CN110769672A - Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film - Google Patents
Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film Download PDFInfo
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- CN110769672A CN110769672A CN201810852060.4A CN201810852060A CN110769672A CN 110769672 A CN110769672 A CN 110769672A CN 201810852060 A CN201810852060 A CN 201810852060A CN 110769672 A CN110769672 A CN 110769672A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 239000003292 glue Substances 0.000 claims abstract description 62
- 239000010410 layer Substances 0.000 claims description 492
- 239000002313 adhesive film Substances 0.000 claims description 64
- 239000002245 particle Substances 0.000 claims description 63
- 239000004020 conductor Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 28
- 239000011148 porous material Substances 0.000 claims description 27
- 238000007747 plating Methods 0.000 claims description 26
- 230000001681 protective effect Effects 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000005229 chemical vapour deposition Methods 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 8
- 230000008020 evaporation Effects 0.000 claims description 8
- 238000005240 physical vapour deposition Methods 0.000 claims description 8
- 238000007788 roughening Methods 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- 238000007772 electroless plating Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims 3
- 238000004880 explosion Methods 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 238000005187 foaming Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 229920006269 PPS film Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 210000001787 dendrite Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to the technical field of electronics, and discloses an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film, wherein the electromagnetic shielding film comprises a first shielding layer, an insulating layer, a second shielding layer and a glue film layer which are sequentially stacked, a hole is formed in the insulating layer, the first shielding layer and the second shielding layer are in mutual contact through the hole to realize electric conduction, one surface, close to the glue film layer, of the second shielding layer is a non-flat surface, high-frequency interference signals are reflected twice through the arrangement of the first shielding layer and the second shielding layer, and meanwhile, redundant charges are introduced into a stratum, so that the shielding efficiency is greatly improved.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film.
Background
With the rapid development of the electronic industry, electronic products are further miniaturized, light-weighted and densely assembled, and the development of flexible circuit boards is greatly promoted, so that the integration of element devices and wire connection is realized. The flexible circuit board can be widely applied to industries such as mobile phones, liquid crystal display, communication, aerospace and the like.
Under the push of the international market, the functional flexible printed circuit board is dominant in the flexible printed circuit board market, and an important index for evaluating the performance of the functional flexible printed circuit board is Electromagnetic Shielding (EMI Shielding for short). With the integration of the functions of communication equipment such as mobile phones, the internal components thereof are rapidly high-frequency and high-speed. For example: besides the original audio transmission function, the camera function has become a necessary function, and WLAN (Wireless Local Area network), GPS (Global Positioning System) and internet function have become popular, and the integration of the sensing component in the future makes the trend of rapid high-frequency and high-speed of the component unavoidable. Problems of electromagnetic interference inside and outside the device, signal attenuation during transmission, insertion loss, and jitter caused by high-frequency and high-speed driving are becoming serious.
At present, an electromagnetic shielding film commonly used for an existing circuit board comprises a shielding layer and a conductive adhesive layer, wherein the shielding layer is connected with a ground layer of the circuit board through the conductive adhesive layer, and then interference charges are led into the ground layer of the circuit board, so that shielding is achieved. The electromagnetic shielding film having the above structure has a low shielding performance, and thus still has a problem of electromagnetic interference in high-frequency and high-speed signal transmission.
Disclosure of Invention
An object of the embodiments of the present invention is to provide an electromagnetic shielding film, a circuit board, and a method for manufacturing the electromagnetic shielding film, which can effectively improve the shielding performance of the electromagnetic shielding film.
In order to solve the technical problem, an embodiment of the present invention provides an electromagnetic shielding film, including a first shielding layer, an insulating layer, a second shielding layer, and a glue film layer, where the first shielding layer, the insulating layer, the second shielding layer, and the glue film layer are sequentially stacked, the insulating layer has a hole, the first shielding layer and the second shielding layer are in contact with each other through the hole to realize electrical conduction, and one surface of the second shielding layer, which is close to the glue film layer, is a non-flat surface.
Preferably, one surface of the shielding layer, which is close to the adhesive film layer, includes a plurality of protrusions and a plurality of recesses, and the plurality of protrusions and the plurality of recesses are arranged at intervals.
Preferably, convex conductor particles are arranged on one surface, close to the adhesive film layer, of the second shielding layer.
Preferably, the thickness of the first shielding layer is 0.1-45 μm, the thickness of the second shielding layer is 0.1-45 μm, the thickness of the insulating layer is 1-80 μm, and the thickness of the glue film layer is 1-80 μm.
Preferably, the adhesive layer comprises an adhesive layer containing conductive particles; or the adhesive film layer comprises an adhesion layer without conductive particles.
Preferably, the electromagnetic shielding film further comprises a protective film layer, and the protective film layer is arranged on one surface, far away from the adhesive film layer, of the first shielding layer.
In order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a circuit board body and the electromagnetic shielding film, wherein the electromagnetic shielding film is laminated with the circuit board body through the adhesive film layer; the second shielding layer pierces through the glue film layer and is electrically connected with the ground layer of the circuit board body.
The embodiment of the invention provides an electromagnetic shielding film and a circuit board, wherein the electromagnetic shielding film comprises a first shielding layer, an insulating layer, a second shielding layer and a glue film layer which are sequentially stacked, one surface of the second shielding layer, which is close to the glue film layer, is a non-flat surface, and the non-flat surface of the second shielding layer can pierce the glue film layer and is connected with the stratum of the circuit board when the electromagnetic shielding film is laminated with the circuit board, so that the connection between the electromagnetic shielding film and the stratum of the circuit board is ensured; in addition, the first shielding layer and the second shielding layer are arranged to reflect high-frequency interference signals twice and guide redundant charges into the stratum, so that the shielding efficiency is greatly improved; in addition, the insulating layer is arranged between the first shielding layer and the second shielding layer to increase the bending property of the electromagnetic shielding film, and meanwhile, the insulating layer is provided with pores, so that the peeling strength between the first shielding layer and the second shielding layer is larger, and the electric connection between the first shielding layer and the second shielding layer is realized through the pores of the insulating layer. In addition, the non-flat surface of the second shielding layer can enhance the binding force between the second shielding layer and the circuit board, so that the electromagnetic shielding film is not easy to generate foaming delamination; in addition, when the electromagnetic shielding film is laminated with the circuit board, glue substances forming the glue film layer are extruded into the concave position of the second shielding layer to increase glue capacity, so that the phenomenon of board explosion is not easy to occur, the problem that the board is exploded due to insufficient glue capacity at high temperature of the existing electromagnetic shielding film is avoided, and then the grounding of the electromagnetic shielding film is effectively ensured, so that interference charges are led out.
In order to solve the same technical problem, an embodiment of the present invention further provides a method for preparing an electromagnetic shielding film, including the following steps:
forming a first shielding layer;
forming an insulating layer on the first shielding layer;
forming a second shielding layer on the insulating layer;
forming a glue film layer on the second shielding layer;
wherein the insulating layer is provided with a pore, and the first shielding layer and the second shielding layer are in contact with each other through the pore to realize electric conduction; one side of the second shielding layer close to the adhesive film layer is a non-flat surface.
As a preferred scheme, the forming of the first shielding layer specifically includes:
forming a protective film layer on the carrier film;
forming a first shielding layer on the protective film layer; or the like, or, alternatively,
forming a first shielding layer on the surface of the strippable layer with the carrier;
forming a protective film layer on the first shielding layer;
peeling the peelable layer of the tape carrier.
Preferably, the forming a second shielding layer on the insulating layer specifically includes:
forming a second shielding layer on the insulating layer by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating, and hybrid plating.
Preferably, the method further includes, after forming the second shielding layer on the insulating layer:
convex conductor particles are formed on the second shield layer.
Preferably, the forming of the convex conductor particles on the second shielding layer specifically includes:
the convex conductor particles are formed on the second shielding layer by one or more processes of physical roughening, chemical plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating and hybrid plating.
As a preferred scheme, a glue film layer is formed on the second shielding layer, specifically:
coating a glue film layer on the release film;
pressing and transferring the adhesive film layer onto the second shielding layer; or the like, or, alternatively,
and coating a glue film layer on the second shielding layer.
The embodiment of the invention provides a preparation method of an electromagnetic shielding film, which comprises the steps of firstly, forming a first shielding layer, then, forming an insulating layer on the first shielding layer, wherein the insulating layer is provided with a hole, then, forming a second shielding layer on the insulating layer, the first shielding layer and the second shielding layer are mutually contacted through the hole to realize electric conduction, one surface of the second shielding layer, which is far away from the insulating layer, is an uneven surface, and the uneven surface of the second shielding layer can pierce through an adhesive film layer and is connected with the stratum of a circuit board when the electromagnetic shielding film is laminated with the circuit board, so that the connection between the electromagnetic shielding film and the stratum of the circuit board is ensured; in addition, the first shielding layer and the second shielding layer are arranged to reflect high-frequency interference signals twice and guide redundant charges into the stratum, so that the shielding efficiency is greatly improved; in addition, the insulating layer is arranged between the first shielding layer and the second shielding layer to increase the bending property of the electromagnetic shielding film, and meanwhile, the insulating layer is provided with pores, so that the peeling strength between the first shielding layer and the second shielding layer is larger, and the electric connection between the first shielding layer and the second shielding layer is realized through the pores of the insulating layer. In addition, the non-flat surface of the second shielding layer can enhance the binding force between the second shielding layer and the circuit board, so that the electromagnetic shielding film is not easy to generate foaming delamination; in addition, when the electromagnetic shielding film is laminated with the circuit board, glue substances forming the glue film layer are extruded into the concave position of the second shielding layer to increase glue capacity, so that the phenomenon of board explosion is not easy to occur, the problem that the board is exploded due to insufficient glue capacity at high temperature of the existing electromagnetic shielding film is avoided, and then the grounding of the electromagnetic shielding film is effectively ensured, so that interference charges are led out.
Drawings
Fig. 1 is a schematic structural view of an electromagnetic shielding film in an embodiment of the present invention;
fig. 2 is a schematic structural view of another embodiment of an electromagnetic shielding film in an example of the present invention;
fig. 3 is a sectional view of an electromagnetic shielding film in an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a circuit board in an embodiment of the present invention;
fig. 5 is a schematic flow chart of a method for manufacturing an electromagnetic shielding film according to an embodiment of the present invention;
wherein, 1, a first shielding layer; 2. an insulating layer; 21. a pore; 3. a second shielding layer; 31. a convex portion; 32. a recessed portion; 33. a conductive particle; 4. a glue film layer; 5. a protective film layer; 7. the circuit board body.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an electromagnetic shielding film according to a preferred embodiment of the present invention includes a first shielding layer 1, an insulating layer 2, a second shielding layer 3, and a glue film layer 4, where the first shielding layer 1, the insulating layer 2, the second shielding layer 3, and the glue film layer 4 are sequentially stacked, a hole 21 is formed on the insulating layer 2, the first shielding layer 1 and the second shielding layer 2 are in contact with each other through the hole 21 to realize electrical conduction, and a surface of the second shielding layer 3 close to the glue film layer 4 is a non-flat surface.
In the embodiment of the invention, the electromagnetic shielding film is sequentially stacked through the first shielding layer 1, the insulating layer 2, the second shielding layer 3 and the adhesive film layer 4, one surface of the second shielding layer 3, which is close to the adhesive film layer 4, is a non-flat surface, and the non-flat surface of the second shielding layer 3 can pierce through the adhesive film layer 4 and is connected with the stratum of the circuit board when the electromagnetic shielding film is laminated with the circuit board, so that the connection between the electromagnetic shielding film and the stratum of the circuit board is ensured; in addition, the first shielding layer 1 and the second shielding layer 3 are arranged to reflect high-frequency interference signals twice and guide redundant charges into a stratum, so that the shielding efficiency is greatly improved; in addition, by disposing the insulating layer 2 between the first shielding layer 1 and the second shielding layer 3, the bendability of the electromagnetic shielding film is increased, while the insulating layer 2 has the void 21, so that the peel strength between the first shielding layer 1 and the second shielding layer 3 is large, and the electrical connection between the first shielding layer 1 and the second shielding layer 3 is achieved through the void 21 of the insulating layer 2. In addition, the non-flat surface of the second shielding layer 3 can enhance the binding force between the second shielding layer 3 and the circuit board, so that the electromagnetic shielding film is not easy to generate foaming delamination; in addition, when the electromagnetic shielding film is laminated with the circuit board, the glue substances forming the glue film layer 4 are extruded into the concave position of the second shielding layer to increase the glue capacity, so that the board explosion phenomenon is not easy to occur, the problem that the high-temperature board explosion is caused due to insufficient glue capacity of the existing electromagnetic shielding film is avoided, the grounding of the electromagnetic shielding film is effectively ensured, and the interference charges are led out.
In the present embodiment, the area of the pores 21 is preferably 0.1 μm2-1mm2The number of the pores 21 in the insulating layer 2 per square centimeter is preferably set to 10 to 1000. By making the area of the pores 21 preferably 0.1 μm2-1mm2The number of the pores 21 in the insulating layer 2 per square centimeter is preferably set to 10 to 1000To ensure that the insulating layer 2 has a sufficient number of the pores 21 per unit area, thereby ensuring that the first and second shield layers 1 and 3 are in contact with each other to achieve electrical conduction.
In the embodiment of the present invention, the pores 21 may be regularly or irregularly distributed on the shielding layer 1; wherein, the pores 21 are regularly distributed on the shielding layer 1, which means that the pores 21 are in the same shape and are uniformly distributed on the shielding layer 1; the pores 21 are irregularly distributed on the shielding layer 1, which means that the shapes of the pores 21 are different and are randomly distributed on the shielding layer 1. Preferably, the shape of each aperture 21 is the same, and each aperture 21 is uniformly distributed on the shielding layer 1. In addition, the aperture 21 may be a circular aperture, and may also be an aperture of any other shape, and the drawings of the present invention only illustrate that the aperture 21 is a circular aperture, but the aperture 21 of any other shape is within the protection scope of the present invention.
In the embodiment of the present invention, the uneven surface of the second shielding layer 3 is a regular uneven surface or an irregular uneven surface. Specifically, when the uneven surface of the second shielding layer 3 is a regular uneven surface, the uneven surface is a structure with periodic fluctuation, and the amplitude of the fluctuation and the interval of the fluctuation on the uneven surface are the same; when the uneven surface of the second shield layer 3 is an irregular uneven surface, the uneven surface is a structure with non-periodic fluctuation, and the amplitude of the fluctuation and/or the interval of the fluctuation on the uneven surface are different.
As shown in fig. 1, fig. 2 and fig. 4, in order to make the second shielding layer 3 more easily pierce the adhesive film layer 4 during the lamination process, a surface of the second shielding layer 3 close to the adhesive film layer 4 in this embodiment includes a plurality of protrusions 31 and a plurality of recesses 32, and the plurality of protrusions 31 and the plurality of recesses 32 are disposed at intervals. The plurality of convex parts 31 and the plurality of concave parts 32 are arranged on one surface, close to the adhesive film layer 4, of the second shielding layer 3, and the plurality of convex parts 31 and the plurality of concave parts 32 are arranged at intervals, so that the second shielding layer 3 can pierce the adhesive film layer 4 more easily in the pressing process, the connection reliability between the second shielding layer 3 and the ground layer of the circuit board is ensured, and the quality of the electromagnetic shielding is improved; in addition, when the electromagnetic shielding film is laminated with the circuit board, the glue substances forming the glue film layer 4 are extruded into the concave part 32 to increase the glue containing amount, so that the board explosion phenomenon is not easy to occur, the problem that the board is exploded at high temperature due to insufficient glue containing amount of the existing electromagnetic shielding film is avoided, and the grounding of the electromagnetic shielding film is effectively ensured, so that the interference charges are led out. In addition, the plurality of protrusions 31 may have a certain distance from the outer surface of the adhesive film layer 4, and may also contact the outer surface of the adhesive film layer 4 or extend out of the outer surface of the adhesive film layer 4.
Referring to fig. 1, in order to further ensure the reliability of the grounding and improve the conductive efficiency, the distance between each protrusion 31 and the adjacent recess 32 is the same in the present embodiment. The distance between each convex part 31 and the adjacent concave part 32 is set to be the same, so that the convex parts 31 can uniformly pierce the adhesive film layer 4, the reliability of the connection between the second shielding layer 3 and the ground layer of the circuit board is further ensured, and the conductive efficiency is improved. Preferably, each of the protrusions 31 has the same shape; each of the recesses 32 is identical in shape; wherein each of the protrusions 31 is of an axisymmetric structure; each of the recesses 32 has an axisymmetric structure; of course, each of the protrusions 31 may also have a non-axisymmetric structure, and each of the recesses 32 may also have a non-axisymmetric structure. Because the distance between each convex part 31 and the adjacent concave part 32 is the same, the shape of each convex part 31 is the same, and the shape of each concave part 32 is the same, the glue capacity of the surface of the second shielding layer 3 is uniform, so that the plate explosion is further avoided, the grounding of the electromagnetic shielding film is further ensured, and the interference charges are led out.
Referring to fig. 1, in order to further ensure the electrical connection between the electromagnetic shielding film and the ground layer of the circuit board, in this embodiment, convex conductor particles 33 are disposed on a surface of the second shielding layer 3 close to the adhesive film layer 4. Convex conductor particles 33 are arranged on one surface, close to the glue film layer 4, of the second shielding layer 3, so that the glue film layer 4 is pierced, and therefore the electromagnetic shielding film is further ensured to be electrically connected with the ground layer of the circuit board. Preferably, the conductive particles 33 are intensively distributed on the convex portion 31, so that the second shielding layer 3 can pierce the adhesive film layer 4 more easily in the pressing process, thereby achieving grounding and improving the quality of electromagnetic shielding. Of course, the recesses 32 can also have a distribution of conductor particles 33. In addition, the conductor particles 33 may also be distributed on other positions of the second shielding layer 3 near the surface of the adhesive film layer 4, not only on the surface of the convex portion 31, as shown in fig. 1, 2 and 4. Of course, the conductive particles 33 may be distributed only on the surface of the convex portion 31.
In the embodiment of the present invention, the conductor particles 33 may include a plurality of conductor particles 33, and the plurality of conductor particles 33 may be regularly or irregularly distributed on a surface of the second shielding layer 3 close to the adhesive film layer 4; the plurality of conductor particles 33 are regularly distributed on the surface of the second shielding layer 3 close to the adhesive film layer 4, that is, the plurality of conductor particles 33 are the same in shape and are uniformly distributed on the surface of the second shielding layer 3 close to the adhesive film layer 4; the plurality of conductor particles 33 are irregularly distributed on the surface of the second shielding layer 3 close to the adhesive film layer 4, which means that the plurality of conductor particles 33 are irregularly distributed on the surface of the second shielding layer 3 close to the adhesive film layer 4. In this embodiment, the shapes of the conductor particles 33 are the same, and/or the pitches of the conductor particles 33 are the same. Preferably, the shape of the plurality of conductor particles 33 is the same, and the plurality of conductor particles 33 are uniformly distributed on the side of the second shielding layer 3 close to the adhesive film layer 4. In addition, the surface of the second shielding layer 3 away from the adhesive film layer 4 may be a surface of any shape, for example, a flat surface, an uneven surface with a wavy shape, or other rough surface. The figure of the present invention only illustrates that the side of the second shielding layer 3 away from the adhesive film layer 4 is a flat surface, but any other shape is within the protection scope of the present invention.
In a specific implementation, the second shielding layer 3 may be formed first, and then the conductive particles 33 may be formed on the second shielding layer 3 through another process. Of course, the second shielding layer 3 and the conductor particles 33 may also be an integral structure formed by a one-time molding process.
Preferably, the height of the conductor particles 33 is 0.1 μm to 30 μm; the conductor particles 33 may be spaced apart from the outer surface of the adhesive film layer 4, and may be in contact with the outer surface of the adhesive film layer 4 or extend beyond the outer surface of the adhesive film layer 4. In addition, the outer surface of the adhesive film layer 4 may be a flat surface without undulation, or may be an uneven surface with gentle undulation.
It should be noted that the shapes of the conductive particles 33 in fig. 1, fig. 2 and fig. 4 are merely exemplary, and the conductive particles 33 may have other shapes such as clusters, ice-hanging shapes, stalactites, and dendrites due to differences in process means and parameters. In addition, the conductive particles 33 in the embodiment of the present invention are not limited to the shapes shown in the drawings and described above, and any conductive particles 33 having piercing and conductive functions are within the scope of the present invention.
Preferably, the thickness of the first shielding layer 1 is 0.1 μm to 45 μm, the thickness of the second shielding layer 3 is 0.1 μm to 45 μm, the thickness of the insulating layer 2 is 1 μm to 80 μm, and the thickness of the glue film layer 4 is 1 μm to 80 μm. The material used for the glue film layer 4 is selected from the following materials: modified epoxy resins, acrylic resins, modified rubbers, and modified thermoplastic polyimides. It can be understood that, in order to ensure that the first shielding layer 1 and the second shielding layer 3 have good electrical conductivity, the first shielding layer 1 and the second shielding layer 3 respectively include one or more of a metal shielding layer, a carbon nanotube shielding layer, a ferrite shielding layer, and a graphene shielding layer. Wherein the metal shielding layer comprises a single metal shielding layer and/or an alloy shielding layer; the single metal shielding layer is made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy shielding layer is made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
Preferably, the waviness of the side of the second shielding layer 3 close to the adhesive film layer 4 (i.e. the distance between the highest point and the lowest point of the side of the second shielding layer 3 close to the adhesive film layer 4) is 0.1 μm to 30 μm, and the waviness of the side of the second shielding layer 3 close to the adhesive film layer 4 is set within the above range, so as to enhance the piercing function of the second shielding layer 3, thereby ensuring that the interference charges in the first shielding layer 1 and the second shielding layer 3 are smoothly introduced into the ground, and further avoiding the accumulation of the interference charges to form an interference source.
Preferably, the thickness of the adhesive film layer 4, the sum of the undulation degree of the second shielding layer 3 on the side close to the adhesive film layer 4 and the height of the conductor particles 33 satisfy a proportional relationship of 0.5-2, so as to ensure sufficient piercing strength and glue holding capacity, which is specifically embodied as: on one hand, the phenomenon of plate explosion caused by insufficient glue accommodating amount due to the fact that the undulation degree of the side, close to the glue film layer 4, of the glue film layer 4 and the height of the conductor particles 33 are excessively small relative to the second shielding layer 3 is prevented, and on the other hand, the phenomenon of grounding failure caused by insufficient piercing strength due to the fact that the undulation degree of the side, close to the glue film layer 4, of the second shielding layer 3 and the height of the conductor particles 33 and the thickness of the glue film layer 4 are excessively small are prevented.
In an embodiment of the present invention, the conductor particles 33 include one or more of metal particles, carbon nanotube particles, and ferrite particles. Further, the metal particles include single metal particles and/or alloy particles; the single metal particles are made of any one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the alloy particles are made of any two or more of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold. The conductive particles 33 may be the same as or different from the material of the first shielding layer 1 or the second shielding layer 3.
In the embodiment of the present invention, in order to further ensure the connection between the electromagnetic shielding film and the ground layer of the circuit board, the adhesive layer 4 in this embodiment includes an adhesive layer containing conductive particles. The adhesive layer 4 comprises an adhesive layer containing conductive particles, so that the conductivity of the adhesive layer 4 is improved, and the ground connection of the electromagnetic shielding film and the circuit board is further ensured. Of course, the adhesive layer 4 may include an adhesive layer without conductive particles to reduce the insertion loss of the circuit board with the electromagnetic shielding film, thereby improving the bending property of the circuit board while improving the shielding performance.
The conductive particles may be conductive particles separated from each other, or may be large-particle conductive particles formed by aggregation; when the conductive particles are mutually separated conductive particles, the grounding conductivity of the adhesive film layer 4 can be further improved; and when the conductive particles are agglomerated large conductive particles, the piercing strength can be increased.
Referring to fig. 2, the electromagnetic shielding film of the present embodiment further includes a protection film layer 5, and the protection film layer 5 is disposed on a surface of the first shielding layer 1 away from the adhesive film layer 4. The protective film layer 5 has an insulating effect, so that the shielding effectiveness of the first shielding layer 1 and the second shielding layer 3 is ensured; in addition, the protective film layer 5 also has a protective effect to ensure that the first shielding layer 1 is not scratched or damaged in the using process, so as to maintain the high shielding effectiveness of the first shielding layer 1. The protective film layer 5 comprises a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed after epoxy resin ink is cured, a film layer formed after polyurethane ink is cured, a film layer formed after modified acrylic resin is cured or a film layer formed after polyimide resin is cured. A carrier film may be further disposed on a surface of the protective film layer 5 away from the first shielding layer 1, and the carrier film supports the protective film layer 5, which is beneficial to subsequent processing.
It should be noted that the first shielding layer 1, the insulating layer 2, and the second shielding layer 3 of the present embodiment may be respectively of a single-layer structure or a multi-layer structure. When the first shielding layer 1 is a single layer or multiple layers, convex conductor particles 33 may be disposed on one surface of each first shielding layer 1 close to the adhesive film layer 4; when the second shielding layer 3 is a plurality of layers, convex conductor particles 33 may be further disposed on one surface of each second shielding layer 3 close to the adhesive film layer 4. Preferably, when the first shielding layer 1, the insulating layer 2 and the second shielding layer 3 are respectively multiple, the first shielding layer 1, the insulating layer 2 and the second shielding layer 3 are sequentially arranged at intervals, for example, when the first shielding layer 1, the insulating layer 2 and the second shielding layer 3 are respectively 2, the arrangement sequence may be: one first shielding layer 1, one insulating layer 2, one second shielding layer 3, another first shielding layer 1, another insulating layer 2, another second shielding layer 3, and so on, which will not be described herein. In addition, the first shielding layer 1 and the second shielding layer 3 of the present embodiment may be provided in a grid shape, a bubble shape, etc. according to the requirements of actual production and application.
Referring to fig. 4, in order to solve the same technical problem, an embodiment of the present invention further provides a circuit board, including a circuit board body 7 and the electromagnetic shielding film, where the electromagnetic shielding film is pressed with the circuit board body 7 through the adhesive film layer 4; the second shielding layer 3 pierces the adhesive film layer 4 and is electrically connected with the ground layer of the circuit board body 7.
In the embodiment of the present invention, when the electromagnetic shielding film is pressed on the circuit board body 7, the protruding portion 31 can pierce through the adhesive film layer 4 and connect with the ground layer of the circuit board body 7, so as to ensure that the first shielding layer 1 and the second shielding layer 3 are connected with the ground layer of the circuit board body 7, thereby guiding the interference charges in the first shielding layer 1 and the second shielding layer 3 into the ground, and avoiding the interference source formed by the accumulation of the interference charges from affecting the normal operation of the circuit board.
Preferably, the circuit board body 7 is one of a flexible single-sided board, a flexible double-sided board, a flexible multilayer board and a flex-rigid board.
Referring to fig. 5, in order to solve the same technical problem, an embodiment of the present invention further provides a method for manufacturing an electromagnetic shielding film, including the following steps:
s11, forming a first shielding layer 1;
s12, forming an insulating layer 2 on the first shield layer 1;
s13, forming a second shield layer 3 on the insulating layer 2;
s14, forming a glue film layer 4 on the second shielding layer 3;
wherein, the insulating layer 2 has a pore 21, and the first shielding layer 1 and the second shielding layer 2 are in contact with each other through the pore 21 to realize electric conduction; one surface of the second shielding layer 3 close to the adhesive film layer 4 is a non-flat surface.
As shown in fig. 1, fig. 2 and fig. 4, in order to make the second shielding layer 3 more easily pierce the adhesive film layer 4 during the lamination process, a surface of the second shielding layer 3 close to the adhesive film layer 4 in this embodiment includes a plurality of protrusions 31 and a plurality of recesses 32, and the plurality of protrusions 31 and the plurality of recesses 32 are disposed at intervals. The plurality of convex parts 31 and the plurality of concave parts 32 are arranged on one surface, close to the adhesive film layer 4, of the second shielding layer 3, and the plurality of convex parts 31 and the plurality of concave parts 32 are arranged at intervals, so that the second shielding layer 3 can pierce the adhesive film layer 4 more easily in the pressing process, the connection reliability between the second shielding layer 3 and the ground layer of the circuit board is ensured, and the quality of the electromagnetic shielding is improved; in addition, when the electromagnetic shielding film is laminated with the circuit board, the glue substances forming the glue film layer 4 are extruded into the concave part 32 to increase the glue containing amount, so that the board explosion phenomenon is not easy to occur, the problem that the board is exploded at high temperature due to insufficient glue containing amount of the existing electromagnetic shielding film is avoided, and the grounding of the electromagnetic shielding film is effectively ensured, so that the interference charges are led out.
Referring to fig. 1, in order to further ensure the reliability of the grounding and improve the conductive efficiency, the distance between each protrusion 31 and the adjacent recess 32 is the same in the present embodiment. The distance between each convex part 31 and the adjacent concave part 32 is set to be the same, so that the convex parts 31 can uniformly pierce the adhesive film layer 4, the reliability of the connection between the second shielding layer 3 and the ground layer of the circuit board is further ensured, and the conductive efficiency is improved. Preferably, each of the protrusions 31 has the same shape; each of the recesses 32 is identical in shape; wherein each of the protrusions 31 is of an axisymmetric structure; each of the recesses 32 has an axisymmetric structure; of course, each of the protrusions 31 may also have a non-axisymmetric structure, and each of the recesses 32 may also have a non-axisymmetric structure. Because the distance between each convex part 31 and the adjacent concave part 32 is the same, the shape of each convex part 31 is the same, and the shape of each concave part 32 is the same, the glue capacity of the surface of the second shielding layer 3 is uniform, so that the plate explosion is further avoided, the grounding of the electromagnetic shielding film is further ensured, and the interference charges are led out.
In step S11, the forming the first shielding layer 1 specifically includes:
forming a protective film layer 5 on the carrier film;
forming a first shielding layer 1 on the protective film layer 5; wherein the first shielding layer 1 may be formed on the protective film layer 5 by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputter plating, electroplating, and hybrid plating; or the like, or, alternatively,
forming a first shielding layer 1 on the surface of the peelable layer with the carrier;
forming a protective film layer 5 on the first shielding layer 1;
peeling the peelable layer of the tape carrier; wherein the first shield layer 1 may be formed on the surface of the peelable layer of the tape carrier by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating, and hybrid plating.
In the embodiment of the present invention, the insulating layer 2 may be provided with the pores 21 enabling electrical conduction between the first shield layer 1 and the second shield layer 2 by:
firstly, processing PPS, PEN or a polyimide film and the like by laser processing or die cutting to form an insulating layer 2 with pores 21, wherein the thickness is preferably 1-80 μm, and then forming a first shielding layer 1 and/or a second shielding layer 3 on the surface of the insulating layer 2 with pores 21 by sputtering and the like, so that when the first shielding layer 1 and/or the second shielding layer 3 are formed, part of materials for preparing the first shielding layer 1 and/or the second shielding layer 3 extend into the pores 21 to fill the pores 21 with metal, and thus the first shielding layer 1 and the second shielding layer 3 can be in contact with each other through the pores 21 to realize electric conduction; alternatively, the aperture 21 is directly treated by electroless plating or the like to form a metal layer on the inner surface of the aperture 21, so that the first shield layer 1 and the second shield layer 3 can be electrically conducted by contacting each other through the aperture 21. Further, since the insulating layer 2 is made of an elastic material such as PPS, PEN, or a polyimide film, the flexibility of the electromagnetic shielding film can be improved by providing the insulating layer 2 having elasticity.
In step S13, forming a second shielding layer 3 on the insulating layer 2 specifically includes:
the second shielding layer 3 is formed on the insulating layer 2 by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating, and hybrid plating.
In the embodiment of the present invention, after forming the second shielding layer 3 on the insulating layer 2, the method further includes: convex conductor particles 33 are formed on the second shield layer 3. Forming convex conductor particles 33 on the second shielding layer 3 specifically includes: the conductor particles 33 having a convex shape are formed on the second shield layer 3 by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating, and hybrid plating.
In step S14, the adhesive film layer 4 may be directly coated on the second shielding layer 3, or the adhesive film layer 4 may be coated on a release film, and then the adhesive film layer 4 is transferred onto the second shielding layer 3 by pressing, so as to form the adhesive film layer 4 on the second shielding layer 3.
To sum up, the embodiment of the invention provides an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film, wherein the electromagnetic shielding film is sequentially stacked through a first shielding layer 1, an insulating layer 2, a second shielding layer 3 and a glue film layer 4, one surface of the second shielding layer 3, which is close to the glue film layer 4, is an uneven surface, and the uneven surface of the second shielding layer 3 can pierce through the glue film layer 4 and is connected with the stratum of the circuit board when the electromagnetic shielding film is laminated with the circuit board, so that the connection between the electromagnetic shielding film and the stratum of the circuit board is ensured; in addition, the first shielding layer 1 and the second shielding layer 3 are arranged to reflect high-frequency interference signals twice and guide redundant charges into a stratum, so that the shielding efficiency is greatly improved; in addition, by disposing the insulating layer 2 between the first shielding layer 1 and the second shielding layer 3, the bendability of the electromagnetic shielding film is increased, while the insulating layer 2 has the void 21, so that the peel strength between the first shielding layer 1 and the second shielding layer 3 is large, and the electrical connection between the first shielding layer 1 and the second shielding layer 3 is achieved through the void 21 of the insulating layer 2. In addition, the non-flat surface of the second shielding layer 3 can enhance the binding force between the second shielding layer 3 and the circuit board, so that the electromagnetic shielding film is not easy to generate foaming delamination; in addition, when the electromagnetic shielding film is laminated with the circuit board, the glue substances forming the glue film layer 4 are extruded into the concave position of the second shielding layer to increase the glue capacity, so that the board explosion phenomenon is not easy to occur, the problem that the high-temperature board explosion is caused due to insufficient glue capacity of the existing electromagnetic shielding film is avoided, the grounding of the electromagnetic shielding film is effectively ensured, and the interference charges are led out.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (13)
1. The utility model provides an electromagnetic shielding film, its characterized in that includes first shielding layer, insulating layer, second shielding layer and glued membrane layer, first shielding layer the insulating layer the second shielding layer with the glued membrane layer stacks gradually the setting, the hole has on the insulating layer, first shielding layer with the second shielding layer passes through the hole is contacted each other and is realized the electric conductance, the second shielding layer is close to the one side of glued membrane layer is the uneven surface.
2. The electromagnetic shielding film according to claim 1, wherein a surface of the shielding layer adjacent to the adhesive film layer includes a plurality of convex portions and a plurality of concave portions, and the plurality of convex portions and the plurality of concave portions are disposed at intervals.
3. The electromagnetic shielding film according to claim 1, wherein a surface of the second shielding layer adjacent to the adhesive film layer is provided with convex conductor particles.
4. The electro-magnetic shielding film of claim 1, wherein the first shielding layer has a thickness of 0.1 μm to 45 μm, the second shielding layer has a thickness of 0.1 μm to 45 μm, the insulating layer has a thickness of 1 μm to 80 μm, and the adhesive film layer has a thickness of 1 μm to 80 μm.
5. The electromagnetic shielding film according to any one of claims 1 to 4, wherein the adhesive layer comprises an adhesive layer containing conductive particles; or the adhesive film layer comprises an adhesion layer without conductive particles.
6. The electromagnetic shielding film according to any one of claims 1 to 4, further comprising a protective film layer disposed on a surface of the first shielding layer away from the adhesive film layer.
7. A circuit board, comprising a circuit board body and the electromagnetic shielding film according to any one of claims 1 to 6, wherein the electromagnetic shielding film is laminated with the circuit board body through the adhesive film layer; the second shielding layer pierces through the glue film layer and is electrically connected with the ground layer of the circuit board body.
8. The preparation method of the electromagnetic shielding film is characterized by comprising the following steps of:
forming a first shielding layer;
forming an insulating layer on the first shielding layer;
forming a second shielding layer on the insulating layer;
forming a glue film layer on the second shielding layer;
wherein the insulating layer is provided with a pore, and the first shielding layer and the second shielding layer are in contact with each other through the pore to realize electric conduction; one side of the second shielding layer close to the adhesive film layer is a non-flat surface.
9. The method for preparing an electromagnetic shielding film according to claim 8, wherein the forming of the first shielding layer specifically comprises:
forming a protective film layer on the carrier film;
forming a first shielding layer on the protective film layer; or the like, or, alternatively,
forming a first shielding layer on the surface of the strippable layer with the carrier;
forming a protective film layer on the first shielding layer;
peeling the peelable layer of the tape carrier.
10. The method for preparing an electromagnetic shielding film according to claim 8, wherein forming a second shielding layer on the insulating layer specifically comprises:
forming a second shielding layer on the insulating layer by one or more processes of physical roughening, electroless plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating, and hybrid plating.
11. The method for preparing an electro-magnetic shielding film according to any one of claims 8 to 10, further comprising, after forming a second shielding layer on the insulating layer:
convex conductor particles are formed on the second shield layer.
12. The method for preparing an electromagnetic shielding film according to claim 11, wherein forming convex conductive particles on the second shielding layer specifically comprises:
the convex conductor particles are formed on the second shielding layer by one or more processes of physical roughening, chemical plating, physical vapor deposition, chemical vapor deposition, evaporation plating, sputtering plating, electroplating and hybrid plating.
13. The method for preparing an electromagnetic shielding film according to any one of claims 8 to 10, wherein a film adhesive layer is formed on the second shielding layer, specifically:
coating a glue film layer on the release film;
pressing and transferring the adhesive film layer onto the second shielding layer; or the like, or, alternatively,
and coating a glue film layer on the second shielding layer.
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