CN110767822A

CN110767822A - OLED screen, manufacturing method thereof and electronic device

Info

Publication number: CN110767822A
Application number: CN201810837603.5A
Authority: CN
Inventors: 陈佳; 王培章
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-07-26
Filing date: 2018-07-26
Publication date: 2020-02-07

Abstract

The application relates to an OLED screen and a manufacturing method and an electronic device thereof, the OLED screen comprises a cover plate and a base plate which are arranged relatively, and an organic light-emitting diode, a waterproof sealing frame and a solid hot melt adhesive layer which are arranged between the cover plate and the base plate, wherein the waterproof sealing frame is connected between the edge of the cover plate and the edge of the base plate, the organic light-emitting diode is arranged in an area which is surrounded by the cover plate, the base plate and the waterproof sealing frame, and the hot melt adhesive layer is filled in the area which is surrounded by the cover plate, the base plate and the waterproof sealing frame. Set up solid-state hot melt adhesive layer in the above-mentioned OLED screen, adsorb apron and base plate and become a whole, and when the OLED screen received the impact, apron, base plate and hot melt adhesive layer as a whole, shock resistance is strong, and hot melt adhesive layer has the ability that the buffering was strikeed to guarantee that the OLED screen does not receive the damage.

Description

OLED screen, manufacturing method thereof and electronic device

Technical Field

The present disclosure relates to the field of electronic devices, and more particularly, to an OLED screen, a method for manufacturing the OLED screen, and an electronic device.

Background

Most of the substrate glass and the cover plate glass of the conventional OLED screen are packaged and connected together by using low-melting-point glass powder, and when external impact is applied, the substrate glass and the cover plate glass of the whole OLED screen are easily separated or broken to lose efficacy.

Disclosure of Invention

The embodiment of the application provides an OLED screen, a manufacturing method thereof and an electronic device, and aims to solve the technical problem that when the OLED screen is impacted externally, substrate glass and cover plate glass of the whole OLED screen are easy to separate or break to lose efficacy.

The utility model provides a OLED screen, includes relative apron, the base plate that sets up to and be located organic light emitting diode, waterproof sealing frame and the solid-state hot melt adhesive layer between apron and the base plate, waterproof sealing frame connects between the edge of apron and the edge of base plate, organic light emitting diode is located apron, base plate and waterproof sealing frame and encloses the region of establishing, hot melt adhesive layer fills up and is located apron, base plate and waterproof sealing frame and encloses the region of establishing.

Set up solid-state hot melt adhesive layer in the above-mentioned OLED screen, adsorb apron and base plate and become a whole, and when the OLED screen received the impact, apron, base plate and hot melt adhesive layer as a whole, shock resistance is strong, and hot melt adhesive layer has the ability that the buffering was strikeed to guarantee that the OLED screen does not receive the damage.

In one embodiment, the waterproof sealing frame is made of low-melting-point glass powder.

In one embodiment, the hot melt adhesive layer is made of colorless and transparent liquid hot melt adhesive.

In one embodiment, the hot melt adhesive layer covers the organic light emitting diode.

In one embodiment, the side walls of the cover plate and the substrate and the outer side surface of the waterproof sealing frame are flush to form the side surface of the OLED screen, and a silicon carbide layer is arranged on the side surface of the OLED screen.

In one embodiment, the cover plate and the substrate are made of glass.

An electronic device includes an OLED screen.

The electronic device comprises the OLED screen, and the screen is strong in impact resistance and not easy to break.

A method of manufacturing an OLED screen, comprising:

providing a cover plate and a substrate;

disposing an organic light emitting diode on a substrate;

arranging low-melting-point glass powder on the periphery of the surface of the substrate, which is provided with the organic light-emitting diode;

the area surrounded by the low-melting-point glass powder is filled with colorless and transparent liquid hot melt adhesive; and the number of the first and second groups,

and pressing the cover plate and the substrate relatively, and solidifying the low-melting-point glass powder and the liquid hot melt adhesive to integrate the cover plate and the substrate.

According to the manufacturing method of the OLED screen, the liquid hot melt adhesive is arranged in the area surrounded by the low-melting-point glass powder, the cover plate and the substrate, the waterproof sealing frame and the solid hot melt adhesive layer are obtained through solidification, the cover plate and the substrate are adsorbed into a whole, the impact resistance of the OLED screen is high, the hot melt adhesive layer has the impact buffering capacity, and the OLED screen is prevented from being damaged.

In one embodiment, the low-melting-point glass powder is sintered into the waterproof sealing frame.

In one embodiment, the liquid hot melt adhesive cools and solidifies into a solid hot melt adhesive layer.

In one embodiment, the cover plate, the side wall of the substrate and the outer side surface of the waterproof sealing frame are flush to form the side surface of the OLED screen, and the method further comprises the step of arranging a silicon carbide layer on the side surface of the OLED screen.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a front view of an electronic device according to an embodiment, wherein a screen of the electronic device is an OLED screen;

FIG. 2 is a schematic three-dimensional exploded view of the OLED screen of the electronic device shown in FIG. 1;

fig. 3 is a schematic cross-sectional profile view of the OLED screen of the electronic device shown in fig. 1.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As used herein, "terminal device" refers to a device capable of receiving and/or transmitting communication signals including, but not limited to, devices connected via any one or more of the following connections:

(1) via wireline connections, such as via Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), Digital cable, direct cable connections;

(2) via a Wireless interface means such as a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter.

A terminal device arranged to communicate over a wireless interface may be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

(1) satellite or cellular telephones;

(2) personal Communications Systems (PCS) terminals that may combine cellular radiotelephones with data processing, facsimile, and data Communications capabilities;

(3) radiotelephones, pagers, internet/intranet access, Web browsers, notebooks, calendars, Personal Digital Assistants (PDAs) equipped with Global Positioning System (GPS) receivers;

(4) conventional laptop and/or palmtop receivers;

(5) conventional laptop and/or palmtop radiotelephone transceivers, and the like.

Referring to fig. 1 and 2, in an embodiment, the electronic device 10 is a mobile phone, and the display screen of the electronic device 10 is an OLED screen 100.

As shown in fig. 2, in an embodiment, the OLED screen 100 includes a cover plate 110, a substrate 120, an organic light emitting diode 130, a hot melt adhesive layer 140, and a waterproof sealing frame 150. The cover plate 110 and the substrate 120 are arranged oppositely and made of glass, and the cover plate 110 and the substrate 120 are fixed together through a waterproof sealing frame 150. The waterproof sealing frame 150 is fixed to edges of the oppositely disposed surfaces of the cover plate 110 and the substrate 120, and the waterproof sealing frame 150 has a certain height such that a space exists between the cover plate 110 and the substrate 120. The waterproof sealing frame 150, the cover plate 110 and the substrate 120 together enclose a sealed cavity 160, so as to prevent substances in the external environment, which are not beneficial to the organic light emitting diode 130, from entering the cavity 160.

In one embodiment, as shown in fig. 2, the organic light emitting diode 130 is disposed in the cavity 160. The organic light emitting diode 130 is fixed on the substrate 120. The substrate 120 is provided with a plurality of organic light emitting diodes 130, and the organic light emitting diode 130 in fig. 2 is an enlarged schematic view of only one of the organic light emitting diodes. The OLED screen is powered on and the organic light emitting diode 130 emits light, so that the OLED screen becomes bright.

As shown in fig. 2 and 3, in one embodiment, a hot melt adhesive layer 140 is disposed between the cover plate 110 and the base plate 120. The hot melt adhesive layer 140 is a transparent solid, and fills a sealed cavity 160 defined by the cover plate 110, the substrate 120, and the waterproof sealing frame 150. The hot melt adhesive layer 140 includes a first surface 141 and a second surface 142 oppositely disposed, and a side 143 connecting the first surface 141 and the second surface 142. No air exists between the first surface 141 and the cover plate 110, and vacuum adsorption is performed; no air exists between the second surface 142 and the substrate 120, and vacuum adsorption bonding is performed; the side 143 is attached to the waterproof sealing frame 150. It is understood that the solid hot melt adhesive layer 140 fills the cavity 160 and tightly adheres the cover plate 110 and the base plate 120 together, so that the cover plate 110 and the base plate 120 are integrated. The condition that when the space between the cover plate 110 and the substrate 120 is hollow, the OLED screen is separated or broken by external impact, so that the whole OLED screen fails is avoided. The hot melt adhesive layer 140 is arranged in the OLED screen, when the OLED screen is impacted, the cover plate 110, the substrate 120 and the hot melt adhesive layer 140 are taken as a whole, the impact resistance is strong, and the hot melt adhesive layer 140 has the impact buffering capacity, so that the OLED screen is prevented from being damaged.

As shown in fig. 2 and 3, in an embodiment, the solid thermal adhesive layer 140 does not react with all the substances on the cover plate 110 and the substrate 120, including physical reaction and chemical reaction, and does not affect the organic light emitting diode 130. The solid thermal melting adhesive layer 140 is colorless and transparent, and does not affect the brightness of the organic light emitting diode 130. The thermal adhesive layer 140 covers the organic light emitting diode 130 to achieve sealing of the organic light emitting diode 130. The hot melt adhesive layer 140 is filled in the cavity 160, so that external water vapor, oxygen, heat and the like are prevented from invading into the OLED screen and contacting with the organic light emitting diode 130 to damage the OLED screen, the service life of the OLED screen is ensured, and the repair rate of products can be greatly reduced. The hot melt adhesive layer 140 is solid at normal temperature, the melting point exceeds 100 ℃, and in a normal use state of the OLED screen, the hot melt adhesive layer 140 does not change in physical and chemical states, and the display effect of the OLED screen is not affected.

In one embodiment, the hot melt adhesive layer 140 is made of a transparent liquid hot melt adhesive. The liquid hot melt adhesive has thermal plasticity, is coated in a molten state, and changes from the liquid state to the plasticized state and then to the solid state along with the reduction of the temperature in the cooling process. The hot melt adhesive comprises 15-45% of polymer, 40-65% of tackifying resin, 10-20% of plasticizer, 0-1.0% of additive and the like. The polymer used in the hot melt adhesive layer 140 in this application is Polyurethane (PU). The polyurethane is white irregular spherical or columnar particles and is divided into two categories, namely polyester type and polyether type. The usual polyester polyols are polymerized with diisocyanates. The most outstanding characteristics of polyurethane are excellent wear resistance, high hardness, high strength, good elasticity and low temperature resistance. Polyurethane reactive adhesives can be classified into hot melt curability and hot melt heating reaction type.

The tackifying resin is used for improving bonding strength, reducing cost, improving operation performance, improving impact strength and peel strength, and adjusting heat-resistant temperature and exposure time. The tackifying resin selection principle comprises the following steps: selected according to compatibility with the polymer; selecting according to the coating mode of the hot melt adhesive; the selection is made according to the characteristics of the resin. The tackifying resin comprises rosin and derivatives thereof. The tackifying resin comprises rosin, hydrogenated rosin, polymerized rosin, disproportionated rosin, glycerol rosin ester and the like. In another embodiment, the tackifying resin comprises terpenes and modified terpene resins. In still another embodiment, the tackifying resin comprises a petroleum resin such as a C5 petroleum resin, a C9 petroleum resin, a C5/C9 petroleum copolymer resin, or an aliphatic petroleum resin.

The plasticizer is a polymer material auxiliary agent widely used in industry, and the plasticizer is added in plastic processing, so that the flexibility of the plasticizer is enhanced, the plasticizer is easy to process, and the plasticizer can be legally used for industrial application. In one embodiment, the plasticizer is white oil or paraffin wax.

The antioxidant meets the following requirements of good compatibility with a polymer, good inhibition and oxidation delaying effects, no influence on the process and physical and mechanical properties of the hot melt adhesive, storage stability, no occurrence of discoloration, layering, gelation, deterioration and the like of the hot melt adhesive, and the antioxidant adopted in the embodiment is 1010 with a chemical name of tetra [ methyl- β - (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate ] pentaerythritol ester.

In one embodiment, the hot melt adhesive layer 140 is a reactive polyurethane hot melt adhesive, and has the characteristics of being a single-component package, having no need of assembly, having no risk of metering error, ensuring construction quality, containing no organic solvent, causing no environmental pollution, being an environment-friendly material, and being curable by condensation after heating, and in particular, the hot melt adhesive layer 140 is a prepolymer type hot melt adhesive containing a latent curing agent and a terminal-NCO group, wherein the latent curing agent is oxazolidine and is obtained by dehydration condensation of β -alcohol amine and aldehyde or ketone, the compound has high sensitivity to water, when a mixture also containing isocyanate groups and water, the oxazolidine preferentially reacts with water chemically to release β -alcohol amine, and the amine group and the hydroxyl group in the mixture react with the terminal-NCO group in sequence to perform curing reaction, and the series of reactions consume water molecules to prevent the water molecules from damaging the organic light emitting diode 130.

In one embodiment, the waterproof sealing frame 150 is made of low melting point glass frit. The low-melting-point glass powder is low-temperature melting glass powder which is produced by mixing relatively environment-friendly materials, melting, copolymerizing and crystallizing the materials in a high-temperature environment to produce silicon oxide boron metal salt and has the remarkable characteristic of ultralow-temperature melting (generally 390 plus 780 ℃). The low-temperature molten glass powder is an advanced sealing material, has low melting temperature and sealing temperature, good heat resistance and chemical stability and high mechanical strength, and is widely applied to the fields of electric vacuum and microelectronic technologies, laser and infrared technologies, high-energy physics, energy sources, space navigation, automobiles and the like. Can realize mutual sealing among glass, ceramics, metal and semiconductors.

Screen printing a circle of low-melting-point glass powder on the edge of the substrate 120; by adopting a laser packaging method, a laser head is controlled by a PC to scan along glass powder to melt the glass powder, and the substrate 120 and the cover plate 110 are bonded into an integrated structure, so that a closed cavity 160 is formed between the cover plate 110 and the substrate 120. The organic light emitting diode 130 is located in the cavity 160, so that the organic light emitting diode 130 is completely encapsulated by glass.

As shown in fig. 3, in an embodiment, the cover plate 110, the side wall of the substrate 120, and the outer side surface of the waterproof sealing frame 150 are flush to form a side surface of the OLED screen, and a silicon carbide layer 170 is disposed on the side surface of the OLED screen. The chemical formula of the silicon carbide is as follows: and SiC. Pure silicon carbide is a colorless and transparent crystal and does not affect the brightness of the organic light emitting diode 130. The silicon carbide layer 170 has high density due to stable chemical properties, so that water vapor and oxygen in the air can be effectively prevented from entering the cavity 160. The silicon carbide layer 170 has good wear resistance and high hardness, and the mohs hardness is 9.5, which is second to the hardest diamond (10 grade) in the world, and can increase the strength of the OLED screen. And the silicon carbide layer 170 has high thermal conductivity and small thermal expansion coefficient, so the silicon carbide layer 170 does not obstruct the heat dissipation of the OLED screen, and the silicon carbide layer 170 does not fall off from the OLED screen due to thermal expansion.

A method of manufacturing an OLED screen, comprising:

providing a cover plate 110 and a base plate 120;

an organic light emitting diode 130 is disposed on the substrate;

arranging low-melting-point glass powder around the surface of the substrate, which is provided with the organic light-emitting diode 130;

the area surrounded by the low-melting-point glass powder is filled with liquid hot melt adhesive; and the number of the first and second groups,

the cover plate 110 and the substrate 120 are pressed relatively, and the low-melting-point glass powder and the liquid hot melt adhesive are solidified, so that the cover plate 110 and the substrate 120 are integrated.

In one embodiment, the cover plate 110 and the substrate 120 are made of glass according to the size of the OLED screen, and the organic layer is coated on the substrate 120. The coating method includes vacuum deposition or vacuum thermal evaporation, organic vapor deposition, ink-jet printing, and then metal cathode evaporation to fabricate the organic light emitting diode 130. A driving circuit for driving the organic light emitting diode 130, for example, including a power line, and the like, and for example, a gate line, a data line, a switching transistor, a driving transistor, a storage capacitor, and the like may be further provided on the substrate 120.

In one embodiment, a circle of low melting point glass powder is silk-screened around the side of the substrate 120 where the organic light emitting diode 130 is disposed. And injecting liquid hot melt adhesive into the area surrounded by the low-melting-point glass powder, and standing to enable the liquid to be flatly laid in the area surrounded by the low-melting-point glass powder. The liquid hot melt adhesive submerges the organic light emitting diode 130. The cover plate 110 is then covered so that the edge of the cover plate 110 is flush with the edge of the substrate 120. The packaging method of laser sintering is adopted, a laser head is controlled by a PC to scan and sinter along glass powder to melt the glass powder, the substrate 120 and the cover plate 110 are bonded into an integrated structure, and the organic light emitting diode 130 is packaged to isolate external water vapor and oxygen. As the temperature decreases, the liquid hot melt adhesive solidifies into the solid hot melt adhesive layer 140, filling the cavity 160, increasing the drop resistance of the OLED screen.

It should be noted that, a plurality of organic light emitting diodes 130 are included in one OLED screen, and each organic light emitting diode 130 may be encapsulated by using the waterproof sealing frame 150, or a plurality of organic light emitting diodes 130 are encapsulated together by using the waterproof sealing frame 150. In the case that the plurality of organic light emitting diodes 130 are packaged together by the waterproof sealing frame 150, the interior of the organic light emitting diodes 130 includes a plurality of organic light emitting diodes 130 arranged in an array, and a planar structure is formed on the whole, which can be applied to a device requiring whole-surface light emission, such as the OLED screen of this embodiment. The organic light emitting diode 130 includes an anode, an organic light emitting layer, and a cathode, which are sequentially stacked, and in operation, electrons are injected from the cathode and holes are injected from the anode, and the two are recombined in the organic light emitting layer and then light emission is excited. If necessary, a hole injection layer and a hole transport layer may be provided from the anode to the organic light-emitting layer, and an electron injection layer and an electron transport layer may be provided from the cathode to the organic light-emitting layer. For example, the anode is usually made of a conductive material with a high work function, such as Indium Tin Oxide (ITO) or the like; the cathode is usually made of a conductive material with low work function, such as Ag, Al, Ca, In, Li and Mg, or a composite metal with low work function (such as Mg-Ag magnesium silver). The organic light emitting diode 130 may emit red light, green light, blue light, white light, etc. when operating; for example, in order to assist in adjusting the color of light, a fluorescent layer or a color filter may be disposed on the light emitting side of the organic light emitting diode 130.

In one embodiment, the cover plate 110, the side wall of the substrate 120, and the outer surface of the waterproof sealing frame 150 are flush to form a side surface of the OLED screen, and further includes disposing a silicon carbide layer 170 on the side surface of the OLED screen. The silicon carbide layer 170 is formed on the side surface of the OLED screen by physical or chemical vapor deposition, spraying, or the like.

In an embodiment, an electronic device 10 includes the OLED screen 100. The screen of the electronic device 10 has increased resistance to falling and is less likely to shatter.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a OLED screen, its characterized in that, is including relative apron, the base plate that sets up to and be located organic light emitting diode, waterproof sealing frame and the solid-state hot melt adhesive layer between apron and the base plate, waterproof sealing frame connects between the edge of apron and the edge of base plate, organic light emitting diode is located the region that apron, base plate and waterproof sealing frame enclose and establish, the hot melt adhesive layer is filled up and is located apron, base plate and waterproof sealing frame and encloses the region of establishing.

2. The OLED screen of claim 1, wherein the waterproof sealing frame is made of low-melting glass frit.

3. The OLED screen of claim 1, wherein the hot melt adhesive layer is made of a colorless and transparent liquid hot melt adhesive.

4. The OLED screen of claim 1, wherein the layer of hot melt adhesive covers the organic light emitting diodes.

5. The OLED screen of claim 1, wherein the cover plate, the side walls of the substrate and the outer side surfaces of the waterproof sealing frame are flush to form the side surfaces of the OLED screen, and the side surfaces of the OLED screen are provided with the silicon carbide layer.

6. The OLED screen of claim 1, wherein the cover plate and the substrate are both glass.

7. An electronic device, characterized in that it comprises an OLED screen according to any one of claims 1 to 6.

8. A method of manufacturing an OLED screen, comprising:

providing a cover plate and a substrate;

disposing an organic light emitting diode on a substrate;

9. The method of manufacturing an OLED screen according to claim 8, characterized in that the low-melting glass frit is sintered into a waterproof sealing frame.

10. The method of manufacturing an OLED screen according to claim 8, wherein said liquid hot melt adhesive is cooled to solidify into a solid hot melt adhesive layer.

11. The method for manufacturing the OLED screen, according to claim 8, wherein the side walls of the cover plate, the substrate and the outer side surface of the waterproof sealing frame are flush to form the side surface of the OLED screen, and the side surface of the OLED screen is provided with the silicon carbide layer.