CN110767564A - 一种晶圆检测方法 - Google Patents
一种晶圆检测方法 Download PDFInfo
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- CN110767564A CN110767564A CN201911031236.0A CN201911031236A CN110767564A CN 110767564 A CN110767564 A CN 110767564A CN 201911031236 A CN201911031236 A CN 201911031236A CN 110767564 A CN110767564 A CN 110767564A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
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CN201911031236.0A CN110767564A (zh) | 2019-10-28 | 2019-10-28 | 一种晶圆检测方法 |
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CN201911031236.0A CN110767564A (zh) | 2019-10-28 | 2019-10-28 | 一种晶圆检测方法 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112070766A (zh) * | 2020-11-16 | 2020-12-11 | 深圳中科飞测科技有限公司 | 缺陷检测方法及装置、检测设备及可读存储介质 |
CN112819799A (zh) * | 2021-02-09 | 2021-05-18 | 上海众壹云计算科技有限公司 | 目标缺陷检测方法及装置、系统、电子设备和存储介质 |
CN115100163A (zh) * | 2022-07-05 | 2022-09-23 | 江苏泰治科技股份有限公司 | 一种晶圆缺陷识别方法及装置 |
CN117911400A (zh) * | 2024-03-14 | 2024-04-19 | 深圳市壹倍科技有限公司 | 一种晶圆缺陷的确定方法、装置、计算机设备及存储介质 |
Citations (4)
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US6614924B1 (en) * | 1999-08-02 | 2003-09-02 | Applied Materials, Inc. | Adaptive mask technique for defect inspection |
CN107389689A (zh) * | 2017-07-26 | 2017-11-24 | 武汉精测电子技术股份有限公司 | 一种用于缺陷检测的aoi管理系统及管理方法 |
CN107506605A (zh) * | 2017-09-11 | 2017-12-22 | 深圳市前海安测信息技术有限公司 | 基于医疗云平台的影像大数据分析系统及方法 |
CN108376655A (zh) * | 2018-01-30 | 2018-08-07 | 北京世纪金光半导体有限公司 | 一种晶圆制造过程中检测缺陷的定位和跟踪方法 |
-
2019
- 2019-10-28 CN CN201911031236.0A patent/CN110767564A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US6614924B1 (en) * | 1999-08-02 | 2003-09-02 | Applied Materials, Inc. | Adaptive mask technique for defect inspection |
CN107389689A (zh) * | 2017-07-26 | 2017-11-24 | 武汉精测电子技术股份有限公司 | 一种用于缺陷检测的aoi管理系统及管理方法 |
CN107506605A (zh) * | 2017-09-11 | 2017-12-22 | 深圳市前海安测信息技术有限公司 | 基于医疗云平台的影像大数据分析系统及方法 |
CN108376655A (zh) * | 2018-01-30 | 2018-08-07 | 北京世纪金光半导体有限公司 | 一种晶圆制造过程中检测缺陷的定位和跟踪方法 |
Non-Patent Citations (2)
Title |
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方宝英,周建宁,魏爱英: "边缘检测法在晶圆缺陷检测中的应用", 《计算机与数字工程》 * |
马磊: "IC晶圆表面缺陷检测技术研究", 《中国优秀博硕士学位论文全文数据库(硕士) 信息科技辑》 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112070766A (zh) * | 2020-11-16 | 2020-12-11 | 深圳中科飞测科技有限公司 | 缺陷检测方法及装置、检测设备及可读存储介质 |
CN112070766B (zh) * | 2020-11-16 | 2021-02-19 | 深圳中科飞测科技有限公司 | 缺陷检测方法及装置、检测设备及可读存储介质 |
CN112819799A (zh) * | 2021-02-09 | 2021-05-18 | 上海众壹云计算科技有限公司 | 目标缺陷检测方法及装置、系统、电子设备和存储介质 |
CN112819799B (zh) * | 2021-02-09 | 2024-05-28 | 上海众壹云计算科技有限公司 | 目标缺陷检测方法及装置、系统、电子设备和存储介质 |
CN115100163A (zh) * | 2022-07-05 | 2022-09-23 | 江苏泰治科技股份有限公司 | 一种晶圆缺陷识别方法及装置 |
CN117911400A (zh) * | 2024-03-14 | 2024-04-19 | 深圳市壹倍科技有限公司 | 一种晶圆缺陷的确定方法、装置、计算机设备及存储介质 |
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Effective date of registration: 20211210 Address after: 221300 plant No.16, phase III, amorphous Industrial Park, north side of Huancheng North Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Applicant after: Jiangsu Jingjie Photoelectric Technology Co.,Ltd. Address before: No.88 Liaohe West Road, Pizhou Economic Development Zone, Xuzhou City, Jiangsu Province Applicant before: SU Normal University Semiconductor Materials and Equipment Research Institute (Pizhou) Co.,Ltd. |
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Application publication date: 20200207 |