CN110767558A - Packaging process of NOX sensor chip - Google Patents
Packaging process of NOX sensor chip Download PDFInfo
- Publication number
- CN110767558A CN110767558A CN201911186383.5A CN201911186383A CN110767558A CN 110767558 A CN110767558 A CN 110767558A CN 201911186383 A CN201911186383 A CN 201911186383A CN 110767558 A CN110767558 A CN 110767558A
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- Prior art keywords
- sensor chip
- substrate
- solder ball
- packaging process
- sealing
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- 238000012858 packaging process Methods 0.000 title claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 claims abstract description 36
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 5
- 230000002950 deficient Effects 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000010531 catalytic reduction reaction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
- G01N33/0027—General constructional details of gas analysers, e.g. portable test equipment concerning the detector
- G01N33/0036—General constructional details of gas analysers, e.g. portable test equipment concerning the detector specially adapted to detect a particular component
- G01N33/0037—NOx
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Medicinal Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combustion & Propulsion (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Food Science & Technology (AREA)
- Power Engineering (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The invention discloses a packaging process of an NOX sensor chip, which relates to the field of sensor chip sealing and comprises a second lead, wherein a second bonding pad is connected with a third bonding pad through the second lead, connecting grooves are formed in the left side and the right side of the upper surface of a substrate, a first bonding pad is arranged in each connecting groove, one end, far away from the sensor chip, of each first bonding pad penetrates through the substrate and is connected with the first lead, a sealing element is arranged on the upper side of the substrate, a sealing groove is formed in the lower surface of the sealing element, a second medium layer and a third solder ball salient point are arranged in each sealing groove, the third solder ball salient point is positioned right above the third bonding pad, the first medium layer, the second solder ball salient point and a connecting bulge are symmetrically arranged at the left end and the right end of. The invention has good packaging effect, and prevents moisture from entering a closed cavity formed by the substrate and the sealing element, thereby prolonging the service life of the sensor chip and reducing the defective rate.
Description
Technical Field
The invention relates to the field of sensor chip sealing, in particular to a packaging process of an NOX sensor chip.
Background
There are various emissions such as nitrogen oxides (e.g., NO and NO2) in the exhaust of an internal combustion engine. To reduce emissions from motor vehicles, emissions are regulated by utilizing exhaust system components such as catalytic converters. Further, various gas sensors including a NOX sensor are used to detect emissions in the exhaust gas.
The NOx sensor is a very important sensor in the current automobile and is used for detecting the concentration content of NOx in the exhaust emission of the automobile. In various countries around the world, standard regulations for the pollution of automobile exhaust emission to the environment are becoming more and more strict. Such sensors based on ceramic sensing elements can measure NOX concentrations in automobile exhaust and transmit input signals to an engine Electronic Control Unit (ECU) for most efficient control of the engine combustion process and exhaust aftertreatment. In diesel locomotives, this is achieved by injecting ammonia into a Selective Catalytic Reduction (SCR) system; in gasoline engines this is accomplished by controlling the regeneration period of the NOX storage catalyst in conjunction with lean-burn engine technology. Ceramic element NOX sensors therefore play a very important role in this respect.
In the existing NOX sensor chip packaging process, the NOX sensor chip to be packaged is fixed on the substrate upward by an adhesive through a NOX sensor packaging structure in a wire bonding interconnection manner, and then the pad electrode on the NOX sensor chip is interconnected with the substrate pad through a wire. The packaging form has no connection structure, poor sealing effect and no protection of a medium layer, can not seal the sensor chip in a closed cavity formed by a sealing element, causes chip pollution and can also cause moisture to enter, so that the service life of the sensor chip is reduced, and the sensor chip is not detected and positioned in the packaging process, so that the packaging failure is easily caused by the movement of the sensor chip, and the packaging process needs to be improved, so that the packaging process of the NOX sensor chip is provided for solving the problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a packaging process of an NOx sensor chip.
In order to achieve the purpose, the invention adopts the following technical scheme:
the packaging process of the NOX sensor chip comprises a substrate, wherein a sensor chip is arranged in the substrate, second bonding pads are symmetrically fixed on the left side and the right side of the upper surface of the substrate, third bonding pads are symmetrically arranged on the left side and the right side of the upper surface of the sensor chip, second leads are fixed on the upper surface of the third bonding pads, the second bonding pads are connected with the third bonding pads through the second leads, connecting grooves are formed in the left side and the right side of the upper surface of the substrate, first bonding pads are arranged in the connecting grooves, one ends, far away from the sensor chip, of the first bonding pads penetrate through the substrate and are connected with the first leads, a sealing element is arranged on the upper side of the substrate, a sealing groove is formed in the lower surface of the sealing element, a second medium layer and third solder ball salient points are arranged in the sealing groove, the third solder ball, The connecting bulge is positioned on the outer side of the second solder ball bulge, and the lower end face of the connecting bulge is fixed with the first solder ball bulge.
Preferably, the upper surface of the substrate is provided with a mounting groove, and the lower end of the sensor chip is arranged in the mounting groove.
Preferably, the sealing groove is formed right above the sensor chip, and the caliber of the sealing groove is larger than that of the sensor chip.
Preferably, the connecting bulge is trapezoidal, the caliber of the upper end of the connecting bulge is larger than that of the lower end of the connecting bulge, and the connecting groove is matched with the connecting bulge in shape.
Preferably, the first solder bump and the second solder bump are respectively located right above the first pad and the second pad.
Preferably, the second pad and the third pad are connected by a second lead, and the first pad is independently connected by a first lead.
Preferably, the substrate is a ceramic material.
The invention has the beneficial effects that: according to the invention, the sensor chip is placed in the mounting groove on the upper surface of the substrate, then the chip is positioned, and then the chip is butted with the connecting groove through the connecting bump, and then the second medium layer is fixed between the substrate and the sealing element after the first solder ball bump, the first bonding pad, the second solder ball bump and the second bonding pad are welded and fixed, and the third solder ball bump and the third bonding pad are welded and fixed, so that the sensor chip is packaged in the sealing groove on the lower surface of the sealing element, moisture is prevented from entering, and the service life of the sensor is prolonged.
The sensor chip is assembled on the substrate for positioning detection, so that the packaging failure caused by the fact that the sensor chip is not positioned is avoided, the packaging success rate is improved, and the packaging process is optimized.
The invention has good packaging effect, and prevents moisture from entering a closed cavity formed by the substrate and the sealing element, thereby prolonging the service life of the sensor chip and reducing the defective rate.
Drawings
Fig. 1 is a schematic structural view of a substrate and a sealing member before being packaged.
Fig. 2 is a schematic structural view of the substrate and the sealing member after being packaged.
FIG. 3 is a schematic flow chart of the sensor chip package according to the present invention.
Reference numbers in the figures: the sensor comprises a sensor chip 1, a substrate 2, a first bonding pad 3, a connecting groove 4, a second bonding pad 5, a second lead 6, a third bonding pad 7, a sealing element 8, a third solder ball bump 9, a second solder ball bump 10, a first dielectric layer 11, a connecting bump 12, a first solder ball bump 13, a lead 14, a sealing groove 15 and a second dielectric layer 16.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-3, a packaging process of an NOX sensor chip includes a substrate 2, a sensor chip 1 is disposed in the substrate 2, second pads 5 are symmetrically fixed on left and right sides of an upper surface of the substrate 2, third pads 7 are symmetrically disposed on left and right sides of an upper surface of the sensor chip 1, second leads 6 are fixed on upper surfaces of the third pads 7, the second pads 5 are connected to the third pads 7 through the second leads 6, connection grooves 4 are formed on left and right sides of an upper surface of the substrate 2, first pads 3 are disposed in the connection grooves 4, one end of the first pads 3 away from the sensor chip 1 penetrates the substrate 2 and is connected to first leads 14, a sealing member 8 is disposed on an upper side of the substrate 2, a sealing groove 15 is formed on a lower surface of the sealing member 8, a second dielectric layer 16 and third solder bumps 9 are disposed in the sealing groove 15, the third solder bumps 9, the left end and the right end of the lower surface of the sealing plate 8 are symmetrically provided with a first medium layer 11, a second solder ball salient point 10 and a connecting bulge 12, the connecting bulge 12 is positioned on the outer side of the second solder ball salient point 10, and a first solder ball salient point 13 is fixed on the lower end surface of the connecting bulge 12. The invention has good packaging effect, and prevents moisture from entering a closed cavity formed by the substrate and the sealing element, thereby prolonging the service life of the sensor chip and reducing the defective rate.
The upper surface of the substrate 2 is provided with a mounting groove, the lower end of the sensor chip 1 is arranged in the mounting groove, the sensor chip 1 to be packaged is convenient to locate, the sealing groove 15 is arranged right above the sensor chip 1, the caliber of the sealing groove 15 is larger than that of the sensor chip 1, the sensor chip 1 has enough space, the connecting bulge 12 is trapezoidal, the caliber of the upper end of the connecting bulge 12 is larger than that of the lower end, the connecting groove 4 is matched with the shape of the connecting bulge 12, the butt joint of the sealing element 8 and the substrate 2 is convenient, the first solder bump 13 and the second solder bump 10 are respectively arranged right above the first bonding pad 3 and the second bonding pad 5, the welding precision is convenient to improve, the second bonding pad 5 and the third bonding pad 7 are connected through the second lead 6, the first bonding pad 3 is independently connected through the first lead 14, the first solder bump 13, the second solder bump 5 and the third bonding pad 7, The second solder bump 10 and the third solder bump 9 are soldered and fixed, and the substrate 2 is made of a ceramic material to improve thermal conductivity and electrical insulation.
The working principle is as follows: through placing sensor chip 1 in the mounting groove of base plate 2 upper surface, then fix a position back to sensor chip 1, dock the back through coupling protrusion 12 and spread groove 4, rethread first solder ball bump 13 and first pad 3, second solder ball bump 10 and second pad 5, third solder ball bump 8 and third pad 7 welded fastening back, make second dielectric layer 16 fixed between base plate 2 and sealing member 8, thereby encapsulate sensor chip 1 in seal groove 15 of 8 lower surfaces of sealing member, and then prevent that moisture from getting into, extension sensor chip 1 life, through fixing a position the detection to sensor chip 1 assembly on base plate 2, avoid sensor chip 2 to lead to the encapsulation failure because not fixing a position, thereby improve the encapsulation success rate, and then optimize the encapsulation flow. The invention has good packaging effect, and prevents moisture from entering a closed cavity formed by the substrate and the sealing element, thereby prolonging the service life of the sensor chip and reducing the defective rate.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. A packaging process of a NOX sensor chip comprises a substrate (2), wherein a sensor chip (1) is arranged in the substrate (2), and is characterized in that second bonding pads (5) are symmetrically fixed on the left side and the right side of the upper surface of the substrate (2), third bonding pads (7) are symmetrically arranged on the left side and the right side of the upper surface of the sensor chip (1), second leads (6) are fixed on the upper surface of the third bonding pads (7), the second bonding pads (5) are connected with the third bonding pads (7) through the second leads (6), connecting grooves (4) are formed in the left side and the right side of the upper surface of the substrate (2), first bonding pads (3) are arranged in the connecting grooves (4), one ends, far away from the sensor chip (1), of the first bonding pads (3) penetrate through the substrate (2) and are connected with first leads (14), sealing elements (8) are arranged on the upper side of, sealing groove (15) have been seted up to sealing member (8) lower surface, be provided with second dielectric layer (16) and third solder ball bump (9) in sealing groove (15), third solder ball bump (9) are located directly over third pad (7), both ends symmetry is provided with first dielectric layer (11), second solder ball bump (10) and connects arch (12) about sealing plate (8) lower surface, it is located second solder ball bump (10) outside to connect arch (12), terminal surface is fixed with first solder ball bump (13) under connecting arch (12).
2. The packaging process of the NOx sensor chip as claimed in claim 1, wherein a mounting groove is formed in the upper surface of the base plate (2), and the lower end of the sensor chip (1) is disposed in the mounting groove.
3. The packaging process of the NOx sensor chip is characterized in that the sealing groove (15) is formed right above the sensor chip (1), and the caliber of the sealing groove (15) is larger than that of the sensor chip (1).
4. The packaging process of the NOx sensor chip as claimed in claim 1, wherein the connecting bump (12) is trapezoidal, the caliber of the upper end of the connecting bump (12) is larger than that of the lower end of the connecting bump, and the connecting groove (4) is matched with the connecting bump (12) in shape.
5. The packaging process of the NOx sensor chip is characterized in that the first solder ball bumps (13) and the second solder ball bumps (10) are respectively positioned right above the first bonding pads (3) and the second bonding pads (5).
6. The packaging process of the NOx sensor chip is characterized in that the second bonding pad (5) and the third bonding pad (7) are connected through a second lead (6), and the first bonding pad (3) is independently connected through a first lead (14).
7. The packaging process of the NOx sensor chip according to claim 1, wherein the substrate (2) is a ceramic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911186383.5A CN110767558B (en) | 2019-11-28 | 2019-11-28 | Packaging process of NOX sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911186383.5A CN110767558B (en) | 2019-11-28 | 2019-11-28 | Packaging process of NOX sensor chip |
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| Publication Number | Publication Date |
|---|---|
| CN110767558A true CN110767558A (en) | 2020-02-07 |
| CN110767558B CN110767558B (en) | 2021-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911186383.5A Active CN110767558B (en) | 2019-11-28 | 2019-11-28 | Packaging process of NOX sensor chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113203833A (en) * | 2021-04-27 | 2021-08-03 | 浙江朗德电子科技有限公司 | Non-heating type sensor chip |
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| WO2013129820A1 (en) * | 2012-02-27 | 2013-09-06 | Lg Innotek Co., Ltd. | Light emitting device package |
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| EP3161878A1 (en) * | 2014-06-30 | 2017-05-03 | Texas Instruments Incorporated | Optoelectronic package |
| CN207993845U (en) * | 2016-11-10 | 2018-10-19 | 北京万应科技有限公司 | A kind of intelligent sensing modular structure |
| CN109904079A (en) * | 2019-01-30 | 2019-06-18 | 深圳市志金电子有限公司 | Package substrate manufacturing process, package substrate and chip-packaging structure |
| CN110233199A (en) * | 2018-08-31 | 2019-09-13 | 深圳市聚飞光电股份有限公司 | LED support and preparation method thereof, LED light emitting device, light emitting device |
-
2019
- 2019-11-28 CN CN201911186383.5A patent/CN110767558B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1921125A (en) * | 2005-08-25 | 2007-02-28 | 矽格股份有限公司 | Packaging structure for optical sensing assembly and method of manufacture |
| CN102709479A (en) * | 2011-05-06 | 2012-10-03 | 京东方科技集团股份有限公司 | Package structure and package method for organic light emitting diode (OLED) device |
| WO2013129820A1 (en) * | 2012-02-27 | 2013-09-06 | Lg Innotek Co., Ltd. | Light emitting device package |
| EP3161878A1 (en) * | 2014-06-30 | 2017-05-03 | Texas Instruments Incorporated | Optoelectronic package |
| CN105129720A (en) * | 2015-07-25 | 2015-12-09 | 中国科学院地质与地球物理研究所 | MEMS sensor packaging structure and method |
| CN207993845U (en) * | 2016-11-10 | 2018-10-19 | 北京万应科技有限公司 | A kind of intelligent sensing modular structure |
| CN110233199A (en) * | 2018-08-31 | 2019-09-13 | 深圳市聚飞光电股份有限公司 | LED support and preparation method thereof, LED light emitting device, light emitting device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113203833A (en) * | 2021-04-27 | 2021-08-03 | 浙江朗德电子科技有限公司 | Non-heating type sensor chip |
| CN113203833B (en) * | 2021-04-27 | 2023-03-24 | 浙江朗德电子科技有限公司 | Non-heating type sensor chip |
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| Publication number | Publication date |
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| CN110767558B (en) | 2021-06-15 |
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Effective date of registration: 20240506 Address after: Room B151, 3rd Floor, Building 1, No. 1887 Chenqiao Road, Fengxian District, Shanghai, 2014 Patentee after: Shanghai Rongshu Industrial Co.,Ltd. Country or region after: China Address before: No. 666, Zhongxing East Road, Xikou Town, Fenghua District, Ningbo City, Zhejiang Province, 315000 Patentee before: NINGBO ANCHUANG ELECTRONIC TECHNOLOGY CO.,LTD. Country or region before: China |