and the outer space of the water storage box (4) corresponding to the positions of the lower pipelines (6), the calibers of the through holes are matched with the calibers of the upper pipelines (5), namely, each flow guide pipeline device is respectively corresponding to each through hole on the lower surface of the water storage box (4), one end of each upper pipeline (5) in each flow guide pipeline device is fixedly butted with the corresponding through hole on the lower surface of the water storage box (4), and the end part of each upper pipeline (5) facing one side of the substrate (1) is covered with a film (7) in a separable way; the end parts of the upper pipelines (5) covered with the thin films (7) are respectively arranged in the ports protruding out of the upper surface of the substrate (1) on the corresponding lower pipelines (6), and the edge of each upper pipeline (5) of the thin film (7) is connected with the inner wall of the corresponding lower pipeline (6) in a dispensing mode.
2. The trigger expansion type self-protection structure circuit board of claim 1, wherein: the heat-conducting layer is characterized by further comprising a metal heat-conducting layer (8), the surface size of the metal heat-conducting layer (8) is larger than the surface size of the substrate (1), the metal heat-conducting layer (8) is arranged between the substrate (1) and the water-swelling layer (2), the projection of the substrate (1) is positioned in the projection of the metal heat-conducting layer (8) along the projection direction perpendicular to the surface of the substrate (1), the lower surface of the substrate (1) is attached to the upper surface of the metal heat-conducting layer (8), and the lower surface of the metal heat-conducting layer (8) is attached to the upper surface of the water-swelling layer; the end parts of the lower pipelines (6) facing the water-swelling layer (2) in each flow guide pipeline device respectively penetrate through the metal heat conduction layer (8) and are butted with the upper surface of the water-swelling layer (2).
3. The trigger expansion type self-protection structure circuit board of claim 2, wherein: the water-swelling type heat-conducting module is characterized by further comprising a closed frame (9), the structure of the closed frame (9) is integrally coplanar, the shape and the size of the closed frame (9) are the same as those of the edge of the water-swelling layer (2), the thickness of the closed frame (9) is a preset thickness, the closed frame (9) is arranged between the metal heat-conducting layer (8) and the water-swelling layer (2) in a posture that the surface where the closed frame (9) is parallel to the surface of the metal heat-conducting layer (8), one circle of the edge of one side, facing the water-swelling layer (2), of the closed frame (9) is fixedly butted with one circle of the edge of the upper surface of the water-swelling layer (2), one circle of the edge of one side, facing the metal heat-conducting layer (8), of the closed frame (9) is fixedly butted with the lower surface of the metal heat; the end parts of the lower pipelines (6) of the flow guide pipeline devices facing the water-swellable layer (2) are respectively communicated with the inner cavity of the closed frame (9).
4. Triggering expansion type self-protected structural circuit board according to any of claims 1 to 3, characterized in that: the water-swelling layer (2) is made of water-absorbent resin or water-swelling rubber.
CN201911050070.7A 2019-10-31 2019-10-31 Triggering expansion type self-protection structure circuit board Active CN110785002B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201911050070.7A CN110785002B (en) 2019-10-31 2019-10-31 Triggering expansion type self-protection structure circuit board

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CN110785002A CN110785002A (en) 2020-02-11
CN110785002B true CN110785002B (en) 2020-09-01

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CN102458059A (en) * 2010-10-22 2012-05-16 深圳市新国都技术股份有限公司 Protection cover with conductive coating protection circuit and point-of-sale (POS) equipment consisting of protection cover
CN102573283B (en) * 2011-12-29 2014-07-16 福建联迪商用设备有限公司 PCB (printed circuit board) safety protective board and PCB safety protective device

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